An IDC server node module

Abstract

This utility model relates to the field of server device technology, and in particular to an IDC server node module. The IDC server node module of this utility model includes a housing, a motherboard, a graphics card module, a cooling fan assembly, and a power supply adapter board. One side of the housing is open. The motherboard, graphics card module, and cooling fan assembly are respectively mounted on the other side wall inside the housing. The motherboard is located near one end of the housing. The cooling fan assembly is positioned between the motherboard and the graphics card module, with the airflow direction of the cooling fan assembly facing one end of the housing. Ventilation vents are provided on both end side walls of the housing. The power supply adapter board is mounted on one side wall of the housing. Advantages: Reasonable structural design, rational layout of internal electrical components, enhanced hardware expandability, and a direct-flow airflow design that significantly improves heat dissipation performance.

Description

Technical Field

[0001] This utility model relates to the field of server device technology, and in particular to an IDC server node module. Background Technology

[0002] A node server is a server device used in server clusters. It is primarily used for services such as AI computing, web, FTP, and VPN. Existing multi-node servers assemble multiple server nodes within a single chassis to form a high-density server network.

[0003] Existing IDC nodes are generally equipped with high-performance multi-core, multi-threaded processors. These processors have higher clock speeds, more cores, and larger caches, enabling them to handle a large number of computing tasks simultaneously and meet complex business needs. However, traditional IDC server node modules still use conventional fan layouts for heat dissipation, which are often poorly designed, resulting in scattered airflow and inadequate heat dissipation.

[0004] Therefore, it is necessary to develop an IDC server node module to solve the above-mentioned technical problems. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an IDC server node module that effectively overcomes the defects of the prior art.

[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0007] An IDC server node module includes a housing, a motherboard, a graphics card module, a cooling fan assembly, and a power supply adapter board. The housing has an open side. The motherboard, graphics card module, and cooling fan assembly are respectively installed on the other side wall inside the housing. The motherboard is located near one end of the housing. The cooling fan assembly is located between the motherboard and the graphics card module. The airflow direction of the cooling fan assembly is towards one end of the housing. Ventilation vents are provided on both end side walls of the housing. The power supply adapter board is installed on one side wall of the housing.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, the first sidewall, second sidewall, two end walls, and bottom wall of the aforementioned box body are described above. The second sidewall includes a first sidewall, two sidewalls, and a connecting wall. The first sidewall and the two sidewalls are respectively arranged parallel to each other at both ends of one side of the first sidewall. The connecting wall is perpendicularly connected to the ends of the first sidewall and the two sidewalls that are close to each other. One of the end walls is perpendicularly connected between one end of the first sidewall and one end of the first sidewall, and the other end wall is perpendicularly connected between one end of the two sidewalls and the other end of the first sidewall. The edge of the bottom wall is connected and fixed to the first sidewall, the second sidewall, and the two end walls. The motherboard, the graphics card module, and the cooling fan assembly are respectively installed on the inner surface of the bottom wall. The motherboard is located between the first sidewall and the first sidewall. One end of the graphics card module extends between the two sidewalls and the first sidewall. The power supply adapter board is installed at the connection between the first sidewall and the connecting wall. The two end walls are respectively provided with the aforementioned ventilation openings.

[0010] Furthermore, two connecting posts are vertically provided on the inner side of one end of the aforementioned sidewall near the connecting wall, and the aforementioned power supply adapter plate is vertically connected to the two aforementioned connecting posts.

[0011] Furthermore, the aforementioned cooling fan assembly includes a perforated mounting bracket extending toward the two side walls of the aforementioned housing and a plurality of cooling fans, all of which are mounted in the aforementioned mounting bracket and arranged in a row between the two side walls of the aforementioned housing.

[0012] Furthermore, the motherboard has a slotted air guide shroud with open ends at the corresponding chip position. The slot of the air guide shroud fits the motherboard. One end of the air guide shroud is close to one end of the housing. The other end of the air guide shroud extends to the mounting bracket. At least two of the cooling fans are located inside the other end of the air guide shroud, and at least one of the cooling fans is located outside the other end of the air guide shroud.

