Condenser, thermosyphon radiator and power conversion equipment

Abstract

The utility model discloses a condenser, a thermosyphon radiator and power conversion equipment, the condenser comprises a condensation heat exchange part and an air-air heat exchange part, the condensation heat exchange part is provided with a condensation cavity, and the condensation cavity is used for communicating with an evaporator of the thermosyphon radiator; the air-air heat exchange part is arranged on the condensation heat exchange part and is provided with an air heat exchange cavity which is not communicated with the condensation cavity, the air heat exchange cavity is provided with an air inlet and an air outlet, and the air inlet and the air outlet are used for being communicated with an inner cavity of the electrical case in a circulating mode. The condensation cavity of the condensation heat exchange part is communicated with the evaporator, the basic heat dissipation function of the thermosyphon radiator can be met, the air heat exchange cavity of the air-air heat exchange part is communicated with the inner cavity of the electrical case in a circulating mode, heat dissipation of the internal environment temperature of the electrical case can be achieved, the environment temperature of operation of internal devices of the electrical case is reduced, and the service life of the electrical case is prolonged. And the operation life and the operation efficiency of internal devices can be improved.

Description

Technical Field

[0001] This application relates to the field of electrical chassis heat dissipation technology, and more specifically, to a condenser, a thermosiphon radiator, and a power conversion device. Background Technology

[0002] Current thermosiphon radiators mainly address the heat dissipation problem of the power module itself, but cannot meet the ambient temperature heat dissipation needs inside the electrical chassis. However, excessively high ambient temperature inside the electrical chassis can also affect the operating efficiency of the power conversion equipment.

[0003] In summary, how to solve the problem that the internal ambient temperature of the electrical enclosure cannot be adequately cooled when using a thermosiphon radiator has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, this application provides a condenser, a thermosiphon radiator, and a power conversion device to solve the problem that the thermosiphon radiator cannot meet the internal ambient temperature heat dissipation requirements of the electrical enclosure.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A condenser, used in a thermosiphon radiator, comprising:

[0007] The condensing heat exchange section has a condensing chamber, which is used to communicate with the evaporator of the thermosiphon radiator;

[0008] An air-to-air heat exchange section is provided in the condensation heat exchange section and has an air heat exchange chamber that is not interconnected with the condensation chamber. The air heat exchange chamber has an air inlet and an air outlet, which are used to circulate with the inner cavity of the electrical chassis.

[0009] In some embodiments of this application, the air-to-air heat exchange section is disposed on the outer surface of the condensation heat exchange section.

[0010] In some embodiments of this application, the air-to-air heat exchange section and the condensation heat exchange section are arranged along a first direction;

[0011] Alternatively, the air-to-air heat exchange section and the condensation heat exchange section are arranged along the second direction;

[0012] Alternatively, the air-to-air heat exchange section and the condensation heat exchange section are arranged along a third direction;

[0013] Wherein, the first direction is the length direction of the condensation heat exchange section, the second direction is the height direction of the condensation heat exchange section, and the third direction is the thickness direction of the condensation heat exchange section.

[0014] In some embodiments of this application, the condensation heat exchange section includes a condensation body, a gas collecting chamber, and a liquid collecting chamber. The gas collecting chamber is connected to the evaporator through a gas pipeline, and the liquid collecting chamber is connected to the evaporator through a liquid pipeline.

[0015] In some embodiments of this application, the condensation body is configured as a microchannel heat dissipation structure.

[0016] In some embodiments of this application, the air-to-air heat exchange section includes a heat dissipation main body, a first ventilation cavity, and a second ventilation cavity.

[0017] In some embodiments of this application, the heat dissipation body is configured as a microchannel heat dissipation structure.

[0018] In some embodiments of this application, the heat dissipation main body and the condensation main body are constructed as an integral structure and are not interconnected, the first ventilation cavity and the gas collection cavity are arranged adjacent to each other and are not interconnected, and the second ventilation cavity and the liquid collection cavity are arranged adjacent to each other and are not interconnected.

[0019] In some embodiments of this application, the air outlet is disposed in the first ventilation cavity, and the air inlet is disposed in the second ventilation cavity.

