Wafer bearing device

Abstract

The utility model discloses a wafer bearing device, which comprises a heating disc, a magnetic fluid, a lifting mechanism and a rotating mechanism, the heating disc is connected with the magnetic fluid, the lifting mechanism and the rotating mechanism are connected with the magnetic fluid, and the lifting mechanism and the rotating mechanism drive the heating disc to lift and rotate through the magnetic fluid. According to the wafer bearing device provided by the utility model, the lifting mechanism and the rotating mechanism can drive the height of the heating disc to lift and rotate, and the quality improvement of a wafer surface film deposition process is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a wafer carrier device. Background Technology

[0002] In many processes of semiconductor manufacturing (such as photolithography, chemical vapor deposition (CVD), physical vapor deposition (PVD), etc.), wafers need to be heated. Wafer heating pads are usually used, which play a crucial role in the semiconductor manufacturing process. Their technical specifications and technical support directly affect the stability of the process and the quality of the product.

[0003] Typically, a wafer heating plate is made of multiple layers of metal or ceramic plates welded together, with heating wires or other heating elements embedded inside. The wafer is placed on the surface of the heating plate and heated through heat conduction.

[0004] Current wafer heating pads have only one function: heating the wafer. Utility Model Content

[0005] In view of the shortcomings of the prior art, this utility model innovatively provides a wafer carrier device that can solve the above-mentioned technical problems existing in the prior art.

[0006] To achieve the aforementioned technical objectives, this utility model discloses a wafer carrier device, comprising a heating plate, a magnetic fluid, a lifting mechanism, and a rotating mechanism, wherein the heating plate is connected to the magnetic fluid.

[0007] The lifting mechanism and the rotating mechanism are connected to the magnetohydrodynamic fluid, and the lifting mechanism and the rotating mechanism drive the heating plate to lift and rotate through the magnetohydrodynamic fluid.

[0008] Furthermore, the heating plate includes a plate body and a support column. An airflow channel is provided inside the plate body, and the airflow channel forms multiple outlets on the side wall of the plate body.

[0009] The support column has an air blowing hole inside, and the air blowing hole is connected to the airflow channel.

[0010] Furthermore, the support column is connected to the main shaft of the magnetofluid, and the support column and the main shaft are coaxially arranged.

[0011] An air blowing channel is formed inside the main shaft, and the air blowing channel is connected to the air blowing hole.

[0012] Furthermore, the main shaft is provided with an air intake channel, the support column is provided with an air intake hole, and a plurality of adsorption holes are formed on the bearing surface of the disc. The adsorption holes are connected to the air intake holes, and the air intake holes are connected to the air intake channel.

[0013] Furthermore, the lifting mechanism includes an electric cylinder and a moving block, the moving block being connected to the electric cylinder, and the electric cylinder driving the moving block to lift.

[0014] Furthermore, the movable block is provided with an adjustment component, which is connected to the magnetic fluid and is used to adjust the level of the magnetic fluid.

[0015] Furthermore, the rotating mechanism includes a geared motor, which is connected to the main shaft of the magnetofluid.

[0016] Furthermore, a heating wire is provided inside the disk body, a wiring hole is formed inside the support column, and a wiring channel is provided inside the main shaft of the magnetofluid.

[0017] An electric slip ring is provided at the end of the main shaft, and the power line and signal line of the heating wire are connected to the electric slip ring.

[0018] The beneficial effects of this utility model are as follows:

[0019] The wafer carrier device provided by this utility model can drive the heating plate to rise and fall and rotate through the lifting mechanism and the rotating mechanism, which helps to improve the quality of the wafer surface thin film deposition process. Attached Figure Description

[0020] Figure 1 This diagram shows a schematic representation of the wafer carrier device according to an embodiment of the present invention.

[0021] Figure 2 This diagram shows a partial cross-sectional view of the heating plate and magnetic fluid in an embodiment of the present invention.

[0022] Figure 3 A side view of the adjustment component according to an embodiment of the present invention is shown;

[0023] Figure 4 The diagram shows a bottom view of the adjustment component according to an embodiment of the present invention.

