Rotary table mechanism for silicon wafer processing and laser sintering apparatus

Abstract

The utility model provides a kind of rotary table mechanism and laser sintering equipment for silicon wafer processing, wherein rotary table mechanism includes a plurality of for adsorbing and fixedly holding silicon wafer adsorption rotary table, a rotary table support for fixedly holding adsorption rotary table, a driving assembly for driving rotary table support rotation, and a vacuumizing assembly for carrying out vacuumizing to adsorption rotary table internal cavity, wherein adsorption rotary table is equipped with a plurality of adsorption parts, each adsorption part includes a suction hole and at least one gas groove located on the side of suction hole;The utility model can improve the uniformity of adsorption, thereby reduce the risk that silicon wafer is broken due to local excessive stress in processing process, or processing error caused by the displacement of silicon wafer relative to adsorption rotary table when rotating due to uneven stress.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic cell technology, and more specifically, it relates to a turntable mechanism and laser sintering equipment for silicon wafer processing. Background Technology

[0002] In the production process of solar cells, silicon wafers undergo laser sintering. This crucial step has a significant impact on the quality of the silicon wafers and the performance of the subsequent solar cells. Currently, common laser sintering equipment is typically equipped with a turntable mechanism to automate the flow of silicon wafers between multiple stations. However, existing turntable mechanisms have some design shortcomings. For example, adsorption turntables usually adsorb and fix silicon wafers by creating circular micropores, but during processing, the silicon wafers may crack due to localized high stress, leading to a decrease in wafer processing yield and increased production costs.

[0003] Therefore, improving the quality of silicon wafer processing has become an urgent problem to be solved in the industry. Utility Model Content

[0004] The present invention aims to provide a turntable mechanism and laser sintering equipment for silicon wafer processing, so as to solve the problem that silicon wafers may crack due to excessive local stress in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] This utility model provides a turntable mechanism for silicon wafer processing, including multiple adsorption turntables for adsorbing and fixing silicon wafers, a turntable support for fixing the adsorption turntables, a drive assembly for driving the turntable support to rotate, and a vacuum assembly for evacuating the internal cavity of the adsorption turntables. The adsorption turntables are provided with multiple adsorption parts, each adsorption part including an air suction hole and at least one air groove located next to the air suction hole.

[0007] Furthermore, the adsorption section includes a first air groove and a second air groove arranged symmetrically about the air intake hole.

[0008] Furthermore, both the first and second air grooves are elongated grooves.

[0009] Furthermore, the adsorption turntable has multiple through holes to assist in breaking the vacuum.

[0010] Furthermore, the turntable support includes a support body and multiple mounting brackets arranged around the support body, wherein the support body is connected to the drive assembly, and the mounting brackets are respectively connected to the corresponding adsorption turntable and the support body.

[0011] Furthermore, the mounting bracket is connected to the corresponding adsorption turntable by several bolts.

[0012] Furthermore, the bolts are equipped with insulating retaining blocks to prevent current from being transmitted to the adsorption turntable.

[0013] Furthermore, the drive assembly includes a motor and a mounting component, wherein the motor's shaft passes through the mounting component and is connected to the turntable bracket, and the motor is fixed to the worktable surface by the mounting component.

[0014] Furthermore, a zero-point positioning component is provided between the mounting component and the turntable bracket. The zero-point positioning component includes a photoelectric bracket, a photoelectric sensor, and a light-shielding plate. The photoelectric sensor is fixed to the mounting component through the photoelectric bracket, and the light-shielding plate is installed on the turntable bracket and cooperates with the photoelectric sensor for positioning.

[0015] This utility model also provides a laser sintering equipment for laser sintering silicon wafers. The laser sintering equipment includes a turntable mechanism for realizing the transfer of silicon wafers between the loading station, the unloading station and the laser sintering station. The turntable mechanism adopts the turntable mechanism for silicon wafer processing as described above.

