SSD chip sorting device

Abstract

The utility model discloses an SSD chip sorting device, and relates to the field of SSD chip sorting devices. The device comprises a sorting platform, a sliding frame and a movable frame, one side of the movable frame is in transmission connection with a plurality of negative pressure adsorption assemblies through a plurality of y-axis driving components, the movable frame is movably connected with the y-axis driving components through a sliding mechanism, and the position of any y-axis driving component is limited through a locking mechanism. Through the sliding mechanism, the transverse sliding block moves along the sliding rod on the inner side of the movable frame to drive the y-axis driving part and the negative-pressure adsorption assembly which are fixed with the transverse sliding block to synchronously and transversely move, and flexible adjustment of the distance between adjacent adsorption assemblies is achieved. By means of the mechanical structure, the sorting device can be matched with SSD chips of different sizes, the limitation that the distance between traditional array type suction cups is fixed is broken through, the problem of adsorption dislocation or suction leakage caused by the size difference of the chips is solved, and the compatibility of the device to the chips of different specifications is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of SSD chip sorting devices, specifically an SSD chip sorting device. Background Technology

[0002] The SSD chip negative pressure suction cup three-axis sorting platform is a high-precision automated device designed specifically for semiconductor packaging testing. Its core components include a negative pressure suction cup system, a highly stable three-axis motion platform, and an intelligent sorting module. This platform has efficient sorting capabilities, is compatible with various chip sizes and package types, and adopts a modular design to reduce maintenance costs. Through AOI vision guidance and real-time data analysis, it ensures testing accuracy and a low failure rate. It is suitable for the mass production and R&D of precision components such as SSDs and Micro LEDs, significantly improving yield and production efficiency.

[0003] Currently, most SSD chip sorting operations use three-axis suction cup sorting machines. However, a problem exists in practical use: the current sorting efficiency is not improved, and the suction cup structure is set as an array structure, which undoubtedly has certain adsorption compatibility issues. This is mainly manifested in the difficulty of adjusting the spacing between adjacent suction cup structures. As a result, during reverse sorting operations, in order to increase compatibility, the amount of movement of the three axes in the sorting device is increased, thereby reducing sorting efficiency. In view of this, the inventors urgently need to design a sorting device that can adjust the spacing between adjacent suction cup structures to improve the sorting efficiency of SSD chips. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide an SSD chip sorting device to solve the technical problem of adjusting the spacing of array-type suction cups in SSD chip sorting.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an SSD chip sorting device, comprising a sorting platform, a sliding frame, and a movable frame. One side of the movable frame is connected to several negative pressure adsorption components via several y-axis driving components. The movable frame and the y-axis driving components are movably connected via a sliding mechanism, and the position of any y-axis driving component is restricted by a locking mechanism to adjust the spacing between adjacent y-axis driving components and negative pressure adsorption components.

[0006] The sliding mechanism includes a sliding block, which engages and slides inside the movable frame. Three sets of sliding rods are fixedly installed inside the movable frame, and the sliding rods pass through the sliding block.

[0007] By adopting the above technical solution, the spacing between adjacent negative pressure adsorption components can be flexibly adjusted through the synergistic effect of the sliding mechanism and the locking mechanism. When the sliding block slides laterally along the sliding rod, it drives the y-axis drive component to move synchronously, so that the array arrangement of the adsorption components can be adapted to SSD chips of different sizes, thus solving the problem of insufficient sorting adaptability caused by the non-adjustable spacing of traditional fixed suction cups.

[0008] Furthermore, the sliding block is fixedly connected to the y-axis drive component, and the sliding rod is used to limit the longitudinal position of the y-axis drive component relative to the movable frame, so that any y-axis drive component can only be adjusted in the lateral position.

[0009] By adopting the above technical solution, the sliding block is fixedly connected to the y-axis drive component, and its longitudinal degree of freedom is restricted by the sliding rod, ensuring that the y-axis drive component can only slide and adjust the spacing in the lateral direction. This simplifies the motion control logic when multiple axes are linked and avoids the risk of mechanical interference caused by redundant longitudinal degrees of freedom.

[0010] Furthermore, one side of the sliding frame is connected to the movable frame via an x-axis drive component, and the sorting platform is connected to the sliding frame via a z-axis drive component.

[0011] By adopting the above technical solution, the x-axis drive component drives the movable frame to move laterally, and the z-axis drive component controls the vertical lifting and lowering of the sorting platform, thus realizing the decoupled control of the three-axis motion. The independent drive design of the movable frame and the sorting platform ensures that the bidirectional lateral displacement of the adsorption components does not interfere with each other.

