A pre-packaged chip module and its bonding structure

Abstract

This invention discloses a pre-packaged chip module and its bonding structure. The pre-packaged chip module includes a semiconductor chip and a hot melt adhesive encapsulator. The bottom surface of the semiconductor chip includes a plurality of protruding electrodes. The hot melt adhesive encapsulator covers all sides of the semiconductor chip. The electrodes of the semiconductor chip are exposed in a window at the lower end of the hot melt adhesive encapsulator, and the bottom surface of the semiconductor chip electrodes is flush with or protrudes from the bottom surface of the hot melt adhesive encapsulator. The bonding structure includes a circuit board. The pre-packaged chip module is arranged on top of the circuit board, and the chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module are aligned. The bottom surface of the hot melt adhesive encapsulator of the pre-packaged chip module is bonded to the substrate and circuit layer of the circuit board, and the electrodes of the semiconductor chip in the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads. This pre-packaged chip module simplifies the chip bonding process, increases chip bonding production efficiency, and reduces the total cost of the product.

Description

Technical Field

[0001] This utility model relates to semiconductor chips, and more particularly to a pre-packaged chip module and its bonding structure. Background Technology

[0002] As electronic products evolve towards smaller, thinner, higher-performance, and lower-cost designs, the interconnect technology between chips and substrates plays a crucial role. Flip-chip technology, due to its shortest electrical connection paths and excellent high-frequency performance, has become the mainstream high-density interconnect solution.

[0003] Existing flip chip bonding technologies mainly include:

[0004] 1) Solder Bump Reflow Soldering Process: This process involves creating solder bumps (such as tin, tin-silver-copper, etc.) on the chip electrodes, printing flux or solder paste on the substrate, and then performing surface mount and reflow soldering. Post-soldering cleaning and underfill processes are typically required to enhance mechanical reliability. This method is lengthy and involves numerous steps (bump fabrication, printing, surface mount, reflow, cleaning, underfill, curing), and for fine-pitch applications, solder bridging can easily lead to a decrease in yield.

[0005] 2) Anisotropic Conductive Material (ACF / ACP) Process: This process uses an adhesive film (ACF) or adhesive paste (ACP) containing conductive particles as the bonding medium. Under thermo-pressing, conductive particles are compressed only between the chip electrodes and the substrate pads to form conductive pathways. This method eliminates solder and underfill, but ACF / ACP materials themselves are expensive, and the process window requirements for pressure, temperature, and time are extremely stringent. Long-term reliability (such as conductivity stability under high temperature and high humidity environments) remains a challenge.

[0006] 3) Non-conductive adhesive (NCP / NCF) thermoforming bonding process: This process involves pre-applying non-conductive adhesive to the substrate, then pressing the chip with hard bumps (such as gold bumps or copper pillars) directly onto the substrate using a thermoforming bonding head. The bumps pierce the non-conductive adhesive layer and form a metallurgical connection with the substrate pads, while the adhesive cures to fill the gap. This technology offers high reliability, but requires costly pre-processing of bump fabrication on the chip side, and demands extremely high alignment accuracy.

[0007] In summary, existing technologies face an inherent contradiction between cost, efficiency, and reliability when applied to large-scale markets such as RFID and IoT, where cost is extremely sensitive. This is particularly true for bare chips with tiny dimensions (e.g., < 1x1 mm²) and extremely thin thicknesses (e.g., < 100 μm), which suffer from drawbacks such as difficult chip handling, susceptibility to chip damage, complex bonding processes, and low bonding yield. Summary of the Invention

[0008] The technical problem to be solved by this utility model is to provide a pre-packaged chip module that can simplify the bonding process and reduce the total cost of the product.

[0009] Another technical problem to be solved by this invention is to provide a bonding method for pre-packaged chip modules that can simplify the bonding process and reduce the total cost of the product.

