Integrated microwave source device

Abstract

The utility model belongs to the field of microwave devices, and particularly relates to an integrated microwave source device. Comprising a shell, a microwave power supply and a microwave generator, the microwave power supply comprises a high-voltage power supply, the high-voltage power supply comprises an input rectifier module, an inverter module, a transformer module and an output rectifier module which are sequentially connected in series, and the microwave generator comprises a magnetron; a middle partition plate is arranged in the shell, the interior of the shell is arranged in a double-layer mode through the middle partition plate, a first water-air heat exchanger and a fan are arranged on the two sides of the magnetron correspondingly, and a first ventilation opening and a second ventilation opening are formed in the two ends of the middle partition plate correspondingly; and the shell upper layer, the first ventilation opening, the shell lower layer and the second ventilation opening form a circulating air duct. The utility model provides an integrated microwave source device, and aims to solve the problem of poor heat dissipation capability of an integrated microwave source device in the prior art.

Description

Technical Field

[0001] This utility model belongs to the field of microwave devices, specifically relating to an integrated microwave source device. Background Technology

[0002] A microwave device is a device or system that uses microwaves (electromagnetic waves with wavelengths on the order of micrometers) to perform various operations. A microwave device includes a microwave power supply and a microwave generator, and because the microwave power supply and microwave generator generate a lot of heat, heat dissipation for the microwave power supply and microwave generator is essential.

[0003] In existing technologies, microwave devices include both split-type and integrated designs. In a split-type design, the microwave power supply and microwave generator are two separate devices, allowing for independent heat dissipation for each, resulting in better heat dissipation. However, in an integrated design, because the microwave power supply and microwave generator are installed close together, the heat generated by them cannot be quickly conducted and absorbed for dissipation, leading to poor overall heat dissipation capabilities in existing integrated microwave devices. Utility Model Content

[0004] This utility model provides an integrated microwave source device, the purpose of which is to solve the problem of poor heat dissipation capacity of existing integrated microwave source devices.

[0005] To achieve the above objectives, this utility model provides an integrated microwave source device, including a housing, a microwave power supply and a microwave generator disposed inside the housing and electrically connected thereto; the microwave power supply includes a high-voltage power supply, which includes an input rectifier module, an inverter module, a transformer module and an output rectifier module connected in series; the microwave generator includes a magnetron.

[0006] The housing is provided with a partition plate, which makes the interior of the housing have two layers. The high-voltage power supply is located in the lower layer of the housing, and the microwave generator is located in the upper layer of the housing. A first water-air heat exchanger and a fan are respectively provided on both sides of the magnetron. A first vent and a second vent are respectively provided at both ends of the partition plate. The upper layer of the housing, the first vent, the lower layer of the housing, and the second vent form a circulating air duct.

[0007] This solution utilizes a circulating airflow channel within the casing to remove heat generated by the microwave power supply and generator. The heat-carrying airflow then exchanges heat with a first water-air heat exchanger, cooling the airflow. The cooled airflow then contacts the microwave power supply and generator again for further cooling, creating a continuous airflow circulation. This method achieves better heat dissipation for the microwave power supply and generator compared to existing integrated microwave source devices.

[0008] Preferably, in order to supply cooling water to the first water-air heat exchanger, this solution further includes a water-to-water heat exchanger and a pump body. The water-to-water heat exchanger is connected to the first water-air heat exchanger. The pump body is disposed in the water circulation between the water-to-water heat exchanger and the first water-air heat exchanger, and the pump body is used to deliver cooling water to the first water-air heat exchanger.

[0009] In this design, a water-to-water heat exchanger is used to provide cooling water. Then, the pump operates, delivering the cooling water from the water-to-water heat exchanger to the first water-to-air heat exchanger. Inside the first water-to-air heat exchanger, the cooling water exchanges heat with the airflow, thus cooling the airflow.

[0010] Preferably, in order to achieve better heat dissipation, this solution also includes a first water distributor and a heat dissipation pipe. The inlet of the first water distributor is connected to the first water-air heat exchanger, the outlet of the first water distributor is connected to the heat dissipation pipe, and the heat dissipation pipe is connected to the water-to-water heat exchanger.

[0011] In this design, after the cooling water flows out from the first water-air heat exchanger, it flows to the first water distributor, which then guides the cooling water into the heat dissipation pipes. The heat dissipation pipes then dissipate heat from the electrical components, ultimately improving the overall cooling performance of the device.