[0012] Furthermore, both the x-axis drive component and the z-axis drive component are servo lead screw motors, and both are electrically connected to an external power supply through a controller.

[0013] By adopting the above technical solution and using a servo screw motor as the power source for the x-axis and z-axis drive components, high-precision closed-loop position control can be achieved through the controller. The fast response characteristics of the servo motor can significantly improve the motion efficiency of the sorting platform and the movable frame, meeting the cycle time requirements of high-speed sorting scenarios.

[0014] Furthermore, the locking mechanism includes a slide groove and a locking plate. The slide groove is formed on the surface of the movable frame, and the cross-section of the slide groove has a "T" shape.

[0015] Furthermore, the inner side of the slide groove is fitted with fastening bolts, and the locking piece is fastened to the movable frame by fastening bolts and nuts.

[0016] By adopting the above technical solution, the T-shaped groove of the locking mechanism and the locking plate are matched and set to guide the tightening direction of the fastening bolt through mechanical limiting.

[0017] Furthermore, the other side of the locking plate is fastened to the y-axis drive component by a fastening bolt.

[0018] By adopting the above technical solution, the locking plate is connected to the y-axis drive component and the movable frame in both directions by fastening bolts, forming a rigid fixed structure, which significantly improves the vibration resistance of the adsorption assembly in high-speed sorting.

[0019] Furthermore, the negative pressure adsorption component is connected to an external negative pressure device, the y-axis driving component is a pneumatic actuator, and a visual recognition system is installed on one side of the negative pressure adsorption component for visual inspection of the SSD chip.

[0020] By adopting the above technical solution, the combination of the negative pressure adsorption component and the pneumatic push rod type y-axis drive component enables rapid response of adsorption and lifting actions through pneumatic control. The low friction characteristics of the pneumatic push rod can reduce energy loss during y-axis drive, while the flexible contact characteristics of negative pressure adsorption can avoid damage to the chip surface.

[0021] In summary, the present invention has the following main advantages:

[0022] 1. This utility model utilizes a sliding mechanism where a laterally sliding block moves along a sliding rod inside the movable frame, causing the fixed y-axis drive component and negative pressure adsorption assembly to move laterally synchronously, thus achieving flexible adjustment of the spacing between adjacent adsorption components. This mechanical structure enables the sorting device to adapt to SSD chips of different sizes, breaking through the limitations of fixed spacing in traditional array-type suction cups, solving the problem of adsorption misalignment or missed adsorption caused by differences in chip size, and significantly improving the device's compatibility with chips of different specifications;

[0023] 2. In this utility model, the locking mechanism guides the sliding path of the locking plate through the T-shaped slide groove, and uses fastening bolts to rigidly fix the y-axis drive component to the movable frame, ensuring that the adjusted adsorption component spacing remains stable during the sorting process, avoiding spacing changes caused by vibration or inertial displacement. Through the synergistic effect of mechanical locking and sliding mechanism, the adaptability of the sorting device to diverse production environments is enhanced, and the motion load of the three-axis system is reduced, further improving sorting efficiency and reliability. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is a bottom view of the structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the assembly structure of the movable frame and the Z-axis drive component of this utility model;

[0027] Figure 4This is a schematic diagram of the assembly position structure of the locking mechanism of this utility model;

[0028] Figure 5 This is a side view of the movable frame of this utility model.

[0029] In the diagram: 1. Sorting platform; 2. Sliding frame; 3. Movable frame; 4. Y-axis drive component; 5. Negative pressure adsorption assembly; 6. Sliding mechanism; 601. Sliding rod; 602. Sliding block; 7. Locking mechanism; 701. Slide groove; 702. Locking plate; 703. Fastening bolt; 8. Z-axis drive component; 9. X-axis drive component. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In this embodiment:

[0032] An SSD chip sorting device, such as Figure 1-4 As shown, it includes a sorting platform 1, a sliding frame 2, and a movable frame 3. One side of the movable frame 3 is connected to several negative pressure adsorption components via several y-axis drive components 4. The movable frame 3 and the y-axis drive components 4 are movably connected by a sliding mechanism 6, and the position of any y-axis drive component 4 is restricted by a locking mechanism 7, so as to adjust the distance between adjacent y-axis drive components 4 and negative pressure adsorption components.