[0024] In the picture,

[0025] 1. Heating plate; 11. Plate body; 12. Support column; 2. Magnetofluid; 21. Main shaft; 3. Lifting mechanism; 31. Motor; 32. Lead screw; 33. Moving block; 4. Rotating mechanism; 5. Adjusting assembly; 51. Connecting plate; 52. Side support plate; 53. Fixing plate; 54. First adjusting plate; 55. Intermediate plate; 56. Second adjusting plate; 57. Sliding block; 581. First adjusting bolt; 582. Second adjusting bolt; 59. Magnetofluid mounting plate; 510. Adjusting screw; 6. Electric slip ring; 7. Motor mounting base. Detailed Implementation

[0026] The wafer carrier device provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0027] The wafer carrier device provided by this utility model can drive the heating plate to rise and fall and rotate through a lifting mechanism and a rotating mechanism. Furthermore, the magnetic fluid is connected to the heating plate, allowing for simultaneous heating, vacuum adsorption, and edge cleaning of the wafer, which helps improve the quality of the wafer surface thin film deposition process. The following detailed description of this utility model is provided in conjunction with specific embodiments:

[0028] In some embodiments, such as Figure 1 As shown, this utility model provides a wafer carrier device, including a heating plate 1, a magnetic fluid 2, a lifting mechanism 3, and a rotating mechanism 4. The heating plate 1 is equipped with a heating device for heating the wafer. The heating plate 1 is connected to the magnetic fluid 2, which includes a main shaft 21. The heating plate 1 is connected to the main shaft 21 of the magnetic fluid 2. The lifting mechanism 3 and the rotating mechanism 4 are connected to the magnetic fluid 2. The lifting mechanism 3 and the rotating mechanism 4 drive the heating plate 1 to lift and rotate through the magnetic fluid 2, which can realize multi-dimensional adjustment of the wafer position.

[0029] Optionally, such as Figure 2 As shown, the heating plate 1 includes a plate body 11 and a support column 12. The plate body 11 is a circular structure, and its upper surface forms a bearing surface for supporting the wafer. The support column 12 is a cylindrical structure, vertically connected to the lower surface of the plate body 11, and the center of the plate body 11 is located on the axis of the support column 12. An airflow channel is provided inside the plate body 11, extending radially along the plate body 11. Multiple outlets are formed on the side wall of the plate body 11. An air blowing hole is formed inside the support column 12, which communicates with the airflow channel. The support column 12 is connected to the main shaft 21 of the magnetohydrodynamic 2, and the support column 12 and the main shaft 21 are coaxially arranged. An air blowing channel is formed inside the main shaft 21, which communicates with the air blowing hole. The airflow in the main shaft 21 is blown out through the air blowing hole and the airflow channel onto the side wall of the plate body 11, which can sweep the edge of the wafer on the plate body 11 and improve the back-side coating problem in the thin film deposition process.

[0030] In some embodiments, the spindle 21 is provided with an air intake channel, the support column 12 is provided with an air intake hole, and a plurality of adsorption holes are formed on the bearing surface of the disk 11. The adsorption holes are connected to the air intake holes, and the air intake holes are connected to the air intake channel. The air intake channel in the spindle 21 draws air through the adsorption holes, so that the wafer on the bearing surface is held in place, thereby fixing the wafer and eliminating the need for a wafer fixing structure.

[0031] Optionally, a heating wire is provided inside the plate body 11, a wiring hole is formed inside the support column 12, a wiring channel is provided inside the main shaft 21 of the magnetic fluid 2, and an electric slip ring 6 is provided at the end of the main shaft 21. The power line and signal line of the heating wire are connected to the electric slip ring 6, and are connected to the stator of the electric slip ring 6 through its internal structure, so as to realize the external transmission of current and electrical signals of the heating plate 1. Further, the heating plate 1 can be made of metal, ceramic or other materials with good thermal conductivity.

