Clamp for cutting silicon wafer
By improving the structural design of the clamping assembly and utilizing the cooperation of the sliding groove and the rotating column, rapid clamping of silicon wafers was achieved, solving the problem of low clamping efficiency in the existing technology and improving cutting efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINJIANG HORGOS HESHENG NEW ENERGY TECHNOLOGY CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-05-26
AI Technical Summary
In existing silicon wafer cutting equipment, the clamping method is inefficient, which leads to a decrease in cutting efficiency.
The clamping assembly includes a slide, slider, turntable, upright, and rotating column. The slider is pushed by the spring's rebound force, and the sliding is controlled by the rotating column and guide groove to achieve rapid clamping.
It improves clamping efficiency and ensures the stability of the clamping plate and cutting efficiency during the cutting process.
Smart Images
Figure CN224275683U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of fixture technology, specifically a fixture for cutting silicon wafers. Background Technology
[0002] The process of transforming semiconductors from sand into silicon wafers involves several crucial steps, including single-crystal ingot formation, dicing, oxidation, photolithography, etching, thin-film deposition, and interconnection. Before wafer processing, the silicon wafer substrate must be cut into blocks. Existing silicon wafer dicing equipment commonly employs methods such as fixed cylinder clamping, moving cylinder clamping, or rodless cylinder clamping to clamp the silicon wafer substrate.
[0003] Chinese utility model CN216928543U discloses a clamp for semiconductor silicon wafers, which includes a manual clamping mechanism. The principle is to rotate a lead screw to drive a slider to move inside a groove, thereby simultaneously driving a clamping block to clamp both ends of the silicon wafer.
[0004] However, the existing device, which uses a lead screw to drive the slider, is inefficient and reduces cutting efficiency. Therefore, a clamping fixture with faster clamping speed was designed to address the aforementioned problem. Utility Model Content
[0005] (a) Technical problems to be solved
[0006] To address the shortcomings of existing technologies, this invention provides a clamp for cutting silicon wafers, which offers the advantage of faster clamping of silicon wafers and solves the problem of poor clamping efficiency in existing devices.
[0007] (II) Technical Solution
[0008] To achieve the above objectives, this utility model provides the following technical solution: a clamp for cutting silicon wafers, comprising: a worktable with a clamping plate on its top; a clamping assembly disposed inside the worktable, the clamping assembly comprising: a slide groove formed on the top of the worktable; a slider slidably disposed inside the slide groove and connected to the clamping plate at its top; a spring disposed inside the slide groove and connected at both ends to the slider and the inner sidewall of the slide groove; a turntable disposed inside the worktable; a guide groove formed on the top of the turntable; a vertical rod slidably disposed inside the guide groove and connected to the turntable at its top; and a rotating column whose top end penetrates the bottom of the worktable and is connected to the turntable.
[0009] Preferably, the clamping assembly further includes: a knob disposed at the bottom end of the rotating column; and a fixing assembly disposed on the rotating column to restrict the rotation of the rotating column.
[0010] Preferably, the clamping assembly further includes: a crossbar disposed inside the spring, with one end connected to the inner wall of the slide groove, and the other end passing through the slider and connected to the inner wall of the slide groove.
[0011] Preferably, the fixing component includes: a positioning hole at the bottom of the workbench; a ring sleeved on the outside of the rotating column; a protrusion at the top of the ring; two springs sleeved on the outside of the rotating column, with both ends connected to the rotating knob and the ring; and a fixing rod with its bottom end penetrating through the ring and connected to the rotating knob.
[0012] Preferably, 15 sets of both the positioning holes and the protrusions are provided.
[0013] Preferably, the fixing component further includes a cone disposed at the top of the protrusion.
[0014] Preferably, the fixing assembly further includes: a plate body disposed on the inner side of the clamping plate; two ends of the spring three being connected to the plate body and the clamping plate; and a rod body, one end of which passes through the clamping plate and through the spring three and is connected to the plate body.
[0015] Preferably, the fixing component further includes a rubber pad disposed on one side of the plate.
[0016] (III) Beneficial Effects
[0017] Compared with the prior art, the present invention provides a clamp for cutting silicon wafers, which has the following advantages:
[0018] 1. This clamping device uses the spring force to push the slider to slide and bring the clamping plate closer to hold the silicon wafer. At the same time, the design of the rotating column, guide groove and upright rod can control the sliding of the slider inside the groove, which is more efficient than the existing device.
