An automatic drying system for semiconductor materials
By combining a vibrating feeding unit and an exhaust channel, the problem of exhaust gas and dust pollution during the drying process of semiconductor materials is solved, achieving a more efficient and environmentally friendly drying effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 广东长信精密设备有限公司
- Filing Date
- 2025-04-30
- Publication Date
- 2026-05-26
AI Technical Summary
During the drying process of semiconductor materials, the exhaust gas generated in the rotating cylinder contains water vapor, which is easily reliquefied and adheres to the material, affecting the drying effect. Furthermore, the exhaust gas and dust are directly emitted, polluting the environment.
The material is dispersed and conveyed into the cylinder by a vibrating feeding unit, and the exhaust gas and dust during the drying process are extracted through the exhaust channel. Combined with the heating device, the drying process is carried out to ensure that the exhaust gas and dust are removed in a timely manner.
It improves drying efficiency, avoids environmental pollution from exhaust gas and dust, and achieves a more environmentally friendly drying process.
Smart Images
Figure CN224285336U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor drying technology, specifically an automatic drying system for semiconductor materials. Background Technology
[0002] Semiconductor materials, as the cornerstone of the modern electronics industry, play an irreplaceable and crucial role in many fields such as integrated circuits, optoelectronic devices, and sensors. In the manufacturing process of semiconductor materials, drying the powder material is a critical step, the purpose of which is to remove moisture from the powder to ensure that the prepared material has stable performance.
[0003] CN201921112217.6 discloses a rotary dryer with a high-efficiency heating device, including a frame and a rotary drum inclinedly arranged on the frame. The rotary drum is rotatably mounted on the frame. A feeding device is provided at one end of the rotary drum inclined upward, and a discharging device is provided at the other end. The frame is provided with a heating device for heating the rotary drum and a driving device for driving the rotary drum to rotate.
[0004] The above-mentioned technical solution involves feeding materials into a feeding device and using a drive device and a heating device to dry the materials. However, during the drying process of semiconductor materials, waste gas is generated in the rotating cylinder, and the waste gas contains water vapor. Therefore, during the rotation of the rotating cylinder, the water vapor is easily reliquefied and adheres to the semiconductor materials, thus affecting the drying effect. Utility Model Content
[0005] The purpose of this invention is to solve the above problems and provide an automatic drying system for semiconductor materials. This system uses a vibrating feeding unit to disperse and transport the material into the cylinder, and then a heating device to dry the material. The dust generated during the vibration conveying process and the exhaust gas during the drying process are extracted through the exhaust channel, which is environmentally friendly and improves the drying effect.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] An automatic drying system for semiconductor materials includes a frame, a vibrating feeding unit, and a cylinder. The cylinder is inclined and rotatably mounted on the frame. The frame is equipped with a drive mechanism for driving the cylinder to rotate and a heating device for heating the cylinder. The cylinder is connected to the drive mechanism, and the inclined upward end of the cylinder is the feeding end.
[0008] The frame is also equipped with a housing, which has an exhaust channel, a connecting chamber, and a first through hole into the connecting chamber for the feed end; the vibrating feed unit is mounted on the frame, and the output end of the vibrating feed unit passes through one side of the housing and extends to the feed end;
[0009] The exhaust duct is connected to the feed end via the connecting chamber. The exhaust duct is used to extract exhaust gas and dust generated during material conveying from the cylinder.
[0010] In the aforementioned automatic drying system for semiconductor materials, the heating device includes a heating chamber mounted on a frame. The heating chamber has a heating space for accommodating a cylindrical body. Multiple heating tubes are installed inside the heating chamber. The frame is equipped with multiple support frames for supporting the heating chamber, and all of the support frames are connected to the heating chamber.
[0011] In the aforementioned automatic drying system for semiconductor materials, the heating space is adapted to the shape of the cylinder.
[0012] In the aforementioned automatic drying system for semiconductor materials, the heating chamber includes a lower chamber and an upper chamber hinged to the lower chamber. The lower chamber has a first recess, and the upper chamber has a second recess.
[0013] When the upper box is flipped over and the upper and lower boxes are closed, the first and second recesses cooperate to form a heating space.
