Four-chamber magnetron sputtering static coating equipment

Abstract

The application relates to a four-chamber magnetron sputtering static coating device, which comprises an inlet conversion chamber, a transition heating chamber, a plurality of static coating chambers and an outlet conversion chamber in sequence along the substrate transmission direction, a plurality of rotating cathode mechanisms for magnetron sputtering are arranged in the static coating chambers, the rotating cathode mechanism comprises a second rotating driving mechanism and a magnetic rod assembly, and the driving end of the second rotating driving mechanism is connected with the magnetic rod assembly through a second transmission assembly. The four-chamber magnetron sputtering static coating device not only improves the coating efficiency of the substrate, but also improves the uniformity of the coating.

Description

Technical Field

[0001] This utility model relates to the field of coating technology, and in particular to a four-chamber magnetron sputtering static coating equipment. Background Technology

[0002] Magnetron sputtering coating technology is widely used in optics, electronics, and decorative fields due to its advantages such as fast deposition rate, high film quality, and strong adhesion. However, traditional magnetron sputtering static coating equipment typically employs a single-chamber structure, which suffers from low production efficiency and poor film uniformity. The single-chamber structure requires frequent switching between vacuum and atmospheric environments, resulting in slow production cycles and low efficiency. During static coating, the uneven distribution of the magnetic field leads to large thickness deviations in different areas of the substrate. Existing equipment typically exhibits thickness deviations > ±15% when the substrate is stationary, which is insufficient to meet the requirements of precision optical devices. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a four-chamber magnetron sputtering static coating equipment, which not only improves the coating efficiency of the substrate, but also improves the uniformity of the coating.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a four-chamber magnetron sputtering static coating equipment, which includes an inlet conversion chamber, a transition heating chamber, several static coating chambers and an outlet conversion chamber in sequence along the substrate transport direction. The static coating chamber is provided with multiple rotating cathode mechanisms for magnetron sputtering. The rotating cathode mechanism includes a second rotating drive mechanism and a magnetic rod assembly. The drive end of the second rotating drive mechanism is connected to the magnetic rod assembly through a second transmission assembly.

[0005] In one embodiment, the multiple rotating cathode mechanisms of the four-chamber magnetron sputtering static coating equipment are arranged perpendicular to the transmission direction and at equal intervals. The rotating cathode mechanism includes a first rotating drive mechanism and a target cylinder. The drive end of the first rotating drive mechanism is connected to the target cylinder through a first transmission component. The magnetic rod assembly is installed inside the target cylinder. The second rotating drive mechanism is used to drive the magnetic rod assembly to rotate inside the target cylinder.

[0006] In one embodiment, the inlet conversion chamber of the four-chamber magnetron sputtering static coating equipment is provided with a first vacuum pumping device, which is used to convert the atmospheric environment into a rough vacuum environment.

[0007] In one embodiment, a second vacuum pumping device is provided in the transition heating chamber of the four-chamber magnetron sputtering static coating equipment. The second vacuum pumping device is used to convert the rough vacuum environment into a high vacuum environment.

[0008] In one embodiment, a heating device is provided in the transition heating chamber of the four-chamber magnetron sputtering static coating equipment, which is used to preheat the substrate.

[0009] In one embodiment, the transition heating chamber of the four-chamber magnetron sputtering static coating equipment is further provided with a temperature control system, which is used to control the temperature of the substrate.

[0010] In one embodiment, a third vacuum pumping device is provided in the outlet conversion chamber of the four-chamber magnetron sputtering static coating equipment. The third vacuum pumping device is used to convert the vacuum environment in the outlet conversion chamber into an atmospheric environment.

[0011] In one embodiment, the outlet conversion chamber of the four-chamber magnetron sputtering static coating equipment is equipped with an air filling device, which is used to accelerate the conversion of the vacuum environment into an atmospheric environment.