[0010] To solve the above-mentioned technical problems, the present invention adopts a pre-packaged chip module, comprising a semiconductor chip and a hot melt adhesive encapsulation body. The bottom surface of the semiconductor chip includes a plurality of protruding electrodes. The hot melt adhesive encapsulation body covers all sides of the semiconductor chip. The electrodes of the semiconductor chip are exposed in a window at the lower end of the hot melt adhesive encapsulation body. The bottom surface of the hot melt adhesive encapsulation body is flush with the bottom surface of the semiconductor chip electrodes or the electrodes of the semiconductor chip protrude from the bottom surface of the hot melt adhesive encapsulation body.

[0011] The pre-packaged chip module described above, wherein the hot melt adhesive encapsulation covers the top surface of the semiconductor chip, and the top surface of the hot melt adhesive encapsulation includes a cover film.

[0012] The pre-packaged chip module described above includes a semiconductor chip comprising a bare die and a package. The bare die includes a plurality of pads corresponding to the electrodes of the semiconductor chip. The package covers the top and side surfaces of the bare die, and the electrodes of the semiconductor chip are arranged on the bottom surface of the package. The bottom surface of the bare die pads is connected to the top surface of the corresponding electrodes, and the lateral dimension of the electrodes is larger than the lateral dimension of the corresponding pads.

[0013] The pre-packaged chip module described above includes a semiconductor chip comprising three bare dies: an R-die, a G-die, and a B-die. The semiconductor chip's electrodes include an R-electrode, a G-electrode, a B-electrode, and a common electrode. The first pad of the R-die is connected to the R-electrode, and the second pad of the R-die is connected to the common electrode. Similarly, the first pad of the G-die is connected to the G-electrode, and the second pad of the G-die is connected to the common electrode. Finally, the first pad of the B-die is connected to the B-electrode, and the second pad of the B-die is connected to the common electrode.

[0014] A bonding structure for the aforementioned pre-packaged chip module includes a circuit board, the circuit board including a circuit layer on the top surface of a substrate, the circuit layer including a plurality of chip pads corresponding to the electrodes of the semiconductor chip of the pre-packaged chip module; the pre-packaged chip module is disposed above the circuit board, the chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module are aligned; the bottom surface of the hot melt encapsulation of the pre-packaged chip module is thermally bonded to the substrate and circuit layer of the circuit board, and the electrodes of the semiconductor chip of the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads.

[0015] The bonding structure described above, the pre-packaged chip module is an electronic tag pre-packaged chip module, and the circuit board is an electronic tag flexible circuit board.

[0016] The bonding structure described above, the pre-packaged chip module is an RGB LED chip module, and the circuit board is an RGB LED display board.

[0017] The pre-packaged chip module of this invention can simplify the chip bonding process, improve chip bonding production efficiency, and reduce the total cost of the product. Attached Figure Description

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] Figure 1 This is a schematic diagram of step 1 of the RFID pre-packaged chip module manufacturing method according to Embodiment 1 of this utility model.

[0020] Figure 2 This is a schematic diagram of step 2 of the RFID pre-packaged chip module manufacturing method according to Embodiment 1 of this utility model.

[0021] Figure 3 This is a schematic diagram of step 3 of the RFID pre-packaged chip module manufacturing method according to Embodiment 1 of this utility model.

[0022] Figure 4 This is a schematic diagram of the structure of the RFID pre-packaged chip module obtained in step 4 of the RFID pre-packaged chip module manufacturing method of Embodiment 1 of this utility model.

[0023] Figure 5 This is a schematic diagram of step 1 of the RFID pre-packaged chip module bonding method according to Embodiment 1 of this utility model.

[0024] Figure 6 This is a schematic diagram of the bonding structure obtained in step 2 of the RFID pre-packaged chip module bonding method of Embodiment 1 of this utility model.

[0025] Figure 7 This is a schematic diagram of step 1 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0026] Figure 8 This is a schematic diagram of step 2 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0027] Figure 9 This is a schematic diagram of step 3 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model, which involves peeling off the second temporary carrier.

[0028] Figure 10This is a schematic diagram of step 3 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model, which involves coating the first photosensitive film.

[0029] Figure 11 This is a schematic diagram of step 4 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0030] Figure 12 This is a schematic diagram of step 5 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0031] Figure 13 This is a schematic diagram of step 6 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0032] Figure 14 This is a schematic diagram of the structure of the RFID chip obtained by the RFID pre-packaged chip module manufacturing method of Embodiment 2 of this utility model.

