Battery array management unit, battery management system and energy storage equipment

Abstract

The utility model relates to a battery array management unit, a battery management system and energy storage equipment. The battery array management unit comprises a mainboard, a complete machine shell, a communication module, an antenna socket, an antenna glue stick, a first antenna I-PEX seat and a second antenna I-PEX seat, the complete machine shell wraps the mainboard, the communication module, the antenna socket, the first antenna I-PEX seat and the second antenna I-PEX seat; the communication module is arranged on the mainboard in a pluggable manner; the antenna socket is welded on the mainboard; the connecting end of the antenna glue stick is detachably connected with the antenna socket, and the antenna glue stick is partially arranged outside the whole machine shell; the first antenna I-PEX base and the second antenna I-PEX base are both arranged on the main board. According to the invention, the battery array management unit is provided with I-PEX seats of different models, so that the flexible configuration of the communication module can be ensured, the short-circuit hidden danger of main board components can be avoided, and the safety and the use convenience of the energy storage terminal can be improved.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a battery array management unit, a battery management system, and an energy storage device. Background Technology

[0002] Currently, battery array units (BAUs) on the market need to be equipped with a network module to ensure that the data collected by the BAU can be uploaded to the cloud synchronously, so that managers can view and operate the energy storage battery management system (BMS) remotely.

[0003] However, due to differences in actual application scenarios, BAU devices may or may not be equipped with a 4G module. Furthermore, the antenna I-PEX connector may differ when a 4G module is selected.

[0004] There is an urgent need for a highly adaptable terminal device that can easily connect BAUs to the network. Utility Model Content

[0005] To address the aforementioned technical issues, it is necessary to provide a battery array management unit, battery management system, and energy storage device that offers high adaptability and effectively improves the networking performance and security of energy storage devices. The specific solution is as follows:

[0006] In a first aspect, this embodiment provides a battery array management unit, including: a motherboard, a casing, a communication module, an antenna socket, an antenna adhesive rod, a first antenna I-PEX socket and a second antenna I-PEX socket, wherein the first antenna I-PEX socket and the second antenna I-PEX socket are of different models;

[0007] The outer casing encloses the motherboard, the communication module, the antenna socket, the first antenna I-PEX connector, and the second antenna I-PEX connector; the communication module is pluggable onto the motherboard; the antenna socket is soldered onto the motherboard; the connecting end of the antenna adhesive rod is detachably connected to the antenna socket, and the antenna adhesive rod portion is external to the outer casing.

[0008] Both the first antenna I-PEX socket and the second antenna I-PEX socket are mounted on the motherboard.

[0009] In one embodiment, the distance between the first antenna I-PEX socket and the second antenna I-PEX socket on the motherboard is less than or equal to a preset distance threshold.

[0010] In one embodiment, the communication module is a 4G module, which is pluggably mounted on the motherboard via a mini PCIe interface;

[0011] The antenna socket is an SMA antenna socket; the antenna adhesive rod is a 4G antenna adhesive rod, and the connection end of the 4G antenna adhesive rod is a threaded interface.

[0012] In one embodiment, the antenna socket includes a first coaxial cable, and the interface of the first coaxial cable corresponds to the first antenna I-PEX socket.

[0013] In one embodiment, when the 4G communication module is not mounted on the motherboard, the two ends of the first coaxial cable are respectively connected to the antenna socket and the first antenna I-PEX socket.

[0014] In one embodiment, when the 4G communication module is mounted on the motherboard and the interface type of the 4G communication module is the same as the model of the first antenna I-PEX socket, the two ends of the first coaxial cable are respectively connected to the antenna socket and the interface of the 4G communication module.

[0015] In one embodiment, the battery array management unit further includes: a second coaxial line;

[0016] When the 4G communication module is mounted on the motherboard and the interface type of the 4G communication module is the same as the model of the second antenna I-PEX socket, the two ends of the first coaxial cable are respectively connected to the antenna socket and the first antenna I-PEX socket, and the two ends of the second coaxial cable are respectively connected to the interface of the 4G communication module and the second antenna I-PEX socket.

[0017] In one embodiment, the wiring of the connecting lines corresponding to the first antenna I-PEX socket and / or the second antenna I-PEX socket is connected with the shortest possible distance.

[0018] Secondly, this embodiment provides a battery management system, including the battery array management unit described in the first aspect.

[0019] Thirdly, this embodiment provides an energy storage device, including the battery management system described in the second aspect.