[0014] When the upper and lower boxes are closed, they are locked together by a locking structure.
[0015] Multiple heating elements are evenly distributed in the upper and lower housings, and multiple support frames are connected to the lower housing.
[0016] In the aforementioned automatic drying system for semiconductor materials, the driving mechanism includes a rotary motor mounted on a frame, teeth on the outer wall of the cylinder, and a gear on the output end of the rotary motor, which is connected to the teeth via a chain.
[0017] The frame is equipped with a first support roller group and a second support roller group. The upper end of the cylinder overlaps the first support roller group, and the lower end of the cylinder overlaps the second support roller group.
[0018] In the above-mentioned automatic drying system for semiconductor materials, the vibrating feeding unit includes a linear vibrating feeder mounted on a frame, a mounting plate mounted on the linear vibrating feeder, and a conveying pipe mounted on the mounting plate, with a feeding funnel on the conveying pipe.
[0019] The shell is also provided with a second through hole opposite to the first through hole; one end of the conveying pipe passes through the second through hole and enters the connecting chamber and extends into the cylinder.
[0020] In the aforementioned automatic drying system for semiconductor materials, a first fixed frame and a second fixed frame are also provided on the frame, with the first fixed frame and the second fixed frame located at both ends of the cylinder, respectively.
[0021] The first fixed frame is provided with two first gratings, and the second fixed frame is provided with two second gratings corresponding to the first gratings.
[0022] In the aforementioned automatic drying system for semiconductor materials, a first fixed frame is provided with a first pulley for contacting the side of the cylinder; a second fixed frame is provided with a second pulley for contacting the side of the cylinder.
[0023] In the aforementioned automatic drying system for semiconductor materials, multiple temperature sensors are provided on the first recess.
[0024] In the aforementioned automatic drying system for semiconductor materials, the locking structure includes a latch hook disposed on the upper chamber and a latch ring disposed on the lower chamber.
[0025] Compared with the prior art, the beneficial effects of this utility model are:
[0026] In this invention, the vibrating feeding unit disperses the material by vibration and then conveys it into the cylinder. The material is then dried by a heating device. Since the exhaust channel is connected to the cylinder through the connecting chamber, the exhaust channel can remove the exhaust gas generated during the drying process and the dust generated during the vibrating conveying of the material, which is environmentally friendly and improves the drying effect. Attached Figure Description
[0027] Figure 1 This is a perspective view of an automatic drying system for semiconductor materials according to Example 1;
[0028] Figure 2 This is a perspective view of the housing of an automatic drying system for semiconductor materials according to Example 1;
[0029] Figure 3 This is one of the perspective views of the heating device of an automatic semiconductor material drying system according to Embodiment 1;
[0030] Figure 4 This is a second perspective view of the heating device of an automatic semiconductor material drying system according to Example 1;
[0031] Figure 5 This is the third perspective view of the heating device of an automatic semiconductor material drying system according to Example 1;
[0032] Figure 6 yes Figure 1 Enlarged diagram of A in the middle;
[0033] The figure labels for each figure are as follows:
[0034] 1. Frame; 11. First support roller group; 12. Second support roller group; 13. Support frame; 14. First fixed frame; 141. First grating; 142. First pulley; 15. Second fixed frame; 151. Second grating; 152. Second pulley; 2. Cylinder; 21. Toothed part; 3. Vibrating feeding unit; 31. Linear vibrating feeder; 32. Conveying pipe; 33. Feeding funnel; 4. Heating device; 41. Heating box; 41 1. Upper housing; 4111. First recess; 4112. Temperature sensor; 412. Lower housing; 4121. Second recess; 42. Heating element; 5. Housing; 51. First through hole; 52. Connecting chamber; 53. Exhaust duct; 54. Second through hole; 6. Drive mechanism; 61. Rotary motor; 7. Locking structure; 71. Hook and loop; 72. Hook and loop ring; 8. Chain; 9. Junction box; 91. Outlet; 92. Heat dissipation hole. Detailed Implementation
[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0036] Example 1
[0037] refer to Figures 1-6 An automatic drying system for semiconductor materials includes a frame 1, a vibrating feeding unit 3, and a cylinder 2. The cylinder 2 is inclined and rotatably mounted on the frame 1. The frame 1 is provided with a drive mechanism 6 for driving the cylinder 2 to rotate and a heating device 4 for heating the cylinder 2. The cylinder 2 is connected to the drive mechanism 6 in a transmission manner, and the inclined upward end of the cylinder 2 is the feeding end.