[0020] In some embodiments of this application, the condenser further includes a cooling fan assembly, which is disposed on the side of the condensation heat exchange section and the air-to-air heat exchange section away from the electrical chassis, and is used to perform air cooling on the condensation heat exchange section and the air-to-air heat exchange section.

[0021] To address the issue that thermosiphon radiators cannot adequately dissipate the internal ambient temperature of electrical enclosures, this application provides a condenser for use with thermosiphon radiators. The condenser includes a condensation heat exchange section and an air-to-air heat exchange section. The condensation heat exchange section has a condensation chamber that communicates with the evaporator of the thermosiphon radiator. The air-to-air heat exchange section is located within the condensation heat exchange section and has an air heat exchange chamber that is not interconnected with the condensation chamber. The air heat exchange chamber has an air inlet and an air outlet that are circulated with the internal cavity of the electrical enclosure. In practical applications, by applying the aforementioned condenser to the thermosiphon radiator, the thermosiphon radiator dissipates heat from the electrical chassis. The condenser chamber of the condenser heat exchange section is connected to the evaporator, thus fulfilling the basic heat dissipation function of the thermosiphon radiator, i.e., meeting the heat dissipation requirements of the power modules inside the electrical chassis. The air heat exchange chamber of the air-to-air heat exchange section is circulated with the internal cavity of the electrical chassis, enabling heat dissipation of the internal ambient temperature of the electrical chassis. This reduces the operating temperature of the internal components, helping to improve their lifespan and operating efficiency. Furthermore, since the air-to-air heat exchange section is located within the condenser heat exchange section, both can share a single cooling fan assembly when external fans are needed for heat dissipation.

[0022] This application also provides a thermosiphon radiator, including an evaporator and a condenser, wherein the condenser is the condenser described in any of the above embodiments. Since the aforementioned condenser has the above-mentioned technical effects, the thermosiphon radiator having this condenser should also have corresponding technical effects, which will not be elaborated further here.

[0023] This application also provides a power conversion device, including an electrical enclosure and a thermosiphon radiator disposed within the electrical enclosure, wherein the thermosiphon radiator is the thermosiphon radiator described in any of the above embodiments. Since the aforementioned thermosiphon radiator has the above-mentioned technical effects, the power conversion device having this thermosiphon radiator should also have corresponding technical effects, which will not be elaborated further here.

[0024] In some embodiments of this application, the power conversion device further includes a circulating fan for powering the airflow circulation between the inner cavity of the electrical enclosure and the air heat exchange cavity.

[0025] In some embodiments of this application, the circulating fan is disposed inside the electrical enclosure and arranged close to the air inlet;

[0026] Alternatively, the circulating fan may be installed inside the electrical enclosure and positioned close to the air outlet.

[0027] Alternatively, the circulating fan may be located in the air heat exchange chamber.

[0028] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the isometric structure of a thermosiphon radiator installed in an electrical chassis, as provided in an embodiment of this application.

[0031] Figure 2 A schematic diagram of the side structure of the thermosiphon radiator installed in the electrical chassis according to an embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the structure of the thermosiphon radiator provided in the embodiments of this application;

[0033] Figure 4 A schematic diagram of a structure in which the condensation heat exchange section and the air-to-air heat exchange section are arranged side by side in a first direction, as provided in an embodiment of this application;

[0034] Figure 5 Another structural schematic diagram showing the condensation heat exchange section and the air-to-air heat exchange section arranged side by side in the first direction, as provided in the embodiments of this application;

[0035] Figure 6 This is a schematic diagram of the structure provided in this application, showing the condensation heat exchanger and the air-to-air heat exchanger arranged side by side in the third direction.