[0020] In summary, this application provides a battery array management unit, a battery management system, and an energy storage device, including a motherboard, a housing, a communication module, an antenna socket, an antenna adhesive rod, a first antenna I-PEX connector, and a second antenna I-PEX connector. The housing encloses the motherboard, communication module, antenna socket, first antenna I-PEX connector, and second antenna I-PEX connector. The communication module is pluggable onto the motherboard. The antenna socket is soldered onto the motherboard. The antenna adhesive rod's connecting end is detachably connected to the antenna socket, with the adhesive rod portion extending outside the housing. Both the first and second antenna I-PEX connectors are located on the motherboard. The battery array management unit in this application is equipped with I-PEX connectors of different models, ensuring flexible configuration of the communication module while avoiding short-circuit risks in motherboard components, thus improving the safety and ease of use of the energy storage terminal. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural block diagram of the battery array management unit in one embodiment;

[0023] Figure 2 This is a schematic diagram of the battery array management unit in one embodiment;

[0024] Figure 3 This is a circuit diagram of a 4G module in one embodiment;

[0025] Figure 4 This is a circuit diagram of the antenna socket in one embodiment;

[0026] Figure 5 This is a circuit diagram of the first antenna I-PEX socket and the second antenna I-PEX socket in one embodiment;

[0027] Figure 6 This is a schematic diagram of an antenna adhesive rod in one embodiment;

[0028] Figure 7 This is a schematic diagram of the battery array management unit in another embodiment;

[0029] Figure 8 This is a schematic diagram of the battery array management unit in yet another embodiment;

[0030] Figure 9This is a schematic diagram of the battery array management unit in another embodiment.

[0031] Explanation of reference numerals in the attached figures:

[0032] Mainboard-101; Overall casing-102; Communication module-103; Antenna socket-104; Antenna adhesive rod-105; Connecting part-51; First fixing part-52; Rotating part-53; Second fixing part-54; Antenna part-55; First antenna I-PEX connector-106; Second antenna I-PEX connector-107. Detailed Implementation

[0033] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0035] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0036] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0037] It is understandable that "at least one" refers to one or more, and "multiple" refers to two or more. "At least a part of an element" refers to part or all of an element.

[0038] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0039] In related technologies, energy storage devices are all equipped with a Battery Management System (BMS). As the core control unit of the battery pack, the BMS mainly ensures the safe, efficient, and long-life operation of the battery pack under complex operating conditions through real-time monitoring, state estimation, safety protection, and equalization control. Within the BMS, there are management units responsible for different levels of control: the Battery Array Unit (BAU), the Battery Cluster Unit (BCU), and the Battery Module Unit (BMU).

[0040] Among them, the Battery Array Management Unit (BAU), as the highest-level management unit in the Battery Management System (BMS), is the central control unit of the BMS and can also be referred to as BAMS (Battery Array Management System) or MBMS (Multi-Battery Management System). The Battery Array Management Unit (BAU) is mainly responsible for the centralized management and coordination of the batteries in the entire energy storage power station, ensuring the safe and reliable operation of the battery system under various operating conditions.

[0041] The Battery Cluster Management Unit (BCU), as an intermediate-level management unit in the Battery Management System (BMS), is the main control unit of the BMS. It can also be called the High Voltage Unit (HVU) or the Battery Cluster Management Unit (BCMU). The BCU is primarily responsible for managing and controlling battery clusters composed of multiple battery modules.

[0042] The Battery Management Unit (BMU), as the lowest-level management unit in the BMS, is directly connected to an individual battery module or battery cell. The BMU is primarily used for real-time monitoring and management of individual battery cells to ensure the health of each cell and prevent any conditions that could damage the battery.

[0043] In related technologies, energy storage cabinets are typically equipped with a Battery Management System (BMS), and the Battery Active Unit (BAU) within the BMS serves as the control center of the management system. It needs to upload real-time data collected from the batteries in the energy storage cabinet to the cloud; therefore, the BAU device requires internet access. In practical applications, energy storage cabinets are generally installed outdoors or in remote areas where wired network connections are inconvenient. To ensure that the data collected by the BAU can be synchronously uploaded to the cloud, facilitating remote viewing and operation of the BMS by management personnel, a 4G module is configured in the BAU. In some scenarios, to reduce the deployment cost of the energy storage cabinet, the BAU may not be equipped with a 4G module.

