Cooling cavity of bipolar splayed magnetron sputtering machine table
By designing the cooling chamber of the bipolar figure-eight magnetron sputtering machine and utilizing the coordinated movement of the clamping and conveying device and the lifting assembly, the problem of low processing efficiency in the existing technology has been solved, and efficient cooling and environmentally stable material transfer have been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU YOULUN VACUUM EQUIP TECH CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-05-01
AI Technical Summary
Existing sputtering coating technology uses only one intermediate chamber for buffering, resulting in low processing efficiency.
A cooling chamber for a bipolar figure-eight magnetron sputtering machine is designed, comprising a first main chamber module and a second main chamber module arranged symmetrically. Each main chamber is equipped with an independently controlled clamping and conveying device and a transfer buffer chamber module. Through the coordinated movement of the clamping and conveying device and the lifting and hoisting assembly, the material is transitioned between the cooling station and the conveying path. A cooling buffer unit and a sealing assembly are also provided to maintain a vacuum environment.
It improves processing efficiency, ensures material cooling efficiency, maintains environmental stability in the process chamber, prevents material displacement, and adapts to different cooling methods through modular design to meet various process requirements.
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Figure CN224186251U_ABST
Abstract
Description
Cooling chamber of a bipolar figure-eight magnetron sputtering machine Technical Field
[0001] This utility model relates to the field of vacuum equipment technology, and more specifically, to a cooling cavity for a bipolar figure-eight magnetron sputtering machine. Background Technology
[0002] With the development of science and technology, vacuum coating technology has advanced rapidly. Thin film technology can modify the surface properties of workpieces, improving their wear resistance, oxidation resistance, and corrosion resistance, thereby extending their service life. Thin film technology can also be used to fabricate optical, electrical, and semiconductor thin film devices, possessing high economic value. Magnetron sputtering technology can prepare various superhard films, corrosion-resistant friction films, superconducting films, magnetic films, optical films, and various films with special functions, and its applications in industrial thin film preparation are very extensive.
[0003] The patent closest to the prior art, application publication number: CN118374778A, discloses a sputtering coating system, including a vacuum transfer chamber, at least one sputtering coating device, a sample transfer arm mechanism, and a vacuum drive mechanism. The sputtering coating device includes a vacuum coating chamber, a substrate support mechanism, and a cathode target. The vacuum coating chamber is connected to the vacuum transfer chamber. The substrate support mechanism is located at the top of the vacuum coating chamber and is used to support the substrate. The cathode target is vacuum-sealed to the vacuum coating chamber and is disposed opposite to the substrate support mechanism. The sample transfer arm mechanism is at least partially disposed within the vacuum transfer chamber. The vacuum drive mechanism is connected to the sample transfer arm mechanism and is used to drive the sample transfer arm mechanism to transfer the substrate between at least one sputtering coating device.
[0004] Existing sputtering coating technology uses only one intermediate chamber for buffering, which cannot provide reserved buffer space, resulting in low processing efficiency.
[0005] In view of this, the present invention proposes a cooling chamber for a bipolar figure-eight magnetron sputtering machine that is easy to cool and has a simple structure. Summary of the Invention
[0006] In view of this, the present invention proposes a cooling chamber for a bipolar figure-eight magnetron sputtering machine that is easy to cool and has a simple structure.
[0007] A cooling cavity for a bipolar figure-eight magnetron sputtering machine is characterized by:
[0008] It includes a first main chamber module 2 and a second main chamber module 3 arranged symmetrically. Each first main chamber module 2 and second main chamber module 3 is equipped with an independently controlled clamping and conveying device 9. The clamping and conveying device 9 is a conveying mechanism that can move in three-dimensional space and is used for transferring materials across chambers, as well as a transfer buffer chamber module 4 set in the central area.
[0009] The transit buffer chamber module 4 includes:
[0010] The removable upper fixing plate 41 located at the top forms an equipment maintenance port;
[0011] The lower fixing plate 44 is located at the bottom, and a cooling buffer unit 43 is provided above it. The cooling buffer unit 43 integrates a temperature control device and forms a heat exchange interface with the material contact surface.
[0012] The lifting material assembly 42 is located on one side of the cooling buffer unit 43;
[0013] The working surface of the cooling buffer unit 43 and the movement trajectory of the lifting material assembly 42 form a spatial intersection. Through the coordinated movement of the clamping and conveying device 9 and the lifting material assembly 42, the material transitions between the cooling station and the transmission path.
