A copper diffusion mechanism and a thermal compression bonding apparatus

Abstract

The utility model relates to the technical field of bonding equipment provides a copper diffusion mechanism, including pressure mechanism and bearing cavity, the pressure plate of pressure mechanism sets up the top of bearing cavity, a plurality of pressure head posts of pressure plate sets up the lower part of pressure plate. Good contact is favorable to copper atom under the action of pressure more smoothly diffuses, improves the effect and consistency of diffusion.

Description

Technical Field

[0001] This utility model relates to the field of bonding equipment technology, and in particular to a copper diffusion mechanism and a hot-press bonding device. Background Technology

[0002] Hot-press bonding is a solid-state bonding process that combines heat and force to cause plastic deformation between two thin sheets, forming a clean surface in close contact.

[0003] In existing technologies, dozens or even more chips are accurately placed on an intermediate carrier such as a substrate, where solder is applied to the corresponding chip placement positions. All chips are then packaged together and placed in a reflow oven, heated to a temperature that melts the solder to complete bonding, and then subsequent steps are performed, such as removing flux residue and underfilling.

[0004] Existing hot-press bonding technology lacks a copper diffusion mechanism. Summary of the Invention

[0005] This invention provides a copper diffusion mechanism to solve the problem that hot-press bonding in the prior art does not have a copper diffusion mechanism.

[0006] A copper diffusion mechanism includes a pressure applying mechanism and a supporting cavity; the pressure applying plate of the pressure applying mechanism is disposed above the supporting cavity, and a plurality of pressure head columns of the pressure applying plate are disposed at the lower part of the pressure applying plate.

[0007] According to the copper diffusion mechanism of this utility model, the pressure applying mechanism further includes at least one horizontal guide rail and at least one horizontal slider. The horizontal guide rail is disposed on both sides of the pressure plate, the horizontal slider is disposed on the horizontal guide rail, the pressure plate is disposed on the lifting mechanism, and the lifting mechanism is disposed on the horizontal slider.

[0008] According to the copper diffusion mechanism of this utility model, the pressure applying mechanism further includes at least one horizontal guide rail and at least one horizontal slider. The horizontal guide rail is disposed on both sides of the pressure plate, the horizontal slider is disposed on the horizontal guide rail, the pressure plate is disposed on the lifting mechanism, and the lifting mechanism is disposed on the horizontal slider.

[0009] The copper diffusion mechanism according to this utility model further includes at least one first driving mechanism, which drives the horizontal slider to move.

[0010] According to the copper diffusion mechanism of this utility model, the lifting mechanism includes a fixed plate, a second driving mechanism and a driving shaft. The second driving mechanism is disposed on the fixed plate, the driving shaft drives the pressure plate to move up and down, and the second driving mechanism drives the driving shaft to move.

[0011] The copper diffusion mechanism according to this utility model further includes a vertical plate, a vertical guide rail, and a vertical slider; the vertical plate is disposed on both sides of the fixed plate, the vertical guide rail is disposed on the fixed plate, the vertical slider is disposed on the vertical guide rail, and the vertical plate is disposed on the vertical slider.

[0012] The copper diffusion mechanism according to this utility model also includes a limit sensor, which is disposed on the upper part of the fixed plate.

[0013] According to the copper diffusion mechanism of this utility model, the supporting cavity includes a cavity frame, a heating plate, a heating tube, and a cooling tube; the heating plate is disposed inside the supporting cavity, the cooling tube is embedded below the heating plate, and the heating tube is disposed below the cooling tube.

[0014] According to the copper diffusion mechanism of this utility model, the heating tube is an infrared heating tube.

[0015] A hot-press bonding apparatus includes the copper diffusion mechanism described above.

[0016] This invention precisely controls the heating plate temperature through a copper diffusion mechanism, ensuring copper diffusion on the wafer within a suitable temperature range. This guarantees effective diffusion while preventing damage to the wafer from excessive heat. The pressure head column applies stable pressure to the wafer, ensuring good contact between the wafer and related components during copper diffusion. This facilitates smoother diffusion of copper atoms under pressure, improving diffusion efficiency and consistency. The entire copper diffusion mechanism is compact and occupies little space. Its flexible position adjustment accommodates wafers of different sizes. The horizontal guide rail allows for easy adjustment of the pressure mechanism's position, ensuring the pressure head column accurately applies pressure to the appropriate location on the wafer, thus enhancing the equipment's versatility. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the copper diffusion mechanism;

[0019] Figure 2 A three-dimensional structural diagram of the pressure application mechanism. Figure 1 ;

[0020] Figure 3 A three-dimensional structural diagram of the pressure application mechanism. Figure 2 ;

[0021] Figure 4 This is a schematic diagram of the three-dimensional structure of a magnified view of part A.

[0022] Figure 5 This is a schematic diagram of the three-dimensional structure of a magnified view of part B.