[0036] in, Figures 1-6 middle:

[0037] 1-Condenser;

[0038] 11-Condensation heat exchange section;

[0039] 111 - Condenser main body;

[0040] 112 - Gas collection chamber;

[0041] 113 - Liquid collection chamber;

[0042] 12-Air-to-Air Heat Exchanger;

[0043] 120 - Air heat exchange chamber;

[0044] 120a - Air inlet;

[0045] 120b - Air outlet;

[0046] 121 - Heat dissipation main body;

[0047] 122 - First ventilation chamber;

[0048] 123 - Second ventilation chamber;

[0049] 13-Gas piping;

[0050] 14-Liquid piping;

[0051] 15 - Cooling fan assembly;

[0052] 2-Evaporator;

[0053] 3-Electrical enclosure;

[0054] 30-Power Module;

[0055] 4- Circulating fan. Detailed Implementation

[0056] The core of this application is to provide a condenser, a thermosiphon radiator, and a power conversion device to solve the problem that the thermosiphon radiator cannot meet the internal ambient temperature heat dissipation requirements of the electrical enclosure.

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] To enable those skilled in the art to better understand the technical solutions provided by this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0059] In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0060] In existing technologies, thermosiphon radiators are commonly used on the electrical chassis of power conversion equipment for heat dissipation, thus better meeting the heat dissipation requirements of high-power applications. Those skilled in the art should be familiar with the basic working principle of thermosiphon radiators. A thermosiphon radiator generally includes an evaporator and a condenser. The evaporator is in close contact with the power module inside the electrical chassis for heat exchange. This design significantly improves the heat dissipation efficiency of the power module. The condenser's condensing chamber is connected to the evaporator. Specifically, the evaporator absorbs heat from the power module, causing the cooling medium inside the evaporator to turn into a gas. This gas is then led to the condensing chamber of the condenser through a gas pipe. The condensing chamber has a heat dissipation function; the gaseous cooling medium, after being cooled by the condenser, becomes a liquid and then flows back to the evaporator through a liquid pipe. This cycle of cooling medium continuously dissipates heat from the power module. However, current thermosiphon radiators mainly solve the heat dissipation problem of the power module itself, and cannot meet the ambient temperature heat dissipation inside the electrical chassis. There are usually some internal components installed inside the electrical chassis, and these internal components also need to have certain heat dissipation requirements. If the ambient temperature inside the electrical chassis is too high, it will also affect the operating efficiency and service life of the power conversion equipment.

[0061] Based on this, one embodiment of this application provides a condenser for use in a thermosiphon radiator. By equipping the thermosiphon radiator with the condenser provided in this application, not only can the heat dissipation requirements of the thermosiphon radiator for the power module be met, but the heat dissipation of the internal ambient temperature of the electrical enclosure can also be met.

[0062] Specifically, refer to Figure 1 and Figure 2 The condenser 1 specifically includes a condensation heat exchange section 11 and an air-to-air heat exchange section 12. The condensation heat exchange section 11 has a condensation chamber, which is connected to the evaporator 2 of the thermosiphon radiator to circulate and dissipate heat from the cooling medium. Specifically, the cooling medium, heated and turned into gas in the evaporator 2, is guided to the condensation chamber through a gas pipeline 13, and the cooling medium, condensed and turned into liquid in the condensation chamber, is guided to the evaporator 2 through a liquid pipeline 14.

[0063] It should be noted that, in order to better guide the gas cooling medium through the gas pipeline 13, one end of the gas pipeline 13 is usually connected to the upper part of the evaporator 2, and the other end of the gas pipeline 13 is connected to the upper part of the condenser cavity, because the gas cooling medium will collect above the corresponding cavity; in order to better guide the liquid cooling medium through the liquid pipeline 14, one end of the liquid pipeline 14 is usually connected to the lower part of the condenser cavity, and the other end of the liquid pipeline 14 is connected to the lower part of the evaporator 2, because the liquid cooling medium will collect below the corresponding cavity.

[0064] It is worth mentioning that the specific number of gas pipelines 13 and liquid pipelines 14 is not limited and can be configured according to actual needs. For example, it can be designed as follows: Figure 1 The gas pipeline 13 shown is configured with 3 lines, and the liquid pipeline 14 is configured with 2 lines.

