Embedded component circuit board and circuit board assembly

Abstract

The utility model provides a kind of element embedded circuit board and circuit board assembly, and it includes board body and the embedded element group of being arranged in board body, external element;The embedded element group includes shell part and is arranged in the adhesive layer, filling layer, embedded element of shell part, the adhesive layer is arranged between embedded element or between embedded element and shell part, and the filling layer is filled in shell part;The embedded element of this embedded element group is more than one;The shell part is heat-conducting metal material, and heat-conducting connection between adjacent shell part.The circuit board of the utility model can consider heat dissipation performance and miniaturization design, with good development prospect;Strong practicality.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology; and more particularly to a component-embedded circuit board. Background Technology

[0002] In current technology, with the trend towards thinner and lighter electronic devices, a considerable number of electronic components must be installed within a limited space. As the number of electronic components within electronic devices continues to increase, embedded component placement is becoming increasingly common. However, if too many electronic components are integrated, it becomes difficult to dissipate heat efficiently and in a timely manner. Excessive temperature can affect component performance and even damage electronic components, leading to reduced circuit board reliability, such as causing localized deformation and warping. Current circuit boards cannot simultaneously achieve both excellent heat dissipation and miniaturization, thus limiting the development of electronic devices. Utility Model Content

[0003] Therefore, it is necessary to provide a component-embedded circuit board to address the shortcomings of existing technologies.

[0004] An embedded component circuit board includes a board body and a plurality of embedded component groups and external components disposed within the board body; the embedded component group includes a housing portion and an adhesive layer, a filler layer, and embedded components disposed within the housing portion; the adhesive layer is disposed between embedded components or between embedded components and the housing portion; the filler layer fills the housing portion; the embedded component group has one or more embedded components; the housing portion is made of a thermally conductive metal material, and adjacent housing portions are thermally connected.

[0005] Furthermore, the housing portion is frame-shaped and includes a bottom surface, four side walls and a side opening. The bottom surface is provided with several through holes, and the embedded component is provided with an electrical contact portion, with some of the electrical contacts embedded in the through holes.

[0006] Furthermore, the embedded components in the embedded component group include a first embedded component group and a second embedded component group; the first embedded component group includes a first embedded component and a second embedded component arranged in opposite directions; a plurality of embedded components in the second embedded component group are arranged facing the same side.

[0007] Furthermore, an adhesive layer is provided around the inner end of the electrical contact portion of the first embedded element, the electrical contact portion is embedded in the through hole, and the adhesive layer is attached to the bottom surface of the housing portion and the bottom surface of the first embedded element.

[0008] Furthermore, an adhesive layer is also provided on the sidewall between adjacent first embedded components and second embedded components, and an adhesive layer is also provided between the sidewall of the first embedded component and the second embedded component and the sidewall of the housing.

[0009] Furthermore, the housing portions of adjacent embedded component groups are connected by a thermally conductive connection portion, which is a metal thermally conductive sheet.

[0010] Furthermore, the housing portion is configured with a double-layer hollow structure, and the interior of the housing portion is filled with shielding material.

[0011] Furthermore, the plate body is provided with a groove, the shell part is embedded in the groove, the side wall of the groove is provided with an outer groove, the side wall of the shell part is provided with an inner groove, and the filling layer fills the inner groove.

[0012] A circuit board assembly includes an embedded circuit board and a heat sink disposed on the outside of the embedded circuit board. The heat sink includes a heat dissipation plate and a plurality of heat conduction pillars are disposed on the heat dissipation plate. The heat conduction pillars extend into the body of the board and contact the housing portion.

[0013] Furthermore, the housing portion is frame-shaped and includes a bottom surface, four side walls and a side opening. The bottom surface is provided with several through holes, and the embedded component is provided with an electrical contact portion, with some of the electrical contacts embedded in the through holes.

[0014] Furthermore, the embedded components in the embedded component group include a first embedded component group and a second embedded component group; the first embedded component group includes a first embedded component and a second embedded component arranged in opposite directions; a plurality of embedded components in the second embedded component group are arranged facing the same side.

[0015] Furthermore, an adhesive layer is provided around the inner end of the electrical contact portion of the first embedded component, the electrical contact portion is embedded in the through hole, and the adhesive layer is attached to the bottom surface of the housing portion and the bottom surface of the first embedded component.