[0012] In one embodiment, the four-chamber magnetron sputtering static coating equipment further includes a conveying mechanism for transporting the substrate. The conveying mechanism passes through the inlet conversion chamber, the transition heating chamber, several static coating chambers, and the outlet conversion chamber. The conveying mechanism is used for transporting and positioning the substrate.

[0013] A four-chamber magnetron sputtering static coating method, using the aforementioned four-chamber magnetron sputtering static coating equipment, comprises the following coating steps:

[0014] Step 1: The substrate flows into the inlet conversion chamber along with the conveying mechanism. The first vacuum pump in the inlet conversion chamber converts the substrate from an atmospheric environment to a rough vacuum environment.

[0015] Step 2: The substrate then flows into the transition heating chamber along with the conveying mechanism. The second vacuum pump in the transition heating chamber converts the substrate from a rough vacuum environment to a high vacuum environment. At the same time, the heating device in the transition heating chamber preheats the substrate, and the temperature control system monitors the temperature of the substrate.

[0016] Step 3: The substrate then flows into the static coating chamber along with the conveying mechanism. The conveying mechanism stops flowing, so that the substrate is statically located in the static coating chamber. Multiple rotating cathode mechanisms in the static coating chamber simultaneously perform coating operations on the static substrate.

[0017] Step 4: After the coating is completed, the substrate flows into the outlet conversion chamber along with the conveying mechanism. The third vacuum device in the outlet conversion chamber breaks the vacuum of the substrate, so that the vacuum environment is converted into an atmospheric environment. The substrate flows out of the coating equipment, and the operation is completed.

[0018] The beneficial effects of this application are as follows:

[0019] This application provides a four-chamber magnetron sputtering static coating equipment. This equipment, through the coordinated arrangement of an inlet conversion chamber, a transition heating chamber, a static coating chamber, and an outlet conversion chamber, achieves rapid and continuous coating of substrates, improving production efficiency. The static coating chamber employs multiple rotating cathode mechanisms to deposit film layers on stationary substrates, achieving uniform film deposition and improving product quality. This four-chamber magnetron sputtering static coating equipment not only improves production efficiency but also enhances the uniformity of the coating.

[0020] The rotating cathode mechanism of this four-chamber magnetron sputtering static coating equipment uses a second rotating drive mechanism to drive the magnetic rod assembly to swing regularly, breaking the limitations of the traditional fixed magnetic field, thereby improving the coating uniformity to ±3%, achieving uniform film deposition, and improving product quality.

[0021] The inlet conversion chamber, transition heating chamber, and outlet conversion chamber of this four-chamber magnetron sputtering static coating equipment adopt independent control processes. The inlet conversion chamber, transition heating chamber, static coating chamber, and outlet conversion chamber can operate in parallel, improving production efficiency.

[0022] This four-chamber magnetron sputtering static coating equipment can use multiple static coating chambers to achieve continuous deposition of multilayer composite films. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a four-chamber magnetron sputtering static coating apparatus according to an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the rotating cathode mechanism of a four-chamber magnetron sputtering static coating apparatus according to an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of a four-chamber magnetron sputtering static coating apparatus according to an embodiment of this application;

[0026] Figure 4 This is a diagram showing the coating uniformity distribution of a traditional static magnetic rod.

[0027] Figure 5 This is a coating uniformity distribution diagram of a four-chamber magnetron sputtering static coating apparatus according to an embodiment of this application.