[0065] An air-to-air heat exchange section 12 is disposed on the condenser heat exchange section 11 and has an air heat exchange chamber 120 that is not interconnected with the condenser chamber. The air-to-air heat exchange section 12 is disposed on the condenser heat exchange section 11 by, but is not limited to, welding, fastener connection, etc. The air heat exchange chamber 120 has an air inlet 120a and an air outlet 120b, which are used for circulating communication with the inner cavity of the electrical enclosure 3. The air inlet 120a and air outlet 120b of the air heat exchange chamber 120 can be specifically configured to... The air can be fixed to the wall of the electrical enclosure 3 by means of welding, fasteners, etc. The airflow inside the electrical enclosure 3 can enter the air heat exchange chamber 120 through the air inlet 120a. The air heat exchange chamber 120 can use the external airflow of the electrical enclosure 3 to dissipate heat and cool down the airflow inside the air heat exchange chamber 120. Then the cooled airflow can enter the electrical enclosure 3 through the air outlet 120b. This cycle can achieve the cooling of the internal airflow of the electrical enclosure 3.

[0066] In practical applications, by applying the aforementioned condenser 1 to the thermosiphon radiator, when the thermosiphon radiator dissipates heat to the electrical chassis 3, the condensing chamber of the condensing heat exchange section 11 is connected to the evaporator 2, which can meet the basic heat dissipation function of the thermosiphon radiator, that is, meet the heat dissipation requirements of the power module 30 inside the electrical chassis 3. The air heat exchange chamber 120 of the air-to-air heat exchange section 12 is circulated and connected to the inner cavity of the electrical chassis 3, which can dissipate the internal ambient temperature of the electrical chassis 3, reduce the ambient temperature of the internal components of the electrical chassis 3, and help improve the service life and operating efficiency of the internal components. In addition, since the air-to-air heat exchange section 12 is located on the condensing heat exchange section 11, when both need to be equipped with external fans for heat dissipation, they can share a set of cooling fan group 15.

[0067] In some specific implementation plans, refer to Figure 1 and Figure 3 As shown, the aforementioned empty heat exchange section 12 can be specifically disposed on the outer surface of the condensing heat exchange section 11, and the number of empty heat exchange sections 12 is not limited. Specifically, "empty heat exchange section 12 disposed on the outer surface of the condensing heat exchange section 11" means that when the user faces the wall of the electrical enclosure 3 where the thermosiphon radiator is located, the empty heat exchange section 12 is disposed on any one or more of the front, back, left, right, upper, and lower surfaces of the condensing heat exchange section 11. By designing the empty heat exchange section 12 on the outer surface of the condensing heat exchange section 11, it is easier to manufacture the empty heat exchange section 12 on the condensing heat exchange section 11. For example, the heat dissipation body 121 of the empty heat exchange section 12 and the condensing body 111 of the condensing heat exchange section 11 can be more easily manufactured into an integrated structure.

[0068] For example, refer to Figure 4 and Figure 5 As shown, the air-to-air heat exchange section 12 and the condensation heat exchange section 11 can be specifically designed to be arranged along the first direction (for example, the air-to-air heat exchange section 12 and the condensation heat exchange section 11 are arranged in a straight line or staggered in the first direction), specifically as shown in the reference. Figure 4 The condenser heat exchanger 11 shown has an empty heat exchanger 12 on one side, which can also be referred to Figure 5 The condenser heat exchanger 11 shown has air-to-air heat exchangers 12 on both sides. Of course, the air-to-air heat exchangers 12 and the condenser heat exchangers 11 can also be designed to be arranged along the second direction (for example, the air-to-air heat exchangers 12 and the condenser heat exchangers 11 are arranged in a straight line or staggered in the second direction). This arrangement is not shown in the accompanying drawings, but it does not affect the understanding of the solution by those skilled in the art. Additionally, refer to... Figure 6 As shown, the air-to-air heat exchange section 12 and the condensation heat exchange section 11 can also be designed to be arranged along a third direction (for example, the air-to-air heat exchange section 12 and the condensation heat exchange section 11 are arranged in a straight line or staggered in the third direction). Here, the first direction specifically refers to the length direction of the condensation heat exchange section 11, the second direction specifically refers to the height direction of the condensation heat exchange section 11, and the third direction specifically refers to the thickness direction of the condensation heat exchange section 11.

