Ultrasonic sensor probe core with integral damping backing material and ultrasonic sensor

Abstract

The utility model discloses an ultrasonic sensor probe core with an integral damping backing material and an ultrasonic sensor, and relates to the technical field of ultrasonic sensor probe cores, the surface of a piezoelectric assembly is provided with a backing material for reducing parasitic vibration of the piezoelectric assembly, and the backing material is formed by die-filling and injection molding of the piezoelectric assembly. The piezoelectric assembly can be wrapped in the backing layer which is integrally formed through injection molding, so that the backing layer can reduce parasitic vibration of the piezoelectric assembly and can play a role of a shell at the same time, and the processes of shell assembly, gluing and curing waiting are not needed in the production process of the probe core of the ultrasonic sensor; and the production efficiency of the probe core of the ultrasonic sensor is improved.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic sensor probe technology, and in particular to an ultrasonic sensor probe with an integral damping backing material and an ultrasonic sensor. Background Technology

[0002] An ultrasonic sensor is a sensor that uses the principle of ultrasound to measure distance or detect objects. It measures the distance between an object and the sensor by emitting ultrasonic signals and receiving the reflected signals. During the production of ultrasonic sensors, the ultrasonic sensor core needs to be assembled into a housing, then backing adhesive is applied to the housing, and then the backing adhesive is allowed to cure before subsequent production processes can proceed. However, this process results in low production efficiency of the ultrasonic sensor core and is not conducive to improving the production rate of the ultrasonic sensor core. Utility Model Content

[0003] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the problem of long assembly time and low production efficiency between the probe core and the shell.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an ultrasonic sensor probe core with an integral damping backing material, including a piezoelectric component and an integrally formed backing layer, wherein the backing layer is used to cover a portion of the outer surface of the piezoelectric component, leaving the remaining portion of the outer surface of the piezoelectric component exposed to form a sensing part.

[0005] As a further embodiment of this utility model: the backing layer is injection molded on the outer surface of the piezoelectric component.

[0006] As a further embodiment of this utility model: the piezoelectric component includes piezoelectric ceramic located inside the backing layer.

[0007] As a further embodiment of this utility model: the piezoelectric component further includes a sound-permeable layer located below the piezoelectric ceramic, the backing layer fully covers the piezoelectric ceramic and a portion of the outer surface of the sound-permeable layer, so that the other portion of the outer surface of the sound-permeable layer forms a sensing part.

[0008] As a further embodiment of this utility model: a connecting wire solder point is provided above the piezoelectric ceramic, and an inner connecting wire electrically connected to the piezoelectric ceramic is provided between the piezoelectric ceramic and the connecting wire solder point. The inner connecting wire extends from the inner side of the backing layer to the outer side of the backing layer and is attached to the outer side of the backing layer.

[0009] As a further embodiment of this utility model: the backing layer is provided with a PCB adapter board on the side away from the piezoelectric ceramic, where the output end is electrically connected to the receiving end of the internal connection line.

[0010] As a further embodiment of this utility model: the backing layer is also provided with a placement groove for placing a PCB adapter board on the back side away from the piezoelectric ceramic.

[0011] As a further embodiment of this utility model: the backing layer has grooves on both sides for placing internal connecting wires.

[0012] As a further embodiment of this utility model: a solder protective adhesive is provided above the solder joint of the connecting wire.

[0013] Compared with the existing technology, the beneficial effects of this technical solution are as follows: the integrated backing layer can cover part of the outer surface of the piezoelectric component inside, and the backing layer can be made by injection molding, so that the backing layer can act as a shell. This eliminates the need for shell assembly, glue application and curing waiting process in the production of ultrasonic sensor cores, simplifying the process and improving the production efficiency of ultrasonic sensor cores.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional view of the structure of this utility model;

[0017] Figure 2 This is a cross-sectional view of the PCB adapter board after installation according to this utility model;

[0018] Figure 3 This is a top view of the structure of this utility model;

[0019] The corresponding labels in the attached diagram are explained as follows:

[0020] 1. Piezoelectric component; 11. Piezoelectric ceramic; 12. Acoustic layer; 13. Internal connecting wire; 14. Connecting wire solder joint; 15. Solder protective adhesive; 16. Sensing part; 2. Backing material; 21. Damping layer; 22. Groove; 3. PCB adapter board; 31. Placement slot; 32. Boss. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3 An ultrasonic sensor probe with an integral damping backing material includes a piezoelectric component 1 and an integrally molded backing layer 2. The backing layer 2 is used to cover a portion of the outer surface of the piezoelectric component 1, leaving the remaining portion of the outer surface of the piezoelectric component 1 exposed to form a sensing part 16. The integrally molded backing layer can cover a portion of the outer surface of the piezoelectric component internally. Moreover, the backing layer can be injection molded, so that the backing layer can act as a shell. This eliminates the need for shell assembly, gluing, and curing processes during the production of the ultrasonic sensor probe, simplifying the process and improving the production efficiency of the ultrasonic sensor probe.

