Cutting device for tin wire production and processing

Abstract

The utility model relates to the technical field of solder wire production and processing, and discloses a cutting device for solder wire production and processing, which comprises a device base, a scale block is arranged on the device base, and a curled storage component is arranged on one side of the scale block; the cutting assembly is arranged on the device support set in a sliding mode and used for cutting the solder wire, and the scale needle is used for marking the cutting position; the clamping assembly is arranged on the device support set, used for clamping a solder wire and comprises a moving guide assembly and a solder wire clamping assembly arranged on the moving guide assembly in a sliding mode, the solder wire clamping assembly is arranged on one side of the cutting assembly, the moving guide assembly penetrates through the interior of the cutting assembly, and the solder wire clamping assembly comprises a clamping block; the clamp is used for clamping solder wires; and the solder wire is wound on the curling storage assembly, penetrates through the cutting assembly and is clamped through the clamping assembly, the cutting length can be adjusted according to requirements, and the working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of solder wire production and processing technology, specifically a cutting device for solder wire production and processing. Background Technology

[0002] Solder wire consists of two parts: a tin alloy and a flux. The alloy is either tin-lead or lead-free, with the flux evenly poured into the center. During electronic soldering, the solder wire works with a soldering iron. A high-quality soldering iron provides stable and continuous heat, and the solder wire, acting as a filler metal, is added to the surface and gaps of electronic components, fixing them in place and becoming the main component of the soldering process. The produced solder wire is wound according to production requirements and then cut to the desired length. However, different production requirements necessitate different solder wire lengths. Most existing cutting devices require manual adjustment of the cutting length and lack the capability to produce a fixed length, affecting production specifications and reducing efficiency.

[0003] A search revealed an existing technology (application number: CN214079472U) for a cutting device in the production and processing of solder bars. The document describes it as "including a worktable, baffles, and a length adjustment assembly. The baffles are two in number and symmetrically fixed to the top of the worktable. The length adjustment assembly is rotatably connected to one side between the two baffles. The length adjustment assembly includes a swing plate, an adjusting block, a connecting rod, a partition, a lead screw, and a handwheel. The swing plate is two in number." This utility model is easy to use and allows for adjustment of the cutting length.

[0004] However, while the existing technology simplifies the cutting process and allows for adjustable cutting length, it still has some shortcomings: when cutting the processed solder wire, the cutting length cannot be precisely adjusted, which causes some uncertainty in the production length of the solder wire and thus affects the production quality. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a cutting device for solder wire production and processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a cutting device for solder wire production and processing, comprising: a device support assembly, including a device base, on which a scale block is arranged, and a coiling and storing component is provided on one side of the scale block; a cutting component, slidably disposed on the device support assembly, for cutting solder wire, and further including a scale needle for marking the cutting position; a clamping component, disposed on the device support assembly, including a moving guide component and a solder wire clamping component slidably disposed on the moving guide component, the solder wire clamping component being disposed on one side of the cutting component, the moving guide component penetrating the interior of the cutting component, the solder wire clamping component including a clamping block for clamping the solder wire; the solder wire is wound on the coiling and storing component and penetrates the cutting component, and is clamped by the clamping component.

[0007] As a further description of the above technical solution:

[0008] The device support assembly includes a roller, which is disposed on the device base and located on one side of the cutting assembly, for winding solder wire.

[0009] As a further description of the above technical solution:

[0010] The cutting assembly includes: a cutting frame with two sets of sliding grooves on the base of the bottom sliding connection device; a cylinder installed above the cutting frame; a cutting blade fixedly connected to the output end of the cylinder and located inside the cutting frame for cutting solder wire; a cutting groove located inside the cutting frame and below the cutting blade for cooperating with the cutting blade for cutting; and the cylinder driving the cutting blade downwards for cutting.

[0011] As a further description of the above technical solution:

[0012] The scale needle is located on the outer wall of the bottom side of the cutting frame, with one end pointing to the scale block, used to mark and display the length of the cut solder wire.