[0028] in:

[0029] 1. Inlet conversion chamber; 2. Transition heating chamber; 3. Static coating chamber; 4. Outlet conversion chamber; 5. Conveying mechanism; 11. First vacuum pumping device; 21. Second vacuum pumping device; 22. Heating device; 23. Temperature control system; 31. Rotating cathode mechanism; 311. First rotary drive mechanism; 312. Target cylinder; 313. Second rotary drive mechanism; 314. Magnetic rod assembly; 315. First transmission assembly; 316. Second transmission assembly; 41. Third vacuum pumping device; 42. Gas filling device. Detailed Implementation

[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0031] like Figure 1 As shown, an embodiment of this application provides a four-chamber magnetron sputtering static coating apparatus, which includes, in sequence along the substrate transport direction, an inlet conversion chamber 1, a transition heating chamber 2, several static coating chambers 3, and an outlet conversion chamber 4. The static coating chambers 3 are provided with multiple rotating cathode mechanisms 31 for magnetron sputtering. Each rotating cathode mechanism 31 includes a second rotating drive mechanism 313 and a magnetic rod assembly 314. The drive end of the second rotating drive mechanism 313 is connected to the magnetic rod assembly 314 through a second transmission assembly 316.

[0032] Specifically, the glass substrate is first transported through an inlet conversion chamber 1, which converts the substrate from an atmospheric environment to a rough vacuum environment. Then, it passes through a transition heating chamber 2, which converts the rough vacuum environment to a high vacuum environment. The heating device 22 in the transition heating chamber 2 preheats the substrate to improve film quality. Next, it passes through a static coating chamber 3. Multiple rotating cathode mechanisms 31 within the static coating chamber 3 use ITO target cylinders 312. A second rotation drive mechanism 313 drives a magnetic rod assembly 314 to rotate within the target cylinder 312, resulting in a 15-degree oscillation amplitude and a 0.5Hz oscillation frequency. The substrate remains in the static coating chamber 3 for 10 seconds. The multiple rotating cathode mechanisms 31 deposit film on the stationary substrate from all angles, forming an ITO conductive film with a thickness of 160nm ± 11nm and a thickness uniformity of 3.5%. After coating, the substrate is passed through the outlet conversion chamber 4, which breaks the vacuum, converting the vacuum environment to an atmospheric environment, allowing the substrate to flow out of the coating equipment and completing the process. The inlet conversion chamber 1, transition heating chamber 2, static coating chamber 3, and outlet conversion chamber 4 can operate in parallel, improving production efficiency. If multilayer composite films are to be prepared, 2-3 more static coating chambers 3 can be added as needed. Different film layers can be deposited using target cylinders 312 made of different materials, depending on the coating requirements. The magnetic rod assembly 314 includes pole shoes, a vertically arranged first magnet, and two relatively inclined second magnets. The first magnet and the two second magnets are fixedly mounted on the pole shoes, with the first magnet located between the two second magnets. The first magnet has opposite polarities to the two second magnets. The pole shoes are connected to the second rotary drive mechanism via a second transmission assembly. The second rotary drive mechanism 313 drives the second transmission assembly 316 to rotate the pole shoes, the first magnet, and the two second magnets in a regular manner.

[0033] The above structure employs a four-chamber configuration, enabling rapid and continuous substrate deposition and improving production efficiency. Compared to traditional magnetron sputtering dynamic coating equipment, it requires fewer vacuum chambers, saving on investment costs. Figure 4 and Figure 5 As shown, multiple rotating cathode mechanisms 31 are driven by a second rotating drive mechanism 313 to rotate the magnetic rod assembly 314, breaking the limitations of traditional fixed magnetic fields and improving the coating uniformity to ±3%, achieving uniform film deposition and improving product quality. The equipment is equipped with an automated control system, realizing automated control of the entire coating process and reducing operational difficulty. The coating time can be controlled to adjust the film thickness according to specific coating requirements, and different film layers can be deposited by changing the target cylinder 312 of different materials, improving the equipment's flexibility and versatility. This four-chamber magnetron sputtering static coating equipment not only improves production efficiency but also enhances coating uniformity.

