Computer motherboard insulating sheet

By designing symmetrical grooves and raised structures on the insulating sheet, the applicability problem caused by the fixed size of the insulating sheet is solved, and the heat dissipation performance is improved to meet the needs of different motherboard sizes.

CN224417567UActive Publication Date: 2026-06-26DONGGUAN QIANYU ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN QIANYU ELECTRONICS CO LTD
Filing Date
2025-05-28
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

The current size of the insulating sheet on computer motherboards is fixed, which cannot effectively protect the motherboard when the size is mismatched and results in poor heat dissipation.

Method used

Several symmetrical first grooves are made on the front and back of the insulating sheet, and protrusions and groove structures are set on the surface to adjust the size of the insulating sheet according to the motherboard size, while increasing the contact area to improve the heat dissipation effect.

Benefits of technology

This improves the applicability and heat dissipation of the insulating sheet, adapting to the needs of different motherboard sizes while maintaining electrical performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of insulating sheet, especially involves computer mainboard insulating sheet, it has positive and back, positive and back all are set up with a plurality of first grooves, every positive first groove is set up with corresponding and same position and extension direction one first groove in back, the thickness of insulating sheet is 0.3mm-0.5mm, the depth of first groove is 0.1mm-0.15mm, first groove is square strip structure, the surface of insulating sheet is set up with a plurality of second grooves, a plurality of second grooves are used to increase the contact area of insulating sheet and outside, the inside of second groove is set up with a plurality of third grooves, the application is set up with a plurality of first grooves on the surface of two opposite faces of insulating sheet, and a plurality of first grooves are oppositely arranged, and the user can tear a small part of the insulating sheet along the symmetrically arranged first grooves, so that the size of the insulating sheet and the size of the computer mainboard are more matched, and the applicability of the insulating sheet is improved.
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Description

Technical Field

[0001] This utility model belongs to the field of insulating sheet technology, and in particular relates to insulating sheets for computer motherboards. Background Technology

[0002] The insulating sheet on the computer motherboard is a material used for electrical insulation. Its main functions are to prevent short circuits, avoid interference between electrical components, and protect the motherboard's circuitry from damage.

[0003] For example, Chinese patent CN214335622U discloses a scratch-resistant insulating sheet for laptops. The device allows workers to place the insulating sheet on the computer motherboard by pinching the rubber layer with their hands, protecting the edges of the insulating sheet from scratches. A silicone protective film protects the front of the insulating sheet from scratches during the worker's handling and installation process.

[0004] The size of the insulating sheet mentioned in the patent is fixed and cannot be changed. When the size of the computer motherboard is larger than the insulating sheet, the insulating sheet cannot completely cover and protect it. When the size of the computer motherboard is smaller than the insulating sheet, the insulating sheet is inconvenient to install, which reduces the applicability of the insulating sheet. Utility Model Content

[0005] The purpose of this utility model is to provide an insulating sheet for computer motherboards to solve the problems mentioned in the background art. It has a front and a back, and both the front and the back are provided with a number of first grooves. Each first groove on the front has a corresponding first groove on the back with the same position and extension direction.

[0006] Preferably, the thickness of the insulating sheet is 0.3mm-0.5mm.

[0007] Preferably, the depth of the first groove is 0.1mm-0.15mm.

[0008] Preferably, the first groove is a square strip structure.

[0009] Preferably, the surface of the insulating sheet is provided with a plurality of second grooves, the depth of which is less than that of the insulating sheet.

[0010] Preferably, the interior of the second groove is provided with a plurality of third grooves, which are formed on the inner wall of the second groove in the circumferential direction.

[0011] Preferably, the surface of the insulating sheet is provided with a plurality of protrusions, the thickness of which does not exceed 0.1 mm.

[0012] Preferably, the protrusion has a plurality of fourth grooves inside, and the plurality of fourth grooves are formed on the outer wall of the protrusion in the circumferential direction.

[0013] Preferably, the plurality of fourth slots are internally interconnected.

[0014] Preferably, the fourth groove is a circular hole structure.

[0015] This application creates several first grooves on the surfaces of two opposite sides of an insulating sheet and arranges these first grooves in pairs. This allows users to tear off small portions of the insulating sheet along the symmetrically arranged first grooves, thereby making the size of the insulating sheet more compatible with the size of the computer motherboard and improving the applicability of the insulating sheet. Attached Figure Description

[0016] Figure 1 This is an axial view of the present invention;

[0017] Figure 2 This is a raised sectional view of the present invention;

[0018] Figure 3 This is a cross-sectional view of the insulating sheet of this utility model;

[0019] Figure 4 This is a structural diagram of the first groove of this utility model;

[0020] Figure 5 This is a structural diagram of the second groove of this utility model;

[0021] Figure 6 This is a diagram of the protruding structure of this utility model.