[0023] The piezoelectric component 1 includes a piezoelectric ceramic 11 located inside a backing layer 2. The piezoelectric component 1 also includes a sound-permeable layer 12 located below the piezoelectric ceramic 11. The backing layer 2 covers the piezoelectric ceramic 11 and a portion of the outer surface of the sound-permeable layer 12, forming a sensing element 16 in the exposed area of ​​the sound-permeable layer 12. A solder joint 14 is provided above the piezoelectric ceramic 11. An internal connecting line 13 electrically connected to the piezoelectric ceramic 11 is provided between the piezoelectric ceramic 11 and the solder joint 14. The internal connecting line 13 extends from the inner side of the backing layer 2 to the outer side of the backing layer 2 and adheres to the outer side of the backing layer 2. A PCB adapter board 3, with its output end electrically connected to the receiving end of the internal connecting line 13, is provided on the backing layer 2 away from the piezoelectric ceramic 11. The connection between the internal connecting line 13 and the PCB adapter board 3 allows charge to enter the PCB adapter board 3 and then be transferred to the internal connecting line 13. The internal connecting line 13 then transfers the charge to the piezoelectric ceramic 11, causing the piezoelectric ceramic 11 to begin operation. When the piezoelectric ceramic 11 is impacted by ultrasonic waves, it deforms, generating an electric charge. This charge then enters the internal connecting wire 13 and the PCB adapter board 3, which converts the charge into an electrical signal to receive the ultrasonic signal. When the piezoelectric ceramic 11 is energized, it undergoes periodic expansion and contraction vibrations. Meanwhile, the sensing part 16 formed on the exposed surface of the acoustic layer 12 ensures that the acoustic layer 12 can better focus the ultrasonic signal, enhancing the directionality of the ultrasonic wave during propagation and improving the sensitivity of the probe. The acoustic layer 12 can also serve as an acoustic impedance matching layer, reducing the reflection loss of sound waves at the interface and increasing the transmittance of sound waves. At the same time, the acoustic layer 12 can protect the piezoelectric ceramic 11, reducing wear and damage. The internal connecting wire 13 can be a conventional FPC wire available on the market.

[0024] The backing layer 2 is injection molded onto the outer surface of the piezoelectric component 1. The backing layer 2 can effectively reduce the parasitic vibration generated by the piezoelectric ceramic 11 when it is working, and avoid the parasitic vibration with a different working frequency from the piezoelectric ceramic 11 from affecting the operation of the piezoelectric ceramic 11. At the same time, the material hardness of the backing layer 2 can be in the range of 20A-60D. The material hardness within this coefficient can effectively reduce the vibration of the piezoelectric ceramic 11. Furthermore, the backing layer 2 is made by injection molding in one piece, so the piezoelectric component 1 can avoid the processes of shell gluing and shell assembly, thus reducing the production steps of the piezoelectric component 1.

[0025] The backing layer 2, on the side away from the piezoelectric ceramic 11, is also provided with a placement groove 31 for placing the PCB adapter board 3. The placement groove 31 is also provided with a boss 32 for limiting and fixing the PCB adapter board 3. The backing layer 2 has grooves 22 on both sides for placing the internal connecting wires 13. The placement plate 31 allows the PCB adapter board 3 to be placed directly, while the boss 32 can fix the PCB adapter board 3, thereby eliminating the need to fix the PCB adapter board 3 to the housing with glue and wait for the glue to fix.

[0026] Solder protection adhesive 15 is provided above the solder joint 14 of the connecting wire. Solder protection adhesive 15 can protect the solder joint 14 of the connecting wire during the injection molding process of the backing material 2, so as to avoid the pressure of the backing material 2 during injection molding from compressing the solder joint 14 of the connecting wire, which may lead to poor connection of the solder joint 14 of the connecting wire.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An ultrasonic sensor probe core with integral damping backing material, comprising a piezoelectric component (1), characterized in that, It also includes an integrally formed backing layer (2), which is used to cover a portion of the outer surface of the piezoelectric component (1) so that the remaining portion of the outer surface of the piezoelectric component (1) is exposed to form a sensing part (16).

2. The ultrasonic sensor probe with integral damping backing material according to claim 1, characterized in that, The backing layer (2) is injection molded onto the outer surface of the piezoelectric component (1).

3. The ultrasonic sensor probe with integral damping backing material according to claim 2, characterized in that, The piezoelectric component (1) includes a piezoelectric ceramic (11) located inside the backing layer (2).

4. The ultrasonic sensor probe with integral damping backing material according to claim 3, characterized in that, The piezoelectric component (1) also includes a sound-permeable layer (12) located below the piezoelectric ceramic (11). The backing layer (2) fully covers the piezoelectric ceramic (11) and a portion of the outer surface of the sound-permeable layer (12), so that the other portion of the outer surface of the sound-permeable layer (12) forms the sensing part (16).

5. The ultrasonic sensor probe with integral damping backing material according to claim 3, characterized in that, A connecting wire solder point (14) is provided above the piezoelectric ceramic (11). An inner connecting wire (13) electrically connected to the piezoelectric ceramic (11) is provided between the piezoelectric ceramic (11) and the connecting wire solder point (14). The inner connecting wire (13) extends from the inside of the backing layer (2) to the outside of the backing layer (2) and is attached to the outside of the backing layer (2).

6. The ultrasonic sensor probe with integral damping backing material according to claim 5, characterized in that, The backing layer (2) has a PCB adapter board (3) on the back side away from the piezoelectric ceramic (11) where the output end is electrically connected to the receiving end of the internal connecting line (13).

7. The ultrasonic sensor probe with integral damping backing material according to claim 6, characterized in that, The backing layer (2) is also provided with a placement groove (31) on the side away from the piezoelectric ceramic (11) for placing the PCB adapter board (3).

8. The ultrasonic sensor probe with integral damping backing material according to claim 2, characterized in that, The backing layer (2) has grooves (22) on both sides for placing the inner connecting line (13).

9. The ultrasonic sensor probe with integral damping backing material according to claim 5, characterized in that, Solder protective adhesive (15) is provided above the solder joint (14) of the connecting line.

10. An ultrasonic sensor, characterized in that, Including the ultrasonic sensor probe as described in any one of claims 1-9.

Images