[0019] 2. In this clamp, the fixing component is inserted into the positioning hole by a protrusion, and the bottom end of the fixing rod passes through the ring and is connected to the rotary knob, which can limit the rotation of the rotating column, thereby stabilizing the position of the clamp. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of this utility model;
[0021] Figure 2 This is a structural schematic diagram from a second perspective of the present invention;
[0022] Figure 3 This is a schematic diagram of the internal structure of the workbench of this utility model;
[0023] Figure 4 This is a schematic diagram of the structure of the present invention, showing the separation of the protrusion and the positioning hole.
[0024] In the diagram: 11. Workbench; 12. Clamping plate;
[0025] 2. Clamping assembly; 21. Slide groove; 22. Slider; 23. Spring 1; 24. Turntable; 25. Guide groove; 26. Upright rod; 27. Rotating column; 28. Rotating knob; 29. Crossbar;
[0026] 3. Fixing component; 31. Positioning hole; 32. Ring body; 33. Protrusion; 331. Cone; 34. Spring II; 35. Fixing rod; 37. Plate body; 371. Rubber pad; 38. Spring III; 39. Rod body. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0028] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0029] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] In related technologies, the principle is to rotate a lead screw to drive a slider to move inside a groove, while simultaneously causing clamping blocks to hold the two ends of the silicon wafer. However, in existing devices, the method of using a lead screw to drive the slider is inefficient and reduces cutting efficiency.
[0031] To address some of the problems in related technologies, this application provides a clamp for cutting silicon wafers. When clamping a silicon wafer, the rotating column 27 is first gripped and rotated, causing the turntable 24 to rotate as well. This causes the upright 26 to slide inside the guide groove 25, dragging the slider 22 to move inside the slide groove 21. Simultaneously, the spring 23 is compressed, causing the two clamping plates 12 to move away from each other. The silicon wafer is then placed on the clamping plates 12. Subsequently, the rotating column 27 is released, and the spring 23 rebounds, pushing the slider 22 to slide inside the slide groove 21. This causes the clamping plates 12 to move closer together to clamp the silicon wafer. Finally, the silicon wafer is cut using a cutting device.
[0032] This application is described below with reference to the accompanying drawings and specific embodiments:
[0033] This application provides a fixture for cutting silicon wafers, including: a worktable 11 with a clamping plate 12 on its top; a clamping assembly 2 inside the worktable 11, the clamping assembly 2 including: a slide groove 21 formed on the top of the worktable 11; a slider 22 slidably disposed inside the slide groove 21 and connected to the clamping plate 12 at its top; a spring 23 disposed inside the slide groove 21 and connected at both ends to the slider 22 and the inner sidewall of the slide groove 21; a turntable 24 disposed inside the worktable 11; a guide groove 25 formed on the top of the turntable 24; a vertical rod 26 slidably disposed inside the guide groove 25 and connected to the turntable 24 at its top; and a rotating column 27 whose top end penetrates the bottom of the worktable 11 and is connected to the turntable 24.
[0034] Specifically, silicon wafer dicing equipment primarily uses diamond wire as the cutting tool. Diamond wire is a cutting tool in which diamond microparticles are uniformly bonded at a specific density onto a high-carbon steel wire or tungsten wire, and it is widely used for thin-film dicing of silicon ingots or wafers. The dicing device is not shown in the attached diagram. After the silicon wafer is clamped, the dicing device can be held by hand and the diamond wire can be used to cut the silicon wafer.
[0035] When clamping the silicon wafer during use, first manually place the silicon wafer on the top of the worktable 11, then grasp the rotating column 27 with one hand and rotate it, causing the turntable 24 to rotate as well. This causes the upright 26 to slide inside the guide groove 25, dragging the slider 22 to move inside the slide groove 21. At the same time, the spring 23 is compressed, causing the two clamping plates 12 to move away from each other. Then, place the silicon wafer on the clamping plate 12. After that, release the rotating column 27, and the spring 23 will rebound and push the slider 22 to slide inside the slide groove 21, causing the clamping plate 12 to move closer to clamp the silicon wafer. Finally, use the cutting device to cut the silicon wafer.
[0036] Furthermore, the clamping assembly 2 also includes: a knob 28 disposed at the bottom end of the rotating column 27; and a fixing assembly 3 disposed on the rotating column 27 to restrict the rotation of the rotating column 27.
[0037] The design of the knob 28 makes it easy to grip and control the rotation of the rotating column 27, while the grooves on the surface of the knob 28 increase friction during rotation. The fixing component 3 can restrict the rotation of the rotating column 27, making it less likely for the clamping plate 12 to loosen its grip on the silicon wafer.