[0012] Preferably, any one or more of the input rectifier module, inverter module, transformer module and output rectifier module can be configured with a heat sink connector and connected to the heat sink.

[0013] In order to improve the heat dissipation effect of any one or more of the input rectifier module, inverter module, transformer module and output rectifier module, this solution preferably allows any one or more of the input rectifier module, inverter module, transformer module and output rectifier module to be equipped with heat pipe connectors, so that any one or more of the input rectifier module, inverter module, transformer module and output rectifier module can be cooled by heat pipes.

[0014] Preferably, in order to improve the heat exchange effect with the airflow, this solution also includes a second water-air heat exchanger. The inlet of the second water-air heat exchanger is connected to the first water distributor via the heat dissipation pipe, and the outlet of the second water-air heat exchanger is connected to the second water distributor. The second water distributor is connected to the water-water heat exchanger.

[0015] Alternatively, to improve the heat exchange effect with the airflow, this solution also includes a second water-air heat exchanger, the inlet of which is connected to the first water distributor via the heat dissipation pipe, and the outlet of which is connected to the water-water heat exchanger.

[0016] This design incorporates a second water-air heat exchanger inside the casing. When this second heat exchanger comes into contact with the airflow, it further cools the airflow. The cooled airflow then flows within the casing, further enhancing the heat dissipation of the integrated microwave source device.

[0017] Preferably, since the first water-air heat exchanger is located on the upper layer of the shell, in order to improve the heat exchange effect of the second water-air heat exchanger, the second water-air heat exchanger is located on the lower layer of the shell in this solution.

[0018] This design places the first water-air heat exchanger on the upper layer of the shell and the second water-air heat exchanger on the lower layer. The first and second water-air heat exchangers work together to cool the airflow. Because the first and second water-air heat exchangers are located on the upper and lower layers of the shell respectively, the second water-air heat exchanger provides better heat exchange for the airflow compared to placing them on the same layer.

[0019] Preferably, since the magnetron generates a large amount of heat, in order to improve the heat dissipation effect of the magnetron, the magnetron in this solution is installed inside the mounting box, and the first water-air heat exchanger and the fan are respectively installed on both sides of the mounting box.

[0020] In this design, the first water-air heat exchanger and the fan are installed on opposite sides of the mounting box, while the magnetron is located inside the mounting box. Therefore, the heat generated by the magnetron is carried away by the driven airflow, which then directly contacts the first water-air heat exchanger, resulting in heat exchange and cooling.

[0021] Preferably, the housing is further provided with a vertically arranged front partition; a second ventilation opening is formed between the front partition and the middle partition, and a third ventilation opening is provided at both the upper and lower ends of the front partition.

[0022] Preferably, the fan is located between the magnetron and the front partition, and blows air along the direction from the magnetron to the first water-air heat exchanger.

[0023] Preferably, the microwave power supply further includes a filament power supply and a magnetic field power supply; the microwave generator further includes a waveguide interface, and the magnetron is used to convert the electrical energy generated by the microwave power supply into microwaves and transmit them to the waveguide interface.

[0024] The beneficial effects of this invention are as follows: First, a partition separates the microwave generator and the high-voltage power supply, which generate significant heat. Then, the circulating airflow inside the casing dissipates the heat from both the microwave generator and the high-voltage power supply. Finally, the heat-carrying airflow exchanges heat with the first water-air heat exchanger, thus cooling the airflow. This heat dissipation method provides rapid cooling for both the microwave power supply and the microwave generator, offering superior heat dissipation compared to existing integrated microwave source devices.

[0025] Secondly, for magnetrons that generate a lot of heat, this solution places the fan and the first water-air heat exchanger on both sides of the magnetron, so that the heat generated by the magnetron can be quickly conducted and the heat dissipation effect of the magnetron can be improved. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of an integrated microwave source device.

[0027] Figure 2 This is a schematic diagram illustrating how airflow dissipates heat from the magnetron.

[0028] Figure 3 This is a schematic diagram of airflow circulating inside the casing (the arrows in the diagram indicate the direction of airflow).

[0029] The reference numerals in the attached drawings include: shell 1, middle partition 11, front partition 12, first vent 13, second vent 14, third vent 15, microwave generator 2, magnetron 21, microwave power supply 3, fan 4, first water-air heat exchanger 5, second water-air heat exchanger 6, water-water heat exchanger 7, pump body 8, and first water distributor 9. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0031] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" are defined based on the contours of the corresponding components. Terms such as "first" and "second" used in this disclosure are for distinguishing one element from another and do not imply sequence or importance.