[0033] Figure 15 This is a schematic diagram of step 7 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0034] Figure 16 This is a schematic diagram of step 8 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0035] Figure 17 This is a schematic diagram of step 9 of the RFID pre-packaged chip module manufacturing method according to Embodiment 2 of this utility model.

[0036] Figure 18 This is a schematic diagram of the structure of the RFID pre-packaged chip module obtained in step 10 of the RFID pre-packaged chip module manufacturing method of Embodiment 2 of this utility model.

[0037] Figure 19 This is a schematic diagram of step 1 of the RFID pre-packaged chip module bonding method in Embodiment 2 of this utility model.

[0038] Figure 20 This is a schematic diagram of the bonding structure obtained in step 2 of the RFID pre-packaged chip module bonding method of Embodiment 2 of this utility model.

[0039] Figure 21 This is a schematic diagram of step 1 of the chip fabrication process in the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0040] Figure 22 This is a schematic diagram of step 2 of the chip fabrication process in the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0041] Figure 23 This is a schematic diagram of step 3 of the chip fabrication process of the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model, which involves peeling off the third temporary carrier board.

[0042] Figure 24 yes Figure 23 Top view.

[0043] Figure 25 This is a schematic diagram of step 3 of the chip fabrication process of the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model, which involves coating the second photosensitive film.

[0044] Figure 26 This is a schematic diagram of step 4 of the chip fabrication process in the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0045] Figure 27 yes Figure 26 Top view.

[0046] Figure 28 This is a schematic diagram of step 5 of the chip fabrication process in the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0047] Figure 29 This is a schematic diagram of step 6 in the chip fabrication process of the manufacturing method of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0048] Figure 30 yes Figure 29 Top view.

[0049] Figure 31 This is a schematic diagram of the structure of the RGB LED chip obtained in step 7 of the chip fabrication process of the manufacturing method of the pre-packaged RGB LED chip module of Embodiment 3 of this utility model.

[0050] Figure 32 yes Figure 31 Top view.

[0051] Figure 33 This is a schematic diagram of step 1 of the manufacturing process of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0052] Figure 34 This is a schematic diagram of step 2 of the manufacturing process of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0053] Figure 35 This is a schematic diagram of step 3 in the manufacturing process of the pre-packaged RGB LED chip module according to Embodiment 3 of this utility model.

[0054] Figure 36 This is a schematic diagram of the structure of the pre-packaged RGB LED chip module obtained in step 4 of the manufacturing process of the pre-packaged module according to Embodiment 3 of this utility model.

[0055] Figure 37 This is a schematic diagram of step 1 of the bonding method for the pre-packaged RGB LED chip module in Embodiment 3 of this utility model.

[0056] Figure 38 This is a schematic diagram of the bonding structure obtained in step 2 of the bonding method for the pre-packaged RGB LED chip module in Embodiment 3 of this utility model. Detailed Implementation

[0057] The "pre-packaged chip module" of this utility model refers to an integrated unit that integrates a semiconductor chip, a package protection body, and an exposed conductive interface, and can be bonded as an independent component.

[0058] I. The structure of the RFID pre-packaged chip module in Embodiment 1 of this utility model is as follows: Figure 4 As shown, the device includes a semiconductor chip 1 and a hot melt adhesive encapsulation body 51. The semiconductor chip 1 is an RFID chip. The bottom surface of the semiconductor chip 1 includes two protruding electrodes 2. The hot melt adhesive encapsulation body 51 covers the top surface and all sides of the semiconductor chip 1. The electrodes 2 of the semiconductor chip 1 are exposed in a window at the lower end of the hot melt adhesive encapsulation body 51. The bottom surface of the hot melt adhesive encapsulation body 51 is flush with the bottom surface of the electrodes 2 of the semiconductor chip 1, or the electrodes 2 of the semiconductor chip protrude from the bottom surface of the hot melt adhesive encapsulation body 51. The top surface of the hot melt adhesive encapsulation body 51 has a plastic (PET or PI) covering film 6.

