Self-adaptive pressure adjusting structure of wafer expanding clamp for wafer processing

Abstract

The utility model provides a wafer processing wafer expanding clamp self-adaptive pressure adjusting structure, and relates to the wafer processing clamp field, the wafer processing wafer expanding clamp self-adaptive pressure adjusting structure comprises a pedestal and a fixing plate, the upper side of the pedestal is provided with a first driving member and a second driving member, a wafer expanding table is arranged between the first driving member and the second driving member, the lower end of the wafer expanding table is connected with a rotating table, and the rotating table is provided with a pressure adjusting device. The fixing plate is connected to the outer end of the base, a motor is installed at the lower end of the fixing plate, a rotating plate is connected to the upper end of the motor, an air cylinder is connected to the upper side of the outer end of the rotating plate, a suction cup is connected to the lower end of the air cylinder, a suction hole is formed in the bottom of the suction cup, and a mounting groove is formed in the lower side of the suction cup. A pressure sensor is mounted in the mounting groove, and the lower end of the pressure sensor is connected with a buffer pad. The clamping device has the effects of stably applying clamping acting force and stabilizing clamping adaptability, and has the uniform negative pressure adsorption effect.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing fixture technology, and specifically to an adaptive pressure adjustment structure for a wafer processing die expansion fixture. Background Technology

[0002] To facilitate wafer dicing and mounting, after the wafer assembly is shipped, it needs to undergo a die expansion process to increase the spacing between multiple wafers on the wafer assembly.

[0003] A search revealed existing technology (publication number: CN210778500U), which describes "a wafer expansion device, including a support plate and a wafer rotary table rotatably mounted on the support plate; a second driving component including multiple rotatably mounted lead screws, multiple nuts screwed onto the lead screws, a first gear mounted on one lead screw, a second gear mounted on the support plate of a first motor, and a movable bridge gear; the driving unit drives the bridge gear to mesh with the first and second gears, and the first motor drives the lead screws to rotate via the second gear, bridge gear, and first gear, causing the nuts to move the expansion table closer to the wafer rotary table, thus achieving wafer expansion; when wafer expansion is not needed, the driving unit drives the bridge gear to disengage from the first and second gears. This achieves dual functions of wafer expansion and rotation. During wafer expansion, the bridge gear is used to transmit power to the first motor; after wafer expansion, the bridge gear disengages, allowing the wafer rotary table to rotate freely."

[0004] While existing wafer expansion devices have achieved the effects of ease of use and improved expansion efficiency, they still have some shortcomings: existing wafer expansion devices require fixtures to transfer the wafer during use, and existing mechanical fixtures may cause clamping damage, while existing suction cup fixtures may cause the suction force to concentrate in a certain area, resulting in local deformation of the wafer. At the same time, it is impossible to detect the force applied to the wafer during the clamping process. Utility Model Content

[0005] To overcome the shortcomings of existing technologies, an adaptive pressure adjustment structure for wafer processing die expansion fixtures is provided to solve the problems mentioned in the background.

[0006] To achieve the above objectives, an adaptive pressure adjustment structure for a wafer processing die expansion fixture is provided, comprising: a base and a fixing plate. The upper side of the base is provided with a first driving component and a second driving component, and a die expansion stage is provided between the first driving component and the second driving component. A rotary table is connected to the lower end of the die expansion stage. The fixing plate is connected to the outer end of the base, and a motor is installed at the lower end of the fixing plate. A rotary plate is connected to the upper side of the outer end of the rotary plate. A suction cup is connected to the lower end of the cylinder. A suction hole is opened at the bottom of the suction cup. A mounting groove is opened on the lower side of the suction cup, and a pressure sensor is installed in the mounting groove. A buffer pad is connected to the lower end of the pressure sensor.

[0007] Furthermore, the output shaft of the motor rotates through the fixed plate, and the output shaft is fixedly connected to one end of the rotating plate.