[0034] like Figure 2 and Figure 3 As shown, in one embodiment, the multiple rotating cathode mechanisms 31 of the four-chamber magnetron sputtering static coating apparatus are arranged perpendicular to the transport direction and at equal intervals. Each rotating cathode mechanism 31 includes a first rotating drive mechanism 311 and a target cylinder 312. The drive end of the first rotating drive mechanism 311 is connected to the target cylinder 312 via a first transmission assembly 315. The magnetic rod assembly 314 is installed inside the target cylinder 312. A second rotating drive mechanism 313 drives the magnetic rod assembly 314 to rotate within the target cylinder 312. Both the first transmission assembly 315 and the second transmission assembly 316 include a drive shaft, a driven shaft, and a belt cable wound around the drive shaft and the driven shaft. The first rotating drive mechanism 311 is a first motor, and the second rotating drive mechanism 313 is a second motor. The drive end of the first motor is connected to the drive shaft, and the driven shaft is connected to the target cylinder 312. The first motor drives the drive shaft to rotate the belt cable and the driven shaft, and the driven shaft drives the target cylinder 312 to rotate. The drive end of the second motor is connected to the drive shaft, and the driven shaft is connected to the magnetic rod assembly 314. The second motor drives the drive shaft to rotate the belt and the driven shaft, which in turn drives the magnetic rod assembly 314 to rotate within the target cylinder 312. The second motor precisely controls the dwell time of the magnetic rod assembly 314 at various angles, achieving a certain range of left-right oscillation within the target cylinder 312, ensuring uniform film thickness across the entire substrate. The film thickness can also be adjusted by controlling the deposition time. Different film layers can be deposited by using target cylinders 312 made of different materials. Figure 4 and Figure 5 As shown, the 314 oscillating magnetic rod assembly technology breaks through the limitations of traditional fixed magnetic fields, improving the coating uniformity to ±3%, achieving uniform film deposition, and enhancing product quality. The use of multiple rotating cathode mechanisms arranged perpendicular to the transmission direction and at equal intervals further improves the coating uniformity.

[0035] like Figure 1As shown, in one embodiment, the inlet conversion chamber 1 of the four-chamber magnetron sputtering static coating equipment is equipped with a first vacuum pumping device 11, which is used to convert the atmospheric environment into a rough vacuum environment. The first vacuum pumping device 11, the second vacuum pumping device 21, and the third vacuum pumping device 41 all include components such as a vacuum pump, vacuum pipes, vacuum valves, vacuum gauges, and vacuum connectors. The first vacuum pumping device 11 rapidly reduces the chamber pressure from atmospheric pressure to a rough vacuum environment, providing a buffer for the subsequent transition heating chamber 2, avoiding sudden pressure changes caused by directly pumping to a high vacuum, and reducing thermal / mechanical stress on the substrate or equipment. The rough vacuum stage can initially remove a large number of gas molecules, reducing the subsequent high vacuum pumping load and improving process efficiency. In the multi-chamber design, the independent vacuum pumping design of the inlet conversion chamber 1 allows for continuous wafer feeding. While the current substrate is in the transition heating chamber 2, the next substrate can be pre-vacuumed in the inlet conversion chamber 1, shortening the overall cycle time and increasing production capacity. This setup not only improves the stability of the coating process but also optimizes the production cycle and increases production efficiency.

[0036] like Figure 1 As shown, in one embodiment, a second vacuum pumping device 21 is provided in the transition heating chamber 2 of the four-chamber magnetron sputtering static coating equipment. The second vacuum pumping device 21 is used to convert the rough vacuum environment into a high vacuum environment. The second vacuum pumping device 21 further pumps the rough vacuum environment to a high vacuum environment, forming a staged pumping system with the first vacuum pumping device 11 in the inlet conversion chamber 1. This avoids the efficiency loss of a single pump group directly pumping from atmospheric pressure to high vacuum and shortens the pumping time. The high vacuum environment significantly reduces the partial pressure of impurities such as water vapor and oxygen in the chamber, providing a clean environment for sputtering coating and reducing film defects. In the multi-chamber design, the independent high vacuum pumping of the transition heating chamber 2 allows for parallel processing. While one substrate is being coated in the sputtering chamber, the next substrate has already completed high vacuum preparation in the transition heating chamber 2, significantly improving equipment efficiency. This setup solves the problems of low vacuum pumping efficiency, insufficient film purity, and poor process continuity in traditional static coating equipment, making it suitable for high-precision, high-volume coating scenarios.