[0013] Furthermore, the other end of the aforementioned air guide hood is narrowed, and the side of the air guide hood near the side wall of the aforementioned box body is set as a curved air guide surface.

[0014] Furthermore, an equipment debugging interface is provided on the other side wall of the aforementioned box.

[0015] Furthermore, the aforementioned motherboard is an ITX motherboard.

[0016] Furthermore, a handle is provided on the outer side of one end of the aforementioned box.

[0017] Furthermore, the aforementioned ventilation openings are honeycomb-shaped openings.

[0018] The beneficial effects of this utility model are: reasonable structural design, reasonable internal electrical component layout, enhanced hardware expandability, and direct-flow air duct design, which greatly improves heat dissipation performance. Attached Figure Description

[0019] Figure 1 This is a structural plan view of the IDC server node module of this utility model;

[0020] Figure 2 Isometric view of the IDC server node module of this utility model Figure 1 ;

[0021] Figure 3 Isometric view of the IDC server node module of this utility model Figure 2 .

[0022] The attached diagram lists the components represented by each number as follows:

[0023] 1. Box body; 2. Motherboard; 3. Graphics card module; 4. Cooling fan assembly; 5. Power supply adapter board; 6. Air guide shroud; 7. Handle; 11. First side wall; 12. Second side wall; 13. End wall; 14. Bottom wall; 15. Ventilation port; 16. Equipment debugging interface; 31. Air guide surface; 41. Mounting bracket; 42. Cooling fan; 121. First side wall; 122. Second side wall; 123. Connecting wall; 124. Connecting column. Detailed Implementation

[0024] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0025] Example

[0026] like Figure 1 , 2 As shown in Figures 1 and 3, the IDC server node module of this embodiment includes a housing 1, a motherboard 2, a graphics card module 3, a cooling fan assembly 4, and a power supply adapter board 5. The housing 1 has an open side. The motherboard 2, the graphics card module 3, and the cooling fan assembly 4 are respectively installed on the other side wall inside the housing 1. The motherboard 2 is close to one end of the housing 1. The cooling fan assembly 4 is located between the motherboard 2 and the graphics card module 3. The air outlet of the cooling fan assembly 4 is directed towards one end of the housing 1. Ventilation openings 15 are provided on the side walls at both ends of the housing 1. The power supply adapter board 5 is installed on one side wall of the housing 1.

[0027] The IDC server node module in this embodiment adopts a direct-flow heat dissipation airflow design. Specifically, when the cooling fan assembly 4 is running, the airflow enters through the vent 15 on the side wall of the other end of the housing 1, passes through the graphics card module 3 to remove the heat generated by the graphics card, and then is blown towards one end of the housing 1 by the cooling fan assembly 4. During this process, the airflow passes through the motherboard 2, removing the heat generated by the heat-generating electrical components on the motherboard 2. The airflow direction is a direct flow from one end of the housing 1 to the other, greatly improving the heat dissipation performance. In addition, the internal space layout of the housing 1 is optimized, which enhances hardware expandability while ensuring heat dissipation performance.

[0028] In a preferred embodiment, the box body 1 comprises a first side wall 11, a second side wall 12, two end walls 13, and a bottom wall 14. The second side wall 12 includes a first side wall 121, two side walls 122, and a connecting wall 123. The first side wall 121 and the two side walls 122 are respectively arranged parallel to each other at both ends of one side of the first side wall 11. The connecting wall 123 is perpendicularly connected to the adjacent ends of the first side wall 121 and the two side walls 122. One end wall 13 is perpendicularly connected between one end of the first side wall 121 and one end of the first side wall 11, and the other end wall 13 is perpendicularly connected to... Between one end of the two sidewalls 122 and the other end of the first sidewall 11, the edge of the bottom wall 14 is connected and fixed to the first sidewall 11, the second sidewall 12 and the two end walls 13 respectively. The motherboard 2, the graphics card module 3 and the cooling fan assembly 4 are respectively installed on the inner surface of the bottom wall 14. The motherboard 2 is located between the first sidewall 121 and the first sidewall 11. One end of the graphics card module 3 extends to the area between the two sidewalls 122 and the first sidewall 11. The power supply adapter board 5 is installed at the connection between the first sidewall 121 and the connecting wall 123. The two end walls 13 are respectively provided with the ventilation openings 15.