[0008] Furthermore, a vacuum pump is connected to the upper end of the rotating plate, and a flexible hose is connected to the pumping end of the vacuum pump.

[0009] Furthermore, a guide rod is connected to the upper end of the suction cup, and the guide rod is fixed to the lower end of the rotating plate.

[0010] Furthermore, the upper end of the suction cup is provided with an air tube, which is arranged radially on the upper side of the suction cup, and the upper end of the air tube is connected to a ring tube.

[0011] Furthermore, the ring tube is connected to each air tube, and the upper end of the ring tube is connected to the lower end of the hose. The lower end of the air tube has a through hole in its wall, which is connected to the suction hole.

[0012] Furthermore, a buffer groove is provided on the lower side of the mounting groove, and a sliding plate is connected to the lower end of the pressure sensor. A telescopic rod is connected to the lower end of the sliding plate, and the buffer pad is rotatably connected to the lower end of the telescopic rod.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. When clamping the wafer during wafer expansion, the motor is first started to drive the rotating plate to rotate until the chuck moves to the upper part of the expansion stage. Then, the cylinder is activated to press the wafer onto the expansion stage by lowering the buffer pad on the lower side of the chuck. At this time, when the expansion stage rotates, it can maintain a certain pressure on the wafer. At the same time, through the buffer pad, telescopic rod and slide plate, the pressure is applied in reverse to the pressure sensor, thereby realizing the detection of wafer pressure by the cylinder. This makes it easy to clamp wafers of different thicknesses and increases the number of different usage scenarios.

[0015] 2. During wafer transfer, the cylinder continuously applies downward pressure, causing the suction holes on the underside of the suction cup to directly contact the wafer. Then, the vacuum pump is activated, using hoses, ring tubes, and air tubes to achieve negative pressure suction of the suction holes. The evenly radial arrangement of the suction holes ensures that the negative pressure suction force is evenly distributed during wafer suction, preventing deformation of the wafer due to localized stress and achieving a stable clamping and transfer effect. Attached Figure Description

[0016] Figure 1 This is a top view of an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the front section structure of the suction cup according to an embodiment of the present invention.

[0018] Figure 3 This is a bottom view of the suction cup structure according to an embodiment of the present invention.

[0019] Figure 4 This is a top view of the suction cup structure according to an embodiment of the present invention.

[0020] Figure 5 This is an embodiment of the present utility model. Figure 2 Schematic diagram of the structure at point A in the middle.

[0021] Figure 6 This is a schematic cross-sectional view of the telescopic rod according to an embodiment of the present invention.

[0022] In the diagram: 1. Base; 2. First driving component; 3. Crystal expansion stage; 4. Second driving component; 5. Fixing plate; 6. Motor; 7. Rotating plate; 8. Vacuum pump; 81. Hoses; 9. Cylinder; 10. Suction cup; 101. Mounting slot; 102. Pressure sensor; 103. Slide plate; 104. Telescopic rod; 105. Buffer pad; 106. Buffer groove; 11. Air pipe; 12. Ring pipe; 13. Guide rod; 14. Suction hole. Detailed Implementation

[0023] Reference Figures 1 to 6As shown, this utility model provides an adaptive pressure adjustment structure for a wafer processing die expansion fixture, including: a base 1 and a fixing plate 5. The upper side of the base 1 is provided with a first driving member 2 and a second driving member 4, and a die expansion stage 3 is provided between the first driving member 2 and the second driving member 4. The lower end of the die expansion stage 3 is connected to a rotary table. The fixing plate 5 is connected to the outer end of the base 1, and a motor 6 is installed at the lower end of the fixing plate 5. The upper end of the motor 6 is connected to a rotary plate 7. The upper side of the outer end of the rotary plate 7 is connected to a cylinder 9, and the lower end of the cylinder 9 is connected to a suction cup 10. The bottom of the suction cup 10 is provided with a suction hole 14, and the lower side of the suction cup 10 is provided with a mounting groove 101. A pressure sensor 102 is installed in the mounting groove 101, and the lower end of the pressure sensor 102 is connected to a buffer pad 105.

