COB light source and camera lamp

Abstract

The utility model relates to a COB (chip on board) light source and a camera lamp, which belongs to the technical field of light-emitting lamps and comprises a copper substrate and a plurality of light source parts, a light source bearing area is arranged on one side of the copper substrate, and the plurality of light source parts are connected onto the copper substrate and are all positioned in the light source bearing area. The light source part is provided with a second heat dissipation bonding pad facing the copper substrate, the second heat dissipation bonding pad is in contact with the copper substrate, a circuit layer is arranged between the copper substrate and the light source part, and an insulating high-conductivity layer is arranged between the circuit layer and the copper substrate. And meanwhile, the phenomena that the ceramic substrate is broken and the copper substrate is bent and deformed due to the difference of thermal expansion coefficients when the large-size ceramic substrate and the copper substrate are welded are avoided, the quality and the yield of the copper substrate product are improved, and the effect of high heat conduction efficiency is achieved.

Description

Technical Field

[0001] This utility model relates to the technical field of light-emitting lamps, and in particular to a COB light source and a camera light. Background Technology

[0002] COB (Chip-on-Board) technology is a high-density light source solution that integrates multiple LED chips directly onto a substrate. It has advantages such as high luminous efficiency, uniform light emission, and compact size, and is widely used in professional photography lighting fields such as film and television shooting and stage lighting.

[0003] Existing COB products typically employ a three-layer composite structure consisting of NCSP LEDs, a ceramic substrate, and a copper substrate. A large ceramic substrate is directly soldered onto the copper substrate, while multiple NCSP LEDs are soldered onto the ceramic substrate to support them.

[0004] The existing technical solutions mentioned above have the following drawbacks: ceramic substrates are expensive and costly. Furthermore, when welding large-sized ceramic substrates and copper substrates, the different materials and large differences in the coefficients of thermal expansion can easily lead to cracking of the ceramic substrate and bending deformation of the copper substrate, affecting product quality. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a COB light source and camera lamp to solve the technical problems of high cost in the prior art, and the easy cracking of the ceramic substrate and bending deformation of the copper substrate during the welding of the ceramic substrate and copper substrate, which affects the product quality.

[0006] This utility model provides a COB light source, comprising:

[0007] A copper substrate with a light source carrier area on one side;

[0008] A plurality of light sources are provided, which are connected to the copper substrate and are all located within the light source carrying area. Each light source has a second heat dissipation pad on the copper substrate, which is in contact with the copper substrate. A circuit layer is provided between the copper substrate and the light source, and an insulating high-conductivity layer is provided between the circuit layer and the copper substrate.

[0009] Optionally, the copper substrate is provided with a plurality of first heat dissipation pads and a plurality of first positive and negative electrodes on the side facing the light source, the first positive and negative electrodes are electrically connected to the circuit layer, and the plurality of first heat dissipation pads and first positive and negative electrodes are correspondingly provided with a plurality of light source elements;

[0010] The light source component is provided with a second positive and negative electrode and a second heat dissipation pad facing the copper substrate;

[0011] The first heat dissipation pad is connected to the corresponding second heat dissipation pad on the light source component, and the first positive and negative electrodes are connected to the corresponding second positive and negative electrodes on the light source component.

[0012] Optionally, the light source includes:

[0013] The ceramic substrate, the second heat dissipation pad, and the second positive and negative electrodes are all connected to the ceramic substrate on the side facing the copper substrate.

[0014] An LED chip is disposed on the side of the ceramic substrate facing away from the second heat dissipation pad. A chip electrode is disposed on the side of the LED chip facing the ceramic substrate, and the chip electrode is connected to the ceramic substrate.

[0015] Optionally, the light source further includes a fluorescent adhesive that coats the LED chip.

[0016] Optionally, the light source can be configured as a warm yellow light source and / or a cool white light source.

[0017] Optionally, the light source is configured as an aluminum nitride ceramic lamp bead.

[0018] Optionally, a light source wiring terminal is provided on the copper substrate, and the light source wiring terminal is electrically connected to the light source through a circuit layer.

[0019] Optionally, it also includes a thermistor, which is disposed at the light source and used to monitor the temperature of the light source.

[0020] Optionally, the copper substrate has multiple screw holes around its periphery for mounting a heat dissipation structure.

[0021] This utility model also provides a camera light, including the aforementioned COB light source.