[0037] like Figure 1 As shown, in one embodiment, a heating device 22 is provided in the transition heating chamber 2 of the four-chamber magnetron sputtering static coating equipment. The heating device 22 is used to preheat the substrate. The heating temperature of the substrate by the heating device 22 can be set as needed. This heating device 22 significantly improves the quality and efficiency of substrate coating through surface activation, thermal stress control, and process stability.

[0038] like Figure 1As shown, in one embodiment, the transition heating chamber 2 of the four-chamber magnetron sputtering static coating equipment is further equipped with a temperature control system 23, which is used to control the temperature of the substrate. This temperature control system 23 enables precise temperature control of the substrate, keeping the control error within ±5℃, thus ensuring the quality of subsequent coating.

[0039] like Figure 1 As shown, in one embodiment, a third vacuum device 41 is provided in the outlet conversion chamber 4 of the four-chamber magnetron sputtering static coating equipment. The third vacuum device 41 is used to convert the vacuum environment in the outlet conversion chamber 4 into an atmospheric environment. Inert gas is slowly injected through the third vacuum device 41 to avoid sudden pressure changes caused by direct exposure of the high vacuum chamber to the atmosphere, thus preventing microcracks in the film layer due to stress impact. Active evacuation and inflation through the third vacuum device 41 create an airflow direction from the outlet chamber outwards, preventing water vapor and dust in the atmosphere from re-entering the coating core area, protecting the cleanliness of the sputtering target and the chamber. When the outlet conversion chamber 4 independently completes the depressurization process, the other chambers can maintain a vacuum working environment, enabling parallel processing of multiple substrates. This setup not only improves the environmental conversion efficiency but also ensures the integrity of the substrate coating, thereby increasing production efficiency.

[0040] like Figure 1 As shown, in one embodiment, the outlet conversion chamber 4 of the four-chamber magnetron sputtering static coating equipment is equipped with a gas filling device 42, which is used to accelerate the conversion of the vacuum environment to an atmospheric environment. This arrangement can quickly convert the vacuum environment of the chamber into an atmospheric environment, improving the conversion efficiency of the chamber environment.

[0041] like Figure 1 As shown, in one embodiment, the four-chamber magnetron sputtering static coating equipment further includes a conveying mechanism 5 for transporting the substrate. The conveying mechanism 5 passes through the inlet conversion chamber 1, the transition heating chamber 2, several static coating chambers 3, and the outlet conversion chamber 4. The conveying mechanism 5 is used for transporting and positioning the substrate. The substrate is placed horizontally on the conveying mechanism 5, which drives the substrate to pass sequentially through the inlet conversion chamber 1, the transition heating chamber 2, the static coating chambers 3, and the outlet conversion chamber 4. When the substrate passes through the static coating chamber 3, the conveying mechanism 5 stops for 10 seconds, allowing multiple rotating cathode mechanisms 31 to perform omnidirectional film deposition on the static substrate. The conveying mechanism 5, in conjunction with the multiple rotating cathode mechanisms 31, achieves uniform coating operation on the substrate.

[0042] like Figure 1 As shown, a four-chamber magnetron sputtering static coating method is used, employing the aforementioned four-chamber magnetron sputtering static coating equipment. The coating steps are as follows:

[0043] Step 1: The substrate flows into the inlet conversion chamber 1 along with the conveying mechanism 5. The first vacuum pumping device 11 in the inlet conversion chamber 1 converts the substrate from an atmospheric environment to a rough vacuum environment.

