Thermoelectric separation aluminum substrate

Abstract

The utility model provides a thermoelectric separation aluminum substrate, which solves the problems of welding stability and the like of LED (light-emitting diode) lamp beads and comprises an aluminum sheet with an etched boss, an insulating layer and a circuit layer are sequentially covered on the aluminum sheet, the etched boss sequentially penetrates through the insulating layer and the circuit layer, a pressure-bearing seat is fixed at the top of the etched boss of the aluminum sheet through an adhesion layer in an adhering manner, and the pressure-bearing seat is fixed on the aluminum sheet through the adhesion layer. The center of the pressure-bearing seat is provided with a pressure-bearing cylinder which is inserted into the etching boss and penetrates through the aluminum sheet, and a reinforcing assembly is fixed between the pressure-bearing seat and the pressure-bearing cylinder. The utility model has the advantages of simple structure, effective prevention of pin offset and the like.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a thermoelectric separation aluminum substrate. Background Technology

[0002] Existing aluminum-based circuit boards typically employ a four-layer architecture. The top layer is a conventional circuit layer used for transmitting electrical signals; the second layer is a windowed insulating layer that partially removes the dielectric, creating a path for heat conduction; the third layer is a heat-conducting metal block responsible for heat transfer; and the bottom layer is a heat-dissipating substrate, separating the heat-generating components from the heat dissipation structure. The heat path involves the chip or power device directly conducting heat to the metal substrate via thermal pads or metal pillars, while electrical signals are transmitted through independent circuit layers or floating circuits to avoid intersecting with the heat path. The pin spacing of LED chips varies depending on factors such as packaging and power rating. Due to the special structural limitations of traditional thermoelectric separation boards, LED chips with excessively small pin spacing may experience pin misalignment, open solder joints, and other defects during the surface mount process.

[0003] To address the shortcomings of existing technologies, people have conducted long-term explorations and proposed various solutions. For example, Chinese patent literature discloses a thermoelectric separation aluminum substrate [202122296966.2], which includes a base plate, a protective component at the upper end of the base plate, a connecting plate at the upper end of the protective component, multiple LED beads at the upper end of the connecting plate, reinforcing bolts at the four corners of the upper end of the connecting plate, and limit components at the left and right upper ends of the base plate.

[0004] The above solution has solved the problem of structural strength of aluminum substrate to some extent, but it still has many shortcomings, such as the stability of LED chip welding. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a reasonably designed thermoelectrically separated aluminum substrate that ensures stable fixing of LED beads.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a thermoelectric separation aluminum substrate, comprising an aluminum sheet with etched protrusions, an insulating layer and a circuit layer sequentially covering the aluminum sheet, the etched protrusions sequentially passing through the insulating layer and the circuit layer, a pressure bearing seat being attached and fixed to the top of the etched protrusions of the aluminum sheet by an adhesive layer, a pressure bearing cylinder having an insertion of the etched protrusion and penetrating the aluminum sheet at the center of the pressure bearing seat, and a reinforcing component being fixed between the pressure bearing seat and the pressure bearing cylinder.

[0007] In the above-mentioned thermoelectric separation aluminum substrate, the pressure seat has positioning teeth protruding towards the etched boss. The positioning teeth are symmetrically arranged relative to the central axis of the pressure seat and the pressure cylinder. The positioning teeth are pressed together with the adhesive layer, and the adhesive layer fills the gap between the etched boss and the insulating layer and the circuit layer.

[0008] In the aforementioned thermoelectric separation aluminum substrate, the reinforcing component includes a riveting part disposed at the lower end of the pressure-bearing cylinder, and the riveting part is connected and fixed to the reinforcing mesh plate.

[0009] In the aforementioned thermoelectric separation aluminum substrate, the reinforcing mesh is made of fiberglass board.

[0010] In the above-mentioned thermoelectric separation aluminum substrate, the reinforcing mesh plate has mesh-like reinforcing ribs distributed on the side away from the aluminum sheet, and a buffer film is distributed on the side of the reinforcing mesh plate opposite to the aluminum sheet.

[0011] In the aforementioned thermoelectric separation aluminum substrate, the riveting part is conical and inserted into a reinforcing mesh plate, which is deformed by the pressure of the riveting part.

[0012] In the aforementioned thermoelectric separation aluminum substrate, the thickness of the reinforcing mesh is 1.5-2.0 mm.

