LED filament lamp and display equipment

By uniformly distributing LED chips on a sapphire substrate and setting opposite connection directions, combined with silicone layer and transparent protective cover encapsulation, the light decay problem of LED beads in harsh environments is solved, achieving stable use in DC and AC environments, and improving lifespan and luminous efficiency.

CN224218766UActive Publication Date: 2026-05-08JIANGXI SMART SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGXI SMART SEMICON CO LTD
Filing Date
2025-04-24
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

Existing LED chips are prone to light decay when used for a long time in harsh environments, and can only be used in DC environments, which cannot meet the requirements of AC environments.

Method used

It uses LED chips evenly distributed on a sapphire substrate with opposite connection directions, combined with silicone layer encapsulation and transparent protective cover encapsulation, and has heat dissipation holes to form an LED filament structure, which is suitable for low voltage DC and AC environments.

Benefits of technology

It improves the lifespan and luminous efficacy of LED filament lamps in harsh environments, solves the light decay problem, and enables normal use in AC environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an LED filament lamp and a display device, the LED filament lamp comprises a sapphire substrate, a plurality of LED chips and a transparent protective cover, the plurality of LED chips are uniformly distributed on the sapphire substrate in a matrix form, the connection directions of the adjacent LED chips are opposite, the sapphire substrate and the plurality of LED chips are combined to form an LED filament, and the transparent protective cover is arranged on the sapphire substrate. A plurality of side walls of the sapphire substrate are covered with silica gel layers, and the silica gel layers wrap the LED chips; the interior of the transparent protection cover is hollow to form a containing space, the LED lamp filament is located in the containing space, a plurality of heat dissipation holes are formed in the transparent protection cover, and the heat dissipation holes communicate with the containing space. And meanwhile, the problem that when the LED filament lamp is used for a long time in a severe environment, the light attenuation of the LED filament lamp is large is solved.
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Description

Technical Field

[0001] This utility model relates to the field of automotive lighting technology, and in particular to an LED filament lamp and display device. Background Technology

[0002] With the continuous development of electric and autonomous vehicles, the importance of lighting is also increasing. Generally, car parking lights and reading lights typically use halogen lamps with a power range of approximately 5-21W. Because LED filaments have a much higher luminous efficiency than halogen lamps, achieving the same lighting effect requires significantly less power from LED filaments, thus placing a smaller burden on the vehicle's power supply. Therefore, LED filaments, as the fourth-generation lighting source, have become the preferred choice for next-generation automotive lighting technology due to their advantages of small size, long lifespan, low energy consumption, and fast start-up time.

[0003] Currently, some high-end brands and electric vehicle brands have adopted LED lights for their parking lights, reading lights, and headlights. LED lights in electric vehicles can generally only be used in a DC environment. Their structure typically consists of multiple EMC3030 or 3535 LED beads of similar size mounted on two or even six sides of an aluminum substrate. The overall volume is relatively large, and there is no bubble shell for sealing protection. When used in harsh environments for a long time, the LED beads will experience significant light decay or even failure. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide an LED filament lamp and display device to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, this utility model provides an LED filament lamp, including a sapphire substrate, multiple LED chips, and a transparent protective cover. The multiple LED chips are evenly distributed on the sapphire substrate in a matrix, and the connection directions of adjacent LED chips are opposite. The sapphire substrate and the multiple LED chips are combined to form an LED filament. The LED filament is connected to a power supply through metal pins. The metal pins are bent into an inverted L-shaped structure. Multiple sidewalls of the sapphire substrate are covered with a silicone layer, and the silicone layer encapsulates the LED chips.

[0006] The transparent protective cover has a hollow interior forming a receiving space, and the LED filament is located within the receiving space. The transparent protective cover has several heat dissipation holes that are connected to the receiving space.

[0007] The beneficial effects of this utility model are as follows: by uniformly distributing multiple LED chips in a matrix on a sapphire substrate, setting the connection direction of adjacent LED chips to opposite, connecting the LED chips to the power supply through metal pins, and applying adhesive to cover silicone layers on all four sides of the sapphire substrate, using the silicone layers to include the LED chips, and placing the LED filament formed by combining the sapphire substrate and multiple LED chips inside a transparent protective cover, and opening heat dissipation holes on the transparent protective cover to improve heat dissipation capacity, this LED filament lamp can be used in both low-voltage DC environments in automobiles and AC environments. At the same time, it also helps to improve the problem of large light decay of LED filament lamps when used for a long time in harsh environments.