[0044] Step 2: The substrate then flows into the transition heating chamber 2 along with the conveying mechanism 5. The second vacuum pumping device 21 of the transition heating chamber 2 converts the substrate from a rough vacuum environment to a high vacuum environment. At the same time, the heating device 22 of the transition heating chamber 2 preheats the substrate, and the temperature control system 23 monitors the temperature of the substrate.

[0045] Step 3: The substrate then flows into the static coating chamber 3 along with the conveying mechanism 5. The conveying mechanism 5 stops flowing, so that the substrate is statically located in the static coating chamber 3. Multiple rotating cathode mechanisms 31 in the static coating chamber 3 simultaneously perform coating operations on the static substrate.

[0046] Step 4: After the coating is completed, the substrate flows into the outlet conversion chamber 4 along with the conveying mechanism 5. The third vacuum device 41 in the outlet conversion chamber 4 performs vacuum breaking treatment on the substrate, so that the vacuum environment is converted into an atmospheric environment. The substrate flows out of the coating equipment, and the operation is completed.

[0047] The above-mentioned coating method not only improves production efficiency, but also improves the uniformity of coating.

[0048] Figure 4 and Figure 5 In this context, Simulation Position refers to the position coordinates of the substrate in three-dimensional space in millimeters, Cathode refers to the cathode, and Sum refers to the total amount of coated cathodes.

[0049] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A four-chamber magnetron sputter static coating apparatus, characterized in that, Along the substrate transport direction, it includes an inlet conversion cavity (1), a transition heating cavity (2), several static coating cavities (3) and an outlet conversion cavity (4). The static coating cavity (3) is provided with multiple rotating cathode mechanisms (31) for magnetron sputtering coating of a stationary substrate. The rotating cathode mechanism (31) includes a second rotating drive mechanism (313) and a magnetic rod assembly (314). The drive end of the second rotating drive mechanism (313) is connected to the magnetic rod assembly (314) through a second transmission assembly (316).

2. The four-chambered magnetron sputter static coating apparatus according to claim 1, characterized in that The plurality of rotating cathode mechanisms (31) are arranged perpendicular to the transmission direction and at equal intervals. Each rotating cathode mechanism (31) includes a first rotating drive mechanism (311) and a target cylinder (312). The drive end of the first rotating drive mechanism (311) is connected to the target cylinder (312) through a first transmission assembly (315). The magnetic rod assembly (314) is installed inside the target cylinder (312). The second rotating drive mechanism (313) is used to drive the magnetic rod assembly (314) to rotate inside the target cylinder (312).

3. The four-chambered magnetron sputter static coating apparatus according to claim 1, characterized in that The inlet conversion chamber (1) is equipped with a first vacuum pumping device (11), which is used to convert the atmospheric environment into a rough vacuum environment.

4. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, The transition heating chamber (2) is equipped with a second vacuum pumping device (21), which is used to convert the rough vacuum environment into a high vacuum environment.

5. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, The transition heating chamber (2) is equipped with a heating device (22), which is used to preheat the substrate.

6. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, The transition heating chamber (2) is also equipped with a temperature control system (23), which is used to control the temperature of the substrate.

7. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, The outlet conversion chamber (4) is equipped with a third vacuum pumping device (41), which is used to convert the vacuum environment in the outlet conversion chamber (4) into an atmospheric environment.

8. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, An inflation device (42) is provided inside the outlet conversion chamber (4). The inflation device (42) is used to accelerate the conversion of the vacuum environment into an atmospheric environment.

9. The four-chambered magnetron sputter static coating apparatus of claim 1, wherein, It also includes a conveying mechanism (5) for transporting the substrate. The conveying mechanism (5) passes through the inlet conversion chamber (1), the transition heating chamber (2), several static coating chambers (3) and the outlet conversion chamber (4). The conveying mechanism (5) is used to transport and position the substrate. The second rotary drive mechanism (313) is a second motor.

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