[0038] The frame 1 is also provided with a housing 5, which has an exhaust channel 53, a connecting chamber 52 and a first through hole 51 into the connecting chamber 52; the vibrating feed unit 3 is provided on the frame 1, and the output end of the vibrating feed unit 3 passes through one side of the housing 5 and extends to the feed end.
[0039] The exhaust duct 53 is connected to the feed end through the connecting chamber 52. The exhaust duct 53 is used to extract the exhaust gas and dust generated during material conveying in the cylinder 2.
[0040] It should be noted here that the exhaust duct 53 is connected to the external exhaust gas treatment mechanism.
[0041] In this design, the cylinder 2 is inclined and rotatably mounted on the frame 1. The rotation of the cylinder 2 is driven by the drive mechanism 6. When conveying materials, the vibrating feeding unit 3 disperses the materials and conveys them into the cylinder 2. The continuous rotation of the cylinder 2 ensures that the materials are heated evenly. Since the exhaust duct 53 is connected to the cylinder 2 through the connecting chamber 52, when the external exhaust gas treatment mechanism is working, the exhaust gas generated during the drying process and the dust generated during the vibration conveying process will first pass through the connecting chamber 52 and then be carried away through the exhaust duct 53. In this way, the drying effect is improved and it is more environmentally friendly.
[0042] In this design, the heating device 4 transfers heat to the inside of the cylinder 2 through the cylinder body 2. The powdered material is fed into the vibrating feeding unit 3 manually or by an external feeding device. The vibrating feeding unit 3 feeds the material into the cylinder body 2. With the cylinder body 2 tilted and rotated, the powdered material moves downward along the inclined direction of the cylinder body 2. During the downward movement, the powdered material comes into contact with the hot air inside the cylinder body 2 and exchanges heat, thereby drying the powdered material. The water vapor, exhaust gas, and dust generated by the vibration of the vibrating feeding unit 3 during the drying process will move towards the exhaust channel 53 due to the negative pressure environment of the connecting chamber 52 and enter the external exhaust gas treatment mechanism. In this way, not only is it possible to prevent the powdered material from entering the cylinder body 2 in a blocky manner, thus improving the drying effect, but it is also possible to prevent exhaust gas and dust from being directly discharged into the working environment, making it more environmentally friendly.
[0043] In this embodiment, the heating device 4 includes a heating box 41 mounted on the frame 1. The heating box 41 has a heating space for accommodating the cylinder 2. Multiple heating tubes 42 are installed inside the heating box 41. Multiple support frames 13 are provided on the frame 1 for supporting the heating box 41. All multiple support frames 13 are connected to the heating box 41.
[0044] The heating space is adapted to the shape of cylinder 2;
[0045] The heating box 41 includes a lower box 412 and an upper box 411 hinged to the lower box 412. The lower box 412 is provided with a first recess 4111 and the upper box 411 is provided with a second recess 4121.
[0046] When the upper box 411 is flipped over and the upper box 411 and the lower box 412 are closed, the first recess 4111 and the second recess 4121 cooperate to form a heating space.
[0047] When the upper box 411 and the lower box 412 are closed, the upper box 411 and the lower box 412 are locked together by a locking structure 7.
[0048] Multiple heating elements 42 are evenly distributed in the upper housing 411 and the lower housing 412, and multiple support frames 13 are connected to the lower housing 412.
[0049] Specifically, the heating element 42 is arranged in an arc shape inside the upper and lower housings. The support frame 13 supports the lower housing 412. The upper housing 411 and the lower housing 412 are hinged together, allowing them to be unfolded or closed. The upper housing 411 is provided with a first recess 4111, and the lower housing 412 is provided with a second recess 4121. When the upper housing 411 and the lower housing 412 are closed, the first recess 4111 and the second recess 4121 cooperate to form a heating space to accommodate the cylinder 2. The upper housing 411 and the lower housing 412 are locked and fixed by the locking structure 7, and the heating element provided in the upper housing 411 and the lower housing 412 heats the cylinder 2. When the cylinder 2 is damaged and needs to be replaced, the locking structure 7 is unlocked, the upper housing 411 is unfolded, and the cylinder 2 is replaced after heat dissipation.