[0013] In the above-mentioned thermoelectric separation aluminum substrate, the aluminum sheet has a bent portion with a bending angle of 0-25°.

[0014] In the aforementioned thermoelectric separation aluminum substrate, the aluminum sheet thickness is 1.0-2.0 mm.

[0015] In the aforementioned thermoelectric separation aluminum substrate, the etched bosses are distributed in a matrix, and LED lights are welded onto the pressure bearing seats.

[0016] Compared with existing technologies, the advantages of this utility model are as follows: the etched protrusions on the aluminum sheet are equipped with a pressure-bearing seat and a pressure-bearing cylinder as a fixing base for the LED beads, and the reinforcing components improve the positional stability with the substrate; the reinforcing components reinforce the aluminum sheet itself, improving its resistance to deformation without affecting its heat dissipation performance; the pressure-bearing seat completely seals the window gap through the adhesive layer, preventing the LED bead pins from shifting into the gap and causing product defects. Attached Figure Description

[0017] Figure 1 This is a structural cross-sectional view of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of this utility model;

[0019] Figure 3 This is a partial sectional view of the present invention;

[0020] Figure 4 This is a partial schematic diagram of the present invention;

[0021] In the figure, aluminum sheet 1, etched boss 2, insulating layer 3, circuit layer 4, adhesive layer 5, pressure bearing seat 6, positioning tooth 61, pressure bearing cylinder 7, reinforcing component 8, riveting part 81, and reinforcing mesh plate 82. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0023] like Figure 1-4 As shown, a thermoelectrically separated aluminum substrate includes an aluminum sheet 1 with etched protrusions 2. An insulating layer 3 and a circuit layer 4 are sequentially covered on the aluminum sheet 1 to form the main structure of the circuit board. The etched protrusions 2 pass through the insulating layer 3 and the circuit layer 4 to provide a soldering substrate for LED chips. A pressure-bearing seat 6 is attached and fixed to the top of the etched protrusions 2 of the aluminum sheet 1 by an adhesive layer 5. The pressure-bearing seat 6 has a pressure-bearing cylinder 7 at its center, which inserts into the etched protrusions 2 and penetrates the aluminum sheet 1. The pressure-bearing seat 6 and the pressure-bearing cylinder 7 provide local reinforcement to the aluminum sheet 1 and reduce the difficulty of mounting LED chips. A reinforcing component 8 is fixed between the pressure-bearing seat 6 and the pressure-bearing cylinder 7 to improve the overall structural strength of the aluminum sheet 1.

[0024] Since the opening of the copper-clad substrate is larger than the etched boss 2, there is a certain gap between the two. If the lead spacing of the LED bead is too small, the lead may be offset to the gap, resulting in product defects.

[0025] To address the aforementioned issues, the pressure seat 6 has positioning teeth 61 protruding towards the etched boss 2. The positioning teeth 61 are symmetrically arranged relative to the central axis of the pressure seat 6 and the pressure cylinder 7. The positioning teeth 61 are pressed together with the adhesive layer 5, which fills the gaps between the etched boss 2, the insulating layer 3, and the circuit layer 4. The adhesive layer 5 completely fills the gaps, preventing pin misalignment after soldering.

[0026] Furthermore, the reinforcing component 8 is fixed using a riveting structure, specifically including a riveting part 81 located at the lower end of the pressure-bearing cylinder 7, which is connected and fixed to the reinforcing mesh plate 82.

[0027] Furthermore, in this embodiment, the reinforcing mesh plate 82 is made of fiberglass board, which is composed of glass fiber and resin, and has good insulation effect and processability, ensuring the bonding effect with aluminum sheet 1.

[0028] Furthermore, the side of the reinforcing mesh plate 82 away from the aluminum sheet 1 is provided with mesh-like reinforcing ribs to reduce weight and improve heat dissipation. The side of the reinforcing mesh plate 82 opposite to the aluminum sheet 1 is provided with a buffer film to completely seal the gap between them.

[0029] In addition, the riveting part 81 is conical and inserted into the reinforcing mesh plate 82. The reinforcing mesh plate 82 is deformed by the riveting part 81 until the lower end of the riveting part 81 is flush with the surface of the reinforcing mesh plate 82.

[0030] Meanwhile, the thickness of the reinforcing mesh plate 82 is 1.5-2.0mm, preferably 1.5mm thick, to support the aluminum sheet 1, and its edges are consistent with the overall specifications of the aluminum sheet 1.

