A low-loss solid capacitor

Abstract

This utility model relates to the field of electronic device technology, specifically to a low-loss solid-state capacitor, comprising a package housing, a core package disposed within the package housing, and two leads mounted on the core package. The core package is composed of multiple stacked capacitor units, each capacitor unit including a cathode foil and an anode foil disposed above the cathode foil. An electrolyte layer is disposed between the cathode foil and the anode foil. Multiple micropores are disposed on the side of the anode foil near the electrolyte layer to increase the contact area between the anode foil and the electrolyte layer and reduce the equivalent series resistance. A heat dissipation coating is disposed on the outer surface of the package housing for cooling the capacitor during operation, and a silver-tin alloy layer is disposed on the surface of the leads. Multiple heat dissipation protrusions are fixedly mounted on the outer surface of the package housing. This utility model has the advantages of low loss, reduced energy waste, and extended service life.

Description

Technical Field

[0001] This utility model relates to the field of electronic device technology, and more specifically, to a low-loss solid-state capacitor. Background Technology

[0002] Against the backdrop of the rapid development of modern electronic information technology, various electronic devices are evolving towards miniaturization, high performance, and high reliability, which puts forward higher requirements for the performance and quality of electronic components. Solid-state capacitors, with their advantages of high stability, long life and low equivalent series resistance, are widely used in consumer electronics, new energy vehicles, industrial automation, communication equipment and other fields, and are one of the key components to ensure the stable operation of electronic devices.

[0003] Chinese patent application CN112002556A discloses a stacked solid-state capacitor, comprising a plurality of capacitor units, a conductive structure, and a packaging unit. Each capacitor unit includes a positive electrode and a negative electrode that are electrically insulated from each other. The plurality of capacitor units are stacked sequentially along a stacking direction. The negative electrodes of two adjacent stacked capacitor units are electrically connected to each other through a first conductive layer. The conductive structure includes a positive conductive structure and a negative conductive structure. The positive conductive structure includes a first horizontal plate and a first vertical plate connected to each other, and the negative conductive structure includes a second horizontal plate and a second vertical plate connected to each other. The positive electrode of each capacitor unit is progressively mounted on the stepped first vertical plate, and the negative electrode of the capacitor unit abuts against the second horizontal plate and the second vertical plate. The packaging unit covers the plurality of capacitor units and part of the conductive structure. This design facilitates the stacking of capacitor units, aids in assembly, and supports two different stacking orientations for capacitor unit configurations to meet various application requirements.

[0004] While this technology offers the advantage of supporting capacitor cell configurations with two different stacking orientations to meet various application requirements, despite significant improvements in losses compared to traditional liquid electrolytic capacitors, solid-state capacitors still exhibit high internal dielectric and resistive losses under complex operating conditions such as high frequency and high power. This not only leads to severe overheating of the capacitor itself, reducing energy conversion efficiency, but also affects the normal operation of surrounding electronic components and shortens the overall lifespan of the equipment. For example, in the electric drive systems of new energy vehicles, high-loss solid-state capacitors cause significant energy waste, reducing driving range, while also increasing the burden on the cooling system, affecting the stability and reliability of the equipment. Utility Model Content

[0005] The purpose of this invention is to provide a low-loss solid-state capacitor to address the deficiencies mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A low-loss solid-state capacitor includes a package housing, a core package disposed within the package housing, and two leads mounted on the core package. The core package is composed of multiple stacked capacitor units. Each capacitor unit includes a cathode foil and an anode foil disposed above the cathode foil. An electrolyte layer is disposed between the cathode foil and the anode foil. Multiple micropores are disposed on the side of the anode foil near the electrolyte layer. The micropores are used to increase the contact area between the anode foil and the electrolyte layer and reduce the equivalent series resistance. A heat dissipation coating is disposed on the outer surface of the package housing for cooling the capacitor during operation.

[0008] Preferably, a silver-tin alloy layer is provided on the surface of the pin, which is used to reduce the contact resistance of the pin and reduce energy loss during current transmission.

[0009] Preferably, an insulating seal is fixedly installed on the inner wall of the end of the package near the outside, and the pin passes through the insulating seal.

[0010] This insulating seal provides insulation protection and prevents leakage to the outside.