[0069] It is understood that the arrangement of the air-to-air heat exchange section 12 on the outer surface of the condensing heat exchange section 11 is merely an example of an embodiment in this application. In actual applications, it can also be positioned in the middle of the condensing heat exchange section 11, with a window corresponding to the middle of the condensing heat exchange section 11, and the air-to-air heat exchange section 12 disposed within this window. No diagrams are provided for this structure, but it does not affect the understanding of the solution by those skilled in the art. In specific applications, the arrangement can be chosen according to requirements, and no further specific limitations are made here.

[0070] It is worth mentioning that the number of air-to-air heat exchange units 12 can be selected and arranged according to actual needs, and no specific limit is made here.

[0071] For example, refer to Figure 1 and Figure 5 As shown, there are two air-to-air heat exchange sections 12, and the two air-to-air heat exchange sections 12 are respectively arranged on two opposite sides of the condensation heat exchange section 11 in the first direction. It can be understood that when there are two air-to-air heat exchange sections 12, the arrangement of the two air-to-air heat exchange sections 12 on the condensation heat exchange section 11 is not limited to two opposite sides in the first direction. For example, it can also be designed as two opposite sides in the second direction.

[0072] Another example, see reference Figure 3 and Figure 4 As shown, the number of air-to-air heat exchange sections 12 can also be one, and it can be arranged on any one side of the outer surface of the condensation heat exchange section 11.

[0073] In some specific implementation plans, refer to Figure 4 and Figure 5 As shown, the condensing heat exchange section 11 includes a condensing main body 111, a gas collecting chamber 112 and a liquid collecting chamber 113. The gas collecting chamber 112 is connected to the evaporator 2 through a gas pipeline 13, and the liquid collecting chamber 113 is connected to the evaporator 2 through a liquid pipeline 14.

[0074] Specifically, the gas collecting chamber 112 can be disposed above the condenser body 111, and the liquid collecting chamber 113 can be disposed below the condenser body 111. Here, "above" and "below" refer to the position of the condenser heat exchanger 11 in the installed state, relative to the condenser body 111 in the direction of gravity, which corresponds to the second direction in the attached figure. Designing the condenser heat exchanger 11 in the above-described structural form offers several advantages: First, it improves heat exchange efficiency. By arranging the gas collecting chamber 112 above the condenser body 111, it facilitates the collection and guidance of high-temperature gas into the condenser 1. Similarly, by arranging the liquid collecting chamber 113 below the condenser body 111, it facilitates the collection and discharge of condensed liquid. This design optimizes the gas-liquid flow path, contributing to improved heat exchange efficiency. Second, it reduces flow resistance. Separate gas and liquid collection reduces mutual interference during flow, lowering flow resistance and making the system operate more smoothly. Third, it prevents gas-liquid mixing. The separation design avoids gas and liquid mixing within the condenser, reducing bubble retention and improving condensation efficiency. Fourth, it simplifies the structural design. Separate gas and liquid collection simplifies the internal structure of the condenser, facilitating manufacturing and maintenance. Fifth, it enhances system stability. The separation design helps stabilize gas-liquid flow, reduces pressure fluctuations, and improves system operational stability. Sixth, it facilitates maintenance and repair. The separation design makes the gas and liquid paths clear, facilitating inspection and maintenance and reducing maintenance costs. In summary, this design improves heat exchange efficiency, reduces flow resistance, prevents gas-liquid mixing, simplifies the structure, enhances stability, and facilitates maintenance.

[0075] In a further implementation plan, refer to Figure 4 and Figure 5 As shown, the aforementioned condenser body 111 can be specifically configured as a microchannel heat dissipation structure. By designing the condenser body 111 as a microchannel heat dissipation structure, the heat exchange area can be increased, which helps to improve heat exchange efficiency. Furthermore, the structure is compact, reducing the amount of cooling fluid required. Additionally, the microchannel structure has low thermal inertia, enabling rapid response to changes in heat load. It is understood that, besides being designed as a microchannel heat dissipation structure, the condenser body 111 can also be selected from other structural forms such as shell-and-tube, plate, and finned types, depending on the requirements; no further specific limitations are made here.