[0044] In related technologies, battery array management units are often equipped with a 4G module and a 4G antenna. The 4G module is installed on the motherboard, and the 4G antenna is designed as an adhesive FPC antenna, which is attached to the inside of the rear shell of the battery array management unit (BAU).

[0045] During application, the configuration of 4G modules and 4G antennas presents numerous material configuration issues. For example, 4G modules manufactured on the market have different specifications, and their corresponding I-PEX connector types also differ. Typically, the BAU motherboard is configured with a standardized I-PEX connector. When users configure 4G modules on the BAU, installation problems arise because the I-PEX connector specifications on the BAU motherboard are different from the corresponding I-PEX connector type for the 4G module. Users need to invest more effort in material procurement.

[0046] Furthermore, adhesive-type FPC antennas present several problems. Because they are glued inside the back cover of the device, the signal strength received by the adhesive-type FPC antenna is relatively weak. When the BAU's back cover is metal, the metal cover will shield the antenna signal, rendering the adhesive-type FPC antenna unusable in this situation. There is a risk that the adhesive backing of the adhesive-type FPC antenna will detach as the ambient temperature rises. The adhesive-type FPC antenna comes with a first-generation I-PEX connector by default, which is incompatible with 4G modules that use second-generation I-PEX connectors. Selecting a different FPC antenna with a second-generation I-PEX connector to match this 4G module would result in inconsistent materials and lead to confusion regarding the FPC antennas used.

[0047] To solve the above problems, such as Figure 1 As shown, this embodiment provides a battery array management unit, including: a motherboard 101, a casing 102, a communication module 103, an antenna socket 104, an antenna adhesive rod 105, a first antenna I-PEX socket 106, and a second antenna I-PEX socket 107, wherein the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 are of different models.

[0048] In this embodiment, the specific materials and assembly relationship of the motherboard 101 and the casing 102 can be selected from the general materials and general assembly relationship of the battery array management unit. The specific materials and assembly relationship of the motherboard 101 and the casing 102 are not limited here.

[0049] The communication module 103 is used to enable internet access. The BAU can use the communication module 103 to perform data communication functions such as synchronously uploading data to the cloud. In this embodiment, the communication module 103 can be selected as a 4G module, 5G module, or 6G module according to the needs of the actual application scenario. It should be noted that the specific model of the communication module 103 can be adaptively configured according to the needs of the actual application scenario.

[0050] Antenna socket 104 is used to assemble the communication antenna. In this embodiment, antenna socket 104 has at least one coaxial line directly connected to antenna socket 104 at one end. The core structure of the coaxial line consists of two coaxial cylindrical conductors, with air or a high-frequency dielectric filled between the inner and outer conductors to form a broadband microwave transmission system. Antenna rod 105 is an external wireless communication antenna made of elastic material, which can be adapted to various wireless communication scenarios.

[0051] I-PEX connectors are miniature connectors widely used in the radio frequency (RF) field, characterized by high frequency, small size, and multiple generations of iteration. In this embodiment, the first I-PEX connector can be a first-generation, second-generation, third-generation, fourth-generation, or fifth-generation I-PEX connector. The second I-PEX connector can also be a first-generation, second-generation, third-generation, fourth-generation, or fifth-generation I-PEX connector. In this embodiment, the first and second I-PEX connectors have different model numbers. For example, if the first I-PEX connector is a first-generation I-PEX connector, the second I-PEX connector is a second-generation I-PEX connector. If the second I-PEX connector is a first-generation I-PEX connector, the first I-PEX connector is a second-generation I-PEX connector.

[0052] It should be noted that in practical applications, the antenna socket 104 and the communication module 103 mainly use either a first-generation or second-generation I-PEX socket. Therefore, in this embodiment, the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 are preferably either first-generation or second-generation I-PEX sockets.

[0053] In this embodiment, the outer casing 102 encloses the motherboard 101, communication module 103, antenna socket 104, first antenna I-PEX connector 106, and second antenna I-PEX connector 107. The communication module 103 is pluggably mounted on the motherboard 101. The antenna socket 104 is soldered onto the motherboard 101. The connecting end of the antenna adhesive rod 105 is detachably connected to the antenna socket 104, and part of the antenna adhesive rod 105 extends outside the outer casing 102.

[0054] In this embodiment, by making the communication module 103 pluggable onto the motherboard 101, the user can determine whether to select a suitable communication module 103 to be installed on the motherboard 101 according to the needs of the actual application scenario. In this embodiment, the motherboard 101 of the main BAU mainly includes the following two states: First, the communication module 103 is not installed on the motherboard 101. Second, the communication module 103 is installed on the motherboard 101.