[0029] In the above implementation scheme, the entire box 1 adopts a rectangular frame design, with one end of the box 1 being wider than the other end, and the wider section being higher than the narrower section. The motherboard 2 and graphics card module 3 are mainly installed in the wider section of the box 1, and hardware expansion is possible in the narrower section. The overall shape is regular.

[0030] In this embodiment, two connecting posts 124 are vertically provided on the inner side of one end of the side wall 121 near the connecting wall 123, and the power supply adapter plate 5 is vertically connected to the two connecting posts 124. The two connecting posts 124 can be additional metal posts or posts designed integrally with the side wall 121, mainly to facilitate the installation of the power supply adapter plate 5.

[0031] Preferably, the aforementioned cooling fan assembly 4 includes a perforated mounting bracket 41 extending toward the two side walls of the housing 1 and a plurality of cooling fans 42. The plurality of cooling fans 42 are all mounted in the mounting bracket 41 and arranged in a row between the two side walls of the housing 1. The "partitioned" design of the plurality of cooling fans 42 between the two side walls of the housing 1 directs airflow toward one end of the housing 1, forming a straight airflow path from one end to the other within the housing 1. This results in good airflow and effective heat dissipation.

[0032] In a preferred embodiment, the motherboard 2 is provided with a slotted air guide shroud 6 with open ends at the corresponding chip position. The slot of the air guide shroud 6 fits the motherboard 2. One end of the air guide shroud 6 is close to one end of the housing 1, and the other end of the air guide shroud 6 extends to the mounting bracket 41. At least two of the cooling fans 42 are located inside the other end of the air guide shroud 6, and at least one of the cooling fans 42 is located outside the other end of the air guide shroud 6.

[0033] In the above implementation scheme, one end of the air guide shroud 6 faces the ventilation opening 15 at one end of the housing 1, and the other end of the air guide shroud 6 is connected to the mounting bracket 41 of the cooling fan assembly 4. This allows the air blown out by at least two cooling fans 42 to enter the air guide shroud 6. The air guide shroud 6 covers the important electronic components (chips) on the motherboard 2. Therefore, the air guide shroud 6 focuses on effectively dissipating heat from the important electronic components on the motherboard 2, resulting in better heat dissipation performance and better operation of the motherboard 2. At the same time, multiple cooling fans 42 cover the areas of the side walls on both sides of the housing 1, blowing directly onto the surface, eliminating blind spots in heat dissipation and making the entire IDC server node operate more stably.

[0034] Preferably, the other end of the air guide shroud 6 is tapered, and the side of the air guide shroud 6 closest to the side wall of the housing 1 is a curved air guide surface 31. After the other end of the air guide shroud 6 is tapered, it connects with the cooling fan assembly 4. The airflow blown out by the cooling fan 42 enters through the narrower air inlet at the other end of the air guide shroud 6, which will increase the air pressure to a certain extent, allowing it to quickly enter the interior of the air guide shroud 6, promoting airflow and indirectly improving heat dissipation performance.

[0035] In this embodiment, a device debugging interface 16 is provided on the other side wall of the box 1.

[0036] In this embodiment, the motherboard 2 is an ITX motherboard of a compatible model available on the market.

[0037] As a preferred embodiment, a handle 7 is provided on the outer side of one end of the box body 1.

[0038] In the above implementation scheme, the handle 7 facilitates pushing or pulling the entire box 1 in through one end, and also makes it easy to carry the entire IDC server node module.