[0076] In some other specific implementation schemes, refer to Figure 4 and Figure 5As shown, the aforementioned air-to-air heat exchange section 12 may specifically include a heat dissipation main body 121, a first ventilation cavity 122, and a second ventilation cavity 123. The first ventilation cavity 122 may be disposed above the heat dissipation main body 121, and the second ventilation cavity 123 may be disposed below the heat dissipation main body 121. Here, "above" and "below" refer to the air-to-air heat exchange section 12 in its installed state, relative to the heat dissipation main body 121 in the direction of gravity. In this case, the direction of gravity corresponds to the second direction shown in the attached figure.

[0077] Designing the air-to-air heat exchange section 12 with the aforementioned structure also offers several advantages: First, it optimizes airflow organization. The first ventilation cavity 122 guides hot air into the heat dissipation body 121, ensuring uniform airflow distribution and improving heat exchange efficiency. The second ventilation cavity 123 collects and discharges cooled air, preventing airflow turbulence and reducing pressure drop. Second, it improves heat exchange efficiency. The ventilation cavity design ensures sufficient air contact with the heat dissipation body 121, increasing the effective heat exchange area and improving overall efficiency. Third, it reduces flow resistance. The ventilation cavity makes the airflow path smoother, reducing flow resistance and lowering fan energy consumption. Fourth, it enhances heat dissipation. The design offers several advantages: First, it improves heat dissipation by introducing hot air into the upper ventilation cavity and expelling cold air from the lower cavity, creating natural convection. Second, it features a compact structure, integrating the main heat dissipation unit 121 and the ventilation cavity, saving space and making it suitable for compact installation environments. Third, it facilitates maintenance by simplifying the internal structure of the ventilation cavity, making cleaning and maintenance easier and extending equipment lifespan. Fourth, it is highly adaptable, allowing for flexible adjustments to accommodate different airflow volumes and heat dissipation needs. Fifth, it reduces noise by minimizing airflow turbulence, lowering operating noise, and enhancing the user experience. Sixth, it improves reliability by reducing localized overheating through optimized airflow organization, increasing heat exchange efficiency, reducing flow resistance, enhancing heat dissipation, and providing a compact, easy-to-maintain, adaptable, noise-reducing, and reliability-enhancing design.

[0078] In a further implementation plan, refer to Figure 4 and Figure 5 As shown, the aforementioned heat dissipation body 121 can be specifically constructed as a microchannel heat dissipation structure. By designing the heat dissipation body 121 as a microchannel heat dissipation structure, the heat exchange area can be increased, which helps to improve heat exchange efficiency. Furthermore, the structure is compact, reducing the amount of cooling fluid required. Additionally, the microchannel structure has low thermal inertia, enabling rapid response to changes in heat load. It is understood that, besides being designed as a microchannel heat dissipation structure, the heat dissipation body 121 can also be selected from other structural forms such as tubular, plate, or finned types, depending on the requirements; no further specific limitations are made here.

[0079] In some other specific implementation schemes, refer to Figure 4 and Figure 5 As shown, the aforementioned heat dissipation main body 121 and condensation main body 111 can be constructed as an integral structure and are not interconnected. The first ventilation cavity 122 and the gas collection cavity 112 are arranged adjacent to each other and are not interconnected, and the second ventilation cavity 123 and the liquid collection cavity 113 are arranged adjacent to each other and are not interconnected. For example, the first ventilation cavity 122 is located at the end of the gas collection cavity 112 in the first direction, and the second ventilation cavity 123 is located at the end of the liquid collection cavity 113 in the first direction. By designing the structure as described above, the structure becomes more compact and easier to manufacture.

