Light-emitting light path structure for reducing dispersion of emitted light

Abstract

The utility model relates to a light-emitting light path structure capable of reducing dispersion of emitted light. The light-emitting light path structure is arranged in a circuit board setting area of the dust sensor; the light path passing area of the dust sensor is separated from the circuit board setting area through a partition plate; the light-emitting light path structure comprises a light passing hole, a gap and a light extinction plate. The gap is formed between the partition plate and the light-emitting element; the light passing hole is formed in the partition plate and is coaxial with the optical axis of the light-emitting element; the extinction plate does not exceed the light-emitting element and is opposite to the light-emitting element. The utility model provides the light-emitting light path structure capable of reducing dispersion of emitted light, a lens is not used, a lens film is not needed, the assembly difficulty can be reduced, the assembly efficiency can be improved, and the cost can be saved.

Description

Light emission path structure that reduces light dispersion Technical Field

[0001] This utility model relates to the technical field of dust sensors, and in particular to a light-emitting optical path structure that reduces the dispersion of emitted light. Background Technology

[0002] Dust sensors based on the principle of light scattering are among the most common types. For this type of dust sensor, the emitted light from the light-emitting element should be as parallel as possible before it strikes the dust particles. To achieve this, existing technologies offer two solutions. The first solution involves placing a convex lens in the optical path of the emitted light, as in patent application number 201820231903.4; the focal point of this convex lens coincides with the position of the light-emitting element, thus converting the emitted light into parallel rays. This requires strict control over the relative positions of the convex lens and the light-emitting element during assembly, resulting in cumbersome and difficult assembly, low assembly efficiency, increased assembly components, and higher assembly costs. The second solution involves covering the light-emitting part of the light-emitting element with a thin lens film. While this simplifies assembly and increases efficiency, it is less effective at converting the emitted light into parallel rays. Currently, existing dust sensors lack an optical path structure that balances assembly requirements with reduced light dispersion. Summary of the Invention

[0003] The purpose of this invention is to solve the above-mentioned problems and provide a light-emitting optical path structure that reduces the dispersion of emitted light.

[0004] The technical solution of this utility model is as follows: A light-emitting optical path structure for reducing the dispersion of emitted light is disposed in the circuit board mounting area of ​​a dust sensor; the circuit board is mounted in the circuit board mounting area; the surface of the light-emitting element is mounted on the circuit board; the light path passage area of ​​the dust sensor is separated from the circuit board mounting area by a partition plate; the light path passage area is the part where emitted light is scattered by dust particles; the light-emitting optical path structure includes a light-passing hole, a gap, and an extinction plate; the gap is disposed between the partition plate and the light-emitting element; the light-passing hole is disposed on the partition plate and is coaxial with the optical axis of the light-emitting element; emitted light parallel to the optical axis of the light-emitting element passes through the gap and the light-passing hole and enters the light path passage area; emitted light not parallel to the optical axis of the light-emitting element, i.e., dispersed emitted light, is directed towards the partition plate and remains in the circuit board mounting area; the extinction plate does not exceed the light-emitting element and is opposite to the light-emitting element; emitted light directed towards the partition plate is reflected back to the extinction plate and then reflected again by the extinction plate; the dispersed reflected light is repeatedly reflected in the gap and thus reduced; these dispersed emitted lights will not interfere with the circuit board behind the extinction plate or the electronic components on the circuit board.

[0005] Preferably, the light-passing hole is a flared opening facing the area where the circuit board is set; the diffused emitted light directed towards the wall of the light-passing hole will not enter the area through which the light passes, but will be reflected back and forth between the gaps and reduced.

[0006] Preferably, the partition includes an upper partition and a lower partition that are interlocked to form a structure that is easy to assemble; the upper partition extends downward with a snap tooth; the lower partition is provided with a snap groove that matches and engages with the snap tooth; the dispersed emitted light cannot enter the light path passage area through the gap between the upper partition and the lower partition.