[0023] Figure 6 This is a three-dimensional structural diagram of the supporting cavity;

[0024] Reference numerals: 1. Pressing mechanism; 2. Bearing cavity; 11. Pressing plate; 12. First driving mechanism; 13. Lifting mechanism; 14. Horizontal slider; 15. Horizontal guide rail; 21. Cavity frame; 22. Heating tube; 23. Cooling tube; 24. Heating plate; 111. Pressing plate body; 112. Press head column; 131. Vertical plate; 132. Vertical slider; 133. Fixing plate; 134. Limit sensor; 135. Second driving mechanism; 136. Drive shaft. Detailed Implementation

[0025] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0026] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0028] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] The following is combined with Figure 1-6 This invention describes a copper diffusion mechanism according to an embodiment of the present invention, comprising a pressure applying mechanism 1 and a supporting cavity 2; a pressure plate 11 of the pressure applying mechanism 1 is disposed above the supporting cavity 2, and a plurality of pressure head columns 112 of the pressure plate 11 are disposed below the pressure plate 11. That is, the pressure head columns 112 are disposed below the pressure plate body 111 of the pressure plate 11.

[0031] In some embodiments, the pressure applying mechanism 1 further includes at least one lifting mechanism 13, at least one horizontal guide rail 15 and at least one horizontal slider 14. The horizontal guide rail 15 is disposed on both sides of the pressure plate 11, the horizontal slider 14 is disposed on the horizontal guide rail 15, the pressure plate 11 is disposed on the lifting mechanism 13, and the lifting mechanism 13 is disposed on the horizontal slider 14.

[0032] In some embodiments, at least one first drive mechanism 12 is further included, which drives the horizontal slider 14 to move.

[0033] In some embodiments, the lifting mechanism 13 includes a fixed plate 133, a second driving mechanism 135 and a driving shaft 136. The second driving mechanism 135 is disposed on the fixed plate 133, and the driving shaft 136 drives the pressure plate 11 to move up and down. The second driving mechanism 135 drives the driving shaft 136 to move.

[0034] In some embodiments, the system further includes a vertical plate 131, a vertical guide rail, and a vertical slider 135; the vertical plate 131 is disposed on both sides of the fixed plate 133, the vertical guide rail is disposed on the fixed plate 133, the vertical slider 132 is disposed on the vertical guide rail, and the vertical plate 131 is disposed on the vertical slider 132.

[0035] In some embodiments, a limit sensor 134 is also included, which is disposed on the upper part of the fixed plate 133. The limit sensor 134 can limit the lifting height of the pressure plate.

[0036] In some embodiments, the support cavity 2 includes a cavity frame 21, a heating plate 24, a heating tube 22, and a cooling tube 23; the heating plate 24 is disposed inside the support cavity 2, and the cooling tube 23 is embedded below the heating plate 24, with the heating tube 24 positioned below the cooling tube 23. When a workpiece, such as a wafer, is placed on the heating plate, the pressure head column 112 applies pressure to the wafer for copper diffusion.

[0037] In some embodiments, the heating element 22 is an infrared heating element 22.

[0038] A hot-press bonding apparatus includes the aforementioned copper diffusion mechanism.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A copper diffusion mechanism characterized by, It includes a pressure applying mechanism and a bearing cavity; the pressure applying plate of the pressure applying mechanism is disposed above the bearing cavity, and a plurality of pressure head columns of the pressure applying plate are disposed at the lower part of the pressure applying plate. The pressure applying mechanism also includes at least one horizontal guide rail and at least one horizontal slider. The horizontal guide rail is disposed on both sides of the pressure applying plate, and the horizontal slider is disposed on the horizontal guide rail. The pressure applying plate is disposed on a lifting mechanism, and the lifting mechanism is disposed on the horizontal slider.

2. The copper diffusion mechanism according to claim 1, characterized in that, It also includes at least one first drive mechanism that drives the horizontal slider to move.

3. The copper diffusion mechanism according to claim 1, characterized in that, The lifting mechanism includes a fixed plate, a second drive mechanism, and a drive shaft. The second drive mechanism is disposed on the fixed plate, and the drive shaft drives the pressure plate to move up and down. The second drive mechanism drives the drive shaft to move.

4. The copper diffusion mechanism according to claim 3, characterized in that, It also includes a vertical plate, a vertical guide rail, and a vertical slider; the vertical plate is disposed on both sides of the fixed plate, the vertical guide rail is disposed on the fixed plate, the vertical slider is disposed on the vertical guide rail, and the vertical plate is disposed on the vertical slider.

5. The copper diffusion mechanism according to claim 4, characterized in that, It also includes a limit sensor, which is disposed on the upper part of the fixed plate.

6. The copper diffusion mechanism according to claim 1, characterized in that, The supporting cavity includes a cavity frame, a heating plate, a heating tube, and a cooling tube; the heating plate is disposed inside the supporting cavity, the cooling tube is embedded below the heating plate, and the heating tube is disposed below the cooling tube.

7. The copper diffusion mechanism according to claim 6, characterized in that, The heating element is an infrared heating element.

8. A hot-press bonding apparatus, characterized in that, The copper diffusion mechanism includes any one of claims 1 to 7.

Images