[0059] Embodiment 1 of this utility model discloses a method for manufacturing an RFID pre-packaged chip module, as follows: Figures 1 to 4 As shown, it includes the following steps:

[0060] 1) such as Figure 1 As shown, a first adhesive layer 4 covers the top surface of the first temporary carrier 3. Multiple semiconductor chips (RFID chips) 1 are arranged in a matrix on the top surface of the first adhesive layer 4. The electrodes 2 on the bottom surface of the semiconductor chips 1 are bonded to the first adhesive layer 4 with their faces downward. When the electrodes 2 of the semiconductor chips need to protrude from the bottom surface of the hot melt adhesive encapsulation body 51, a thicker adhesive layer 4 can be selected, and pressure can be applied downward to the semiconductor chips 1. The thickness of the adhesive layer 4 and the downward pressure applied to the semiconductor chips 1 are selected according to the height of the electrodes 2 of the semiconductor chips protruding from the bottom surface of the hot melt adhesive encapsulation body 51.

[0061] 2) such as Figure 2As shown, hot melt adhesive is applied over the first adhesive layer 4 and the semiconductor chip 1 to form a hot melt adhesive layer 5. A plastic cover film 6 is applied to the top surface of the hot melt adhesive layer.

[0062] 3) such as Figure 3 As shown, the package formed in step 2 is cut so that each semiconductor chip 1 is surrounded by a hot melt adhesive package 51.

[0063] 4) such as Figure 4 As shown, the first temporary carrier plate 3 and the first adhesive layer 4 are removed from the packaged body after step 3 to obtain the RFID pre-packaged chip module of Example 1.

[0064] Embodiment 1 of this utility model describes a bonding method for an RFID pre-packaged chip module, such as... Figure 5 and Figure 6 As shown, it includes the following steps:

[0065] 1) such as Figure 5 As shown, a circuit board is prepared. The circuit board is a flexible circuit board for electronic tags. The circuit board includes a paper substrate 8 and a circuit layer 7 on the substrate 8. The circuit layer 7 includes two chip pads 71 ​​that correspond to the two electrodes 2 of the pre-packaged chip module semiconductor chip 1, respectively. The pre-packaged chip module is placed on the circuit board, and the two electrodes 2 of the pre-packaged chip module semiconductor chip 1 are aligned with the corresponding chip pads.

[0066] 2) such as Figure 6 As shown, a hot press plate is used to apply pressure and heat to the pre-packaged chip module. The pressure causes the two electrodes 2 of the semiconductor chip 1 in the pre-packaged chip module to be in close contact with the corresponding chip pads. The heating causes the hot melt adhesive encapsulation 51 to melt, and its bottom surface is bonded to the substrate 8 and circuit layer 7 of the circuit board and then cured. The electrodes 2 of the semiconductor chip 1 in the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads 71. Finally, the cover film 6 on the top of the hot melt adhesive encapsulation 51 can be removed to obtain the bonding structure of the RFID pre-packaged chip module of Example 1. In this example, the tensile force formed by the shrinkage of the hot melt adhesive encapsulation 51 after bonding with the circuit board is utilized to form a good conductive contact between the semiconductor chip electrodes 2 and the corresponding chip pads 71.

[0067] II. The structure of the RFID pre-packaged chip module in Embodiment 2 of this utility model is as follows: Figure 18As shown, the device includes a semiconductor chip 1 and a hot melt adhesive encapsulation body 51. The semiconductor chip 1 is an RFID chip. The bottom surface of the semiconductor chip 1 includes two protruding electrodes 2. The hot melt adhesive encapsulation body 51 covers the top surface and all sides of the semiconductor chip 1. The electrodes 2 of the semiconductor chip 1 are exposed in a window at the lower end of the hot melt adhesive encapsulation body 51, and the bottom surface of the hot melt adhesive encapsulation body 51 is substantially flush with the bottom surface of the electrodes 2 of the semiconductor chip 1. The top surface of the hot melt adhesive encapsulation body 51 has a plastic (PET or PI) covering film 6.

