Silicon wafer cutting scrap screening and recycling device

Abstract

The utility model discloses a silicon wafer cutting scrap screening and recycling device, and relates to the technical field of semiconductor material preparation, and the scheme is that the silicon wafer cutting scrap screening and recycling device comprises a rack; the screening roller is rotationally mounted on the rack, and a feeding opening is formed in one end of the screening roller; the primary screening unit is arranged on the screening roller, and the primary screening unit is used for screening out grinding materials; the secondary screening unit is arranged on the screening roller, and the secondary screening unit is used for screening out silicon chips with the preset particle size; the interception and discharge unit is arranged on the screening roller and is used for discharging intercepted silicon scraps; the driving assembly is in transmission connection with the screening roller, and the driving assembly can drive the screening roller to rotate, so that the screening roller can convey internal silicon chips; synchronous and efficient separation of diamond abrasives and silicon chips with different particle sizes can be achieved, the treatment process is shortened, and the resource recovery efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material preparation technology, specifically to a silicon wafer cutting debris screening and recycling device. Background Technology

[0002] Semiconductor-grade silicon wafers, as the core substrate for chip manufacturing, are costly. The silicon shavings, cutting fluid, and abrasive particles generated during wafer cutting form a complex solid-liquid mixture of waste. Diamond abrasive particles, ranging from 5 to 20 μm, introduced during cutting, are non-reusable and contaminate the recycled silicon powder. They require primary sieving using a 20 μm screen to allow particle size differences to cause them to be discharged with the cutting fluid, while retaining silicon shavings larger than 20 μm. Furthermore, coarse silicon lumps larger than 100 μm affect the quality and efficiency of silicon powder preparation and require separate crushing; while silicon shavings between 10 and 100 μm are ideal for recycling. Secondary sieving using a 100 μm screen intercepts coarse silicon lumps, allowing qualified silicon shavings to enter the recycling process. Precise grading ensures the efficiency and quality of silicon powder regeneration, effectively addressing resource waste and environmental challenges.

[0003] Currently, existing technologies face efficiency bottlenecks in the treatment of complex solid-liquid mixed waste generated from silicon wafer dicing. Due to the numerous components that need to be separated, especially the precise sieving of ideal recyclable silicon chips (10-100 μm) from the silicon scrap while simultaneously removing diamond abrasive and large silicon lumps, traditional methods often rely on multiple sieving operations. These sieving processes are not only lengthy and cumbersome, but each sieving stage requires separate equipment, consuming significant time and manpower, resulting in low overall processing efficiency. This makes it difficult to meet the urgent needs of the semiconductor industry for efficient silicon recycling, exacerbating resource waste and increasing processing cost pressures. Utility Model Content

[0004] The purpose of this invention is to provide a silicon wafer cutting debris screening and recycling device, which addresses the problem in existing technologies that require multi-stage screening processes to separate diamond abrasives and silicon chips of different particle sizes, resulting in high equipment investment and low processing efficiency. This invention provides a solution that enables the simultaneous and efficient separation of diamond abrasives and silicon chips of different particle sizes, shortens the processing flow, and improves resource recycling efficiency.

[0005] This utility model is achieved through the following technical solution:

[0006] A silicon wafer cutting debris screening and recycling device includes: a frame; a screening drum rotatably mounted on the frame, with a feed inlet at one end; a primary screening unit disposed on the screening drum for screening out abrasive particles; a secondary screening unit disposed on the screening drum for screening out silicon debris of a preset particle size; a interception and discharge unit disposed on the screening drum for discharging intercepted silicon debris; and a drive assembly connected to the screening drum for driving the screening drum to rotate, thereby enabling the screening drum to transport the internal silicon debris.

[0007] Furthermore, in this utility model, a first temporary storage plate is installed inside the screening drum, and a first release valve port is opened on the edge of the first temporary storage plate. The first temporary storage plate is located between the primary screening unit and the secondary screening unit. A first sealing component is installed on the first temporary storage plate, and the first sealing component can control the closing or opening of the first release valve port.

[0008] Furthermore, in this utility model, the first sealing component includes a first gate and a first cylinder; the first gate is mounted on a first temporary plate and can slide along a preset path; the first cylinder is mounted on the first temporary plate and can control the first gate to cover or detach from the first release valve port.

[0009] Furthermore, in this utility model, a second temporary storage plate is installed inside the screening drum, and a second release valve port is opened on the edge of the second temporary storage plate. The second temporary storage plate is located between the secondary screening unit and the interception and discharge unit. A second sealing assembly is installed on the second temporary storage plate, and the second sealing assembly can control the closing or opening of the second release valve port.