[0024] In this embodiment, the fixed plate 5, motor 6, rotating plate 7, vacuum pump 8, cylinder 9 and suction cup 10 constitute the main structure of the adaptive pressure adjustment structure of the wafer processing die expansion fixture involved in this application.

[0025] Among them, the base 1, the first driving component 2, the crystal expansion stage 3, and the second driving component 4 are all consistent with the relevant structures and principles involved in the prior art documents.

[0026] It should be noted that the upper side of the base 1 also includes other structural components (omitted in the accompanying drawings of this application), which are the same as those involved in the prior art, thereby realizing the crystal expansion operation process.

[0027] Specifically, the height of the rotating plate 7 is higher than that of the base 1, and the expansion stage 3 is located on the rotation path of the chuck 10.

[0028] Specifically, the bottom of the motor 6 is fixed to a platform flush with the base 1 to achieve stable driving of the rotating plate 7.

[0029] Specifically, the pressure sensor 102 is electrically connected to the cylinder 9 through an external controller to detect the downward driving pressure of the cylinder 9.

[0030] As a preferred implementation, a buffer pad 105 is provided to prevent damage to the wafer when it is pressed.

[0031] like Figures 2 to 6In this configuration, the output shaft of motor 6 rotates through the fixed plate 5, and the output shaft is fixedly connected to one end of the rotating plate 7. A vacuum pump 8 is connected to the upper end of the rotating plate 7, and a hose 81 is connected to the suction end of the vacuum pump 8. A guide rod 13 is connected to the upper end of the suction cup 10, and the guide rod 13 is fixed to the lower end of the rotating plate 7. An air pipe 11 is provided at the upper end of the suction cup 10, and the air pipes 11 are arranged radially on the upper side of the suction cup 10. The upper end of the air pipe 11 is connected to... The ring tube 12 is connected to each air tube 11, and the upper end of the ring tube 12 is connected to the lower end of the hose 81. The lower end of the air tube 11 has a through hole in its wall, which is connected to the suction hole 14. The mounting groove 101 has a buffer groove 106 on its lower side. The lower end of the pressure sensor 102 is connected to a slide plate 103, and the lower end of the slide plate 103 is connected to a telescopic rod 104. The buffer pad 105 is rotatably connected to the lower end of the telescopic rod 104.

[0032] Specifically, the hose 81 passes downward through the rotating plate 7 and connects to the ring tube 12, and the hose 81 on the lower side of the rotating plate 7 has excess material so that the connection of the hose 81 can be maintained when the suction cup 10 is raised or lowered.

[0033] Specifically, the guide rod 13 includes a sleeve and a sleeve rod, with the sleeve rod slidingly inserted into the sleeve to achieve stable lifting and lowering of the suction cup 10.

[0034] Specifically, the buffer pad 105 is located in the buffer groove 106, and the slide plate 103 is slidably connected in the mounting groove 101.

[0035] Specifically, the telescopic rod 104 includes a positioning cylinder and a positioning rod, with the positioning rod slidably inserted into the positioning cylinder. An electromagnet is provided on the top inner side of the positioning cylinder, and a spring connects the electromagnet and the positioning rod.

[0036] It should be noted that when the suction cup 10 is used to press the wafer, the telescopic rod 104 remains in an elastic state and the electromagnet is de-energized. When the suction cup 10 adsorbs and transfers the wafer, the positioning rod (metal material) can be retracted inward by energizing the electromagnet, thereby placing the buffer pad 105 in the buffer groove 106, thus avoiding inconvenience when suctioning through the suction hole 14.

[0037] Specifically, the pressure sensor 102 can be preset according to the pressure resistance level of wafers of different thicknesses, and the stroke of cylinder 9 can be preset according to the threshold pressure. The stroke of cylinder 9 can be controlled by a magnetic switch set on the outside or by a controller to directly control the air intake and exhaust flow of cylinder 9.