[0055] In this embodiment, the antenna socket 104 is soldered onto the motherboard 101, effectively avoiding the drawback of adhesive antennas easily falling off. The connecting end of the antenna adhesive rod 105 is detachably connected to the antenna socket 104. In practical applications, when the BAU motherboard 101 has a communication module 103, the connecting end of the antenna adhesive rod 105 is connected to the antenna socket 104. When the BAU motherboard 101 does not have a communication module 103, the connecting end of the antenna adhesive rod 105 is separated from the antenna socket 104. In this embodiment, by partially placing the antenna adhesive rod 105 outside the overall housing 102, the communication capability of the communication antenna can be maximized, effectively avoiding the problem of weak communication capability caused by the environmental influence of adhesive antennas. Furthermore, since the antenna adhesive rod 105 is partially placed outside the overall housing 102 when connected to the antenna socket 104, the BAU housing can be made of a suitable material, such as metal, according to the needs of the actual application scenario, without considering the impact on the communication capability of the communication antenna.

[0056] In this embodiment, the mainboard 101 of the BAU is equipped with at least two I-PEX sockets, namely a first antenna I-PEX socket 106 and a second antenna I-PEX socket 107, that is, both the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 are disposed on the mainboard 101.

[0057] In this embodiment, since the mainboard 101 of the BAU is equipped with at least a first antenna I-PEX socket 106 and a second antenna I-PEX socket 107, whether or not the communication module 103 is installed on the mainboard 101, the coaxial cable of the antenna socket 104 will not be left empty. Therefore, the coaxial cable of the antenna socket 104 will not be left empty, and short circuit abnormalities will not occur with other components on the mainboard 101, causing damage to the mainboard 101 of the BAU.

[0058] In summary, this embodiment provides a battery array management unit (BAU) that is soldered onto the mainboard 101 via the antenna socket 104, effectively avoiding the drawback of adhesive antennas easily falling off. By partially externalizing the antenna adhesive rod 105 outside the overall housing 102, the communication capability of the communication antenna is maximized, effectively preventing the weak communication capability caused by the environmental influence of adhesive antennas. By configuring at least a first antenna I-PEX connector 106 and a second antenna I-PEX connector 107 on the mainboard 101, the compatibility of the BAU mainboard 101 is greatly improved, facilitating the collection of materials from the communication module 103 and the antenna socket 104 by staff, and preventing the presence of idle coaxial cables in the BAU, thus significantly improving the safety of the energy storage device.

[0059] In one embodiment, the distance between the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 on the motherboard 101 is less than or equal to a preset distance threshold.

[0060] In this embodiment, as Figure 2 As shown, the first antenna I-PEX connector 106 is a first-generation I-PEX connector, and the second antenna I-PEX connector 107 is a second-generation I-PEX connector. The PCB trace distance between the first antenna I-PEX connector 106 and the second antenna I-PEX connector 107, i.e., the setting distance between the first antenna I-PEX connector 106 and the second antenna I-PEX connector 107 on the motherboard 101, is less than or equal to a preset distance threshold. The preset distance threshold can be defined and configured according to the needs of the actual application scenario.

[0061] It is worth noting that in this embodiment, the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 are close together, and the wiring is connected with the shortest distance, which can effectively avoid the influence of the first antenna I-PEX socket 106 and the second antenna I-PEX socket 107 on the antenna signal.

[0062] In one feasible embodiment, the wiring of the connecting lines corresponding to the first antenna I-PEX socket 106 and / or the second antenna I-PEX socket 107 is connected with the shortest possible distance.

[0063] When the first antenna I-PEX connector 106 and / or the second antenna I-PEX connector 107 are connected to other devices, the coaxial cable can also be connected at the shortest distance without affecting the operating performance of other devices, thereby maximizing the performance of the motherboard 101 and achieving cost control.

[0064] In one embodiment, such as Figure 2 and Figure 3As shown, the communication module 103 is a 4G module, which is pluggable onto the motherboard 101 via a miniPCIE interface. It should be noted that this embodiment does not limit the specific chip model of the pluggable 4G module; commonly available general-purpose 4G modules can be used. Figure 3 As shown, the 4G module can be plugged into the motherboard 101 by soldering a 52-pin mini PCIe socket onto the motherboard 101.