[0039] Preferably, the aforementioned vent 15 is a honeycomb-shaped opening. Its opening area is relatively large, resulting in better ventilation.

[0040] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0043] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0045] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An IDC server node module, characterized in that: The device includes a housing (1), a motherboard (2), a graphics card module (3), a cooling fan assembly (4), and a power supply adapter board (5). The housing (1) has an open side. The motherboard (2), the graphics card module (3), and the cooling fan assembly (4) are respectively installed on the other side wall inside the housing (1). The motherboard (2) is close to one end of the housing (1). The cooling fan assembly (4) is located between the motherboard (2) and the graphics card module (3). The air outlet of the cooling fan assembly (4) is directed towards one end of the housing (1). Ventilation vents (15) are provided on the two side walls of the housing (1). The power supply adapter board (5) is installed on one side wall of the housing (1).

2. The IDC server node module according to claim 1, characterized in that: The box body (1) has a first sidewall (11), a second sidewall (12), two end walls (13), and a bottom wall (14). The second sidewall (12) includes a first sidewall (121), two sidewalls (122), and a connecting wall (123). The first sidewall (121) and the two sidewalls (122) are respectively arranged parallel to each other at both ends of one side of the first sidewall (11). The connecting wall (123) is perpendicularly connected to the ends of the first sidewall (121) and the two sidewalls (122) that are close to each other. One of the end walls (13) is perpendicularly connected between one end of the first sidewall (121) and one end of the first sidewall (11), and the other end wall (13) is perpendicularly connected to the two sidewalls (121). One end of the bottom wall (14) is between the first side wall (11) and the other end of the first side wall (12). The edges of the bottom wall (14) are respectively connected and fixed to the first side wall (11), the second side wall (12) and the two end walls (13). The motherboard (2), the graphics card module (3) and the cooling fan assembly (4) are respectively installed on the inner surface of the bottom wall (14). The motherboard (2) is located between the first side wall (121) and the first side wall (11). One end of the graphics card module (3) extends to the second side wall (122) and the first side wall (11). The power supply adapter board (5) is installed at the connection between the first side wall (121) and the connecting wall (123). The two end walls (13) are respectively provided with the ventilation openings (15).

3. The IDC server node module according to claim 2, characterized in that: Two connecting posts (124) are vertically provided on the inner side of one end of the side wall (121) near the connecting wall (123), and the power supply adapter plate (5) is vertically connected to the two connecting posts (124).

4. The IDC server node module according to claim 1, characterized in that: The cooling fan assembly (4) includes a hollowed-out mounting bracket (41) extending toward the two side walls of the box (1) and a plurality of cooling fans (42), all of which are installed in the mounting bracket (41) and arranged in a row between the two side walls of the box (1).

5. An IDC server node module according to claim 4, characterized in that: The motherboard (2) is provided with a slotted air guide shroud (6) with open ends at the corresponding chip position. The slot of the air guide shroud (6) fits the motherboard (2). One end of the air guide shroud (6) is close to one end of the housing (1). The other end of the air guide shroud (6) extends to the mounting bracket (41). At least two cooling fans (42) are located inside the other end of the air guide shroud (6), and at least one cooling fan (42) is located outside the other end of the air guide shroud (6).

6. An IDC server node module according to claim 5, characterized in that: The other end of the air guide hood (6) is narrowed, and the side of the air guide hood (6) near the side wall of the box body (1) is set as a curved air guide surface (31).

7. An IDC server node module according to claim 1, characterized in that: The other side wall of the box (1) is provided with a device debugging interface (16).

8. An IDC server node module according to claim 1, characterized in that: The motherboard (2) is an ITX motherboard.

9. An IDC server node module according to any one of claims 1 to 8, characterized in that: A handle (7) is provided on the outer side of one end of the box (1).

10. An IDC server node module according to any one of claims 1 to 8, characterized in that: The ventilation opening (15) is a honeycomb-shaped opening.

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