[0022] The markings in the diagram are as follows:

[0023] 100, Insulating sheet; 110, First groove; 120, Second groove; 121, Third groove; 130, Protrusion; 131, Fourth groove. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0025] To address the issue of fixed and unchangeable insulating sheet dimensions, this embodiment provides an insulating sheet for a computer motherboard, such as... Figure 1 and Figure 4As shown, the insulating sheet 100 has a rectangular structure, with two rectangular pieces symmetrically arranged along its edge. The two rectangular pieces are identical in position and direction of extension. Each rectangular piece has two circular holes for connection between the insulating sheet 100 and the computer host. The insulating sheet 100 has a thickness of 0.3mm-0.5mm and can be made of materials such as polyester film or polytetrafluoroethylene (PTFE) film. The insulating sheet 100 has a front and a back side, both of which have several first grooves 110. Each first groove 110 on the front side is located on the back side. Each surface is provided with a first groove 110 corresponding to it and in the same position and direction of extension. The depth of the first groove 110 is 0.1mm-0.15mm. The first groove 110 is a square strip structure. By setting the first groove 110, on the one hand, the contact area between the insulating sheet 100 and the outside world can be increased, thereby increasing the heat dissipation effect of the insulating sheet 100. On the other hand, when the size of the insulating sheet does not match the size of the computer motherboard, the user can tear off a small part of the insulating sheet along the symmetrically set first groove 110, thereby making the size of the insulating sheet more compatible with the size of the computer motherboard and improving the applicability of the insulating sheet.

[0026] It is important to emphasize that the distance between the first groove 110 on the front and back sides must not be less than 0.1mm. If it is less than 0.1mm, it will affect the anti-electric and heat insulation effects of the insulating sheet 100.

[0027] To improve the heat dissipation effect of the insulating sheet 100, further solutions include, for example... Figure 3 As shown, the surface of the insulating sheet 100 is provided with a plurality of second grooves 120. The depth of the plurality of second grooves 120 is less than that of the insulating sheet 100. The second grooves 120 are circular groove structures. The plurality of second grooves 120 are used to increase the contact area between the insulating sheet 100 and the outside world, thereby improving the heat dissipation effect of the insulating sheet 100.

[0028] To improve the heat dissipation effect of the insulating sheet 100, further solutions include, for example... Figure 5 As shown, four third grooves 121 are provided inside the second groove 120. The third groove 121 is a circular hole-shaped groove. The four third grooves 121 are evenly opened on the inner wall of the second groove 120 in the circumferential direction. The depth of the third groove 121 is less than 0.1 mm. If the depth of the third groove 121 is too large, the heat will not be able to be dissipated in time. The plurality of third grooves 121 are used to increase the contact area between the insulating sheet 100 and the outside world, thereby improving the heat dissipation effect of the insulating sheet 100.

[0029] It is important to emphasize that the thickness of the insulating sheet 100 minus the thickness of the second groove 120 must not be less than 0.1mm. If it is less than 0.1mm, it will affect the anti-electric and heat insulation effects of the insulating sheet 100.

[0030] To improve the heat dissipation effect of the insulating sheet 100, further solutions include, for example... Figure 2 As shown, the surface of the insulating sheet 100 is provided with a plurality of protrusions 130, which are circular in shape. The plurality of protrusions 130 are used to increase the contact area between the insulating sheet 100 and the outside world, thereby improving the heat dissipation effect of the insulating sheet 100.

[0031] To improve the heat dissipation effect of the insulating sheet 100, further solutions include, for example... Figure 6 As shown, the protrusion 130 has four fourth grooves 131 inside. The fourth grooves 131 are circular holes. The fourth grooves 131 are interconnected, so that heat has more outlet options. The four fourth grooves 131 are evenly opened on the outer wall of the protrusion 130 in the circumferential direction. The fourth grooves 131 are used to increase the contact area between the insulating sheet 100 and the outside world, thereby improving the heat dissipation effect of the insulating sheet 100.

[0032] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A computer motherboard insulating sheet having a front surface and a back surface, characterized by, Both the front and back sides are provided with a number of first slots (110), and each first slot (110) on the front side is provided with a corresponding first slot (110) on the back side, which is in the same position and in the same direction of extension.

2. The computer motherboard insulating sheet according to claim 1, characterized in that, The thickness of the insulating sheet (100) is 0.3mm-0.5mm.

3. The computer motherboard insulating sheet according to claim 1, characterized in that, The depth of the first groove (110) is 0.1mm-0.15mm.

4. The computer motherboard insulating sheet according to claim 1, characterized in that, The first groove (110) is a square strip structure.

5. The computer motherboard insulating sheet according to claim 1, characterized in that, The surface of the insulating sheet (100) is provided with a plurality of second grooves (120), the depth of which is less than that of the insulating sheet (100).

6. The computer motherboard insulating sheet according to claim 5, characterized in that, The second groove (120) has a plurality of third grooves (121) inside, and the plurality of third grooves (121) are formed on the inner wall of the second groove (120) in the circumferential direction.

7. The computer motherboard insulating sheet according to claim 1, characterized in that, The surface of the insulating sheet (100) is provided with a plurality of protrusions (130), the thickness of which does not exceed 0.1 mm.

8. The computer motherboard insulating sheet according to claim 7, characterized in that, The protrusion (130) has a plurality of fourth grooves (131) inside, and the plurality of fourth grooves (131) are formed on the outer wall of the protrusion (130) in the circumferential direction.

9. The computer motherboard insulating sheet according to claim 8, characterized in that, The plurality of fourth slots (131) are internally connected.

10. The computer motherboard insulating sheet according to claim 8, characterized in that, The fourth groove (131) is a circular hole structure.