[0065] like Figure 4 As shown, antenna socket 104 is an SMA antenna socket 104. In this embodiment, the default coaxial cable connection terminal of the soldered SMA antenna socket 104 is a first-generation I-PEX connector. In this embodiment, the SMA antenna socket 104 can use a 4-pin plug-in coaxial connector, soldered onto the motherboard 101.

[0066] like Figure 5 As shown, the first I-PEX socket is configured as a first-generation I-PEX socket, and the second I-PEX socket is configured as a second-generation I-PEX socket.

[0067] like Figure 6 As shown, the antenna rod 105 is a 4G antenna rod 105, and the connecting end of the 4G antenna rod 105 is a threaded interface. The antenna rod 105 includes a connecting part 51, a first fixing part 52, a rotating part 53, a second fixing part 54, and an antenna part 55. The connecting part 51, which is the connecting end of the 4G antenna rod 105, has a threaded shape corresponding to the SMA antenna socket 104, and can be threadedly connected to the SMA antenna socket 104. The first fixing part 52 is directly connected to the connecting part 51, and the first fixing part 52 is rotatably connected to the second fixing part 54 via the rotating part 53. The second fixing part 54 is directly connected to the antenna part 55. The first fixing part 52 and the second fixing part 54 mainly serve to fix and support the antenna. The rotating part 53 allows the antenna part 55 of the antenna rod 105 to rotate at a certain angle, thereby better assembling the external antenna rod 105 and achieving better communication signal.

[0068] In one feasible embodiment, the 4G antenna adhesive rod 105 can be made of an elastic material to facilitate the assembly flexibility of the external antenna adhesive rod 105. In this embodiment, the specific dimensions of the 4G antenna adhesive rod 105 are not limited; reference can be made to... Figure 6 The dimensions are configured accordingly. For example, when the connecting part 51, the first fixing part 52, the rotating part 53, the second fixing part 54, and the antenna part 55 of the 4G antenna rod 105 are arranged horizontally, the dimensions are 195. 3 millimeters (mm).

[0069] In one embodiment, the antenna socket 104 includes a first coaxial cable, and the interface of the first coaxial cable corresponds to the first antenna I-PEX connector 106. In this embodiment, the default connection end of the first coaxial cable of the antenna socket 104 is a first-generation I-PEX connector.

[0070] In one embodiment, such as Figure 7 As shown, when the 4G communication module 103 is not installed on the motherboard 101, the two ends of the first coaxial cable are connected to the antenna socket 104 and the first antenna I-PEX socket 106, respectively.

[0071] In this embodiment, when the BAU is not equipped with a 4G module, the coaxial cable of the soldered SMA antenna socket 104 is connected to the first-generation I-PEX socket on the motherboard 101. This avoids the coaxial cable being suspended above the motherboard 101, completely eliminating the risk of short circuit between the coaxial cable and the devices on the motherboard 101, and effectively improving the safety of the BAU.

[0072] In one embodiment, such as Figure 8 As shown, when the 4G communication module 103 is mounted on the motherboard 101 and the interface type of the 4G communication module 103 is the same as the model of the first antenna I-PEX socket 106, the two ends of the first coaxial cable are respectively connected to the antenna socket 104 and the interface of the 4G communication module 103.

[0073] In this embodiment, when the 4G module selected by the BAU is the first-generation I-PEX socket, since the coaxial cable of the soldered SMA antenna socket 104 is of the first generation by default, the coaxial cable can be directly connected to the 4G module to realize network communication.

[0074] In one embodiment, such as Figure 9 As shown, the battery array management unit also includes a second coaxial cable. In this embodiment, both ends of the second coaxial cable correspond to second-generation I-PEX sockets.

[0075] When the 4G communication module 103 is mounted on the motherboard 101, and the interface type of the 4G communication module 103 is the same as the model of the second antenna I-PEX connector 107, the two ends of the first coaxial cable are connected to the antenna socket 104 and the first antenna I-PEX connector 106, respectively, and the two ends of the second coaxial cable are connected to the interface of the 4G communication module 103 and the second antenna I-PEX connector 107, respectively.

[0076] In this embodiment, when the 4G module selected for the BAU is a second-generation I-PEX connector, the coaxial cable of the soldered SMA antenna socket 104 is connected to the first-generation I-PEX connector on the motherboard 101, and a second coaxial cable is used to connect the 4G module and the second-generation I-PEX connector on the motherboard 101. This effectively avoids the coaxial cable being suspended above the motherboard 101, eliminating the risk of short circuit between the coaxial cable and the components on the motherboard 101, and effectively improving the safety of the BAU.