[0068] The semiconductor chip 1 includes a bare die 11 and a package 91. The bottom surface of the bare die 11 includes two pads corresponding to the semiconductor chip electrodes 2. The package 91 encloses the top and side surfaces of the bare die 11, and the semiconductor chip electrodes 2 are arranged on the bottom surface of the package 91. The bottom surface of the bare die pad 12 is connected to the top surface of the corresponding electrode 2, and the lateral dimension of the electrode 2 is larger than the lateral dimension of the corresponding pad 12.

[0069] Embodiment 2 of this utility model describes a method for manufacturing an RFID pre-packaged chip module, as follows: Figures 7 to 18 As shown, it includes the following steps:

[0070] 1) such as Figure 7 As shown, a second adhesive layer 24 covers the top surface of the second temporary carrier board 23. Multiple bare dies 11 are arranged in a matrix on the top surface of the second adhesive layer 24. Two pads 12 protruding from the bottom surface of the bare dies 11 are bonded to the second adhesive layer 24.

[0071] 2) such as Figure 8 As shown, a molding compound is applied over the second adhesive layer 24 and the bare die 11 to form a first molding layer 9.

[0072] 3) such as Figure 9 As shown, the second temporary carrier plate 23 and the second adhesive layer 24 are peeled off, as follows: Figure 10 As shown, a first photosensitive film 10 is coated on the peel surface of the first molding layer 9 and the bare crystal 11.

[0073] 4) such as Figure 11 As shown, the first photosensitive film 10 is exposed and developed to obtain multiple first patterns corresponding to the bare crystal 11. The first pattern includes a cutout pattern 101 corresponding to the semiconductor chip electrode 2.

[0074] 5) such as Figure 12 As shown, two semiconductor chip electrodes 2 corresponding to the bonding pads 12 of the bare die 11 are formed in the hollow pattern 101 of step 4 by vacuum deposition (evaporation or sputtering). The bottom surface of the bonding pad 12 of the bare die 11 is connected to the top surface of the corresponding electrode 2, and the lateral dimension of the electrode 2 is larger than the lateral dimension of the corresponding bonding pad 12.

[0075] 6) For example Figure 13As shown, the first photosensitive film 10 is removed, and the formed package is cut to obtain the following: Figure 14 The RFID chip shown.

[0076] 7) For example Figure 15 As shown, a first adhesive layer 4 covers the top surface of the first temporary carrier plate 3, and multiple semiconductor chips (RFID chips) 1 are arranged in a matrix on the top surface of the first adhesive layer 4. The electrodes 2 on the bottom surface of the semiconductor chips 1 are facing downward and bonded to the first adhesive layer 4.

[0077] 8) For example Figure 16 As shown, hot melt adhesive is applied over the first adhesive layer 4 and the semiconductor chip 1 to form a hot melt adhesive layer 5. A plastic cover film 6 is applied to the top surface of the hot melt adhesive layer.

[0078] 9) For example Figure 17 As shown, the package formed in step 8 is cut so that each semiconductor chip 1 is surrounded by a hot melt adhesive package 51.

[0079] 10) such as Figure 18 As shown, the first temporary carrier plate 3 and the first adhesive layer 4 are removed from the packaged body after cutting in step 9 to obtain the RFID pre-packaged chip module of Example 2.

[0080] Embodiment 2 of this utility model describes a bonding method for an RFID pre-packaged chip module, such as... Figure 19 and Figure 20 As shown, it includes the following steps:

[0081] 1) such as Figure 19 As shown, a circuit board is prepared. The circuit board is a flexible circuit board for electronic tags. The circuit board includes a paper substrate 8 and a circuit layer 7 on the substrate 8. The circuit layer 7 includes two chip pads 71 ​​that correspond to the two electrodes 2 of the pre-packaged chip module semiconductor chip 1, respectively. The RFID pre-packaged chip module is placed on the circuit board, and the two electrodes 2 of the RFID pre-packaged chip module semiconductor chip 1 are aligned with the corresponding chip pads.