[0033] The sliding mechanism 6 includes a sliding block 602, which engages and slides inside the movable frame 3. Three sets of sliding rods 601 are fixedly installed inside the movable frame 3, and the sliding rods 601 pass through the sliding block 602. Through the coordinated action of the sliding mechanism 6 and the locking mechanism 7, the spacing between adjacent negative pressure adsorption components can be flexibly adjusted. When the sliding block 602 slides laterally along the sliding rod 601, it drives the y-axis drive component 4 to move synchronously, so that the array arrangement of the adsorption components can be adapted to SSD chips of different sizes. This solves the problem of insufficient sorting adaptability caused by the non-adjustable spacing of traditional fixed suction cups. At the same time, the locking mechanism 7, through the cooperation of the T-shaped slide groove 701 and the fastening bolt 703, can quickly lock the position of the y-axis drive component 4 after adjustment, ensuring the stability of the spacing of the adsorption components during the sorting process and avoiding displacement caused by vibration or inertia, thereby improving sorting accuracy and reliability.

[0034] See Figure 1 , Figure 3 , Figure 4 , Figure 5The sliding block 602 is fixedly connected to the y-axis drive component 4, and the sliding rod 601 is used to limit the longitudinal position of the y-axis drive component 4 relative to the movable frame 3, so that any y-axis drive component 4 can only be adjusted laterally. By fixing the sliding block 602 to the y-axis drive component 4 and using the sliding rod 601 to limit its longitudinal degree of freedom, it is ensured that the y-axis drive component 4 can only slide and adjust the spacing laterally. This simplifies the motion control logic when multiple axes are linked and avoids the risk of mechanical interference caused by redundant longitudinal degrees of freedom. At the same time, the structure of the sliding rod 601 penetrating the sliding block 602 enhances the guidance of the lateral sliding process, making the spacing adjustment of adjacent adsorption components more stable, reducing the positioning error caused by mechanical gaps, and further ensuring the stability of the sorting device during high-speed operation.

[0035] See Figure 1 , Figure 2 The sliding frame 2 is connected to the movable frame 3 via the x-axis drive component 9 on one side. The sorting platform 1 is connected to the sliding frame 2 via the z-axis drive component 8. The x-axis drive component 9 drives the movable frame 3 to move laterally, and the z-axis drive component 8 controls the vertical lifting of the sorting platform 1, thus realizing the decoupled control of the three-axis motion. The independent drive design of the movable frame 3 and the sorting platform 1 ensures that the bidirectional lateral displacement of the adsorption components does not interfere with each other. At the same time, the sliding frame 2, as an intermediate carrier, further optimizes the spatial layout of the mechanical structure, making the overall device more compact and easier to integrate into automated production lines, thereby improving the applicability and maintenance convenience of the equipment.

[0036] See Figure 1 , Figure 2 Both the x-axis drive component 9 and the z-axis drive component 8 are servo screw motors, and both are electrically connected to an external power supply through a controller. Using servo screw motors as the power source for the x-axis drive component 9 and the z-axis drive component 8 enables high-precision closed-loop position control through the controller. The fast response characteristics of the servo motors can significantly improve the motion efficiency of the sorting platform 1 and the movable frame 3, meeting the cycle time requirements of high-speed sorting scenarios. At the same time, the servo screw transmission system has the characteristics of low backlash and high rigidity, which can effectively suppress vibrations caused by load changes or inertial impacts during the sorting process, ensuring the positioning repeatability during three-axis linkage, thereby ensuring the accuracy of chip gripping and placement.

[0037] See Figure 3 , Figure 4 , Figure 5 The locking mechanism 7 includes a slide groove 701 and a locking piece 702. The slide groove 701 is formed on the surface of the movable frame 3, and the cross-section of the slide groove 701 is a "T" shaped structure.

[0038] The inner side of the slide groove 701 is engaged with a fastening bolt 703, and the locking piece 702 is fastened to the movable frame 3 by the fastening bolt 703 and the nut;

[0039] The T-shaped groove 701 of the locking mechanism 7 and the locking plate 702 are designed to guide the tightening direction of the fastening bolt 703 through mechanical limiting, which simplifies the fixing operation process of the y-axis drive component 4. The T-shaped groove 701 enhances the load-bearing capacity of the locking plate 702 and prevents slippage or deformation caused by uneven force when the bolt is tightened.

[0040] See Figure 3 , Figure 4 , Figure 5 The other side of the locking plate 702 is fastened to the y-axis drive component 4 by fastening bolts. The locking plate 702 is bidirectionally connected to the y-axis drive component 4 and the movable frame 3 by fastening bolts 703, forming a rigid fixed structure, which significantly improves the vibration resistance of the adsorption component in high-speed sorting and avoids sorting failure caused by mechanical loosening.