[0032] In some embodiments, the lifting mechanism 3 includes an electric cylinder and a moving block 33. The moving block 33 is connected to the electric cylinder and is driven to rise and fall by the electric cylinder. The moving block 33 is directly or indirectly connected to the magnetic fluid 2, thereby driving the magnetic fluid 2 to rise and fall via the electric cylinder. Optionally, the electric cylinder includes a motor 31 and a lead screw 32. The motor 31 is connected to the lead screw 32. Optionally, the motor 31 is a servo motor. The moving block 33 is provided on the lead screw 32. The lead screw 32 is vertically arranged. When the lead screw 32 rotates, the moving block 33 can move up and down. For example, when the lead screw 32 rotates clockwise, the moving block moves upward; when the lead screw 32 rotates counterclockwise, the moving block 33 moves downward. The adjusting component 5 is connected to the moving block 33 and moves up and down with the moving block 33. This allows the magnetic fluid 2 to move up and down, i.e., the heating plate 1 to move up and down, in order to adjust the gap between the wafer and the top cover of the vacuum chamber, thereby changing the volume of the ALD / CVD (Atomic Layer Deposition / Chemical Vapor Deposition) reaction zone, adjusting the fluid state on the wafer surface, and further improving the quality of thin film deposition.

[0033] In some embodiments, the adjusting component 5 is connected to the moving block 33, and the magnetic fluid 2 is connected to the adjusting component 5. The adjusting component 5 is used to adjust the level of the magnetic fluid 2 to prevent the heating plate 1 from interfering with other parts and to prevent the heating plate 1 from vibrating too much eccentrically during rotation.

[0034] like Figure 3 , Figure 4 As shown, the adjustment assembly 5 includes: a connecting plate 51, a side support plate 52, a fixing plate 53, a first adjustment plate 54, a middle plate 55, a second adjustment plate 56, a slider 57, an adjustment bolt, a magnetic fluid mounting plate 59, and an adjustment screw 510. The connecting plate 51 is connected to the moving block 33, the side support plate 52 is connected to the connecting plate 51, and the fixing plate 53 is connected to the side support plate 52. The connecting plate 51 is vertically arranged, the fixing plate 53 is horizontally arranged, and the side support plate 52 is vertically arranged and perpendicular to both the connecting plate 51 and the fixing plate 53. Optionally, the side support plate 52 includes two mutually perpendicular connecting edges, which are respectively connected to the connecting plate 51 and the fixing plate 53. In this embodiment, two side support plates 52 are provided, and the two side support plates 52 are parallel to each other and connected to both sides of the connecting plate 51 and the fixing plate 53.

[0035] The fixed plate 53, the first adjusting plate 54, the intermediate plate 55, the second adjusting plate 56, and the magnetofluid mounting plate 59 all have through holes for the main shaft 21 of the magnetofluid 2 to pass through. The first adjusting plate 54 is fixedly mounted on the lower side of the fixed plate 53, the intermediate plate 55 is located on the lower side of the first adjusting plate 54, and the second adjusting plate 56 is located on the lower side of the intermediate plate 55. The first adjusting plate 54, the intermediate plate 55, and the second adjusting plate 56 are connected by bolts, and the first connecting hole on the first adjusting plate 54 is an elongated hole, allowing the intermediate plate 55 and the second adjusting plate 56 to move along the direction of the connecting hole on the first adjusting plate 54. Optionally, the first adjusting plate 54 is provided with a first sliding groove, which is parallel to the connecting hole. The upper surface of the intermediate plate 55 is provided with a first protrusion, which is movably embedded in the first sliding groove. The first adjusting plate 54 is provided with a first adjusting bolt 581, which passes through the first sliding groove and is connected to the first protrusion. The first adjusting bolt 581 is threadedly connected to the first adjusting plate 54. Rotating the first adjusting bolt 581 can adjust the position of the first protrusion, that is, adjust the position of the intermediate plate 55 and the second adjusting plate 56.

[0036] The second adjusting plate 56 is provided with a second connecting hole, through which it connects to the intermediate plate 55 and the first adjusting plate 54. The second connecting hole is perpendicular to the first connecting hole. The second adjusting plate 56 can move relative to the intermediate plate 55, and the direction of movement is perpendicular to the direction of movement of the intermediate plate 55. The second adjusting plate 56 is provided with a second sliding groove, which is parallel to the second connecting hole. The lower surface of the intermediate plate 55 is provided with a second protrusion, which can be movably embedded in the second sliding groove. The second adjusting plate 56 is provided with a second adjusting bolt 582, which extends into the second sliding groove and connects to the second protrusion. The second adjusting bolt 582 is threadedly connected to the second adjusting plate 56. Rotating the second adjusting bolt 582 can adjust the position of the second protrusion in the second sliding groove, that is, adjust the moving position of the second adjusting plate 56.