[0008] Preferably, the transparent protective cover includes a bulb, a lens, and a reflector cup. A plurality of heat dissipation holes are provided on the bulb, the lens is located at the top of the bulb, the reflector cup is located in the middle of the bulb, and the reflector cup is located below the LED filament.

[0009] Preferably, the lens is a biconvex lens.

[0010] Preferably, the bubble shell is provided with a film layer that covers the opening of the heat dissipation hole.

[0011] Preferably, the silicone layer on each sidewall of the sapphire substrate has the same thickness, and the thickness of the silicone layer is 0.95mm ± 0.3mm.

[0012] Preferably, a bracket metal terminal is provided on the sapphire substrate, the LED chip is connected to the bracket metal terminal through gold wire, and the bracket metal terminal is connected to the metal pin.

[0013] Preferably, the LED chip is connected to the sapphire substrate via white adhesive.

[0014] To achieve the above objectives, this utility model also provides a display device, including the LED filament lamp described above.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a structural schematic diagram of an LED filament lamp provided in an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of the structure of the sapphire substrate, LED chip, and metal pins provided in the embodiments of this utility model;

[0018] Figure 3 This is a schematic diagram of the sapphire substrate and LED chip provided in an embodiment of the present invention.

[0019] Explanation of key component symbols:

[0020] 10. Sapphire substrate; 20. LED chip; 21. Gold wire; 31. Bubble shell; 32. Lens; 33. Reflector cup; 34. Heat dissipation hole; 35. Film layer; 40. Support metal terminal; 50. Silicone layer; 60. Metal pin.

[0021] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0022] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0023] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Please see Figures 1 to 3 The LED filament lamp in the first embodiment of this utility model includes a sapphire substrate 10, an LED chip 20, and a transparent protective cover.

[0026] The LED chips 20 are multiple and are evenly distributed on the sapphire substrate 10 in a matrix. The connection directions of adjacent LED chips 20 are opposite, and the spacing between adjacent LED chips 20 is the same. It should be noted that the sapphire substrate 10 has a high light transmittance, which is conducive to achieving 360° light emission of the product, and at the same time, its light distribution also achieves the best effect. Furthermore, under AC drive, the oppositely arranged LED chips 20 can emit light alternately with the direction of the current, which is also conducive to keeping the light-emitting area of ​​the product always centered.

[0027] In this embodiment, during the encapsulation process, the LED chip 20 is bonded to the sapphire substrate 10 with white glue. The end of the sapphire substrate 10 is provided with a support metal terminal 40. Since the connection directions of adjacent LED chips 20 are opposite, in the same row of adjacent LED chips 20, the positive electrode of one LED chip 20 is connected to the negative electrode of another LED chip 20 through a gold wire 21. It should be noted that the LED chip 20 at the end of the same row has one end connected to the adjacent LED chip 20 in the same row through a gold wire 21, and the other end connected to the support terminal through a gold wire 21.

[0028] In this embodiment, silicone layers 50 are applied to multiple sidewalls of the sapphire substrate 10. Specifically, silicone layers 50 are applied to all six sides of the sapphire substrate 10. The LED chip 20 is wrapped with the silicone layers 50. It is understood that the silicone layers 50 are made of silicone material. The light absorption capacity of the silicone layers 50 is generally low, which helps to improve the light decay problem and thus improve the service life of the LED filament lamp.

[0029] In this embodiment, there are two bracket metal terminals 40, which are located at opposite ends of the sapphire substrate 10. Each LED chip 20 is disposed between the two bracket metal terminals 40. Each bracket metal terminal 40 is connected to a metal pin 60, which is connected to a power source to provide power to the LED filament.

[0030] In this embodiment, each metal pin 60 is bent into an inverted L-shaped structure to facilitate welding of the metal pin 60 to the metal end. The metal pin 60 is assembled inside the transparent protective cover by spot welding. It should be noted that the metal pin 60 is 1.2mm wide and 0.2mm thick. Depending on how the product is placed inside the transparent protective cover, the metal pin 60 needs to be in an L-shaped structure to maximize the contact area with the metal extending from the bottom of the transparent protective cover and ensure a stronger weld.

[0031] In this embodiment, the silicone layer 50 on the sidewall of the sapphire substrate 10 has the same thickness, and the thickness of the silicone layer 50 is 0.95mm ± 0.3mm. It should be noted that a special arc-shaped dispensing needle or injection process is used to ensure that the silicone layer 50 completely covers the sapphire substrate 10 and the LED chip 20, and the thickness of the silicone layer 50 is controlled to control the color difference of light emitted from each surface.