[0010] Furthermore, in this utility model, the second sealing component includes a second gate and a second cylinder; the second gate is mounted on a second temporary plate and can slide along a preset path; the second cylinder is mounted on the second temporary plate and can control the second gate to cover or detach from the second release valve port.

[0011] Furthermore, in this utility model, the aforementioned primary screening unit includes a plurality of primary screening holes formed on the surface wall of the screening drum, the aperture of which is 20 μm.

[0012] Furthermore, in this invention, the secondary screening unit includes a plurality of secondary screening holes formed on the surface wall of the screening drum, the aperture of which is 100μm.

[0013] Furthermore, in this utility model, the aforementioned interception and discharge unit includes multiple discharge holes formed on the surface wall of the screening drum, and the diameter of the discharge holes is greater than 100μm.

[0014] Furthermore, in this utility model, the above also includes a rolling support assembly, which includes a support base and a rolling support wheel distributed on both sides of the screening drum. The support base is installed on the frame, and the rolling support wheel is rotatably mounted on the support base. The rolling support wheel makes rolling contact with the outer circumferential surface of the screening drum, and is used to support the screening drum and transmit driving force.

[0015] Furthermore, in this invention, the aforementioned drive assembly includes a motor, a driving gear, and a driven gear ring;

[0016] The motor is mounted on the frame, and the output end of the motor is connected to the drive gear; the driven gear ring is fitted on the outside of the screening drum, and the driven gear ring meshes with the drive gear.

[0017] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0018] 1. This application constructs a multi-component material synchronous separation system by designing a functionalized aperture structure on the surface of the screening drum and combining it with the composite force field generated by rotational motion. Within a single device, the synergistic effect of centrifugal force and gravity enables diamond abrasive and silicon chips of different particle sizes (including ideal recovery particle size and coarse particles) to achieve differentiated motion trajectories, thereby completing the parallel classification and separation of all components. This effectively overcomes the drawbacks of existing technologies, such as lengthy processes, frequent equipment switching, and complex manual intervention. Through the integrated screening drum design and dynamic separation mechanism, the multi-stage screening process is integrated into a single continuous operation, significantly improving processing efficiency and reducing equipment investment and labor costs.

[0019] 2. The first temporary storage plate installed inside the screening drum in this application is installed between the primary screening unit and the secondary screening unit. The first release valve port on the edge of the first temporary storage plate, in conjunction with the pneumatic control of the first sealing component, can block the material conveying path by closing the first release valve port during the screening process, so that the waste is retained in the primary screening unit and fully rotated for screening, thus solving the problem of insufficient screening caused by the accumulation of waste.

[0020] 3. The first release valve port is designed at the edge of the first temporary plate and smoothly transitions to the inner wall of the screening drum. It uses the combined effect of gravity and centrifugal force to guide the flow of waste and avoid the phenomenon of waste residue accumulation. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of a silicon wafer cutting debris screening and recycling device.

[0023] Figure 2 This is a 3D view of the screening drum;

[0024] Figure 3 This is a cross-sectional view of the screening drum;

[0025] Figure 4 This is a schematic diagram showing the relative positions of the first and second temporary storage boards.

[0026] The attached diagram shows the markings and corresponding component names:

[0027] 1-Frame, 2-Screening drum, 3-Primary screening unit, 4-Secondary screening unit, 5-Interception and discharge unit, 6-Primary screening hole, 7-Secondary screening hole, 8-Discharge hole, 9-Feed inlet, 10-Motor, 11-Drive gear, 12-Driven gear ring, 13-Support base, 14-Rolling support wheel, 15-First temporary storage plate, 16-Second temporary storage plate, 17-First release valve port, 18-Second release valve port, 19-First cylinder, 20-Second cylinder, 21-First gate, 22-Second gate. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0029] Example

[0030] Please refer to Figure 1 and Figure 2 This utility model provides a silicon wafer cutting debris screening and recycling device. It includes a frame 1, a screening drum 2, a primary screening unit 3, a secondary screening unit 4, a interception and discharge unit 5, and a drive assembly. The screening drum 2 is rotatably mounted on the frame 1. One end of the screening drum 2 has a feed inlet 9. The screening drum 2 can be installed at an angle or has internal guide ribs. When the screening drum 2 rotates, it conveys the internal silicon debris through the angle of inclination or the guide ribs.