[0038] In use, when clamping the wafer during wafer expansion, the motor first drives the rotating plate to rotate until the chuck moves to the top of the expansion stage. Then, the cylinder is activated, causing the buffer pad on the underside of the chuck to press the wafer firmly onto the expansion stage. At this time, as the expansion stage rotates, it can maintain a certain pressure on the wafer. Simultaneously, through the buffer pad, telescopic rod, and sliding plate, pressure is applied in reverse to the pressure sensor, thereby enabling the cylinder to detect the wafer pressure. This facilitates clamping wafers of different thicknesses and increases the versatility of use. When transferring the wafer, the cylinder continuously applies downward pressure, causing the suction holes on the underside of the chuck to directly contact the wafer. Then, the vacuum pump is activated, creating a negative pressure suction effect on the suction holes through the hose, ring tube, and air tube. The evenly radial arrangement of the suction holes ensures that the negative pressure suction force is evenly distributed during wafer suction, preventing deformation of the wafer due to localized stress and achieving a stable clamping and transfer effect.

[0039] The adaptive pressure adjustment structure of the wafer processing die expansion fixture of this utility model can effectively solve the problems mentioned in the background technology. It achieves stable application of clamping force, stable clamping adaptability effect, and uniform negative pressure adsorption effect on the basis of the existing adaptive pressure adjustment structure technology of wafer processing die expansion fixture.

Claims

1. An adaptive pressure adjustment structure for a wafer fabrication die expansion fixture, comprising: The base (1) and the fixing plate (5) are provided with a first driving member (2) and a second driving member (4) on the upper side of the base (1), and a crystal expansion stage (3) is provided between the first driving member (2) and the second driving member (4), and a rotating stage is connected to the lower end of the crystal expansion stage (3). The fixing plate (5) is connected to the outer end of the base (1), and a motor (6) is installed at the lower end of the fixing plate (5), and a rotating plate (7) is connected to the upper end of the motor (6). A cylinder (9) is connected to the upper side of the outer end of the rotating plate (7), and a suction cup (10) is connected to the lower end of the cylinder (9). A suction hole (14) is opened at the bottom of the suction cup (10), and an installation groove (101) is opened on the lower side of the suction cup (10), and a pressure sensor (102) is installed in the installation groove (101), and a buffer pad (105) is connected to the lower end of the pressure sensor (102).

2. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 1, characterized in that, The output shaft of the motor (6) rotates through the fixed plate (5), and the output shaft is fixedly connected to one end of the rotating plate (7).

3. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 1, characterized in that, The upper end of the rotating plate (7) is connected to a vacuum pump (8), and the vacuum pump (8) is connected to a hose (81) at the pumping end.

4. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 1, characterized in that, The upper end of the suction cup (10) is connected to a guide rod (13), and the guide rod (13) is fixed to the lower end of the rotating plate (7).

5. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 1, characterized in that, The upper end of the suction cup (10) is provided with an air tube (11), and the air tube (11) is arranged in a circumferential radial pattern on the upper side of the suction cup (10), and the upper end of the air tube (11) is connected to a ring tube (12).

6. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 5, characterized in that, The ring tube (12) is connected to each air tube (11), and the upper end of the ring tube (12) is connected to the lower end of the hose (81). The lower end of the air tube (11) has a through hole, which is connected to the suction hole (14).

7. The adaptive pressure adjustment structure for a wafer processing die expansion fixture according to claim 1, characterized in that, A buffer groove (106) is provided on the lower side of the mounting groove (101), and a sliding plate (103) is connected to the lower end of the pressure sensor (102), and a telescopic rod (104) is connected to the lower end of the sliding plate (103). At the same time, the buffer pad (105) is rotatably connected to the lower end of the telescopic rod (104).

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