[0007] Preferably, the lower end of the matte plate is provided with an embedding groove that matches the light-emitting element; the light-emitting element is embedded in the embedding groove and is horizontally limited, which improves the positional stability of the light-emitting element and ensures that the light-emitting element emits light stably; the light-emitting part of the light-emitting element passes through the matte plate; in this way, the matte plate provides maximum protection for the circuit board and the electronic components on the circuit board.

[0008] Preferably, if the electronic component is mounted on the upper surface of the circuit board, the space below the circuit board is not afraid of the diffused emitted light entering; the circuit board has a notch; the notch is correspondingly located on the front side of the light-emitting element; the diffused emitted light can enter the space below the circuit board.

[0009] Furthermore, the notch is symmetrically positioned about the light-emitting element, which can guide the dispersed emitted light into the space below the circuit board as much as possible.

[0010] Furthermore, the light-emitting path structure that reduces the dispersion of emitted light also includes a support plate; if some electronic components are also surface-mounted on the lower surface of the circuit board, then the space under the circuit board also needs to be placed to prevent the dispersion of emitted light from causing interference; the support plate is set directly below the light-emitting element, supports the circuit board, and ensures that the light-emitting element is in a stable state, so that the light-emitting element emits emitted light stably; at this time, the lower partition plate is an extension of the upper partition plate, and the support plate is an extension of the light-absorbing plate, and the gap covers the upper and lower spaces of the circuit board to reduce the dispersion of emitted light.

[0011] Furthermore, the light-emitting path structure that reduces the dispersion of emitted light also includes a top plate and a bottom plate; the upper part of the upper partition plate and the upper part of the extinction plate are connected as one unit through the top plate; the lower part of the lower partition plate and the support column are connected as one unit through the bottom plate; this can ensure the stability of the gap space and ensure the reduction effect brought about by repeated reflection of the dispersed emitted light in the gap.

[0012] The beneficial effects of this invention are as follows: The light-emitting optical path structure of this invention, which reduces the dispersion of emitted light, has the following advantages:

[0013] (1) This utility model utilizes the gap between the partition plate and the light-emitting element to direct a portion of the dispersed emitted light toward the partition plate, and then reflect it back to the matting plate, where it is reflected by the matting plate. The dispersed reflected light is repeatedly reflected in the gap and thus reduced. These dispersed emitted lights will not interfere with the circuit board behind the matting plate or the electronic components on the circuit board. This utility model does not use a lens or a lens film, which can reduce assembly difficulty, improve assembly efficiency, save costs, and also ensure a certain effect of reducing the dispersion of emitted light.

[0014] (2) The notch of this utility model introduces the dispersed emitted light into the space below the circuit board; the lower partition is an extension of the upper partition, the support plate is an extension of the matting plate, and the gap covers the upper and lower spaces of the circuit board to disperse and reduce the emitted light. Attached Figure Description

[0015] Figure 1 is a front view of the light-emitting optical path structure of the present invention for reducing the dispersion of emitted light;

[0016] Figure 2 is a cross-sectional view AA of Figure 1;

[0017] Figure 3 is a BB cross-sectional view of Figure 2;

[0018] Figure 4 is a CC cross-sectional view of Figure 2;

[0019] Figure 5 is a side view of Figure 1;

[0020] Figure 6 is a perspective view of the light-emitting optical path structure of the present invention for reducing the dispersion of emitted light;

[0021] In the diagram: 01. Circuit board setting area, 011. Circuit board, 0111. Notch, 012. Light-emitting element, 021. Upper partition, 0211. Clip, 022. Lower partition, 0221. Clip groove, 03. Light path passage area, 1. Light-passing hole, 2. Gap, 3. Matte plate, 31. Mounting groove, 4. Support plate, 5. Top plate, 6. Bottom plate. Detailed Implementation