[0031] The primary screening unit 3 is mounted on the screening drum 2 and is used to screen out diamond abrasives of 5-20μm; the secondary screening unit 4 is mounted on the screening drum 2 and is used to screen out ideal silicon chips of 10 to 100μm; the interception and discharge unit 5 is mounted on the screening drum 2 and is used to discharge coarse silicon blocks larger than 100μm; the drive assembly is connected to the screening drum 2 and can drive the screening drum 2 to rotate to transport the internal silicon chips.

[0032] Silicon chips, cutting fluid, and abrasive particles generated during silicon wafer cutting form a complex solid-liquid mixture of waste. Operators add this waste into the screening drum 2 through the feed inlet 9. As the drum rotates, the waste sequentially passes through the primary screening unit 3, the secondary screening unit 4, and the interception and discharge unit 5. When passing through the primary screening unit 3, smaller diamond abrasive particles (5 to 20 μm) are screened out and collected by the operator. Continuing to the secondary screening unit 4, ideal silicon chips (10 to 100 μm) are screened out, can be reused, and are collected by the operator. The remaining coarse silicon blocks (greater than 100 μm) in the screening drum 2 are discharged after reaching the interception and discharge unit 5. Due to impurity risks and poor process compatibility, these coarse silicon blocks require a more complex grading process for reuse, thus achieving the goal of accurately refining ideal silicon chips through a single screening process.

[0033] It is important to note that during the sieving process in the primary sieving unit 3, silicon chips of 10 to 20 μm and diamond abrasive particles of 5 to 20 μm are discharged simultaneously, resulting in overlap in particle size ranges. To address this issue, silicon (density approximately 2.33 g / cm³) is used... 3 ) and diamond (density approximately 3.5-3.53 g / cm³) 3 Due to the significant density difference, operators can achieve efficient separation of the two materials through methods such as gravity separation, centrifugal separation, or heavy liquid separation, ensuring the purity and recycling value of diamond abrasive and silicon chips.

[0034] Please refer to Figure 3 and Figure 4 In some embodiments of this application, a first temporary storage plate 15 is provided inside the screening drum 2, and a first release valve port 17 is provided on the edge of the first temporary storage plate 15. The first temporary storage plate 15 is installed between the primary screening unit 3 and the secondary screening unit 4. A first sealing component is integrated on the first temporary storage plate 15 for precisely controlling the opening and closing state of the first release valve port 17.

[0035] In the actual screening process, waste is fed into the screening drum 2 through the feed inlet 9 and continuously conveyed along the inner wall as the drum rotates. Because the waste accumulates inside the drum, the material at the top cannot fully contact the screen surface of the primary screening unit 3, easily leading to insufficient screening. Therefore, by controlling the first sealing assembly to close the first release valve 17, the first temporary storage plate 15 effectively blocks the waste conveying path, causing the waste to temporarily remain in the primary screening unit 3, allowing for thorough screening by the continuous rotation of the screening drum 2. After screening is complete, the operator can open the first release valve 17 through the first sealing assembly, allowing the remaining waste to enter the secondary screening unit 4 through the first release valve 17, thereby significantly improving the efficiency and quality of the primary screening.

[0036] The first release valve 17, located at the edge of the first temporary storage plate 15, rotates synchronously with the screening drum 2. The first release valve 17 is designed at the edge of the first temporary storage plate 15, forming a smooth transition with the inner wall of the screening drum 2. This allows the material to slide along the inner wall of the screening drum 2 to the first release valve 17 by gravity and centrifugal force as the drum rotates. If the first release valve 17 were not located at the edge of the first temporary storage plate 15 (e.g., at the center), waste would naturally accumulate on the inner wall of the screening drum 2 due to gravity when it reaches the bottom, making it difficult to move towards the center and easily leading to residue buildup. The design of the edge first release valve 17 allows waste to smoothly pass through the valve and enter the next screening unit, eliminating the potential for residue buildup from a structural design perspective.

[0037] It should be noted that the outer contour of the first temporary storage plate 15 is precisely matched with the inner contour of the screening drum 2 to ensure that when the first sealing component closes the first release valve port 17, a full circumferential seal can be formed to effectively block the flow path of waste, realize precise temporary storage control of waste, and avoid problems such as premature material leakage or insufficient screening caused by gaps.

[0038] Specifically, the first sealing assembly employs a pneumatic linear drive system, with the first gate plate 21 and the first cylinder 19 working in tandem. The first temporary storage plate 15 is equipped with a dovetail groove slide rail, into which the first gate plate 21 is embedded, ensuring that the first gate plate 21 slides along a path coinciding with the center line of the first release valve port 17. The first cylinder 19 is securely mounted on a dedicated support of the first temporary storage plate 15, and the first cylinder 19 is rigidly connected to the first gate plate 21, forming a reliable power transmission structure.