[0016] Furthermore, an adhesive layer is also provided on the sidewall between adjacent first embedded components and second embedded components, and an adhesive layer is also provided between the sidewall of the first embedded component and the second embedded component and the sidewall of the housing.

[0017] Furthermore, the housing portions of adjacent embedded component groups are connected by a thermally conductive connection portion, which is a metal thermally conductive sheet.

[0018] Furthermore, the housing portion is configured with a double-layer hollow structure, and the interior of the housing portion is filled with shielding material.

[0019] Furthermore, the plate body is provided with a groove, the shell part is embedded in the groove, the side wall of the groove is provided with an outer groove, the side wall of the shell part is provided with an inner groove, and the filling layer fills the inner groove.

[0020] In summary, the circuit board of this invention can be equipped with multiple groups of embedded components, and each group of embedded components can contain multiple embedded components, thereby achieving high-density integration of components. After high-density integration of multiple groups of components, the heat dissipated by the components during operation can be quickly dissipated through the housing. When a component operates continuously and generates particularly high heat, and the housing cannot dissipate the heat in a timely manner, the heat can be dissipated through conduction to adjacent housings, achieving rapid heat dissipation while also ensuring overall heat balance on the circuit board. The circuit board of this invention balances heat dissipation performance and miniaturization, showing good development prospects and strong practicality. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the first embodiment of the embedded circuit board of this utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the second embodiment of the embedded circuit board of this utility model;

[0023] Figure 3 for Figure 2 Schematic diagram of the internal structure of the middle shell section;

[0024] Figure 4 This is a schematic diagram of the circuit board assembly of this utility model. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0026] like Figure 1 As shown, this is a first embodiment of the embedded component circuit board provided by this utility model. In this embodiment, the embedded component circuit board includes a board body 10 and a plurality of embedded component groups 20 and external components 30 disposed within the board body 10. The embedded component group 20 includes a housing portion 21, an adhesive layer 22, a filler layer 23, and embedded components 24. The embedded component group may have one or more embedded components. The housing portion 21 is made of a thermally conductive metal material, and adjacent housing portions 21 are thermally connected.

[0027] The housing portion 21 is frame-shaped, including a bottom surface, four side walls, and a side opening. The bottom surface has several through holes. In this embodiment, the embedded components 24 in the embedded component group 20 are arranged facing the same side or different sides. It includes a first embedded component group and a second embedded component group. The first embedded component group includes a first embedded component 241 and a second embedded component 242, which are arranged in opposite directions and connected to the upper and lower wiring layers, respectively. Several embedded components in the second embedded component group are arranged facing the same side.

[0028] The first embedded component 241 is provided with an electrical contact portion, and an adhesive layer 22 is provided around the inner end of the electrical contact portion. The electrical contact portion of the first embedded component 241 passes through a through hole on the bottom surface of the housing portion 21 and partially extends out of the through hole to connect with the outer wiring layer. The adhesive layer 22 is attached to the bottom surface of the housing portion 21 and the bottom surface of the first embedded component 241 to fix the first embedded component 241. At the same time, the adhesive layer 22 also serves as a buffer.

[0029] Furthermore, an adhesive layer 22 is also provided on the sidewalls between adjacent first embedded components 241 and second embedded components 242, which bonds several components into a whole. Understandably, in other embodiments, an adhesive layer 22 is also provided between the sides of the first embedded components 241 and second embedded components 242 and the sidewalls of the housing portion 21, thereby making the components more stable as a whole. The filling layer 23 fills the space between the housing portion 21 and the first embedded components 241, second embedded components 242, and adhesive layer 22. The housing portion 21 has heat dissipation holes or heat dissipation pillars facing outwards to improve heat dissipation efficiency.

[0030] In this embodiment, the housing portions 21 of adjacent embedded component groups are connected by a thermally conductive connection portion 211, which is a metal thermally conductive sheet. The thermally conductive sheet combines several embedded component groups within the entire circuit board into a heat-balanced heat dissipation system, thereby balancing the heat of the multiple embedded component groups and preventing overheating in some areas from affecting component performance.

[0031] Understandably, in other embodiments, the housing portion 21 may also be a double-layer hollow structure, with the interior of the housing portion 21 filled with shielding material. When a component in a component group has an electromagnetic radiation source, the housing portion 21 can act as a shield to prevent it from interfering with other components and thus avoid causing electromagnetic interference to other components.