[0080] In a further implementation plan, refer to Figure 4 As shown, the air outlet 120b can be specifically located in the first ventilation chamber 122, and the air inlet 120a can be located in the second ventilation chamber 123. Since the first ventilation chamber 122 is adjacent to the gas collecting chamber 112 (e.g., arranged side-by-side in the first direction), the cooling medium in the gas collecting chamber 112 is high-temperature gas, which will heat the first ventilation chamber 122 through heat conduction. The second ventilation chamber 123 is adjacent to the liquid collecting chamber 113 (e.g., arranged side-by-side in the first direction), and the cooling medium in the liquid collecting chamber 113 is low-temperature liquid. By setting the air inlet 120a and air outlet 120b... By adopting the above-mentioned structural form, the temperature influence of the condensation heat exchange section 11 on the air-to-air heat exchange section 12 can be reduced. This is because the air inside the electrical chassis 3 will first enter the second ventilation chamber 123 through the air inlet 120a, while the temperature of the liquid collection chamber 113 is relatively low and will hardly affect the temperature of the second ventilation chamber 123. After entering the heat dissipation body 121 through the second ventilation chamber 123, the heat dissipation structure of the heat dissipation body 121 can exchange heat with the air in the external environment of the electrical chassis 3 to achieve heat dissipation. The cooled air finally enters the electrical chassis 3 through the first ventilation chamber 122 to achieve heat dissipation of the internal cavity of the electrical chassis 3.

[0081] It is understood that the arrangement of the air inlet 120a and air outlet 120b described above is merely an example of an embodiment of this application. In actual applications, other arrangements can be designed, such as the air inlet 120a being arranged in the first ventilation cavity 122 and the air outlet 120b being arranged in the second ventilation cavity 123. In this arrangement, although the air inside the electrical chassis 3 will be heated to a certain extent after entering the first ventilation cavity 122, the heat exchange between the heat dissipation structure of the heat dissipation body 121 and the external air of the electrical chassis 3, followed by heat absorption by the lower-temperature liquid collection cavity 113 into the second ventilation cavity 123, can still meet the heat dissipation requirements of the air inside the electrical chassis 3. In actual applications, the arrangement can be selected according to actual needs, and no more specific limitations are made here.

[0082] In some other specific implementation schemes, refer to Figure 2 Combination Figure 1 As shown, the condenser 1 may further include a cooling fan assembly 15. The cooling fan assembly 15 is disposed on the side of the condensing heat exchange section 11 and the air-to-air heat exchange section 12 away from the electrical chassis 3, and is used to provide air cooling for the condensing heat exchange section 11 and the air-to-air heat exchange section 12. By configuring the cooling fan assembly 15, the heat exchange efficiency between the condensing heat exchange section 11 and the air-to-air heat exchange section 12 and the external air of the electrical chassis 3 can be accelerated, which helps to improve the heat dissipation effect. The specific number of cooling fans included in the cooling fan assembly 15 can be selected and configured according to actual needs, as long as the corresponding heat dissipation requirements are met.

[0083] In addition, this application embodiment also provides a thermosiphon radiator, including an evaporator 2 and a condenser 1, wherein the condenser 1 is the condenser 1 described in any of the above-mentioned solutions. Since the aforementioned condenser 1 has the above-mentioned technical effects, the thermosiphon radiator having the condenser 1 should also have the corresponding technical effects, and no specific limitation is made here.

[0084] Furthermore, this application also provides a power conversion device, which specifically includes an electrical enclosure 3 and a thermosiphon radiator disposed in the electrical enclosure 3. The thermosiphon radiator is the thermosiphon radiator described in the above scheme. Since the aforementioned thermosiphon radiator has the above-mentioned technical effects, the power conversion device having the thermosiphon radiator should also have the corresponding technical effects, which will not be elaborated here.

[0085] It is worth mentioning that the power conversion equipment in this application can be an inverter or other types of power conversion equipment, including but not limited to rectifiers, DC-DC converters, frequency converters, AC-AC converters, uninterruptible power supplies, static var compensators, active power filters, power quality conditioners, motor drivers, photovoltaic inverters, energy storage systems, and wireless power transmission systems, which are widely used in various fields.

[0086] In a further implementation plan, refer to Figure 2As shown, the power conversion device may further include a circulating fan 4, which is mainly used to provide power for the airflow circulation between the inner cavity of the electrical enclosure 3 and the air heat exchange chamber 120. Specifically, the circulating fan 4 can be installed inside the electrical enclosure 3, and can be arranged near the air inlet 120a or near the air outlet 120b of the air heat exchange chamber 120. In actual application, the arrangement can be selected according to actual layout requirements, and no specific limitation is made here. In addition, the circulating fan 4 can also be installed inside the air heat exchange chamber 120. For example, when the air heat exchange chamber 120 is composed of a heat dissipation body 121, a first ventilation chamber 122, and a second ventilation chamber 123, the circulating fan 4 can be designed in the first ventilation chamber 122 and / or the second ventilation chamber 123.