[0037] Optionally, the second adjusting plate 56 is provided with a second groove, which is parallel to the second sliding groove. The first adjusting plate 54 is provided with a first groove, which is parallel to the first sliding groove. The slider 57 is placed in the second groove and the first groove. The intermediate plate 55 is provided with a sliding hole, through which the slider 57 passes. When the intermediate plate 55 or the second adjusting plate 56 slides, the slider 57 acts as a guide.

[0038] The magnetic fluid mounting plate 59 and the second adjusting plate 56 are connected by bolts. Adjusting screws 510 are mounted on the magnetic fluid mounting plate 59 and abut against the second adjusting plate 56. Optionally, three adjusting screws 510 are provided, distributed in three different positions. Rotating the adjusting screws 510 can adjust the gap between the magnetic fluid mounting plate 59 and the second adjusting plate 56 at different positions, thereby adjusting the levelness of the magnetic fluid mounting plate 59. The magnetic fluid 2 is mounted on the magnetic fluid mounting plate 59.

[0039] In some embodiments, the rotating mechanism 4 includes a geared motor connected to the main shaft 21 of the magnetic fluid 2. Optionally, a motor mounting base 7 is provided on the magnetic fluid 2, the geared motor is mounted on the motor mounting base 7, a locking disc is provided on the geared motor, and the main shaft 21 is connected to the locking disc, so that the geared motor can drive the main shaft 21 to rotate, thereby achieving the effect of driving the heating plate 1 to rotate, making the process gas in contact with the wafer surface more uniform, which is beneficial to improving the thin film deposition quality.

[0040] Optionally, the rotating mechanism 4 can also be used in conjunction with a motor to drive the main shaft 21 through gear transmission, belt transmission, friction wheel transmission, chain transmission, etc.

[0041] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer carrier device, characterized in that, It includes a heating plate, a magnetic fluid, a lifting mechanism, and a rotating mechanism, wherein the heating plate is connected to the magnetic fluid. The heating plate includes a plate body and a support column. An airflow channel is provided inside the plate body, and multiple outlets are formed on the sidewalls of the plate body. An air blowing hole is formed inside the support column, and the air blowing hole communicates with the airflow channel. The support column is connected to the main shaft of the magnetofluid, and the support column and the main shaft are coaxially arranged. An air blowing channel is formed inside the main shaft, and the air blowing channel communicates with the air blowing hole. The main shaft is provided with an air intake channel, the support column is provided with an air intake hole, and multiple adsorption holes are formed on the bearing surface of the disc. The adsorption holes communicate with the air intake holes, and the air intake holes communicate with the air intake channel. The lifting mechanism and the rotating mechanism are connected to the magnetohydrodynamic fluid, and the lifting mechanism and the rotating mechanism drive the heating plate to lift and rotate through the magnetohydrodynamic fluid.

2. The wafer carrier device according to claim 1, characterized in that, The lifting mechanism includes an electric cylinder and a moving block. The moving block is connected to the electric cylinder, and the electric cylinder drives the moving block to lift.

3. The wafer carrier device according to claim 2, characterized in that, The movable block is provided with an adjustment component, which is connected to the magnetofluid and is used to adjust the level of the magnetofluid.

4. The wafer carrier device according to claim 2, characterized in that, The rotating mechanism includes a geared motor, which is connected to the main shaft of the magnetohydrodynamic fluid.

5. The wafer carrier device according to claim 1, characterized in that, A heating wire is installed inside the disk, a wiring hole is formed inside the support column, and a wiring channel is provided inside the main shaft of the magnetohydrodynamic fluid. An electric slip ring is provided at the end of the main shaft, and the power line and signal line of the heating wire are connected to the electric slip ring.

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