[0032] like Figures 2 to 3As shown, this is the second embodiment of the present invention. The structure of this embodiment is basically the same as that of the first embodiment. The housing part 21a is embedded in the groove of the plate 10. The difference is that the side wall of the groove is provided with an outer groove 11, and the side wall of the housing part 21a is provided with an inner groove 211a. The inner groove 211a increases the contact surface between the housing part 21a and the filling layer 23, thereby making the adhesion between the two more stable. The outer groove 11 allows the internal gas of the housing part 21a to be quickly squeezed out when it is installed downwards, and it can communicate with the outside, which is beneficial to subsequent heat dissipation requirements.

[0033] like Figure 4 As shown, this utility model discloses a circuit board assembly, which includes an embedded circuit board and a heat sink disposed on the outside of the embedded circuit board. The heat sink includes a heat sink plate 40, on which a plurality of heat-conducting pillars 41 are disposed. The heat-conducting pillars 41 extend into the heat-conducting holes and contact the housing portion 21 to quickly dissipate heat, thereby improving the heat dissipation effect.

[0034] In summary, the circuit board of this invention can be equipped with multiple groups of embedded components, and each group of embedded components can contain multiple embedded components, thereby achieving high-density integration of components. After high-density integration of multiple groups of components, the heat dissipated by the components during operation can be quickly dissipated through the housing. When a component operates continuously and generates particularly high heat, and the housing cannot dissipate the heat in a timely manner, the heat can be dissipated through conduction to adjacent housings, achieving rapid heat dissipation while also ensuring overall heat balance on the circuit board. The circuit board of this invention balances heat dissipation performance and miniaturization, showing good development prospects and strong practicality.

[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A component-embedded circuit board, characterized in that: The device includes a plate and several embedded component groups and external components disposed within the plate. Each embedded component group includes a housing portion and an adhesive layer, a filling layer, and embedded components disposed within the housing portion. The adhesive layer is disposed between embedded components or between embedded components and the housing portion, and the filling layer fills the housing portion. Each embedded component group has one or more embedded components. The housing portion is made of a thermally conductive metal material, and adjacent housing portions are thermally connected.

2. The embedded circuit board as described in claim 1, characterized in that: The housing is frame-shaped and includes a bottom surface, four side walls and a side opening. The bottom surface has several through holes, and the embedded component has an electrical contact part, with some of the electrical contact parts embedded in the through holes.

3. The embedded circuit board as described in claim 1, characterized in that: The embedded components in the embedded component group include a first embedded component group and a second embedded component group; the first embedded component group includes a first embedded component and a second embedded component arranged in opposite directions; a plurality of embedded components in the second embedded component group are arranged facing the same side.

4. The embedded circuit board as described in claim 3, characterized in that: An adhesive layer is provided around the inner end of the electrical contact portion of the first embedded component. The electrical contact portion is embedded in the through hole, and the adhesive layer is attached to the bottom surface of the housing portion and the bottom surface of the first embedded component.

5. The embedded circuit board as described in claim 4, characterized in that: An adhesive layer is also provided on the sidewall between adjacent first embedded components and second embedded components, and an adhesive layer is also provided between the sidewall of the first embedded component and the second embedded component and the sidewall of the housing.

6. The embedded circuit board as described in claim 1, characterized in that: The housing portions of adjacent embedded component groups are connected by a thermally conductive connection portion, which is a metal thermally conductive sheet.

7. The embedded circuit board as described in claim 1, characterized in that: The housing is a double-layered hollow structure, and the interior of the housing is filled with shielding material.

8. The embedded circuit board as described in claim 1, characterized in that: The plate has a groove, the shell part is embedded in the groove, the side wall of the groove has an outer groove, the side wall of the shell part has an inner groove, and the filling layer fills the inner groove.

9. A circuit board assembly, characterized in that: The invention includes an embedded circuit board and a heat sink disposed on the outside of the embedded circuit board. The embedded circuit board is the embedded circuit board as described in any one of claims 1 to 8. The heat sink includes a heat sink plate with a plurality of heat-conducting pillars disposed on the heat sink plate. The heat-conducting pillars extend into the plate body and contact the housing portion.

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