[0050] More preferably, the drive mechanism 6 includes a rotary motor 61 mounted on the frame 1, a toothed portion 21 on the outer wall of the cylinder 2, and a gear (not shown in the figure) on the output end of the rotary motor 61. The gear is connected to the toothed portion 21 via a chain 8.
[0051] The frame 1 is provided with a first support roller group 11 and a second support roller group 12. The upper end of the cylinder 2 is attached to the first support roller group 11, and the lower end of the cylinder 2 is attached to the second support roller group 12.
[0052] Specifically, the first support roller group 11 includes a mounting frame and two support rollers rotatably connected to the mounting frame, and the support rollers are spaced apart. The second support roller group 12 has the same structure as the first support roller group 11, so it will not be described in detail in this embodiment.
[0053] The end of the cylinder 2 is connected between two support rollers. The gear on the output end of the rotary motor 61 is connected to the tooth 21 of the cylinder 2 through a chain 8. The rotary motor 61 drives the gear to rotate, thereby driving the cylinder 2 to rotate. The support rollers rotate with the rotation of the cylinder 2.
[0054] Preferably, the vibrating feeding unit 3 includes a linear vibrating feeder 31 mounted on the frame 1, a mounting plate mounted on the linear vibrating feeder 31, and a conveying pipe 32 mounted on the mounting plate, with a feeding funnel 33 provided on the conveying pipe 32.
[0055] The housing 5 is also provided with a second through hole 54 opposite to the first through hole 51; one end of the conveying pipe 32 passes through the second through hole 54 and enters the connecting chamber 52 and extends into the cylinder 2.
[0056] Furthermore, one end of the conveying pipe 32 extends into the cylinder 2. Workers feed materials into the conveying pipe 32 through the feeding funnel 33. Then, under the action of the linear vibrating feeder 31, the materials in the conveying pipe 32 are dispersed and conveyed into the cylinder 2. The cylinder 2 is driven to rotate by the driving mechanism 6, so that the materials move along the inclined direction of the cylinder 2, and the materials are dried by the heating device 4.
[0057] In this embodiment, the frame 1 is also provided with a first fixing frame 14 and a second fixing frame 15, which are located at the two ends of the cylinder 2 respectively;
[0058] The first fixing frame 14 is provided with two first gratings 141, and the second fixing frame 15 is provided with two second gratings 151 corresponding to the first gratings 141.
[0059] Preferably, the first fixing frame 14 is provided with a first pulley 142 for contacting the side of the cylinder 2; the second fixing frame 15 is provided with a second pulley 152 for contacting the side of the cylinder 2.
[0060] Specifically, the first grating 141 corresponds to the second grating 151, and its main function is to detect whether there are foreign objects blocking the drying process. If a foreign object is detected, the drying process will be stopped to avoid the foreign object affecting the drying process. The first fixed frame 14 and the second fixed frame 15 are respectively provided with the first pulley 142 and the second pulley 152. In this way, the first pulley 142 can cooperate with the first support roller group 11 to limit the upward end of the cylinder 2, and the second pulley 152 can cooperate with the second support roller group 12 to limit the downward end of the cylinder 2, so as to prevent the cylinder 2 from shifting during the rotation process.
[0061] More preferably, a plurality of temperature sensors 4112 are provided on the first recess 4111.
[0062] Furthermore, temperature sensors 4112 are used to collect the temperature of the cylinder 2. Preferably, there are three temperature sensors 4112, which are respectively set at the front end, middle part and rear end of the first recess 4111 to detect the temperature values at the front end, middle part and rear end of the cylinder 2.
[0063] In this embodiment, the locking structure 7 includes a latch hook 71 disposed on the upper housing 411 and a latch ring 72 disposed on the lower housing 412.