[0014] Furthermore, the lifting material assembly 42 includes a drive cylinder 421, a drive connecting rod 422, a fixed ring 423, and receiving claws 424. The side of the lower fixed plate 44 is provided with a through hole, and the drive cylinder 421 is provided below the lower fixed plate 44. The drive end of the drive cylinder 421 is provided with a drive connecting rod 422, and the fixed ring 423 is fixedly provided above the drive connecting rod 422. At least three receiving claws 424 are provided around the fixed ring 423 at intervals. When it is a three-point claw, it effectively prevents material deviation. When the drive cylinder 421 works, the drive connecting rod 422 passes through the through hole and drives the fixed ring 423 and the receiving claws 424 to move vertically up and down.
[0015] Furthermore, a sealing bellows assembly 425 is also sleeved on the outside of the drive connecting rod 422. The sealing bellows assembly 425 is used to ensure the environmental sealing of the central area above the through hole and prevent the lower part of the lifting material assembly 42 from affecting the vacuum level of the central area.
[0016] Furthermore, the receiving claw 424 has a guide slope 45 with a limiting structure. The receiving claw 424 is provided with a guide slope 45 with a limiting structure near the end of the cooling buffer unit 43, which plays the role of limiting and guiding.
[0017] Furthermore, the bottom of the guide slope 45 with the limiting structure is at a right angle 451 to the receiving claw 424 and the end of the cooling buffer unit 43, which serves to further limit the position.
[0018] In some embodiments, the cooling buffer unit 43 is provided with either a water-cooled or air-cooled circulating cooling device.
[0019] In some embodiments, multiple detachable processing chamber modules 5 are radially distributed around the outer periphery of the first main cavity module 2 and the second main cavity module 3, and each processing chamber module 5 is detachably connected to the main cavity module.
[0020] In some embodiments, multiple closed gate valve modules 8 are inclinedly spaced within the first main cavity module 2 and the second main cavity module 3. One end of each closed gate valve module 8 is fixedly connected to the frame structure 7 of the first main cavity module 2 and the second main cavity module 3, and the other end of each closed gate valve module 8 is connected to the input end of each processing chamber module 5. The closed gate valve module 8 is used to open and close the closed gate valve module 8 during the operation of the clamping and conveying device 9, so that the environment between the chambers does not contaminate each other.
[0021] In some embodiments, a support frame 1 is provided below the first main cavity module 2 and the second main cavity module 3. The support frame 1 integrates a gas-liquid supply module 6, which dynamically distributes the process medium to each processing chamber module 5 through branch pipelines.
[0022] Furthermore, the vapor-liquid supply module 6 includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module 5.
[0023] The beneficial effects of this utility model are as follows: This utility model proposes a cooling chamber for a bipolar figure-eight magnetron sputtering machine, including a symmetrically arranged first main chamber module 2 and second main chamber module 3, a clamping and conveying device 9, and a transfer buffer chamber module 4 in the central area. Through a detachable upper fixing plate and independently controlled lifting assembly, the vacuum environment of the main chamber is not affected during equipment maintenance. The cooling buffer unit works in conjunction with the lifting assembly to ensure material cooling efficiency and maintain the environmental stability of the process chamber. The three-dimensional clamping device, in conjunction with the jaws with guide ramps, ensures precise alignment of the material transport path. The dual protection of the limiting structure and guide ramps prevents material deviation during lifting. The combination of the dynamic sealing component and the temperature control device effectively isolates the mutual influence between the process environment and the mechanical drive components. The modular design allows for adaptation to various cooling methods such as water cooling / air cooling to meet different process requirements. Attached Figure Description
[0024] Figure 1 is a schematic diagram of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0025] Figure 2 is a schematic diagram of the connection structure between the transfer buffer chamber module and the frame structure of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0026] Figure 3 is a cross-sectional view showing the connection between the transfer buffer chamber module and the frame structure of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0027] Figure 4 is a schematic diagram of the transfer buffer chamber module of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0028] Figure 5 is a schematic diagram of the transfer buffer chamber module of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0029] Figure 6 is a partially enlarged schematic diagram of the receiving claw of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this utility model.
[0030] Explanation of main component symbols
[0031] Support frame 1, first main cavity module 2, second main cavity module 3, transfer buffer chamber module 4, upper fixed plate 41, lifting material assembly 42, drive cylinder 421, drive connecting rod 422, fixed ring 423, receiving claw 424, sealing bellows assembly 425, cooling buffer unit 43, lower fixed plate 44, guide slope of limiting structure 45, right angle 451, processing chamber module 5, gas-liquid supply module 6, frame structure 7, closed gate valve module 8, clamping and conveying device 9.