[0082] 2) such as Figure 20As shown, a hot press plate is used to apply pressure and heat to the pre-packaged chip module. The pressure causes the two electrodes 2 of the semiconductor chip 1 of the pre-packaged chip module to be in close contact with the two corresponding chip pads 71. Then, the heat is applied to melt the hot melt adhesive encapsulation 51, and its bottom surface is bonded and cured to the substrate 8 and circuit layer 7 of the circuit board. The electrodes 2 of the semiconductor chip 1 of the RFID pre-packaged chip module form a conductive electrical connection with the corresponding chip pads 71. Finally, the cover film 6 on the top of the hot melt adhesive encapsulation 51 is removed to obtain the bonding structure of the RFID pre-packaged chip module of Example 2. In this example, the tensile force formed by the shrinkage of the hot melt adhesive encapsulation 51 after bonding with the circuit board is utilized to form a good conductive contact between the semiconductor chip electrodes 2 and the corresponding chip pads 71.

[0083] III. The structure of the pre-packaged RGB LED chip module in Embodiment 3 of this utility model is as follows: Figure 36 As shown, it includes a semiconductor chip and a hot melt adhesive encapsulation body 51. The semiconductor chip is an RGB LED chip, including an RGB die set, which includes three dies 11. Each die 11 has two pads 12. The three dies 11 are R die 11R, G die 11G, and B die 11B (e.g., R die 11R, G die 11G, and B die 11B). Figure 24 As shown), the four protruding electrodes 2 of the RGB LED chip include an R electrode 2R, a G electrode 2G, a B electrode 2B, and a common electrode 2A (as shown). Figure 30 (As shown). The first pad of R-die 11R is connected to R electrode 2R, and the second pad of R-die 11R is connected to common electrode 2A. The first pad of G-die 11G is connected to G electrode 2G, and the second pad of G-die 11G is connected to common electrode 2A. The first pad of B-die 11B is connected to B electrode 2B, and the second pad of B-die 11B is connected to common electrode 2A.

[0084] The hot melt adhesive encapsulation 51 covers the top surface and all sides of the RGB LED chip. The electrodes 2 of the RGB LED chip are exposed in the window at the lower end of the hot melt adhesive encapsulation 51, and the bottom surface of the electrodes 2 of the RGB LED chip protrudes from the bottom surface of the hot melt adhesive encapsulation 51. The top surface of the hot melt adhesive encapsulation 51 has a plastic (PET or PI) covering film 6.

[0085] Embodiment 3 of this utility model discloses a method for manufacturing a pre-packaged RGB LED chip module, which includes the process of manufacturing the RGB LED chip and the process of manufacturing the pre-packaged module.

[0086] The manufacturing process of RGB LED chips is as follows: Figures 21 to 32 As shown, it includes the following steps:

[0087] 1) such as Figure 21As shown, a third adhesive layer 34 covers the top surface of the third temporary carrier board 33. Multiple RGB die groups are arranged in a matrix on the top surface of the third adhesive layer 34. Each RGB die group includes three dies 11, each die 11 having two pads 12. The three dies 11 are R die 11R, G die 11G, and B die 11B. The pads 12 on the bottom surfaces of R die 11R, G die 11G, and B die 11B are bonded to the third adhesive layer 34.

[0088] 2) such as Figure 22 As shown, a second encapsulating layer 9 is formed by covering the third adhesive layer 34 and the RGB bare die assembly with encapsulating adhesive.

[0089] 3) such as Figure 23 and 24 As shown, the third temporary carrier plate 33 and the third adhesive layer 34 are peeled off. Figure 25 As shown, a second photosensitive film 10 is coated on the peel surface of the second molding layer 9 and the RGB bare die assembly.

[0090] 4) such as Figure 26 and Figure 27 As shown, the second photosensitive film 10 is exposed and developed to obtain multiple second patterns corresponding to the RGB bare crystal assembly. The second patterns include cutout patterns 101 corresponding to the RGB LED chip electrodes. The RGB LED chip electrodes include an R electrode 2R, a G electrode 2G, a B electrode 2B, and a common electrode 2A.

