Vacuum chuck device suitable for various wafer sizes

Abstract

The utility model provides a vacuum chuck device suitable for various wafer sizes, which comprises an upper chuck body and a lower chuck body, the bottom surface of the upper chuck body is fixed on the top surface of the lower chuck body, and the upper chuck body comprises an external O-shaped rubber ring, a middle O-shaped rubber ring, an internal O-shaped rubber ring and a metal surface. The outer O-shaped rubber ring, the middle O-shaped rubber ring and the inner O-shaped rubber ring are concentrically fixed to the top face of the metal face, a plurality of air holes are formed in the metal face along the inner O-shaped rubber ring, a plurality of fan-shaped annular grooves are formed in the portion, between the middle O-shaped rubber ring and the outer O-shaped rubber ring, of the metal face, and the air holes are formed in the fan-shaped annular grooves. A connecting hole is formed in the center of the bottom face of the lower sucker body. According to the utility model, a plurality of O-shaped rubber rings are used for adsorption, the wafer is not in direct contact with a metal surface, the wafer breaking probability is reduced, and the wafer clamping device is suitable for wafers of various different sizes.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer inspection equipment technology, and in particular to a vacuum chuck device suitable for various wafer sizes. Background Technology

[0002] In the wafer inspection process, the wafer needs to be flatly adsorbed onto an ultra-high speed wafer chuck to enable rapid inspection of wafer defects at ultra-high speeds. In the existing technology, the wafer chuck suction cup is small in size, with uneven distribution of pores or processing errors, which causes centrifugal force oscillation, resulting in relative displacement between the wafer and the suction cup contact surface, causing edge breakage, and it cannot be adapted to all wafers. Summary of the Invention

[0003] To address the aforementioned problems, this invention provides a vacuum chuck device suitable for various wafer sizes.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a vacuum chuck device suitable for various wafer sizes, comprising an upper chuck body and a lower chuck body, wherein the bottom surface of the upper chuck body is fixed to the top surface of the lower chuck body, the upper chuck body includes an outer O-ring, a middle O-ring, an inner O-ring, and a metal surface, wherein the outer O-ring, middle O-ring, and inner O-ring are all concentrically fixed to the top surface of the metal surface, the metal surface has a plurality of air holes arranged along the inner O-ring, the metal surface between the middle O-ring and the outer O-ring is provided with a plurality of fan-shaped grooves, the fan-shaped grooves are provided with air holes, and the bottom surface of the lower chuck body is provided with a connecting hole at its center.

[0005] Preferably, the fan ring grooves are arranged along the circumference of the outer O-ring, and the adjacent fan ring grooves are separated by rectangular strips, the top surface height of which does not exceed the top surface height of the outer or middle O-ring.

[0006] Preferably, the top of the outer O-ring, the middle O-ring, and the inner O-ring are all provided with circular grooves, and the inner O-ring is a raised cylindrical shape.

[0007] Preferably, the bottom of the lower suction cup body is provided with several fan-shaped grooves, and several air holes arranged along the inner O-ring of the metal surface penetrate the bottom surface of the fan-shaped grooves. Several reinforcing ribs are fixed to the bottom of the lower suction cup body, and the bottom of the reinforcing ribs is provided with threadless fixing holes and threaded fixing holes.

[0008] Preferably, the air holes in the fan ring groove are close to the outer O-ring, and the outer diameter of the lower suction cup body is smaller than the distance between the innermost side of the air holes in the fan ring groove and the center of the upper suction cup body.

[0009] Preferably, the fan-shaped grooves are arranged along the circumference of the central O-ring rubber ring, and the plurality of air holes arranged along the inner O-ring rubber ring on the metal surface are located at the tip of the fan-shaped grooves.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: The outer O-ring, middle O-ring, and inner O-ring of this utility model have good elasticity and wear resistance, can adapt to objects of different shapes and surfaces, play a supporting and adsorption role, the wafer does not directly contact the metal surface, reducing the probability of wafer breakage, and is suitable for wafers of various sizes; the pores have both adsorption and heat dissipation functions, while providing ventilation paths for internal components; the fan ring groove and fan-shaped groove are used to reduce the overall weight and dynamic balance, facilitate local maintenance, and avoid material waste; the single air path design simplifies the structure, reduces the number of pipes, valves and other components, and reduces the complexity of manufacturing and installation. Attached Figure Description

[0011] Figure 1 This is a top view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0012] Figure 2 This is a bottom view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0013] Figure 3 This is a side view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0014] Figure 4 This is an AA cross-sectional view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0015] Figure 5 This is a BB cross-sectional view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0016] Figure 6 This is a CC cross-sectional view of the vacuum chuck device of this utility model, which is applicable to various wafer sizes.