[0032] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Specific implementation method, Example 1:
[0033] Figure 1 shows a schematic diagram of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention; Figure 2 shows a schematic diagram of the connection between the transfer buffer chamber module and the frame structure of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention; Figure 3 shows a cross-sectional view of the connection between the transfer buffer chamber module and the frame structure of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention; Figure 4 shows a schematic diagram of the structure of the transfer buffer chamber module of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention; Figure 5 shows a schematic diagram of the structure of the transfer buffer chamber module of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention; Figure 6 shows a partially enlarged schematic diagram of the receiving claw of the cooling cavity of the bipolar figure-eight magnetron sputtering machine of this invention.
[0034] A cooling cavity for a bipolar figure-eight magnetron sputtering machine is characterized by:
[0035] It includes a first main chamber module 2 and a second main chamber module 3 arranged symmetrically. Each first main chamber module 2 and second main chamber module 3 is equipped with an independently controlled clamping and conveying device 9. The clamping and conveying device 9 is a conveying mechanism that can move in three-dimensional space and is used for transferring materials across chambers, as well as a transfer buffer chamber module 4 set in the central area.
[0036] The transit buffer chamber module 4 includes:
[0037] The removable upper fixing plate 41 located at the top forms an equipment maintenance port;
[0038] The lower fixing plate 44 is located at the bottom, and a cooling buffer unit 43 is provided above it. The cooling buffer unit 43 integrates a temperature control device and forms a heat exchange interface with the material contact surface.
[0039] The lifting material assembly 42 is located on one side of the cooling buffer unit 43;
[0040] The working surface of the cooling buffer unit 43 and the movement trajectory of the lifting material assembly 42 form a spatial intersection. Through the coordinated movement of the clamping and conveying device 9 and the lifting material assembly 42, the material transitions between the cooling station and the transmission path.
[0041] Furthermore, the lifting material assembly 42 includes a drive cylinder 421, a drive connecting rod 422, a fixed ring 423, and receiving claws 424. The side of the lower fixed plate 44 is provided with a through hole, and the drive cylinder 421 is provided below the lower fixed plate 44. The drive end of the drive cylinder 421 is provided with a drive connecting rod 422, and the fixed ring 423 is fixedly provided above the drive connecting rod 422. At least three receiving claws 424 are provided around the fixed ring 423 at intervals. When the drive cylinder 421 works, the drive connecting rod 422 passes through the through hole and drives the fixed ring 423 and the receiving claws 424 to move vertically up and down.
[0042] Furthermore, a sealing bellows assembly 425 is also sleeved on the outside of the drive connecting rod 422. The sealing bellows assembly 425 is used to ensure the environmental sealing of the central area above the through hole and prevent the lower part of the lifting material assembly 42 from affecting the vacuum level of the central area.
[0043] Furthermore, the receiving claw 424 has a guide slope 45 with a limiting structure. The receiving claw 424 is provided with a guide slope 45 with a limiting structure near the end of the cooling buffer unit 43, which plays the role of limiting and guiding.
[0044] Furthermore, the bottom of the inwardly inclined ramp 45 forms a right angle 451 with the receiving claw 424 and the end of the cooling buffer unit 43, which serves to further limit the movement.
[0045] In some embodiments, the cooling buffer unit 43 is provided with either a water-cooled or air-cooled circulating cooling device.
[0046] In some embodiments, multiple detachable processing chamber modules 5 are radially distributed around the outer periphery of the first main cavity module 2 and the second main cavity module 3, and each processing chamber module 5 is detachably connected to the main cavity module.
[0047] In some embodiments, multiple closed gate valve modules 8 are inclinedly spaced within the first main cavity module 2 and the second main cavity module 3. One end of each closed gate valve module 8 is fixedly connected to the frame structure 7 of the first main cavity module 2 and the second main cavity module 3, and the other end of each closed gate valve module 8 is connected to the input end of each processing chamber module 5. The closed gate valve module 8 is used to open and close the closed gate valve module 8 during the operation of the clamping and conveying device 9, so that the environment between the chambers does not contaminate each other.
[0048] In some embodiments, a support frame 1 is provided below the first main cavity module 2 and the second main cavity module 3. The support frame 1 integrates a gas-liquid supply module 6, which dynamically distributes the process medium to each processing chamber module 5 through branch pipelines.
[0049] Furthermore, the vapor-liquid supply module 6 includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module 5.