[0013] As a further description of the above technical solution:

[0014] The movable guide assembly consists of: a screw, rotatably connected inside the device base; a guide rail, fixedly installed inside the device base and located on both sides of the screw; and a clamping frame, slidably connected to the guide rail and threadedly connected to the screw, used to clamp solder wire.

[0015] As a further description of the above technical solution:

[0016] The second slide is set on both sides of the guide rail and is arranged in parallel, and the cutting component slides above the moving guide component.

[0017] As a further description of the above technical solution:

[0018] Clamping assembly: Screw 2, connected inside the clamping frame; slider, rotatably connected to screw 2 and slidably connected to slide groove 1 opened on the device base; clamping blocks, arranged in two sets, threadedly connected to screw 2 with the two sets of clamping blocks having the thread direction opposite to that of screw 2, and slidably connected to slide groove 3; used to adjust the distance between the two sets of clamping blocks; slide groove 3, set inside the clamping frame.

[0019] This utility model has the following beneficial effects:

[0020] 1. The cutting components are precisely positioned by the scale block and scale needle, and the clamping components stabilize the solder wire, controlling the cutting length error to a very small range, thus meeting the precision requirements of high-end manufacturing for solder wire.

[0021] 2. Through the close collaboration of the coiling and storage component, the cutting component and the clamping component, flexible positioning and stable clamping are achieved, the cutting process is smooth and continuous, the operation is convenient, the cutting time of a single solder wire is greatly shortened, and the production efficiency is significantly improved. Attached Figure Description

[0022] Figure 1 This is an overall schematic diagram of a cutting device for solder wire production and processing proposed in this utility model;

[0023] Figure 2 This is a schematic diagram of the base of a cutting device for solder wire production and processing proposed in this utility model;

[0024] Figure 3 This is a cross-sectional view of a cutting device for solder wire production and processing proposed in this utility model;

[0025] Figure 4 This is a schematic diagram of a cutting component of a cutting device for solder wire production and processing proposed in this utility model;

[0026] Figure 5 This is a schematic diagram of the clamping component of a cutting device for solder wire production and processing proposed in this utility model.

[0027] Legend: 1. Device support assembly; 11. Device base; 12. Roller; 13. Slide 1; 14. Slide 2; 15. Scale block; 2. Cutting assembly; 21. Cylinder; 22. Cutting frame; 23. Cutting blade; 24. Cutting groove; 25. Scale needle; 3. Clamping assembly; 31. Screw 1; 32. Guide rail; 33. Clamping frame; 34. Screw 2; 35. Slider; 36. Clamping block; 37. Slide 3; 4. Solder wire. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Example 1: As Figures 1 to 5 As shown, this embodiment provides a cutting device for solder wire production and processing, comprising: a device support assembly 1, including a device base 11, on which a scale block 15 is arranged, and a coiling and storing component is provided on one side of the scale block 15; a cutting component 2, slidably disposed on the device support assembly 1, for cutting solder wire 4, and also including a scale needle 25 for marking the cutting position; a clamping component 3, disposed on the device support assembly 1, including a moving guide component and a solder wire 4 clamping component 3 slidably disposed on the moving guide component, the solder wire 4 clamping component 3 being disposed on one side of the cutting component 2, the moving guide component penetrating the interior of the cutting component 2, and the solder wire 4 clamping component 3 including a clamping block 36 for clamping the solder wire 4; the solder wire 4 is wound on the coiling and storing component and penetrates the cutting component 2, and is clamped by the clamping component 3.

[0030] In this embodiment, the cutting mark assembly 2, the clamping assembly 3, the device support assembly 1, and the solder wire 4 constitute the cutting device for solder wire production and processing involved in this application, realizing a cutting device for solder wire production and processing. The cutting device in this application can be used for any application requiring solder wire cutting; this application does not limit the specific materials.

[0031] In this embodiment, the scale block 15 cooperates with the scale needle 25 on the cutting assembly 2. By moving the cutting assembly 2 on the device base 1, the scale needle 25 indicates the corresponding scale on the scale block 15. Through the cooperation of the scale block 15 and the scale needle 25, the cutting length of the solder wire 4 can be accurately determined, improving the cutting accuracy.