[0022] The technical solution of this utility model has the following advantages:

[0023] 1. The COB light source provided by this utility model integrates multiple light source components directly within the light source carrier area on the copper substrate, eliminating the large-sized ceramic substrate in the middle. The light source components directly contact the copper substrate through the second heat dissipation pad, which significantly reduces material costs. At the same time, it avoids the phenomenon of ceramic substrate cracking and copper substrate bending deformation caused by the difference in thermal expansion system when the large-sized ceramic substrate is welded to the copper substrate, thereby improving the quality and yield of copper substrate products.

[0024] 2. The COB light source provided by this utility model has multiple light source components directly connected and in contact with the copper substrate through the second heat dissipation pad. The copper substrate directly serves as the heat dissipation carrier for the light source components. The heat generated by the light source components during operation is quickly transferred to the external heat dissipation structure through the high thermal conductivity and low thermal resistance of the copper substrate, which improves the heat conduction efficiency and heat dissipation. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the front structure of the COB light source of this utility model;

[0027] Figure 2 for Figure 1 Enlarged view of section A;

[0028] Figure 3 This is a cross-sectional view of the COB light source in this utility model;

[0029] Figure 4 for Figure 3 Enlarged view of section B in the middle.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Copper substrate; 2. Light source component; 21. Second positive and negative electrodes; 22. Second heat dissipation pad; 23. Ceramic substrate; 24. LED chip; 25. Chip electrode; 26. Phosphor adhesive; 3. First heat dissipation pad; 4. First positive and negative electrodes; 5. Thermistor; 6. NTC terminal; 7. Light source terminal; 8. Light source carrier area; 9. Screw hole. Detailed Implementation

[0032] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0033] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0034] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0036] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0037] Example 1

[0038] Reference Figures 1-4 As shown, this utility model provides a COB light source, including a copper substrate 1 and a light source component 2. The copper substrate 1 is plate-shaped, and the central area of ​​one side of the copper substrate 1 is set as a light source carrying area 8. Multiple light source components 2 are provided and are all located within the light source carrying area 8. The multiple light source components 2 are directly fixedly connected to the copper substrate 1. A second heat dissipation pad 22 is provided on the copper substrate 1 facing the light source component 2. The second heat dissipation pad 22 is in contact with the copper substrate. A circuit layer (not shown in the figure) is provided between the copper substrate 1 and the light source component 2. An insulating high-conductivity layer is provided between the circuit layer and the copper substrate.

[0039] Multiple light source components 2 are directly integrated into the light source carrier area 8 on the copper substrate 1, eliminating the large-size ceramic substrate in the middle, which greatly reduces material costs. At the same time, it avoids the phenomenon of ceramic substrate cracking and copper substrate 1 bending deformation caused by the difference in thermal expansion coefficient when the large-size ceramic substrate is welded to the copper substrate 1, thus improving the quality and yield of the copper substrate 1 product.

[0040] The light source 2 is in direct contact with the copper substrate 1 through the second heat dissipation pad 22. The copper substrate 1 directly serves as the heat dissipation carrier for the light source 2. The heat generated by the light source 2 during operation is directly and quickly transferred to the external heat dissipation structure through the high thermal conductivity and low thermal resistance of the copper substrate 1, which improves the heat conduction efficiency and heat dissipation.

[0041] By setting an insulating high-conductivity layer between the copper substrate 1 and the circuit layer, electrical insulation between the copper substrate 1 and the circuit layer is maintained, preventing leakage or short circuit, while significantly improving thermal conductivity, so that the heat of the circuit layer can be quickly transferred to the copper substrate 1. Specifically, the insulating high-conductivity layer can be composed of a composite material of insulating adhesive and high thermal conductivity filler. The high thermal conductivity filler can be set as aluminum nitride (AlN), boron nitride (BN), or aluminum oxide (AlO), etc.

[0042] As one specific implementation method, refer to Figure 3 and 4 As shown, a plurality of first heat dissipation pads 3 and a plurality of first positive and negative electrodes 4 are provided on the side of the copper substrate 1 facing the light source 2. The first positive and negative electrodes 4 are electrically connected to the circuit layer. The first heat dissipation pads 3 are integrally formed with the copper substrate 1. The number of the plurality of first heat dissipation pads 3 is the same as the number of the plurality of light source 2. The number of the plurality of first positive and negative electrodes 4 is the same as the number of the plurality of light source 2. The plurality of first heat dissipation pads 3 and the plurality of light source 2 are arranged one-to-one. The plurality of first positive and negative electrodes 4 and the plurality of light source 2 are arranged one-to-one. The side of the light source 2 facing the copper substrate 1 is provided with corresponding second positive and negative electrodes. When the light source 2 is installed, the second positive and negative electrodes 21 and the second heat dissipation pads 22 on the light source 2 are aligned with the first positive and negative electrodes 4 and the first heat dissipation pads 3 on the copper substrate 1. The second positive and negative electrodes 21 are connected to the first positive and negative electrodes 4, and the second heat dissipation pads 22 are soldered to the corresponding first heat dissipation pads 3.

