A high thermal conductivity non-stick pan with an embossed pattern
By incorporating a venting mechanism and a blocking mechanism into the non-stick pan lid, the problem of delayed steam release caused by the small diameter of the vent holes is solved, enabling smooth steam release and liquid blocking, thereby improving heating efficiency and food quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUYI BAIYUAN KITCHENWARE CO LTD
- Filing Date
- 2025-04-22
- Publication Date
- 2026-05-26
AI Technical Summary
The vents in existing non-stick pans are too small, which means that steam cannot escape in time, making it easy for liquid to overflow, affecting heating efficiency and the taste of food.
Design a high thermal conductivity nonstick pan with a textured surface. The pan lid is equipped with a venting mechanism, including multiple vent holes and a rotatable circular support plate. By rotating the circular support plate to cover or expose the vent holes, the venting and sealing functions can be switched. It is also equipped with a shielding mechanism to prevent spilled liquid.
It enables the smooth discharge of steam during the heating process, avoids liquid overflow, ensures heating efficiency and food quality, and is easy to disassemble and clean.
Smart Images

Figure CN224269031U_ABST