[0041] See Figure 1 The negative pressure adsorption component is connected to an external negative pressure device. The Y-axis drive component 4 is a pneumatic actuator. A vision recognition system is installed on one side of the negative pressure adsorption component for visual inspection of SSD chips. The combination of the negative pressure adsorption component and the pneumatic actuator Y-axis drive component 4 enables rapid response of adsorption and lifting actions through pneumatic control. The low friction characteristics of the pneumatic actuator can reduce energy loss during Y-axis drive. At the same time, the flexible contact characteristics of negative pressure adsorption can avoid damage to the chip surface. In addition, the integration of the vision recognition system can capture the chip position and posture information in real time and dynamically adjust the gripping path of the adsorption component through three-axis linkage to ensure the accuracy and consistency of chip sorting. It is especially suitable for sorting scenarios of high-density packaging or irregularly shaped chips.

[0042] The implementation principle of this embodiment is as follows: the sliding block 602 is moved laterally along the sliding rod 601 inside the movable frame 3, which drives the fixed y-axis drive component 4 and the negative pressure adsorption component to adjust the spacing synchronously. When the spacing between adjacent adsorption components is adapted to the target chip size, the locking plate 702 is guided by the T-shaped slide groove 701 in the locking mechanism 7, and the y-axis drive component 4 and the movable frame 3 are rigidly fixed by the fastening bolt 703, thus completing the adjustment of the suction cup array spacing. During sorting, the x-axis drive component 9 drives the movable frame 3 and the negative pressure adsorption component to move laterally, the z-axis drive component 8 controls the sliding frame 2 to be positioned laterally, and the y-axis drive component 4 drives the negative pressure adsorption component to rise and fall vertically through the pneumatic push rod. In conjunction with the vision recognition system, the chip is accurately grasped. During the three-axis linkage process, the sliding mechanism 6 and the locking mechanism 7 work together to maintain a stable spacing of the adsorption components, avoiding three-axis compensation movement caused by adjustment errors, thereby improving sorting efficiency.

[0043] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. An SSD chip sorting device, characterized in that: The system includes a sorting platform (1), a sliding frame (2), and a movable frame (3). One side of the movable frame (3) is connected to several negative pressure adsorption components (5) via several y-axis drive components (4). The movable frame (3) and the y-axis drive components (4) are movably connected via a sliding mechanism (6), and the position of any y-axis drive component (4) is restricted by a locking mechanism (7) to adjust the distance between adjacent y-axis drive components (4) and negative pressure adsorption components (5). The sliding mechanism (6) includes a sliding block (602), which engages and slides on the inner side of the movable frame (3). Three sets of sliding rods (601) are fixedly provided on the inner side of the movable frame (3), and the sliding rods (601) pass through the sliding block (602).

2. The SSD chip sorting device according to claim 1, characterized in that: The sliding block (602) is fixedly connected to the y-axis drive component (4), and the sliding rod (601) is used to limit the longitudinal position of the y-axis drive component (4) relative to the movable frame (3), so that any y-axis drive component (4) can only be adjusted in the lateral position.

3. The SSD chip sorting device according to claim 1, characterized in that: One side of the sliding frame (2) is connected to the movable frame (3) via an x-axis drive component (9), and the sorting platform (1) is connected to the sliding frame (2) via a z-axis drive component (8).

4. The SSD chip sorting device according to claim 3, characterized in that: The x-axis drive component (9) and z-axis drive component (8) are both servo lead screw motors, and both are electrically connected to an external power supply through a controller.

5. The SSD chip sorting device according to claim 1, characterized in that: The locking mechanism (7) includes a slide groove (701) and a locking piece (702). The slide groove (701) is opened on the surface of the movable frame (3), and the cross-section of the slide groove (701) is a "T" shaped structure.

6. The SSD chip sorting device according to claim 5, characterized in that: The inner side of the slide groove (701) is engaged with a fastening bolt (703), and the locking piece (702) is fastened to the movable frame (3) by the fastening bolt (703) and the nut.

7. The SSD chip sorting device according to claim 5, characterized in that: The other side of the locking piece (702) is fastened to the y-axis drive component (4) by a fastening bolt.

8. The SSD chip sorting device according to claim 1, characterized in that: The negative pressure adsorption component (5) is connected to an external negative pressure device. The y-axis drive component (4) is a pneumatic actuator. A visual recognition system is installed on one side of the negative pressure adsorption component (5) for visual detection of SSD chips.

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