[0032] Example 1

[0033] The basics are as follows: Figure 1 As shown, the integrated microwave source device includes a housing 1, which is made of metal and can be rectangular in shape. The bottom of the housing 1 is equipped with feet for support. The housing 1 is completely enclosed, preventing air exchange between the interior and exterior, thus avoiding the entry of external impurities into the housing 1.

[0034] like Figure 1As shown, in this embodiment, the housing 1 is provided with a middle partition 11 and a front partition 12. The middle partition 11 is horizontally installed and is located in the middle of the housing 1, thus dividing the housing 1 into an upper and lower layer. The middle partition 11 can be installed inside the housing 1 by welding or by using fasteners. The front partition 12 is vertically installed and is installed on the right side inside the housing 1. The front partition 12 can also be installed inside the housing 1 by welding or by using fasteners.

[0035] like Figure 1 As shown, in this embodiment, a first vent 13 and a second vent 14 are respectively provided on the left and right sides of the partition 11. The first vent 13 and the second vent 14 connect the upper layer and the lower layer of the shell, and the first vent 13 and the second vent 14 are used for airflow between the upper layer and the lower layer of the shell. The first vent 13 and the second vent 14 can be rectangular, circular, or porous.

[0036] To form the first vent 13, the first vent 13 can be directly constructed on the partition plate 11; alternatively, a notch can be constructed at the left edge of the partition plate 11, so that the partition plate 11 and the inner wall of the housing 1 combine to form the first vent 13. To form the second vent 14, the second vent 14 can be directly constructed on the partition plate 11; alternatively, a notch can be constructed at the left edge of the partition plate 11, so that the partition plate 11 and the front partition plate 12 combine to form the second vent 14.

[0037] In this embodiment, to facilitate gas flow, the front partition 12 is provided with third vents 15 at its upper and lower ends. The third vents 15 can be rectangular, circular, or porous.

[0038] In this embodiment, a microwave power supply 3 and a microwave generator 2 are installed inside the housing 1. The microwave power supply 3 includes a high-voltage power supply, a filament power supply, and a magnetic field power supply. The high-voltage power supply includes an input rectifier module, an inverter module, a transformer module, and an output rectifier module connected in series. During installation, the input rectifier module and the inverter module can be installed on the lower right side of the front partition 12, while the filament power supply, the magnetic field power supply, and the relevant control components of the high-voltage power supply can be installed on the upper right side of the front partition 12; the transformer module and the output rectifier module are located on the left side of the front partition 12 and below the middle partition 11. The microwave generator 2 is installed on the upper layer of the housing 1. The microwave generator 2 includes a magnetron 21 and a waveguide interface. The magnetron 21 is used to convert the electrical energy generated by the microwave power supply 3 into microwaves and transmit them to the waveguide interface.

[0039] In this embodiment, the magnetron 21 is installed inside a rectangular housing, which is located on the upper layer of the shell. To dissipate heat from the magnetron 21 inside the housing, a fan 4 and a first water-air heat exchanger 5 are respectively installed on both sides of the magnetron 21. In practice, the fan 4 can be installed on the right outer wall of the housing, and the fan 4 is connected to the interior of the housing. Multiple fans 4 can be installed, such as two, three, or four. The first water-air heat exchanger 5 is installed on the left outer wall of the housing, and the first water-air heat exchanger 5 is connected to the interior of the housing.

[0040] The following describes the heat dissipation process of the magnetron 21 via airflow: When the fan 4 is working, it draws air from outside the housing into the housing, where the airflow cools the magnetron 21. After contacting the magnetron 21, the airflow flows to the first water-air heat exchanger 5, where it is cooled. Finally, the air, having completed heat exchange, is released back outside the housing. For details, please refer to [reference needed]. Figure 2 .

[0041] The following describes the heat dissipation process of the airflow within the entire housing 1: After the airflow reaches the outside of the housing, it continues to flow to the first vent 13 and then to the lower layer of the housing. In the lower layer, the airflow flows from left to right, then to the second vent 14 and reaches the upper layer of the housing via the first vent 13. In the upper layer, the airflow flows from right to the fan 4 and enters the housing. Additionally, when the airflow flows from left to right in the lower layer, it also flows to the lower third vent 15 and enters the right side of the front partition 12, dissipating heat from the electrical components on the right side of the front partition 12. The airflow is then released to the upper layer of the housing via the upper third vent 15. For details, please refer to [reference needed]. Figure 3 .