[0032] Specifically, the graduated needle 25 is a slender metal needle made of stainless steel. The graduated needle 25 is vertically mounted on the bottom right outer wall of the cutting frame 22, with one tip pointing precisely at the graduated block 15.

[0033] In this embodiment, the roller 12 is rotated manually or by a motor, and the solder wire 4 is wound around its surface by the circular motion of the roller 12. This facilitates the centralized storage of the solder wire 4 and prevents it from becoming tangled. During the cutting process, the solder wire 4 can be smoothly released as needed, ensuring the continuity of the cutting work.

[0034] Specifically, the cutting assembly 2 includes: a cutting frame 22, located within two sets of sliding grooves 14 on the bottom sliding connection device base 11; a cylinder 21, installed above the cutting frame 22; a cutting blade 23, fixedly connected to the output end of the cylinder 21 and located inside the cutting frame 22, used for cutting solder wire 4; and a cutting groove 24, located inside the cutting frame 22 and below the cutting blade 23, used to cooperate with the cutting blade 23 for cutting; the cylinder 21 drives the cutting blade 23 downwards for cutting.

[0035] In a preferred embodiment, when cutting is to be performed, the piston rod of cylinder 21 extends downward, driving the cutting blade 23 downward. The cutting blade 23, along the track inside the cutting frame 22, cuts the solder wire 4 located above the cutting groove 24, in conjunction with the cutting groove 24. Simultaneously, the cutting frame 22 can slide on the second slide groove 14 to adjust the cutting position. Cylinder 21 drives the cutting blade 23 downward, and the cutting groove assists in cutting, enabling efficient completion of the cut. Example

[0036] Based on Example 1, in order to further improve the accuracy of cutting solder wire 4, a scale needle 25 is provided on the device base 1;

[0037] Specifically, the scale needle 25 is located on the outer wall of the bottom side of the cutting frame 22, with one end of the scale needle 25 pointing to the scale block 15, for marking and displaying the length of the cutting solder wire 4.

[0038] It should be noted that operators can intuitively and accurately determine the cutting length by observing the relative position of the scale needle 25 and the scale block 15, thereby achieving precise cutting of the solder wire 4.

[0039] Specifically, the moving guide assembly includes: a screw 31, rotatably connected to the inside of the device base 11; a guide rail 32, fixedly installed inside the device base 11 and located on both sides of the screw 31; and a clamping frame 33, slidably connected to the guide rail 32 and threadedly connected to the screw 31, used to clamp the solder wire 4.

[0040] As a preferred implementation, the position of the clamping frame 33 can be easily adjusted, thereby adjusting the clamping position of the solder wire 4 to adapt to the cutting requirements of solder wire 4 of different lengths, ensuring the accuracy and flexibility of cutting. Example

[0041] Based on embodiment 2, in order to ensure that the cutting component 2 can move along the axial direction of the solder wire 4, the second groove 14 is two parallel elongated grooves, which are set on both sides of the guide rail 32 and parallel to the guide rail 32.

[0042] Specifically, the second slide 14 is set on both sides of the guide rail 32 and is arranged in parallel, and the cutting component 2 slides above the moving guide component.

[0043] It should be noted that the chute 214 guides the cutting assembly to move smoothly, ensuring that the cutting assembly moves accurately and smoothly.

[0044] Specifically, the clamping assembly 3 includes: a second screw 34 connected to the clamping frame 33; a slider 35 rotatably connected to the second screw 34 and slidably connected to the slide groove 13 on the device base 11; and two sets of clamping blocks 36 threadedly connected to the second screw 34 with the threads of the two sets of clamping blocks 36 opposite to those of the second screw 34, and slidably connected to the slide groove 37; used to adjust the distance between the two sets of clamping blocks 36; and the slide groove 37 is located inside the clamping frame 33.