[0011] Preferably, the end of the package housing near the exposed pins is provided with a recessed snap-fit ​​portion, and the insulating seal is snapped on the upper and lower sides of the recessed snap-fit ​​portion;

[0012] This setting limits the movement of the insulating seal, preventing it from moving up and down and falling off.

[0013] Preferably, a plurality of heat dissipation protrusions are fixedly installed on the outer surface of the encapsulation shell, and the ends of the heat dissipation protrusions protrude through the heat dissipation coating;

[0014] This setting improves heat dissipation, lowers the temperature of the capacitor during operation, and thus reduces the increase in losses caused by temperature rise.

[0015] Preferably, a model marking area is provided on the top surface of the encapsulation shell, which is used to mark the model and specifications of the capacitor.

[0016] Preferably, the thickness of the cathode foil is between 5 and 30 μm, and the thickness of the anode foil is between 10 and 50 μm.

[0017] Preferably, the thickness of the heat dissipation coating is between 10 and 50 μm, and the thickness of the silver-tin alloy layer is between 5 and 10 μm.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. This utility model effectively increases the contact area between the anode foil and the electrolyte layer by setting multiple micropores on the side of the anode foil near the electrolyte layer, thereby reducing the equivalent series resistance. At the same time, the silver-tin alloy layer on the pin surface further reduces the energy loss during current transmission. The two work together to significantly reduce the resistance loss of the capacitor during operation, optimize the internal current conduction path, and achieve the effect of improving energy conversion efficiency and reducing energy waste, thus ensuring the efficient operation of electronic equipment.

[0020] 2. This utility model greatly improves the heat dissipation efficiency of the capacitor by setting a heat dissipation coating on the outer surface of the encapsulation shell and combining it with the structural design of heat dissipation protrusions. The heat dissipation coating and heat dissipation protrusions can quickly dissipate the heat generated by the capacitor during operation to the external environment, effectively reducing the operating temperature of the capacitor, suppressing the increase in losses caused by temperature rise, achieving the effect of stabilizing capacitor performance and extending service life, and achieving the goal of ensuring the long-term stable operation of electronic equipment.

[0021] 3. This utility model effectively prevents current leakage at the pins by installing an insulating seal on the inner wall of the encapsulation shell and using a concave snap-fit ​​portion to limit its movement, thereby enhancing the insulation performance and safety of the capacitor. Simultaneously, the model marking area on the top surface of the encapsulation shell allows users to quickly identify the capacitor's model and specifications, improving the product's convenience and practicality. This achieves the goals of ensuring safe equipment operation, facilitating product management and use, and meeting diverse market demands. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a cross-sectional view of the present invention;

[0024] Figure 3 This is a cross-sectional view of the capacitor unit of this utility model;

[0025] The meanings of the labels in the diagram are as follows:

[0026] 1. Encapsulation housing; 10. Core package; 101. Capacitor unit; 1011. Cathode foil; 1012. Anode foil; 1013. Electrolyte layer; 1014. Microvia; 11. Lead; 111. Silver-tin alloy layer; 12. Insulating sealant; 13. Recessed snap-fit ​​part;

[0027] 2. Heat dissipation coating; 20. Heat dissipation protrusions;

[0028] 3. Model marking area. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-3 This utility model provides a technical solution: a low-loss solid-state capacitor, including a package shell 1, a core 10 disposed within the package shell 1, and two pins 11 mounted on the core 10. The core 10 is formed by stacking multiple capacitor units 101. Each capacitor unit 101 includes a cathode foil 1011 and an anode foil 1012 disposed above the cathode foil 1011. An electrolyte layer 1013 is disposed between the cathode foil 1011 and the anode foil 1012. Multiple micropores 1014 are disposed on the side of the anode foil 1012 near the electrolyte layer 1013, which greatly increases the contact area between the anode foil 1012 and the electrolyte layer 1013, thereby reducing the equivalent series resistance. When the capacitor is working, the more sufficient contact area can optimize the charge conduction path, reduce resistance loss, and make the current transmission more efficient, thereby improving the energy conversion efficiency of the capacitor and reducing power loss. Furthermore, the anode foil 1012 can be made of high-purity aluminum foil material, and the micropores 1014 on its surface can be made into a uniform and dense porous structure through an etching process.