[0032] In this embodiment, the LED chip 20 and the sapphire substrate 10 are combined to form an LED filament. The LED filament is located inside a transparent protective cover to protect it and further improve the light decay problem. Specifically, the transparent protective cover includes a bulb 31, a lens 32, and a reflector cup 33. The bulb 31 is hollow inside to form a receiving space, and the LED filament is located in the receiving space. The bulb 31 has several heat dissipation holes 34, all of which are connected to the receiving space to improve the heat dissipation capacity of the LED filament and thus improve the light decay problem. The lens 32 is located on the top of the bulb 31 and is a biconvex lens. The arc angle of the outward-facing side of lens 32 is greater than that of the inward-facing side. In other words, the inward-facing side of lens 32 is gentler than the outward-facing side. The reflector cup 33 is located inside the bulb 31 and below the LED filament. The reflector cup 33 is also located within the receiving space. The reflector cup 33 is used to seal the opening of the receiving space of the bulb 31 so that the bulb 31, lens 32 and reflector cup 33 combine to form a sealed space. One end of the reflector cup 33 supports the LED filament to provide a sealed environment for the LED filament, thereby improving the problem of large light decay of LED filament lamp when used for a long time in harsh environments.

[0033] In addition, by designing the bulb 31 with lens 32, and combining the characteristics of LED filament itself, such as small size, high luminous efficiency and 360° light emission, it is beneficial to enable the LED filament lamp to achieve a very good light distribution effect.

[0034] It should be noted that the bubble shell 31 is provided with a film layer 35, which is a transparent film. The film layer 35 covers the openings of each heat dissipation hole 34 to prevent impurities from entering the heat dissipation hole 34.

[0035] In specific implementation, multiple LED chips 20 are evenly distributed on the sapphire substrate 10 in a matrix, the connection directions of adjacent LED chips 20 are set to opposite, and the LED chips 20 are connected to the power supply through metal pins 60. A silicone layer 50 is applied around the sapphire substrate 10, and the silicone layer 50 includes the LED chips 20. The LED filament formed by combining the sapphire substrate 10 and multiple LED chips 20 is placed inside a transparent protective cover, and heat dissipation holes 34 are opened on the transparent protective cover to improve heat dissipation. This allows the LED filament lamp to be used in both low-voltage DC environments in automobiles and AC environments. It also helps to improve the problem of large light decay of LED filament lamps when used for a long time in harsh environments.

[0036] It should be noted that the above implementation process is only to illustrate the feasibility of this application, but it does not mean that the LED filament lamp of this application has only the above-mentioned unique implementation process. On the contrary, as long as the LED filament lamp of this application can be implemented, it can be included in the feasible implementation scheme of this application.

[0037] The display device in the second embodiment of this utility model includes the LED filament lamp in the first embodiment described above.

[0038] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. An LED filament lamp, characterized in that, The device includes a sapphire substrate, multiple LED chips, and a transparent protective cover. The multiple LED chips are evenly distributed on the sapphire substrate in a matrix, and the connection directions of adjacent LED chips are opposite. The sapphire substrate and the multiple LED chips are combined to form an LED filament. The LED filament is connected to a power source through metal pins. The metal pins are bent into an inverted L-shaped structure. Multiple sidewalls of the sapphire substrate are covered with a silicone layer, and the silicone layer encapsulates the LED chips. The transparent protective cover has a hollow interior forming a receiving space, and the LED filament is located within the receiving space. The transparent protective cover has several heat dissipation holes that are connected to the receiving space.

2. The LED filament lamp according to claim 1, characterized in that, The transparent protective cover includes a bulb, a lens, and a reflector cup. Several heat dissipation holes are provided on the bulb, the lens is located at the top of the bulb, the reflector cup is located in the middle of the bulb, and the reflector cup is located below the LED filament.

3. The LED filament lamp according to claim 2, characterized in that, The lens is a biconvex lens.

4. The LED filament lamp according to claim 2, characterized in that, The bubble shell is provided with a film layer that covers the opening of the heat dissipation hole.

5. The LED filament lamp according to claim 1, characterized in that, The silicone layer on each sidewall of the sapphire substrate has the same thickness, which is 0.95mm ± 0.3mm.

6. The LED filament lamp according to claim 1, characterized in that, The sapphire substrate is provided with a bracket metal terminal, the LED chip is connected to the bracket metal terminal through gold wire, and the bracket metal terminal is connected to the metal pin.

7. The LED filament lamp according to claim 1, characterized in that, The LED chip is connected to the sapphire substrate via white glue.

8. A display device, characterized in that, Includes the LED filament lamp as described in any one of claims 1-7.