[0022] Example 1: Referring to Figures 1-6, a light-emitting optical path structure to reduce emitted light dispersion is provided in the circuit board setting area 01 of the dust sensor; the circuit board 011 is mounted in the circuit board setting area 01; the surface of the light-emitting element 012 is mounted on the circuit board 011; the light path passing area 03 of the dust sensor is separated from the circuit board setting area 01 by a partition plate; the light path passing area 03 is the part where emitted light is scattered by dust particles; the light-emitting optical path structure includes a light-passing hole 1, a gap 2, and an extinction plate 3; the gap 2 is located between the partition plate and the light-emitting element 012; the light-passing hole 1 is located on the partition plate, and the light from the light-emitting element 012 is scattered by the light-emitting element 012. The light source is coaxially arranged; the emitted light parallel to the optical axis of the light-emitting element 012 passes through the gap 2 and the light-passing hole 1 and enters the light path passage area 03; the emitted light that is not parallel to the optical axis of the light-emitting element 012, i.e., the dispersed emitted light, is directed towards the partition plate and remains in the circuit board setting area 01; the matting plate 3 is set not beyond the light-emitting element 012 and is opposite to the light-emitting element 012; the emitted light directed towards the partition plate is reflected back to the matting plate 3, and then reflected again by the matting plate 3; the dispersed reflected light is repeatedly reflected in the gap 2 and thus reduced; these dispersed emitted lights will not interfere with the circuit board 011 behind the matting plate 3 and the electronic components on the circuit board 011.

[0023] Compared with the prior art, the present invention provides a light-emitting optical path structure that reduces the dispersion of emitted light. This light-emitting optical path structure utilizes the gap 2 between the partition plate and the light-emitting element 012 to direct a portion of the dispersed emitted light toward the partition plate, which then reflects it back to the extinction plate 3 and is reflected by the extinction plate 3. The dispersed reflected light is repeatedly reflected in the gap 2 and thus reduced. This dispersed emitted light will not interfere with the circuit board 011 behind the extinction plate 3 or the electronic components on the circuit board 011. The present invention does not use a lens or a lens film, which can reduce the assembly difficulty, improve the assembly efficiency, save costs, and also ensure a certain effect of reducing the dispersion of emitted light.

[0024] The light-passing hole 1 is a horn-shaped opening facing the circuit board setting area 01; the scattered emitted light that hits the hole wall of the light-passing hole 1 will not enter the light path passing area 03, but will be reflected back and forth between the gaps 2 and reduced.

[0025] The partition includes an upper partition 021 and a lower partition 022 that are interlocked, forming a structure that is easy to assemble; the upper partition 021 extends downward with a snap tooth 0211; the lower partition 022 is provided with a snap groove 0221 that matches and engages with the snap tooth 0211; the dispersed emitted light cannot enter the light path passage area 03 through the gap between the upper partition 021 and the lower partition 022.

[0026] The lower end of the matting plate 3 is provided with an insert groove 31 that matches the light-emitting element 012; the light-emitting element 012 is inserted into the insert groove 31 and is horizontally limited, which improves the positional stability of the light-emitting element 012 and ensures that the light-emitting element 012 emits light stably; the light-emitting part of the light-emitting element 012 passes through the matting plate 3; in this way, the matting plate 3 provides maximum protection for the circuit board 011 and the electronic components on the circuit board 011.

[0027] If the electronic component is mounted on the upper surface of the circuit board 011, the space below the circuit board 011 is not afraid of the diffused emitted light entering; the circuit board 011 has a notch 0111; the notch 0111 is correspondingly located on the front side of the light-emitting element 012; the diffused emitted light can enter the space below the circuit board 011.

[0028] The notch 0111 is symmetrically arranged about the light-emitting element 012, which can guide the dispersed emitted light into the space below the circuit board 011 as much as possible.

[0029] The light-emitting path structure that reduces the dispersion of emitted light also includes a support plate 4. If some electronic components are also surface-mounted on the lower surface of the circuit board 011, then the space under the circuit board 011 also needs to be placed to prevent the dispersion of emitted light from causing interference. The support plate 4 is located directly below the light-emitting element 012, supporting the circuit board 011 and ensuring that the light-emitting element 012 is in a stable state and emits emitted light stably. At this time, the lower partition 022 serves as an extension of the upper partition 021, and the support plate 4 serves as an extension of the light-absorbing plate 3. The gap 2 covers the upper and lower spaces of the circuit board 011 and is used to reduce the dispersion of emitted light.