[0031] In this embodiment, the cathode foil 1011 can be a carbon nanotube composite foil with high conductivity and good flexibility. The high conductivity of carbon nanotubes can effectively reduce the resistance of the cathode foil, while its flexibility can adapt to the deformation during the stacking process of capacitor units, ensuring the stability of the electrical connection.

[0032] Specifically, the electrolyte layer 1013 can be a solid polymer electrolyte, whose main components include polyethylene oxide, lithium salt, and nano-scale ceramic filler. Polyethylene oxide, as the polymer matrix, has good film-forming properties and ion conductivity; lithium salt provides the ion source for the electrolyte; the nano-scale ceramic filler is uniformly dispersed in the polymer matrix, which can effectively inhibit polymer crystallization, improve ionic conductivity, and enhance the mechanical properties and thermal stability of the electrolyte. In the preparation process of the electrolyte layer, a vacuum impregnation process is used to ensure that the solid polymer electrolyte fully fills the gap between the anode foil and the cathode foil, ensuring a good ion transport channel.

[0033] like Figure 1As shown, a silver-tin alloy layer 111 is provided on the surface of pin 11. Utilizing the good conductivity of the silver-tin alloy, the contact resistance of pin 11 is significantly reduced. During current transmission, the silver-tin alloy layer 111 effectively reduces the energy loss caused by contact resistance, reduces the heat generation at the pin, and makes the connection between the capacitor and the external circuit more stable and reliable, thereby ensuring the stable operation of electronic equipment and reducing energy waste.

[0034] like Figure 2 As shown, an insulating seal 12 is fixedly installed on the inner wall of the end of the package housing 1 closest to the outside. The pin 11 passes through the insulating seal 12, forming a good insulating barrier between the pin 11 and the package housing 1. The insulating seal 12 effectively prevents current leakage from the pin, enhances the insulation performance of the capacitor, avoids safety hazards caused by leakage, and achieves the effect of ensuring the safe operation of the capacitor and protecting surrounding electronic components.

[0035] like Figure 1 and Figure 2 As shown, the exposed end of the package housing 1 near the pin 11 has a recessed snap-fit ​​portion 13. The insulating seal plug 12 is snapped into the upper and lower sides of the recessed snap-fit ​​portion 13, providing precise positioning for the insulating seal plug 12. This design prevents the insulating seal plug 12 from moving up and down or falling off during capacitor use, ensuring that the insulating seal plug 12 always maintains a good insulation state, thereby further enhancing the insulation stability and safety of the capacitor.

[0036] like Figure 1 As shown, a heat dissipation coating 2 for cooling the capacitor during operation is provided on the outer surface of the encapsulation shell 1. Multiple heat dissipation protrusions 20 are fixedly installed on the outer surface of the encapsulation shell 1. The ends of the heat dissipation protrusions 20 protrude through the heat dissipation coating 2. The heat dissipation protrusions 20 and the heat dissipation coating 2 work together to dissipate the heat generated by the capacitor during operation to the external environment more quickly, effectively reducing the operating temperature of the capacitor, suppressing the increase in internal losses caused by temperature rise, and achieving the effect of stabilizing capacitor performance and extending service life.

[0037] like Figure 1 As shown, a model marking area 3 is provided on the top surface of the enclosure 1, which allows users to quickly and accurately identify the model and specifications of the capacitor. During production, installation, and maintenance, the model marking area 3 enables staff to understand the capacitor parameters without complex testing, improving the convenience of product management and use, and achieving the effect of facilitating product selection, installation, and maintenance, thus meeting the diverse needs of the market.

[0038] In this embodiment, the thickness of the cathode foil 1011 is between 5 and 30 μm, and the thickness of the anode foil 1012 is between 10 and 50 μm. This optimizes the structural design of the capacitor unit while ensuring sufficient mechanical strength. The appropriate thickness ensures that the anode and cathode foils have good flexibility to adapt to the stacking process, and also allows for reasonable control of material costs and capacitor volume while meeting electrical performance requirements, achieving a balance between capacitor performance, cost, and structure.

[0039] Specifically, the thickness of the heat dissipation coating 2 is between 10 and 50 μm, and the thickness of the silver-tin alloy layer 111 is between 5 and 10 μm. Within this thickness range, the heat dissipation coating 2 can effectively perform heat dissipation while avoiding problems such as coating peeling due to excessive thickness. The thickness of the silver-tin alloy layer 111 can ensure the effect of reducing contact resistance without increasing production costs and process difficulty due to excessive thickness, thereby achieving the effect of improving capacitor performance and controlling production costs.