[0043] Each light source 2 corresponds to an independent second positive and negative electrode 21 and a first positive and negative electrode 4. The first positive and negative electrode 4 and the second positive and negative electrode 21 are connected, so that the light source 2 can be powered through the circuit layer of the copper substrate 1. The first heat dissipation pad 3 and the second heat dissipation pad 22 are directly soldered to form a local high heat conduction channel, so that the heat generated by the light source 2 when it is working is conducted to the first heat dissipation pad 3 on the copper substrate 1 through the second heat dissipation pad 22, making direct contact and improving the heat conduction efficiency.

[0044] In one specific implementation, the light source 2 is configured as a warm yellow light source 2 and / or a cool white light source 2. In this embodiment, half of the light source 2 is configured as a warm yellow light source 2 with a color temperature range of 2500K-2700K, and the other half is configured as a cool white light source 2 with a color temperature range of 7300K-7800K. There are 12 groups of both the cool white and warm yellow light source 2, each group of which is driven by an independent control circuit. Each group consists of 80 light source 2 elements. By adjusting the dual-color light source 2, different ambient lights can be matched. This dual-color configuration is suitable for scenes in film and television shooting where skin tone requirements are high. Furthermore, in this embodiment, the light source 2 is configured as an aluminum nitride ceramic LED. Compared to conventional LEDs, aluminum nitride ceramic LEDs have a higher thermal conductivity, and the number of internal through-holes is more than doubled compared to conventional LEDs, thereby increasing electrical and thermal conductivity.

[0045] Specifically, the light source 2 includes a ceramic substrate 23 and an LED chip 24. The ceramic substrate 23 is plate-shaped, and the second heat dissipation pad 22 and the second positive and negative electrodes 21 are both connected to the side of the ceramic substrate 23 facing the copper substrate 1. The second heat dissipation pad 22 and the ceramic substrate 23 are integrally formed. The LED chip 24 is disposed on the side of the ceramic substrate 23 away from the second heat dissipation pad 22. A chip electrode 25 is disposed on the side of the LED chip 24 facing the ceramic substrate 23. The chip electrode 25 and the LED chip 24 are electrically connected. The chip electrode 25 and the ceramic substrate 23 are connected. The chip electrode 25 is electrically connected to the second positive and negative electrodes 21 through a through hole on the ceramic substrate 23.

[0046] A ceramic substrate 23 serves as the carrier for the light source element 2. The ceramic substrate 23's insulation ensures no leakage risk between the chip electrodes 25 of the LED chip 24 and the copper substrate 1. Simultaneously, the second positive and negative electrodes 21 achieve efficient electrical connection with the first positive and negative electrodes 4 and the circuit layer on the copper substrate 1. Furthermore, the area of ​​the ceramic substrate 23 within a single light source element 2 only needs to cover the size of the LED chip 24. The difference in thermal expansion coefficients between the small ceramic substrate 23 and the copper substrate 1 is limited to a localized area, thus avoiding the risk of significant bending deformation of the copper substrate 1. A light source terminal 7 is connected to the copper substrate 1. The light source terminal 7 is the power input terminal and is electrically connected to the light source element 2 through the circuit layer, allowing an external power source to be connected to power the light source element 2.

[0047] Furthermore, in order to enable the light source 2 to form both warm yellow light source 2 and cool white light source 2, a fluorescent adhesive 26 is provided on the side of the LED chip 24 facing away from the ceramic substrate 23. The fluorescent adhesive 26 covers the entire surface of the LED chip 24 and extends towards the periphery of the LED chip 24 until it covers all four sides of the LED chip 24, until the fluorescent adhesive 26 and the ceramic substrate 23 are connected, thus covering the entire LED chip 24 and the chip electrode 25. By adjusting the proportion of phosphor in the fluorescent adhesive 26, the color temperature of the light source 2 can be adjusted, enabling the light source 2 to form both warm yellow light source 2 and cool white light source 2 to meet the needs of camera lights in multiple scenarios.

[0048] As another implementation method, refer to Figure 1 and 2 As shown, the COB light source also includes a thermistor 5, which is an NTC thermistor 5. The thermistor 5 is located near the light source 2 and connected to the copper substrate 1. It is used to monitor the temperature of the light source 2. By monitoring the temperature of the light source 2, the controller can control the heat dissipation structure of the light source 2 to dissipate heat according to the monitored temperature, so that the heat dissipation is controllable. An NTC terminal 6 is connected to the copper substrate 1. The NTC terminal 6 and the thermistor 5 are electrically connected through the circuit layer, thereby providing an external interface to facilitate the signal connection between the thermistor 5 and the main control board.