[0077] In summary, this embodiment provides a battery array management unit that uses an external 4G antenna mount, improving the strength of the antenna signal reception. Using an external 4G antenna mount allows for continued use even when the BAU's back cover is metal, overcoming product form limitations. The external 4G antenna mount ensures stability and prevents detachment even in high-temperature environments. It is compatible with pluggable 4G modules from various manufacturers, regardless of the type of I-PEX connector on the 4G module. This broadens the selection of 4G modules, ensuring supply stability and delivery time, and reducing procurement costs. When the BAU is not equipped with a 4G module, it avoids short circuits in motherboard components. It standardizes the motherboard BOM, reducing the workload of BOM development and maintenance, and facilitating the production and material preparation of motherboard components.

[0078] In one embodiment, a battery management system is also provided, including the battery array management unit in the foregoing embodiments.

[0079] In one embodiment, an energy storage device is also provided, including the battery management system described in the foregoing embodiments.

[0080] In this embodiment, the energy storage device can be an energy storage cabinet. Optionally, the energy storage device can also be an energy storage cabinet installed in a remote area. It should be understood that the energy storage device can also be selected according to the needs of the actual application scenario. The energy storage device includes a battery management system, which is equipped with the battery array management unit in the aforementioned embodiment.

[0081] In this embodiment, the implementation method of configuring the battery array management unit in the aforementioned embodiment on the energy storage cabinet can refer to the specific implementation method in the aforementioned embodiment, and will not be repeated here.

[0082] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A battery array management unit, characterized in that, include: The components include a motherboard, a complete casing, a communication module, an antenna socket, an antenna adhesive rod, a first antenna I-PEX connector, and a second antenna I-PEX connector, wherein the first antenna I-PEX connector and the second antenna I-PEX connector are of different models. The outer casing encloses the motherboard, the communication module, the antenna socket, the first antenna I-PEX connector, and the second antenna I-PEX connector; the communication module is pluggable onto the motherboard; the antenna socket is soldered onto the motherboard; the connecting end of the antenna adhesive rod is detachably connected to the antenna socket, and the antenna adhesive rod portion is external to the outer casing. Both the first antenna I-PEX socket and the second antenna I-PEX socket are mounted on the motherboard.

2. The battery array management unit according to claim 1, characterized in that, The distance between the first antenna I-PEX socket and the second antenna I-PEX socket on the motherboard is less than or equal to a preset distance threshold.

3. The battery array management unit according to claim 2, characterized in that, The communication module is a 4G module, which is pluggably mounted on the motherboard via a mini PCIe interface. The antenna socket is an SMA antenna socket; the antenna adhesive rod is a 4G antenna adhesive rod, and the connection end of the 4G antenna adhesive rod is a threaded interface.

4. The battery array management unit according to claim 3, characterized in that, The antenna socket includes a first coaxial cable, and the interface of the first coaxial cable corresponds to the first antenna I-PEX socket.

5. The battery array management unit according to claim 4, characterized in that, When the 4G communication module is not mounted on the motherboard, the two ends of the first coaxial cable are respectively connected to the antenna socket and the first antenna I-PEX socket.

6. The battery array management unit according to claim 4, characterized in that, When the 4G communication module is mounted on the motherboard and the interface type of the 4G communication module is the same as the model of the first antenna I-PEX socket, the two ends of the first coaxial cable are respectively connected to the antenna socket and the interface of the 4G communication module.

7. The battery array management unit according to claim 4, characterized in that, The battery array management unit further includes: a second coaxial line; When the 4G communication module is mounted on the motherboard and the interface type of the 4G communication module is the same as the model of the second antenna I-PEX socket, the two ends of the first coaxial cable are respectively connected to the antenna socket and the first antenna I-PEX socket, and the two ends of the second coaxial cable are respectively connected to the interface of the 4G communication module and the second antenna I-PEX socket.

8. The battery array management unit according to any one of claims 1-7, characterized in that, The wiring of the connecting lines corresponding to the first antenna I-PEX socket and / or the second antenna I-PEX socket is connected with the shortest possible distance.

9. A battery management system, characterized in that, Includes the battery array management unit as described in any one of claims 1-8.

10. An energy storage device, characterized in that, Includes the battery management system according to claim 9.

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