[0091] 5) such as Figure 28 As shown, RGB LED chip electrodes 2 are formed in the cutout pattern 101 of step 704 by vacuum deposition. Specifically, the first pad of the R die 11R is connected to the R electrode 2R, and the second pad of the R die 11R is connected to the common electrode 2A. The first pad of the G die 11G is connected to the G electrode 2G, and the second pad of the G die 11G is connected to the common electrode 2A. The first pad of the B die 11B is connected to the B electrode 2B, and the second pad of the B die 11B is connected to the common electrode 2A.

[0092] 6) For example Figure 29 and Figure 30 As shown, the second photosensitive film 10 is removed, and the package formed in step 5 is cut to obtain the following: Figure 31 and Figure 32 The RGB LED chip shown.

[0093] The manufacturing process of pre-packaged modules is as follows: Figures 33 to 36 As shown, it includes the following steps:

[0094] 1) such as Figure 33As shown, a first adhesive layer 4 covers the top surface of the first temporary carrier 3, and multiple semiconductor chips (RGB LED chips) 1 are arranged in a matrix on the top surface of the first adhesive layer 4. The electrodes 2 on the bottom surface of the semiconductor chips 1 are bonded to the first adhesive layer 4 with their bottom surfaces facing downwards.

[0095] 2) such as Figure 34 As shown, hot melt adhesive is applied over the first adhesive layer 4 and the semiconductor chip 1 to form a hot melt adhesive layer 5. A plastic cover film 6 is applied to the top surface of the hot melt adhesive layer.

[0096] 3) such as Figure 35 As shown, the package formed in step 2 is cut so that each semiconductor chip (RGB LED chip) 1 is surrounded by a hot melt adhesive package 51.

[0097] 4) such as Figure 36 As shown, the first temporary carrier plate 3 and the first adhesive layer 4 are removed from the packaged body after step 3 to obtain the pre-packaged RGB LED chip module of Example 3.

[0098] The bonding method of the pre-packaged RGB LED chip module in Embodiment 3 of this utility model, such as Figure 37 and Figure 38 As shown, it includes the following steps:

[0099] 1) such as Figure 37 As shown, a circuit board is prepared. The circuit board is an RGB LED display board, which includes a substrate 8 and a circuit layer 7 on the substrate 8. The circuit layer 7 includes four chip pads 71 ​​corresponding to the four electrodes 2 of the pre-packaged RGB LED chip module (semiconductor chip 1). The pre-packaged RGB LED chip module (semiconductor chip 1) is placed on the circuit board, with the four electrodes 2 of the pre-packaged RGB LED chip module (semiconductor chip 1) aligned with the corresponding chip pads 71.

[0100] 2) such as Figure 38As shown, a hot press plate is used to apply pressure to the pre-packaged RGB LED chip module (semiconductor chip 1), causing the four electrodes 2 of the pre-packaged RGB LED chip module (semiconductor chip 1) to be in close contact with the corresponding chip pads 71. Heating causes the hot melt adhesive encapsulation 51 to melt, and its bottom surface adheres to and solidifies with the substrate 8 and circuit layer 7 of the circuit board. The four electrodes 2 of the pre-packaged RGB LED chip module (semiconductor chip 1) form conductive electrical connections with the corresponding chip pads 71. Finally, the cover film 6 on top of the hot melt adhesive encapsulation 51 can be removed, resulting in the bonding structure of the pre-packaged RGB LED chip module of Example 3. This embodiment also utilizes the tensile force generated by the shrinkage of the hot melt adhesive encapsulation 51 after bonding with the circuit board, allowing the electrodes 2 of the pre-packaged RGB LED chip module (semiconductor chip 1) to form good conductive contact with the corresponding chip pads 71.

[0101] This utility model has the following beneficial effects:

[0102] 1. Simplified Process Flow: This invention moves the chip packaging protection and bonding interface formation to the back-end process of chip manufacturing, resulting in ready-to-use pre-packaged chip modules. End-user bonding no longer needs to handle fragile bare chips, nor perform complex processes such as solder paste printing and underfilling. The bonding process is simplified to a single "placement-thermal pressing" step, significantly improving production efficiency. This invention combines traditional OSAT (Outsourced Semiconductor Assembly and Finishing) processes with post-fab (Post-Fabrication Layer) processes, creating a completely new chip product form. This reshapes the division of labor in the semiconductor industry chain, allowing fabless chip design companies or foundries to directly provide downstream customers with high-value-added, easily integrated 'componentized' chips, while significantly reducing the entry barriers and manufacturing costs for end-user system integrators (OEMs / ODMs).