[0064] The hook and loop 72 and hook and loop hook 71 have been disclosed in Chinese patent CN218303768U, so the structure of the hook and loop 72 and hook and loop hook 71 will not be described in detail in this embodiment.
[0065] Furthermore, junction boxes 9 are provided on both the upper housing 411 and the lower housing 412. The junction boxes 9 have heat dissipation holes 92 and outlets 91 for the wires connected to the heating tube 42 to pass through. The wiring terminals of the heating tube 42 protrude from the upper housing and the lower housing and are located inside the junction boxes 9.
[0066] The heating element 42 needs to be connected to the positive and negative terminals to form a circuit. Therefore, the two exposed terminals are matched with one heating element 42.
[0067] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements or modifications can be made without departing from the principle of this utility model, and these improvements or modifications should also be considered within the protection scope of this utility model.
Claims
1. An automatic drying system for semiconductor materials, comprising a frame, a vibrating feeding unit, and a cylinder, wherein the cylinder is inclined and rotatably mounted on the frame, the frame is provided with a drive mechanism for driving the cylinder to rotate and a heating device for heating the cylinder, the cylinder is connected to the drive mechanism in a transmission manner, and the inclined upward end of the cylinder is the feeding end; characterized in that The frame is also provided with a housing, which has an exhaust channel, a connecting chamber, and a first through hole into the connecting chamber for the feed end; the vibrating feed unit is mounted on the frame, and the output end of the vibrating feed unit passes through one side of the housing and extends to the feed end; The exhaust channel is connected to the feed end via a connecting chamber, and is used to extract exhaust gas and dust generated during material conveying from the cylinder.
2. The automatic semiconductor material baking system of claim 1, wherein The heating device includes a heating box mounted on a frame. The heating box has a heating space for accommodating a cylinder. Multiple heating tubes are installed inside the heating box. Multiple support frames are provided on the frame to support the heating box. All of the support frames are connected to the heating box.
3. The automatic semiconductor material baking system of claim 2, wherein The heating space is adapted to the shape of the cylinder.
4. The automatic semiconductor material baking system of claim 2, wherein The heating chamber includes a lower chamber and an upper chamber hinged to the lower chamber. The lower chamber has a first recess and the upper chamber has a second recess. When the upper box is flipped over and the upper and lower boxes are closed, the first and second recesses cooperate to form a heating space. When the upper and lower boxes are closed, they are locked together by a locking structure. The multiple heating elements are evenly distributed in the upper and lower housings, and the multiple support frames are all connected to the lower housing.
5. The automatic semiconductor material baking system of claim 1, wherein The drive mechanism includes a rotary motor mounted on a frame, the outer wall of the cylinder is provided with teeth, the output end of the rotary motor is provided with a gear, and the gear is connected to the teeth via a chain. The frame is provided with a first support roller group and a second support roller group. The upper end of the cylinder overlaps the first support roller group, and the lower end of the cylinder overlaps the second support roller group.
6. The automatic semiconductor material baking system of claim 1, wherein The vibrating feeding unit includes a linear vibrating feeder mounted on a frame, a mounting plate mounted on the linear vibrating feeder, and a conveying pipe mounted on the mounting plate. The conveying pipe is provided with a feeding funnel. The housing is also provided with a second through hole opposite to the first through hole; one end of the conveying pipe passes through the second through hole and enters the connecting chamber and extends to the feed end.
7. The automatic semiconductor material baking system of claim 1, wherein The frame is also provided with a first fixed frame and a second fixed frame, which are located at both ends of the cylinder, respectively. The first fixing frame is provided with two first gratings, and the second fixing frame is provided with two second gratings corresponding to the first gratings.
8. The automatic semiconductor material baking system of claim 7, wherein, The first fixing frame is provided with a first pulley for contacting the side of the cylinder; the second fixing frame is provided with a second pulley for contacting the side of the cylinder.
9. The automatic drying system for semiconductor materials according to claim 4, characterized in that, Multiple temperature sensors are provided on the first recess.
10. An automatic drying system for semiconductor materials according to claim 4, characterized in that, The locking structure includes a latch hook on the upper housing and a latch ring on the lower housing.