[0017] Figure descriptions: 1. Upper suction cup body, 11. Fan-shaped groove, 12. Rectangular strip, 2. Outer O-ring, 21. Circular groove, 3. Middle O-ring, 4. Inner O-ring, 5. Metal surface, 6. Air hole, 7. Lower suction cup body, 71. Fan-shaped groove, 8. Reinforcing rib, 81. Unthreaded fixing hole, 82. Threaded fixing hole, 9. Connecting hole. Detailed Implementation

[0018] To provide a better understanding of the purpose, structure, features, and functions of this utility model, detailed descriptions are provided below with reference to specific embodiments.

[0019] Please refer to the reference. Figure 1 , Figure 2 , Figure 3 and Figure 5 This utility model discloses a vacuum chuck device applicable to various wafer sizes, comprising an upper chuck body 1 and a lower chuck body 7. The bottom surface of the upper chuck body 1 is fixed to the top surface of the lower chuck body 7. The upper chuck body 1 includes an outer O-ring 2, a middle O-ring 3, an inner O-ring 4, and a metal surface 5. The outer O-ring 2, the middle O-ring 3, and the inner O-ring 4 are all concentrically fixed to the top surface of the metal surface 5. The metal surface 5 has a plurality of air holes 6 arranged along the inner O-ring 4. The metal surface 5 between the middle O-ring 3 and the outer O-ring 2 is provided with a plurality of fan-shaped grooves 11, and air holes 6 are provided in the fan-shaped grooves 11. The lower chuck body 7 has a connecting hole 9 at the center of its bottom surface.

[0020] The outer O-ring 2, the middle O-ring 3, and the inner O-ring 4 have good elasticity and wear resistance, and can adapt to objects of different shapes and surfaces, playing a supporting and adsorption role. The air hole 6 has both adsorption and heat dissipation functions, and at the same time provides ventilation path for internal components. The fan ring groove 11 reduces the overall weight and facilitates local maintenance. The connecting hole 9 is used to install shaft components and connect and integrate with other components. The single air path design simplifies the structure, reduces the number of pipes, valves and other components, and reduces the complexity of manufacturing and installation.

[0021] In one embodiment, such as Figure 1 and Figure 5 As shown, the fan ring groove 11 is arranged along the circumferential direction of the outer O-ring rubber ring 2. The adjacent fan ring grooves 11 are separated by rectangular strips 12. The top surface height of the rectangular strips 12 does not exceed the top surface height of the outer O-ring rubber ring 2 or the middle O-ring rubber ring 3. The spoke-like layout of the rectangular strips 12 ensures that the outer ring is not easily deformed when subjected to force through the principle of mechanical dispersion.

[0022] In one embodiment, such as Figure 1 and Figure 6 As shown, the outer O-ring 2, the middle O-ring 3, and the inner O-ring 4 are all provided with a circular groove 21 at their tops. The inner O-ring 4 is a raised cylinder. The circular groove 21 provides positioning and adsorption functions, while the raised cylindrical structure of the inner O-ring is used to adsorb and support the wafer.

[0023] In one embodiment, such as Figure 2 and Figure 4As shown, the bottom of the lower suction cup body 7 is provided with several fan-shaped grooves 71. Several air holes 6 arranged along the inner O-ring rubber ring 4 of the metal surface 5 penetrate the bottom surface of the fan-shaped grooves 71. Several reinforcing ribs 8 are fixed to the bottom of the lower suction cup body 7. The bottom of the reinforcing ribs 8 is provided with unthreaded fixing holes 81 and threaded fixing holes 82. The fan-shaped grooves 71 are used for weight reduction and dynamic balance. The unthreaded fixing holes 81 and threaded fixing holes 82 are used to fix and connect other components.