[0103] 2. Significantly reduced total cost of ownership: Due to the simplification of the bonding process, end users can save on expensive solder paste printers, reflow ovens, underfill equipment and testing equipment, and material costs are also significantly reduced because there is no need for solder paste, flux and underfill adhesive.

[0104] 3. Extremely high bonding reliability: This invention adopts a "physical contact first, then adhesive fixation" structure, ensuring low resistance and high stability of the electrical connection. The hot melt adhesive encapsulation body plays a perfect bottom filling role after bonding, completely covering the electrical connection point, effectively buffering thermomechanical stress, and greatly improving the product's drop resistance, vibration resistance, and damp heat resistance.

[0105] 4. Enabling large-scale application of microchips: By packaging tiny (e.g., <0.5mm²) bare chips into modules with larger dimensions (e.g., >1mm²) and higher mechanical strength, the operability and yield of chips in the pick-up, transport and high-speed mounting process are greatly improved, clearing away process obstacles for the popularization and application of microchips in various scenarios.

Claims

1. A pre-packaged chip module, comprising a semiconductor chip, characterized in that, The device includes a hot melt adhesive encapsulation body, and the bottom surface of the semiconductor chip includes a plurality of protruding electrodes; the hot melt adhesive encapsulation body covers all sides of the semiconductor chip; the electrodes of the semiconductor chip are exposed in a window at the lower end of the hot melt adhesive encapsulation body, and the bottom surface of the hot melt adhesive encapsulation body is flush with the bottom surface of the semiconductor chip electrodes or the electrodes of the semiconductor chip protrude from the bottom surface of the hot melt adhesive encapsulation body.

2. The pre-packaged chip module according to claim 1, characterized in that, The hot melt adhesive encapsulation covers the top surface of the semiconductor chip, and the top surface of the hot melt adhesive encapsulation includes a cover film.

3. The pre-packaged chip module according to claim 1, characterized in that, The semiconductor chip includes a bare die and a package. The bare die includes a plurality of pads corresponding to the electrodes of the semiconductor chip. The package covers the top and side surfaces of the bare die, and the electrodes of the semiconductor chip are arranged on the bottom surface of the package. The bottom surface of the bare die pads is connected to the top surface of the corresponding electrodes, and the lateral dimension of the electrodes is larger than the lateral dimension of the corresponding pads.

4. The pre-packaged chip module according to claim 3, characterized in that, The semiconductor chip includes three bare dies, namely an R-die, a G-die, and a B-die. The electrodes of the semiconductor chip include an R-electrode, a G-electrode, a B-electrode, and a common electrode. The first pad of the R-die is connected to the R-electrode, and the second pad of the R-die is connected to the common electrode. The first pad of the G-die is connected to the G-electrode, and the second pad of the G-die is connected to the common electrode. The first pad of the B-die is connected to the B-electrode, and the second pad of the B-die is connected to the common electrode.

5. A bonding structure for a pre-packaged chip module as described in claim 1, comprising a circuit board, the circuit board including a circuit layer on the top surface of a substrate, the circuit layer including a plurality of chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module; characterized in that, The pre-packaged chip module is placed on top of the circuit board, and the chip pads corresponding to the semiconductor chip electrodes of the pre-packaged chip module are aligned. The bottom surface of the hot melt encapsulation of the pre-packaged chip module is hot melt bonded to the substrate and circuit layer of the circuit board, and the electrodes of the semiconductor chip of the pre-packaged chip module form a conductive electrical connection with the corresponding chip pads.

6. The bonding structure according to claim 5, characterized in that, The pre-packaged chip module is an electronic tag pre-packaged chip module, and the circuit board is an electronic tag flexible circuit board.

7. The bonding structure according to claim 5, characterized in that, The pre-packaged chip module is an RGB LED chip module, and the circuit board is an RGB LED display board.

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