[0038] Furthermore, the clamping assembly 2 also includes: a crossbar 29 disposed inside the spring 23, with one end connected to the inner wall of the slide groove 21, and the other end passing through the slider 22 and connected to the inner wall of the slide groove 21.
[0039] The design of the crossbar 29 ensures that the spring 23 will not bend when it is compressed, thus better protecting the spring 23.
[0040] Furthermore, the fixing component 3 includes: a positioning hole 31 opened at the bottom of the workbench 11; a ring 32 sleeved on the outside of the rotating column 27; a protrusion 33 disposed on the top of the ring 32; a spring 34 sleeved on the outside of the rotating column 27, and connected at both ends to the rotating knob 28 and the ring 32; and a fixing rod 35 with its bottom end penetrating through the ring 32 and connected to the rotating knob 28.
[0041] Specifically, the bottom end of the fixing rod 35 is fixedly connected to the knob 28, and the top end is attached to the bottom end of the worktable, but not connected.
[0042] In use, the spring 34 pushes the ring 32 upward, causing the top protrusion 33 to insert into the positioning hole 31. At the same time, the bottom end of the fixing rod 35 is connected to the knob 28, and the top end passes through the ring 32, which can limit the rotation of the rotating column 27, thereby stabilizing the position of the clamping plate 12.
[0043] Furthermore, both the positioning hole 31 and the protrusion 33 are provided with 15 sets.
[0044] When in use, there are 15 settings that can limit the rotation of column 27 after a small rotation.
[0045] Furthermore, the fixing component 3 also includes a cone 331 disposed at the top of the protrusion 33.
[0046] When in use, the pointed tip of the cone 331 makes it easier to insert into the positioning hole 31.
[0047] Furthermore, the fixing component 3 also includes: a plate 37 disposed on the inner side of the clamping plate 12; a spring 38 with both ends connected to the plate 37 and the clamping plate 12; and a rod 39, one end of which passes through the clamping plate 12 and through the spring 38 and is connected to the plate 37.
[0048] When in use, the spring force of spring 38 pushes plate 37 to move and contact the silicon wafer, which can better clamp the silicon wafer and make it more stable.
[0049] Furthermore, the fixing component 3 also includes a rubber pad 371 disposed on one side of the plate 37.
[0050] The design of the rubber pad 371 during use can reduce damage to the silicon wafer when it comes into contact with it.
[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," and "some examples" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0052] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0053] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A fixture for cutting silicon wafers, comprising: The workbench has a clamping plate on top; The feature is that: a clamping assembly is provided inside the worktable, the clamping assembly comprising: A chute is formed at the top of the worktable; The slider is slidably disposed inside the groove and connected to the clamping plate at the top; Spring 1 is disposed inside the slide groove, and its two ends are connected to the slider and the inner sidewall of the slide groove; A turntable is located inside the worktable; A guide groove is formed on the top of the turntable; The upright is slidably disposed inside the guide groove and its top end is connected to the turntable; The rotating column has its top end penetrating through the bottom of the worktable and connecting to the turntable.
2. The clamp for cutting silicon wafers according to claim 1, characterized in that: The clamping assembly further includes: A rotating knob is located at the bottom end of the rotating column; The rotating column is equipped with a fixing component that can restrict the rotation of the rotating column.
3. The fixture for cutting silicon wafers according to claim 1, characterized in that: The clamping assembly further includes: A crossbar is located inside the spring, with one end connected to the inner wall of the slide groove and the other end passing through the slider and connected to the inner wall of the slide groove.
4. A fixture for cutting silicon wafers according to claim 2, characterized in that: The fixing component includes: A positioning hole is provided at the bottom of the worktable; A ring body is fitted onto the outside of the rotating column; A protrusion is provided at the top of the ring body; Spring 2 is sleeved on the outside of the rotating column, and its two ends are connected to the rotating knob and the ring body; A fixed rod, the bottom end of which passes through the ring and is connected to the knob.
5. A fixture for cutting silicon wafers according to claim 4, characterized in that: The positioning holes and the protrusions are each provided in 15 sets.
6. A clamp for cutting silicon wafers according to claim 4, characterized in that: The fixing component also includes: A cone is disposed at the top of the protrusion.
7. A fixture for cutting silicon wafers according to claim 4, characterized in that: The fixing component also includes: The plate body is disposed on the inner side of the clamping plate; Spring three has two ends connected to the plate and the clamping plate; The rod has one end passing through the clamp and the spring, and is connected to the plate.
8. A fixture for cutting silicon wafers according to claim 7, characterized in that: The fixing component also includes: A rubber pad is provided on one side of the plate.