[0024] In one embodiment, such as Figure 1 and Figure 6 As shown, the air holes 6 in the fan ring groove 11 are close to the outer O-ring rubber ring 2. The outer diameter of the lower suction cup body 7 is smaller than the distance between the innermost side of the air hole 6 in the fan ring groove 11 and the center of the upper suction cup body 1. The fan ring groove 11 and the air holes 6 are evenly distributed. The air holes 6 are preferably evenly distributed every other fan ring groove 11. The air holes 6 at the outer ring end and the central protrusion structure provide multiple adsorption holes to facilitate adsorption and support.

[0025] In one embodiment, such as Figure 2 and Figure 5 As shown, the fan-shaped groove 71 is arranged along the circumference of the central O-ring rubber ring 3, and the metal surface 5 has several air holes 6 arranged along the inner O-ring rubber ring 4 located at the tip of the fan-shaped groove 71. The fan-shaped groove 71 and the air holes 6 are evenly distributed, and the air holes 6 in the central area form an air circulation path, which can quickly dissipate internal heat.

[0026] Usage: Combine Figures 1-6 As shown, the suction cup is fixed together with other components through the connecting hole 9, the threadless fixing hole 81 and the threaded fixing hole 82. The wafer is placed on the top surface of the upper suction cup body 1. The outer O-ring 2, the middle O-ring 3 and the inner O-ring 4 provide support and adsorption. The wafer is adsorbed through the vent 6. The vent 6 has both adsorption and heat dissipation functions, and at the same time provides a ventilation path for the internal components.

[0027] This utility model has been described by the above-described embodiments; however, these embodiments are merely examples for implementing this utility model. It must be noted that the disclosed embodiments do not limit the scope of this utility model. Conversely, any modifications and refinements made without departing from the spirit and scope of this utility model are within the scope of patent protection of this utility model.

Claims

1. A vacuum chuck device suitable for various wafer sizes, characterized in that: The suction cup body includes an upper suction cup body (1) and a lower suction cup body (7). The bottom surface of the upper suction cup body (1) is fixed to the top surface of the lower suction cup body (7). The upper suction cup body (1) includes an outer O-ring (2), a middle O-ring (3), an inner O-ring (4), and a metal surface (5). The outer O-ring (2), the middle O-ring (3), and the inner O-ring (4) are all concentrically fixed to the top surface of the metal surface (5). The metal surface (5) has several air holes (6) arranged along the inner O-ring (4). The metal surface (5) between the middle O-ring (3) and the outer O-ring (2) is provided with several fan-shaped grooves (11). The fan-shaped grooves (11) are provided with air holes (6). The lower suction cup body (7) has a connecting hole (9) at the center of its bottom surface.

2. The vacuum chuck device applicable to various wafer sizes as described in claim 1, characterized in that: The fan ring grooves (11) are arranged along the circumference of the outer O-ring (2), and there are rectangular strips (12) between adjacent fan ring grooves (11). The height of the top surface of the rectangular strips (12) does not exceed the height of the top surface of the outer O-ring (2) or the middle O-ring (3).

3. The vacuum chuck device applicable to various wafer sizes as described in claim 1, characterized in that: The top of the outer O-ring (2), the middle O-ring (3) and the inner O-ring (4) are all provided with a circular groove (21), and the inner O-ring (4) is a raised cylinder.

4. The vacuum chuck device applicable to various wafer sizes as described in claim 1, characterized in that: The lower suction cup body (7) has several fan-shaped grooves (71) at its bottom. Several air holes (6) arranged along the inner O-ring (4) of the metal surface (5) penetrate the bottom surface of the fan-shaped grooves (71). Several reinforcing ribs (8) are fixed at the bottom of the lower suction cup body (7). The bottom of the reinforcing ribs (8) has a non-threaded fixing hole (81) and a threaded fixing hole (82).

5. The vacuum chuck device applicable to various wafer sizes as described in claim 1, characterized in that: The air hole (6) in the fan ring groove (11) is close to the outer O-ring (2), and the outer diameter of the lower suction cup body (7) is smaller than the distance between the innermost side of the air hole (6) in the fan ring groove (11) and the center of the upper suction cup body (1).

6. The vacuum chuck device applicable to various wafer sizes as described in claim 4, characterized in that: The fan-shaped groove (71) is arranged along the circumference of the central O-ring (3), and the metal surface (5) has several air holes (6) arranged along the inner O-ring (4) located at the tip of the fan-shaped groove (71).

Images