[0042] It should be noted that: In this embodiment, the fan 4 is set on the upper layer of the shell. However, in some other embodiments, fans can also be set on the lower layer of the shell and at the first vent 13, the second vent 14 and the third vent 15, etc., so as to drive the airflow through the fan and thus achieve a better heat dissipation effect.

[0043] To supply cooling water to the first water-air heat exchanger 5, in this embodiment, the inlet of the first water-air heat exchanger 5 is connected to the outlet of the pump body 8, and the inlet of the pump body 8 is then connected to the water-to-water heat exchanger 7. The water-to-water heat exchanger 7 is connected to an external pipe network. When the first water-air heat exchanger 5 is operating, the pump body 8 delivers the cooling water output from the water-to-water heat exchanger 7 to the first water-air heat exchanger 5, ensuring the cooling water supply to the first water-air heat exchanger 5.

[0044] It is understood that, in this embodiment, the outlet of the pump body 8 is preferably connected to the first water-air heat exchanger 5 via a pipe, and the inlet of the pump body is connected to the water-water heat exchanger 7 via a pipe. However, in some other embodiments, the pump body 8 can also be located at other positions in the water circulation path. For example, the pump body 8 can be directly installed on the first water-air heat exchanger 5, so that the outlet of the pump body 8 is directly connected to the first water-air heat exchanger 5, while the inlet of the pump body is connected to the water-water heat exchanger 7 via a pipe.

[0045] To achieve heat dissipation for electrical modules such as the input rectifier module, inverter module, transformer module, and output rectifier module, in this embodiment, the outlet of the first water-air heat exchanger 5 is connected to the first water distributor 9. The outlet of the first water distributor 9 is connected to multiple heat dissipation pipes (not shown in the figure). The outlets of these heat dissipation pipes can be directly connected to the water-to-water heat exchanger 7, thereby achieving the return flow of cooling water. It should be noted that in some embodiments, the outlets of the heat dissipation pipes can also be connected to a second water distributor, which is then connected to the water-to-water heat exchanger 7. The second water distributor is used to merge the water flows, and the merged cooling water then flows back to the water-to-water heat exchanger 7, achieving the return flow of cooling water.

[0046] In this embodiment, before the cooling water flows back to the water-to-water heat exchanger 7, each heat dissipation pipe extends through different electrical components, allowing the heat emitted by the electrical components to be absorbed by the heat dissipation pipes, further improving the heat dissipation effect. For example, when heat dissipation is required for the transformer module, the heat dissipation pipe extends through the transformer module to dissipate heat from it. The heat released by the transformer module exchanges heat with the heat dissipation pipes, achieving cooling at the transformer module. Simultaneously, heat dissipation pipe connectors can be configured at the transformer module to connect multiple heat dissipation pipe sections, ensuring that the length of the heat dissipation pipes meets the heat dissipation requirements.

[0047] To further improve the heat dissipation effect of the entire device, this embodiment also includes a second water-air heat exchanger. The second water-air heat exchanger 6 is located in the lower layer of the casing, specifically between the transformer module and the output rectifier module. When airflow passes through the second water-air heat exchanger 6, it cools the airflow. To supply cooling water to the second water-air heat exchanger 6, this embodiment can place the second water-air heat exchanger 6 along the path of any heat dissipation pipe. For example, the inlet of the second water-air heat exchanger 6 can be connected to the heat dissipation pipe corresponding to the output rectifier module. After the heat dissipation pipe supplies cooling water to the second water-air heat exchanger 6, the cooling water undergoes water-air heat exchange inside the second water-air heat exchanger 6, and finally flows back into the heat dissipation pipe.

[0048] It should be noted that when a second water distributor is configured, the cooling water output from the second water-air heat exchanger 6 is merged into the second water distributor, and the cooling water flows back to the water-water heat exchanger 7 after passing through the second water distributor.

[0049] The following detailed description of specific implementation methods illustrates this further: When the microwave source device is in operation, both the airflow and the cooling water circulate.