[0039] When the first cylinder 19 pushes the first gate 21 to move toward the first release valve port 17, until the sealing end face of the first gate 21 is tightly fitted with the first release valve port 17 to form a closed state; conversely, the first cylinder 19 pulls the first gate 21 to move in the opposite direction, and the first gate 21 is completely removed from the first release valve port 17, so that waste can flow through the first release valve port 17.

[0040] Please refer to Figure 3 and Figure 4 In some embodiments of this application, a second temporary storage plate 16 is provided inside the screening drum 2 between the secondary screening unit 4 and the interception and discharge unit 5, and a second release valve port 18 is provided on the edge of the second temporary storage plate 16. A second sealing assembly is assembled on the second temporary storage plate 16, and the second sealing assembly controls the opening and closing state of the second release valve port 18 to realize the temporary storage and release control of waste.

[0041] The second blocking assembly adopts the same pneumatic drive structure as the first blocking assembly, consisting of a second gate 22 and a second cylinder 20. The second gate 22 is guided and mounted on the surface of the second temporary storage plate 16 via a slide rail, and can reciprocate linearly along a preset path parallel to the second release valve port 18. The second cylinder 20 is fixed to a dedicated mounting base on the second temporary storage plate 16, and is rigidly connected to the second gate 22. Since the principle of the second blocking assembly is completely the same as that of the first blocking assembly, it will not be described in detail here.

[0042] Please refer to Figure 1 and Figure 2 In some embodiments of this application, the primary screening unit 3 is composed of an array of primary screening holes 6 formed on the surface of the screening drum 2, with the hole diameter of the primary screening holes 6 set to 20 μm. When the solid-liquid mixed waste generated from silicon wafer cutting enters the primary screening unit 3, the diamond abrasive particles with a particle size of 5 to 20 μm, being smaller than the screen hole size, are separated through the primary screening holes 6 under the centrifugal force generated by the rotation of the screening drum 2, thus achieving efficient recovery of the diamond abrasive.

[0043] Please refer to Figure 1 and Figure 2 In some embodiments of this application, the secondary screening unit 4 employs an array of secondary screening holes 7, evenly distributed on the surface of the screening drum 2, with the aperture of the secondary screening holes 7 controlled at 100 μm. When the remaining waste after primary screening enters the secondary screening unit 4, silicon chips with a particle size in the range of 10 to 100 μm are smoothly discharged through the secondary screening holes 7 and captured by the collection device under the combined action of centrifugal force generated by the rotation of the screening drum 2 and gravity. This design achieves precise screening of target silicon chips by matching the ideal recovery particle size range of silicon chips (10 to 100 μm), effectively separating high-purity silicon resources that can be directly reused.

[0044] Please refer to Figure 1 and Figure 2 In some embodiments of this application, the interception and discharge unit 5 is composed of an array of discharge holes 8 evenly distributed on the surface of the screening drum 2, with the diameter of the discharge holes 8 being greater than 100 μm. When the remaining waste after passing through the primary screening unit 3 and the secondary screening unit 4 enters the interception and discharge unit 5, the coarse silicon blocks with a particle size greater than 100 μm are directionally discharged through the discharge holes 8 and collected independently under the action of centrifugal force and gravity generated by the rotation of the screening drum 2.

[0045] Please refer to Figure 1In some embodiments of this application, the rolling support assembly consists of support seats 13 and rolling support wheels 14 distributed on both sides of the screening drum 2. The support seats 13 are fixedly mounted on the frame 1, and the support seats 13 have a bearing structure inside. The rolling support wheels 14 are rotatably mounted on the support seats 13 through the bearings. The outer peripheral surface of the rolling support wheels 14 is in close contact with the outer peripheral surface of the screening drum 2, forming a rolling support fit. The entire rolling support assembly has a compact structure, effectively reducing mechanical wear and energy consumption, and improving the operational stability and service life of the device.

[0046] It should be noted that, to ensure the stability and reliability of the screening drum 2, multiple sets of rolling support components are evenly distributed along the axial extension direction of the screening drum 2, forming a stable load-bearing system through multi-point support. This distributed support structure effectively disperses the radial load during drum operation, significantly reducing the risk of vibration and displacement caused by eccentric loads, and ensuring the continuous, stable, and efficient screening process. The figure shows only a schematic diagram of a single structure; in actual applications, an array arrangement is used to achieve all-round support reinforcement.