[0031] As can be seen, the aluminum sheet 1 has a bent portion with a bending angle of 0-25°. The angle of the bent portion is limited to avoid excessive bending that could affect the stability of the bonding between the aluminum sheet 1 and the insulating layer 3 and the circuit layer 4. Meanwhile, the etched bosses 2 are arranged to avoid the bent portion.

[0032] It is obvious that the aluminum sheet 1 has a thickness of 1.0-2.0mm, preferably 1.5mm, which takes into account both structural strength and heat dissipation stability. It is usually formed by stamping and etching to obtain etched bosses 2. Then, the insulating layer 3 and the circuit layer 4 are stacked, pressed and ground.

[0033] Preferably, the etched bosses 2 are distributed in a matrix, and LED lights are welded onto the pressure bearing seat 6 respectively. For the etched bosses 2 that do not require welding to fix the LED lights, insulation sealing treatment is performed.

[0034] In summary, the principle of this embodiment is as follows: the etched boss 2 on the aluminum sheet 1 provides a welding substrate for the LED lamp through the pressure seat 6 and the pressure cylinder 7, and the reinforcing component 8 on the back maintains the structural strength of the aluminum sheet 1 while further locally reinforcing the welding substrate.

[0035] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

[0036] Although this document frequently uses terms such as aluminum sheet 1, etched boss 2, insulating layer 3, circuit layer 4, adhesive layer 5, pressure bearing seat 6, positioning tooth 61, pressure bearing cylinder 7, reinforcing component 8, riveting part 81, and reinforcing mesh plate 82, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any kind of additional limitation would contradict the spirit of this utility model.

Claims

1. A thermoelectrically separated aluminum substrate, comprising an aluminum sheet (1) having etched bosses (2), wherein an insulating layer (3) and a circuit layer (4) are sequentially covered on the aluminum sheet (1), and the etched bosses (2) sequentially pass through the insulating layer (3) and the circuit layer (4), characterized in that, The top of the etched boss (2) of the aluminum sheet (1) is attached and fixed with a pressure seat (6) by an adhesive layer (5). The pressure seat (6) has a pressure cylinder (7) inserted into the etched boss (2) and penetrating the aluminum sheet (1) at its center. A reinforcing component (8) is fixed between the pressure seat (6) and the pressure cylinder (7).

2. The thermoelectric separation aluminum substrate according to claim 1, characterized in that, The pressure seat (6) has positioning teeth (61) protruding toward the etched boss (2). The positioning teeth (61) are symmetrically arranged relative to the central axis of the pressure seat (6) and the pressure cylinder (7). The positioning teeth (61) are pressed together with the adhesive layer (5). The adhesive layer (5) fills the gap between the etched boss (2) and the insulating layer (3) and the circuit layer (4).

3. The thermoelectric separation aluminum substrate according to claim 1, characterized in that, The reinforcing component (8) includes a riveting part (81) disposed at the lower end of the pressure-bearing cylinder (7), and the riveting part (81) is connected and fixed to the reinforcing mesh plate (82).

4. The thermoelectrically separated aluminum substrate according to claim 3, characterized in that, The reinforcing mesh (82) is made of fiberglass board.

5. The thermoelectrically separated aluminum substrate according to claim 4, characterized in that, The reinforcing mesh plate (82) has mesh-like reinforcing ribs distributed on the side away from the aluminum sheet (1), and a buffer film is distributed on the side of the reinforcing mesh plate (82) opposite to the aluminum sheet (1).

6. The thermoelectrically separated aluminum substrate according to claim 5, characterized in that, The riveting part (81) is conical and inserted into the reinforcing mesh plate (82), and the reinforcing mesh plate (82) is deformed by the riveting part (81).

7. The thermoelectrically separated aluminum substrate according to claim 3, characterized in that, The thickness of the reinforcing mesh plate (82) is 1.5-2.0 mm.

8. The thermoelectric separation aluminum substrate according to claim 1, characterized in that, The aluminum sheet (1) has a bent portion with a bending angle of 0-25°.

9. The thermoelectric separation aluminum substrate according to claim 1, characterized in that, The aluminum sheet (1) has a thickness of 1.0-2.0 mm.

10. The thermoelectric separation aluminum substrate according to claim 1, characterized in that, The etched bosses (2) are arranged in a matrix, and LED lights are welded onto the bearing seats (6).

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