[0050] The beneficial effects of this utility model are as follows: This utility model proposes a cooling chamber for a bipolar figure-eight magnetron sputtering machine, including a symmetrically arranged first main chamber module 2 and second main chamber module 3, a clamping and conveying device 9, and a transfer buffer chamber module 4 in the central area. Through a detachable upper fixing plate and independently controlled lifting assembly, the vacuum environment of the main chamber is not affected during equipment maintenance. The cooling buffer unit works in conjunction with the lifting assembly to ensure material cooling efficiency and maintain the environmental stability of the process chamber. The three-dimensional clamping device, in conjunction with the jaws with guide ramps, ensures precise alignment of the material transport path. The dual protection of the limiting structure and guide ramps prevents material deviation during lifting. The combination of the dynamic sealing component and the temperature control device effectively isolates the mutual influence between the process environment and the mechanical drive components. The modular design allows for adaptation to various cooling methods such as water cooling / air cooling to meet different process requirements.
[0051] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A cooling cavity for a bipolar figure-eight magnetron sputtering machine, characterized in that: The system includes a first main chamber module (2) and a second main chamber module (3) arranged symmetrically. Each first main chamber module (2) and second main chamber module (3) is equipped with an independently controlled clamping and conveying device (9). The clamping and conveying device (9) is a conveying mechanism that can move in three-dimensional space and is used to transfer materials across chambers and a transfer buffer chamber module (4) set in the central area. The transfer buffer chamber module (4) includes: a detachable upper fixed plate (41) at the top, forming an equipment maintenance port; a lower fixed plate (44) at the bottom, on which a cooling buffer unit (43) is provided. The cooling buffer unit (43) integrates a temperature control device and forms a heat exchange interface with the material contact surface; and a lifting material assembly (42) on one side of the cooling buffer unit (43). The working surface of the cooling buffer unit (43) and the movement trajectory of the lifting material assembly (42) form a spatial intersection. Through the coordinated movement of the clamping and conveying device (9) and the lifting material assembly (42), the material transition between the cooling station and the transmission path is realized.
2. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The lifting assembly (42) includes a driving cylinder (421), a driving connecting rod (422), a fixed ring (423), and receiving claws (424). The side of the lower fixed plate (44) is provided with a through hole, and the driving cylinder (421) is provided below the lower fixed plate (44). The driving end of the driving cylinder (421) is provided with a driving connecting rod (422), and a fixed ring (423) is fixedly provided above the driving connecting rod (422). At least three receiving claws (424) are provided around the fixed ring (423). When the driving cylinder (421) works, the driving connecting rod (422) passes through the through hole and drives the fixed ring (423) and the receiving claws (424) to move vertically up and down.
3. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 2, characterized in that: The drive connecting rod (422) is also fitted with a sealing bellows assembly (425) on the outside. The sealing bellows assembly (425) is used to seal the environment of the central area above the through hole and prevent the lifting material assembly (42) from affecting the vacuum level of the central area.
4. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 2, characterized in that: The receiving claw (424) has a guide slope (45) with a limiting structure. The receiving claw (424) is provided with a guide slope (45) with a limiting structure near the end of the cooling buffer unit (43), which plays the role of limiting and guiding.
5. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 4, characterized in that: The bottom of the guide slope (45) with the limiting structure is at a right angle (451) to the receiving claw (424) and the end of the cooling buffer unit (43), which further limits the position.
6. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The cooling buffer unit (43) is equipped with either a water-cooled or air-cooled circulating cooling device.
7. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The outer periphery of the first main cavity module (2) and the second main cavity module (3) has a plurality of detachable processing chamber modules (5) arranged radially, and each processing chamber module (5) is detachably connected to the main cavity module.
8. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: Multiple closed gate valve modules (8) are provided at intervals and inclined inside the first main cavity module (2) and the second main cavity module (3). One end of each closed gate valve module (8) is fixedly connected to the frame structure (7) of the first main cavity module (2) and the second main cavity module (3), and the other end of each closed gate valve module (8) is connected to the input end of each processing chamber module (5). The closed gate valve module (8) is used to open and close the closed gate valve module (8) when the clamping and conveying device (9) is running, so that the environment between the chambers does not pollute each other.
9. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: A support frame (1) is provided below the first main cavity module (2) and the second main cavity module (3). The support frame (1) integrates a gas-liquid supply module (6), which dynamically distributes the process medium to each processing chamber module (5) through branch pipelines.
10. The cooling chamber of the bipolar figure-eight magnetron sputtering machine as described in claim 9, characterized in that: The vapor-liquid supply module (6) includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module (5).
Citation Information
Patent Citations
Sputtering coating system
CN118374778A