[0049] In addition, multiple screw holes 9 are provided around the copper substrate 1. The multiple screw holes 9 are evenly arranged around the copper substrate 1. By providing screw holes 9 on the copper substrate 1, a heat dissipation structure can be installed on the copper substrate 1 to dissipate heat from the copper substrate 1 and the light source 2 on the copper substrate 1.

[0050] The working principle of COB light source: The second heat dissipation pad 22 and the second positive and negative electrodes 21 on the ceramic substrate 23 are directly connected to the first heat dissipation pad 3 and the first positive and negative electrodes 4 on the copper substrate 1, so that the light source 2 is directly set on the copper substrate 1, eliminating the large-size ceramic substrate in the middle, which greatly reduces the material cost. At the same time, it avoids the cracking of the ceramic substrate 23 and the bending deformation of the copper substrate 1 caused by the difference in thermal expansion coefficients when the large-size ceramic substrate is welded to the copper substrate 1, which improves the quality and yield of the copper substrate 1. Furthermore, the heat of the light source 2 can be directly transferred to the first heat dissipation pad 3 and the copper substrate 1 through the second heat dissipation pad 22, which improves the heat dissipation efficiency.

[0051] Example 2

[0052] Reference Figures 1-4As shown, the difference between this embodiment and Embodiment 1 is that this embodiment provides a camera lamp, including the COB light source in Embodiment 1. The COB light source is set on the camera lamp, thereby reducing the cost of the camera lamp, improving the yield and quality during camera lamp manufacturing, improving heat dissipation efficiency, and increasing the lifespan of the camera lamp.

[0053] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0054] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A COB light source, characterized in that, include: A copper substrate (1) has a light source carrier area (8) on one side; Multiple light source elements (2) are provided. The multiple light source elements (2) are connected to the copper substrate (1) and are all located in the light source carrying area (8). The light source elements (2) are provided with a second heat dissipation pad (22) facing the copper substrate (1). The second heat dissipation pad (22) is in contact with the copper substrate (1). A circuit layer is provided between the copper substrate (1) and the light source elements (2). An insulating high conductivity layer is provided between the circuit layer and the copper substrate (1).

2. The COB light source as described in claim 1, characterized in that, The copper substrate (1) is provided with a plurality of first heat dissipation pads (3) and a plurality of first positive and negative electrodes (4) on the side facing the light source (2). The first positive and negative electrodes (4) are electrically connected to the circuit layer. The plurality of first heat dissipation pads (3) and first positive and negative electrodes (4) are provided correspondingly to the plurality of light source (2). The light source (2) is provided with a second positive and negative electrode (21) facing the copper substrate (1); The first heat dissipation pad (3) is connected to the second heat dissipation pad (22) on the corresponding light source (2), and the first positive and negative electrodes (4) are connected to the second positive and negative electrodes (21) on the corresponding light source (2).

3. The COB light source as described in claim 2, characterized in that, The light source (2) includes: The ceramic substrate (23), the second heat dissipation pad (22) and the second positive and negative electrodes (21) are all connected to the side of the ceramic substrate (23) facing the copper substrate (1); An LED chip (24) is disposed on the side of the ceramic substrate (23) facing away from the second heat dissipation pad (22). A chip electrode (25) is disposed on the side of the LED chip (24) facing the ceramic substrate (23). The chip electrode (25) is connected to the ceramic substrate (23).

4. The COB light source as described in claim 3, characterized in that, The light source (2) also includes fluorescent adhesive (26), which covers the LED chip (24).

5. The COB light source as described in claim 1, characterized in that, The light source (2) is configured as a warm yellow light source (2) and / or a cool white light source (2).

6. The COB light source as described in claim 1, characterized in that, The light source (2) is configured as an aluminum nitride ceramic lamp bead.

7. The COB light source as described in claim 1, characterized in that, The copper substrate (1) is provided with a light source terminal (7), which is electrically connected to the light source component (2) through the circuit layer.

8. The COB light source as described in claim 1, characterized in that, It also includes a thermistor (5), which is disposed at the light source (2) and is used to monitor the temperature of the light source (2).

9. The COB light source as described in claim 1, characterized in that, The copper substrate (1) has multiple screw holes (9) around its periphery for mounting heat dissipation structures.

10. A camera light, characterized in that, Includes the COB light source as described in any one of claims 1 to 9.

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