[0030] The working principle of this embodiment is as follows: Light emitted parallel to the optical axis of the light-emitting element 012 passes through the gap 2 and the light-passing aperture 1, entering the optical path passage area 03. Referring to Figures 2 and 3, light emitted that is not parallel to the optical axis of the light-emitting element 012, i.e., dispersed light, is directed towards the partition plate and remains in the circuit board setting area 01. The light emitted towards the partition plate is reflected back to the extinction plate 3, and then reflected again. The dispersed reflected light is repeatedly reflected in the gap 2, thus being reduced. The solid arrows in Figure 2 clearly show the optical path of the dispersed light. This dispersed light will not interfere with the circuit board 011 behind the extinction plate 3 or the electronic components on the circuit board 011. Dispersed light directed towards the wall of the light-passing aperture 1 will not enter the optical path passage area 03, but will be reflected back and forth between the gaps 2 and reduced. The dashed arrows in Figures 2 and 3 clearly show the light path of the dispersed emitted light directed toward the wall of the light-passing aperture 1; the notch 0111 introduces the dispersed emitted light into the space below the circuit board 011; the lower partition 022 is an extension of the upper partition 021, the support plate 4 is an extension of the light-absorbing plate 3, and the gap 2 covers the upper and lower spaces of the circuit board 011 to reduce the dispersed emitted light.

[0031] Example 2: Example 2 is basically the same as Example 1, and the similarities will not be repeated. The difference is that the light-emitting path structure that reduces the dispersion of emitted light also includes a top plate 5 and a bottom plate 6; the upper end of the upper partition 021 and the upper end of the extinction plate 3 are connected as one unit through the top plate 5; the lower end of the lower partition 022 and the support column are connected as one unit through the bottom plate 6; this can ensure the stability of the gap 2 space and ensure the reduction effect brought about by the repeated reflection of the dispersed emitted light in the gap 2.

Claims

1. A light emitting light path structure for reducing dispersion of emitted light, characterized by, The light path of the dust sensor is set in the circuit board area; the light path area of ​​the dust sensor is separated from the circuit board area by a partition plate; the light path structure includes a light-passing hole, a gap, and an anti-glare plate; the gap is set between the partition plate and the light-emitting element; the light-passing hole is set on the partition plate and is coaxial with the light axis of the light-emitting element; the anti-glare plate does not exceed the light-emitting element and is opposite to the light-emitting element.

2. A light emitting light path structure to reduce dispersion of emitted light according to claim 1, characterized in that: The light-passing hole is a horn-shaped opening facing the area set on the circuit board.

3. The light-emitting optical path structure for reducing emitted light dispersion according to claim 1, characterized in that: The partition includes an upper partition and a lower partition that are interlocked; the upper partition extends downward with a snap fastener; the lower partition has a snap groove that matches and engages with the snap fastener.

4. The light emission path structure for reducing dispersion of emitted light according to claim 1, characterized by: The lower end of the matte plate is provided with an insert groove that matches the light-emitting element; the light-emitting element is inserted into the insert groove; the light-emitting part of the light-emitting element passes through the matte plate.

5. A light emitting light path structure for reducing dispersion of emitted light according to claim 1 or 3, characterized in that: The circuit board has a notch; the notch is located on the front side of the light-emitting element.

6. A light emitting light path structure to reduce dispersion of emitted light according to claim 5, wherein: The notch is symmetrically positioned about the light-emitting element.

7. The light-emitting optical path structure for reducing emitted light dispersion according to claim 6, characterized in that: It also includes a support plate; the support plate is positioned directly below the light-emitting element and supports the circuit board.

8. The light-emitting optical path structure for reducing emitted light dispersion according to claim 7, characterized in that: It also includes a top plate and a bottom plate; the upper part of the upper partition plate and the upper part of the matte plate are connected as one unit through the top plate; the lower part of the lower partition plate and the support column are connected as one unit through the bottom plate.

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