[0040] Finally, it should be noted that the capacitor unit 101 and pin 11 involved in this utility model are all general standard parts or parts known to those skilled in the art. Their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power elements, electrical components and the matching controller and power supply, are connected by wires. The specific connection method should refer to the working principle in this utility model. The electrical connection between each electrical component is completed in the order of operation. The detailed connection method is a technology known in the art.

[0041] When using the low-loss solid capacitor of this utility model, first check whether the package shell 1 is intact and undamaged, confirm that the insulating seal 12 is firmly installed in the package shell 1, and that the pins 11 pass through the insulating seal 12 and are in the correct position. Check the model marking area 3 to confirm that the capacitor model and specifications meet the usage requirements. At the same time, check whether the silver-tin alloy layer 111 on the surface of the pins 11 is worn or damaged to ensure that its conductivity is good.

[0042] During installation, according to the circuit design requirements, accurately connect the capacitor pin 11 to the corresponding circuit node to ensure a firm connection and avoid loose connections affecting current transmission. Since the silver-tin alloy layer 111 on the surface of pin 11 can reduce contact resistance, it can ensure stable current transmission during connection.

[0043] During use, when the capacitor is connected to the circuit, the micropores 1014 on the anode foil 1012 of the capacitor unit 101 inside the core package 10 come into play, increasing the contact area with the electrolyte layer 1013, reducing the equivalent series resistance, and efficiently transmitting current. If the capacitor generates heat during operation, the heat dissipation coating 2 and heat dissipation protrusions 20 on the outer surface of the package 1 work together to dissipate heat, reduce the operating temperature, and ensure stable performance.

[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A low-loss solid-state capacitor, comprising a package (1), a core (10) disposed within the package (1), and two leads (11) mounted on the core (10), characterized in that: The core package (10) is composed of multiple capacitor units (101) stacked together. Each capacitor unit (101) includes a cathode foil (1011) and an anode foil (1012) disposed above the cathode foil (1011). An electrolyte layer (1013) is disposed between the cathode foil (1011) and the anode foil (1012). Multiple micropores (1014) are disposed on the side of the anode foil (1012) near the electrolyte layer (1013). The micropores (1014) are used to increase the contact area between the anode foil (1012) and the electrolyte layer (1013) and reduce the equivalent series resistance. A heat dissipation coating (2) is disposed on the outer surface of the encapsulation shell (1) for cooling the capacitor during operation.

2. The low-loss solid-state capacitor according to claim 1, characterized in that: A silver-tin alloy layer (111) is provided on the surface of the pin (11). The silver-tin alloy layer (111) is used to reduce the contact resistance of the pin (11) and reduce energy loss during current transmission.

3. The low-loss solid-state capacitor according to claim 1, characterized in that: An insulating seal plug (12) is fixedly installed on the inner wall of the end of the package (1) near the outside, and the pin (11) passes through the insulating seal plug (12).

4. The low-loss solid-state capacitor according to claim 3, characterized in that: The encapsulation housing (1) has a recessed snap-fit ​​portion (13) on the exposed end housing near the pin (11), and the insulating seal (12) is snapped on the upper and lower sides of the recessed snap-fit ​​portion (13).

5. The low-loss solid-state capacitor according to claim 1, characterized in that: Multiple heat dissipation protrusions (20) are fixedly installed on the outer surface of the encapsulation shell (1), and the ends of the heat dissipation protrusions (20) protrude through the heat dissipation coating (2).

6. The low-loss solid-state capacitor according to claim 1, characterized in that: The top surface of the encapsulation shell (1) is provided with a model marking area (3), which is used to mark the model and specifications of the capacitor.

7. The low-loss solid-state capacitor according to claim 1, characterized in that: The thickness of the cathode foil (1011) is between 5 and 30 μm, and the thickness of the anode foil (1012) is between 10 and 50 μm.

8. The low-loss solid-state capacitor according to claim 2, characterized in that: The thickness of the heat dissipation coating (2) is between 10 and 50 μm, and the thickness of the silver-tin alloy layer (111) is between 5 and 10 μm.

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