[0050] The gas flow circulation path is as follows: When fan 4 operates, it drives the airflow from the right side of the upper layer of the casing to the left side; then the airflow flows to the first vent 13, and through the first vent 13, it reaches the lower layer of the casing; subsequently, the airflow flows from the left side to the right side of the lower layer of the casing, and then to the second vent 14, through the first vent 13, reaching the upper layer of the casing; finally, the airflow is again driven by fan 4 from the right side of the upper layer of the casing to the left side of the upper layer of the casing. In addition, when the airflow flows from the left to the right side of the lower layer of the casing, it also flows to the third vent 15 located at the bottom, and through the third vent 15 enters the right side of the front partition 12; then the airflow is released to the upper layer of the casing through the third vent 15 located at the top.

[0051] The cooling water circulation path is as follows: Pump 8 delivers the cooling water supplied by water-to-water heat exchanger 7 to the first water-to-air heat exchanger 5, where water-to-air heat exchange occurs; then, the cooling water flows through pipes to the first distributor 9, which guides the cooling water into the heat dissipation pipes; then, the cooling water flows through the heat dissipation pipes into the second water-to-air heat exchanger 6, and finally, the cooling water flows back to the water-to-water heat exchanger 7. The water-to-water heat exchanger 7 can exchange heat and cool the cooling water, ensuring the supply of cooling water.

[0052] The above descriptions are merely embodiments of this utility model, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An integrated microwave source device, characterized in that: The device includes a housing, a microwave power supply and a microwave generator disposed inside the housing and electrically connected thereto; the microwave power supply includes a high-voltage power supply, which includes an input rectifier module, an inverter module, a transformer module and an output rectifier module connected in series; the microwave generator includes a magnetron. The housing is provided with a partition plate, which makes the interior of the housing have two layers. The high-voltage power supply is located in the lower layer of the housing, and the microwave generator is located in the upper layer of the housing. A first water-air heat exchanger and a fan are respectively provided on both sides of the magnetron. A first vent and a second vent are respectively provided at both ends of the partition plate. The upper layer of the housing, the first vent, the lower layer of the housing, and the second vent form a circulating air duct.

2. The integrated microwave source device according to claim 1, characterized in that: It also includes a water-to-water heat exchanger and a pump body, wherein the water-to-water heat exchanger is connected to the first water-air heat exchanger; The pump body is installed in the water circulation between the water-to-water heat exchanger and the first water-to-air heat exchanger, and the pump body is used to deliver cooling water to the first water-to-air heat exchanger.

3. The integrated microwave source device according to claim 2, characterized in that: It also includes a first water distributor and a heat dissipation pipe. The inlet of the first water distributor is connected to the first water-air heat exchanger, and the outlet of the first water distributor is connected to the heat dissipation pipe. The heat dissipation pipe is connected to the water-to-water heat exchanger.

4. The integrated microwave source device according to claim 3, characterized in that: Any one or more of the input rectifier module, inverter module, transformer module and output rectifier module can be configured with a heat sink connector and connected to the heat sink.

5. The integrated microwave source device according to claim 3, characterized in that: It also includes a second water-air heat exchanger, the inlet of which is connected to the first water distributor via the heat dissipation pipe, and the outlet of which is connected to the water-water heat exchanger. or; It also includes a second water-air heat exchanger, the inlet of which is connected to the first water distributor via the heat dissipation pipe, the outlet of which is connected to the second water distributor, and the second water distributor is connected to the water-water heat exchanger.

6. The integrated microwave source device according to claim 5, characterized in that: The second water-air heat exchanger is located in the lower layer of the shell.

7. The integrated microwave source device according to claim 1, characterized in that: The magnetron is installed inside the mounting box, and the first water-air heat exchanger and the fan are respectively installed on the left and right sides of the mounting box.

8. The integrated microwave source device according to claim 1, characterized in that: The housing also has a vertically arranged front partition; A second ventilation opening is formed between the front partition and the middle partition, and a third ventilation opening is provided at both the upper and lower ends of the front partition.

9. The integrated microwave source device according to claim 8, characterized in that: The fan is located between the magnetron and the front partition, and blows air along the magnetron toward the first water-air heat exchanger.

10. The integrated microwave source device according to claim 1, characterized in that: The microwave power supply also includes a filament power supply and a magnetic field power supply; the microwave generator also includes a waveguide interface, and the magnetron is used to convert the electrical energy generated by the microwave power supply into microwaves and transmit them to the waveguide interface.

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