[0047] Please refer to Figure 1 In some embodiments of this application, the drive assembly consists of a motor 10, a drive gear 11, and a driven gear ring 12. The motor 10 is fixedly mounted on the frame 1, and the output end of the motor 10 is connected to the drive gear 11 via a coupling; the driven gear ring 12 is fitted onto the outside of the screening drum 2, and the driven gear ring 12 and the drive gear 11 form a meshing transmission. When the motor 10 starts, the drive gear 11 drives the driven gear ring 12 to rotate through inter-tooth meshing, thereby driving the screening drum 2 to rotate stably around its axis.

[0048] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A silicon wafer cutting debris screening and recycling device, characterized in that, include: Rack (1); Screening drum (2), the screening drum (2) is rotatably mounted on the frame (1), and a feed inlet (9) is provided at one end of the screening drum (2); Primary screening unit (3), the primary screening unit (3) is disposed on the screening drum (2), the primary screening unit (3) is used to screen out abrasives; Secondary screening unit (4), which is disposed on the screening drum (2), is used to screen out silicon chips of a preset particle size; The interception and discharge unit (5) is disposed on the screening drum (2) and is used to discharge the intercepted silicon chips; A drive assembly is connected to the screening drum (2) and is able to drive the screening drum (2) to rotate, so that the screening drum (2) can transport the internal silicon chips.

2. The silicon wafer cutting debris screening and recycling device according to claim 1, characterized in that, The screening drum (2) is equipped with a first temporary storage plate (15), and the edge of the first temporary storage plate (15) is provided with a first release valve port (17). The first temporary storage plate (15) is located between the primary screening unit (3) and the secondary screening unit (4). The first temporary storage plate (15) is equipped with a first sealing component, which can control the closing or opening of the first release valve port (17).

3. The silicon wafer cutting debris screening and recycling device according to claim 2, characterized in that, The first blocking assembly includes a first gate (21) and a first cylinder (19); The first gate (21) is installed on the first temporary storage plate (15), and the first gate (21) can slide along a preset path; The first cylinder (19) is mounted on the first temporary plate (15). The first cylinder (19) can control the first gate (21) to cover the first release valve port (17) or to detach from the first release valve port (17).

4. The silicon wafer cutting debris screening and recycling device according to claim 1, characterized in that, The screening drum (2) is equipped with a second temporary storage plate (16), and the edge of the second temporary storage plate (16) is provided with a second release valve port (18). The second temporary storage plate (16) is located between the secondary screening unit (4) and the interception and discharge unit (5). The second temporary storage plate (16) is equipped with a second sealing assembly, which can control the closing or opening of the second release valve port (18).

5. The silicon wafer cutting debris screening and recycling device according to claim 4, characterized in that, The second sealing assembly includes a second gate (22) and a second cylinder (20); The second gate (22) is installed on the second temporary plate (16), and the second gate (22) can slide along a preset path; The second cylinder (20) is mounted on the second temporary plate (16), and the second cylinder (20) can control the second gate (22) to cover the second release valve port (18) or to disengage from the second release valve port (18).

6. The silicon wafer cutting debris screening and recycling device according to any one of claims 1 to 5, characterized in that, The primary screening unit (3) includes a plurality of primary screening holes (6) formed on the surface of the screening drum (2), and the aperture of the primary screening holes (6) is 20 μm.

7. The silicon wafer cutting debris screening and recycling device according to any one of claims 1 to 5, characterized in that, The secondary screening unit (4) includes a plurality of secondary screening holes (7) formed on the surface of the screening drum (2), and the aperture of the secondary screening holes (7) is 100 μm.

8. The silicon wafer cutting debris screening and recycling device according to any one of claims 1 to 5, characterized in that, The interception and discharge unit (5) includes a plurality of discharge holes (8) opened on the surface wall of the screening drum (2), and the diameter of the discharge holes (8) is greater than 100 μm.

9. The silicon wafer cutting debris screening and recycling device according to any one of claims 1 to 5, characterized in that, It also includes a rolling support assembly, which includes a support seat (13) and a rolling support wheel (14) distributed on both sides of the screening drum (2). The support seat (13) is installed on the frame (1), and the rolling support wheel (14) is rotatably mounted on the support seat (13). The rolling support wheel (14) makes rolling contact with the outer circumferential surface of the screening drum (2) to support the screening drum (2) and transmit driving force.

10. The silicon wafer cutting debris screening and recycling device according to any one of claims 1 to 5, characterized in that, The drive assembly includes a motor (10), a drive gear (11), and a driven gear ring (12); The motor (10) is mounted on the frame (1), and the output end of the motor (10) is connected to the drive gear (11); The driven gear ring (12) is fitted on the outside of the screening drum (2), and the driven gear ring (12) meshes with the driving gear (11).

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