[0087] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0088] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0089] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0090] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A condenser applied to a thermosiphon radiator, characterized in that, include: The condensing heat exchange section (11) has a condensing chamber for communicating with the evaporator (2) of the thermosiphon radiator; An air heat exchange section (12) is provided in the condensation heat exchange section (11) and has an air heat exchange chamber (120) that is not interconnected with the condensation chamber. The air heat exchange chamber (120) has an air inlet (120a) and an air outlet (120b). The air inlet (120a) and the air outlet (120b) are used to circulate with the inner cavity of the electrical enclosure (3).

2. The condenser of claim 1, wherein The air-to-air heat exchange section (12) is disposed on the outer surface of the condensation heat exchange section (11).

3. The condenser as described in claim 2, characterized in that, The air-to-air heat exchange section (12) and the condensation heat exchange section (11) are arranged along a first direction; Alternatively, the air-to-air heat exchange section (12) and the condensation heat exchange section (11) are arranged along the second direction; Alternatively, the air-to-air heat exchange section (12) and the condensation heat exchange section (11) are arranged along a third direction; Wherein, the first direction is the length direction of the condensing heat exchange section (11), the second direction is the height direction of the condensing heat exchange section (11), and the third direction is the thickness direction of the condensing heat exchange section (11).

4. The condenser as described in claim 1, characterized in that, The condensing heat exchange section (11) includes a condensing main body (111), a gas collecting chamber (112) and a liquid collecting chamber (113). The gas collecting chamber (112) is connected to the evaporator (2) through a gas pipeline (13), and the liquid collecting chamber (113) is connected to the evaporator (2) through a liquid pipeline (14).

5. The condenser as described in claim 4, characterized in that, The condenser body (111) is configured as a microchannel heat dissipation structure.

6. The condenser as described in claim 4 or 5, characterized in that, The air-to-air heat exchange section (12) includes a heat dissipation main body (121), a first ventilation cavity (122), and a second ventilation cavity (123).

7. The condenser as described in claim 6, characterized in that, The heat dissipation body (121) is configured as a microchannel heat dissipation structure.

8. The condenser as described in claim 6, characterized in that, The heat dissipation main body (121) and the condensation main body (111) are constructed as an integral structure and are not interconnected. The first ventilation cavity (122) and the gas collection cavity (112) are arranged adjacent to each other and are not interconnected. The second ventilation cavity (123) and the liquid collection cavity (113) are arranged adjacent to each other and are not interconnected.

9. The condenser as claimed in claim 8, characterized in that, The air outlet (120b) is located in the first ventilation cavity (122), and the air inlet (120a) is located in the second ventilation cavity (123).

10. The condenser according to any one of claims 1-5 and 7-9, characterized in that, It also includes a cooling fan assembly (15), which is located on the side of the condensation heat exchange section (11) and the air-to-air heat exchange section (12) away from the electrical chassis (3), and is used to perform air cooling on the condensation heat exchange section (11) and the air-to-air heat exchange section (12).

11. A thermosiphon radiator, comprising an evaporator (2) and a condenser (1), characterized in that, The condenser (1) is the condenser (1) as described in any one of claims 1-10.

12. A power conversion device, comprising an electrical enclosure (3) and a thermosiphon radiator disposed in the electrical enclosure (3), characterized in that, The thermosiphon radiator is the thermosiphon radiator as described in claim 11.

13. The power conversion device as described in claim 12, characterized in that, The power conversion device also includes a circulating fan (4), which is disposed in the inner cavity of the electrical housing (3) and arranged near the air inlet (120a); Alternatively, the circulating fan (4) is disposed in the inner cavity of the electrical housing (3) and arranged near the air outlet (120b); Alternatively, the circulating fan (4) may be located in the air heat exchange chamber (120).

Images