[0045] In this embodiment, two sets of clamping blocks 36 are threaded to both ends of the second screw 34, and their thread directions are opposite to those of the second screw 34. Inside the clamping frame 33, two sliding grooves 37 adapted to the clamping blocks 36 are provided, and the clamping blocks 36 are slidably connected to the sliding grooves 37.

[0046] When using the product, to select the cutting length, place the movable end of the solder wire 4 between the clamping blocks 36, and rotate the screw 2 34 to clamp the solder wire 4. At this time, rotate the screw 1 31, and the clamping frame 33 slides on the guide rail 32. Stretch the solder wire 4 as needed. When cutting, first slide the cutting component 2 left and right by hand until the scale needle 25 is aligned with the required length on the scale block 15. Then start the cylinder 21 and push the cutting blade 23 downward to cut the solder wire 4. The cutting work is then completed.

[0047] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0048] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cutting device for solder wire production and processing, characterized in that: include: The device support assembly (1) includes a device base (11), on which a scale block (15) is arranged, and a roll-up storage component is provided on one side of the scale block (15). The cutting assembly (2) is slidably mounted on the device support assembly (1) for cutting solder wire (4), and also includes a scale needle (25) for marking the cutting position; The clamping assembly (3) is disposed on the device support assembly (1) and includes a moving guide assembly and a solder wire (4) clamping assembly (3) slidably disposed on the moving guide assembly. The solder wire (4) clamping assembly (3) is disposed on one side of the cutting assembly (2). The moving guide assembly passes through the interior of the cutting assembly (2). The solder wire (4) clamping assembly (3) includes a clamping block (36) for clamping the solder wire (4). Solder wire (4) is wound around the coiled storage component and passes through the cutting component (2), and is held by the clamping component (3).

2. The cutting device for solder wire production and processing according to claim 1, characterized in that: The device support assembly (1) includes: A roller (12), mounted on the device base (11) and located on one side of the cutting assembly (2), is used to coil solder wire (4).

3. A cutting device for solder wire production and processing according to claim 2, characterized in that: The cutting component (2) includes: The cutting frame (22) is located in two sets of sliding grooves (14) on the base (11) of the bottom sliding connection device; Cylinder (21) is mounted above the cutting frame (22); The cutting blade (23) is fixedly connected to the output end of the cylinder (21) and is located inside the cutting frame (22) for cutting solder wire (4). The cutting groove (24) is located inside the cutting frame (22) and below the cutting blade (23) and is used to cooperate with the cutting blade (23) for cutting; The cylinder (21) drives the cutting blade (23) downward to cut.

4. A cutting device for solder wire production and processing according to claim 3, characterized in that: The scale needle (25) is located on the outer wall of the bottom side of the cutting frame (22), with one end of the scale needle (25) pointing to the scale block (15) to mark and display the length of the cutting solder wire (4).

5. A cutting device for solder wire production and processing according to claim 4, characterized in that: The motion guidance component: Screw 1 (31) is rotatably connected to the inside of the device base (11); The guide rail (32) is fixedly installed inside the device base (11) and is located on both sides of the screw (31); The clamping frame (33) is slidably connected to the guide rail (32) and threadedly connected to the screw (31) for clamping the solder wire (4).

6. A cutting device for solder wire production and processing according to claim 5, characterized in that: The second slide (14) is set on both sides of the guide rail (32) and is arranged in parallel. The cutting component (2) slides above the moving guide component.

7. A cutting device for solder wire production and processing according to claim 6, characterized in that: The clamping assembly (3) includes: Screw 2 (34) is connected inside the clamping frame (33); The slider (35) is rotatably connected to the screw (34) and slidably connected to the groove (13) opened on the device base (11); The clamping blocks (36) are arranged in two sets, threadedly connected to the screw rod (34) and the thread direction of the two sets of clamping blocks (36) is opposite to that of the screw rod (34), and slidably connected to the slide groove (37); used to adjust the distance between the two sets of clamping blocks (36); Slide three (37) is located inside the clamping frame (33).

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