[0016] Compared with existing technologies, the advantages of the turntable mechanism and laser sintering equipment for silicon wafer processing provided by this invention are as follows: In the design of the adsorption turntable, each adsorption section is equipped with an air suction hole and at least one air groove, with the air groove located beside the air suction hole. This design can improve the uniformity of adsorption, thereby reducing the risk of silicon wafers breaking due to excessive local stress during processing, or the processing errors caused by the silicon wafers shifting relative to the adsorption turntable due to uneven stress. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional schematic diagram of the turntable mechanism provided in a preferred embodiment of this utility model;

[0019] Figure 2 An assembly diagram of the adsorption turntable and the turntable support provided for a preferred embodiment of this utility model;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 A top view of the turntable mechanism provided in a preferred embodiment of this utility model;

[0022] Figure 5 A top view of a laser sintering apparatus provided in a preferred embodiment of this utility model;

[0023] The main markings in the attached figures are as follows:

[0024] 1. Adsorption turntable; 11. Adsorption section; 12. Through hole; 111. Suction hole; 112. Air groove; 1121. First air groove; 1122. Second air groove;

[0025] 2. Turntable bracket; 21. Support body; 22. Mounting bracket; 23. Bolts;

[0026] 31. Motor; 32. Mounting components; 321. Mounting square plate; 322. Mounting sleeve; 323. Sealing plate;

[0027] 41. Photoelectric mounting plate; 42. Photoelectric limiting block; 43. Light shield;

[0028] 50. Garland sleeve; 51. Air pipe clamp; 52. Vacuum generator; 53. Generator mounting plate; 54. Pressure regulating valve; 55. Valve mounting plate; 56. Rotary joint adapter; 57. Joint mounting plate; 58. Joint connecting plate; 59. Fixed sheet metal;

[0029] 100. Turntable mechanism; 601. Loading docking section; 602. Swing arm loading assembly; 603. Whole piece assembly; 605. Laser sintering assembly; 606. Swing arm unloading assembly; 607. Unloading rejection box; 608. Unloading docking section; 609. Rejection station; 610. Temporary storage station; 611. Whole piece station; 612. Loading station; 613. First laser sintering station; 614. Second laser sintering station; 615. Unloading station. Detailed Implementation

[0030] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0031] Please refer to the following: Figures 1 to 3A preferred embodiment of the present invention provides a turntable mechanism 100 for silicon wafer processing. The turntable mechanism 100 includes a plurality of adsorption turntables 1 for adsorbing and fixing silicon wafers, a turntable support 2 for fixing the adsorption turntables 1, a drive assembly for driving the turntable support 2 to rotate, and a vacuum assembly for evacuating the internal cavity of the adsorption turntables 1. The adsorption turntables 1 are provided with a plurality of adsorption parts 11, each adsorption part 11 including an air suction hole 111 and at least one air groove 112 located next to the air suction hole 111.

[0032] In the design of the adsorption turntable 1, this invention equips each adsorption section 11 with an air intake 111 and at least one air groove 112. The air groove 112 is located beside the air intake 111, effectively dispersing the airflow around the air intake 111, thereby forming a more uniform negative pressure area and reducing local stress concentration. This design improves the uniformity of adsorption, thereby reducing the risk of silicon wafers breaking due to excessive local stress during processing, or processing errors caused by displacement of the silicon wafer relative to the adsorption turntable 1 due to uneven stress. Compared with the prior art, the turntable mechanism 100 of this invention not only improves the yield of silicon wafer processing, but also effectively reduces the increase in production costs caused by silicon wafer damage. In addition, this design requires minimal modification to the adsorption turntable 1, only requiring the addition of air grooves 112 to the existing adsorption turntable 1, without the need for large-scale modification of the turntable mechanism 100, thus reducing production costs and manufacturing difficulty. This is of great significance for improving production efficiency and economic benefits.

[0033] It should be noted that the adsorption turntable 1 can be made of copper, and the number, shape, and size of the adsorption turntable 1 can be adjusted according to actual needs. In the preferred embodiment of this utility model, a turntable mechanism 100 containing four rectangular adsorption turntables 1 is used as an example for explanation. Each adsorption turntable 1 is formed by a lower plate and an upper plate together enclosing a cavity, wherein the lower plate and the upper plate are firmly connected by a number of screws or bolts 23 and other fasteners. The upper plate is provided with an adsorption part 11, while the lower plate is connected to the turntable support 2.

[0034] In the preferred embodiment of this utility model, such as Figure 3 As shown, the adsorption section 11 includes a first air groove 1121 and a second air groove 1122 arranged symmetrically about the air intake hole 111.

[0035] This invention further enhances the stability of the silicon wafer on the adsorption turntable 1 through the symmetrical arrangement of the first air groove 1121 and the second air groove 1122. This symmetrical design not only ensures that the silicon wafer is evenly stressed when subjected to adsorption force, reducing the risk of deformation and breakage caused by uneven stress, but also improves the stability of the silicon wafer as it rotates with the adsorption turntable 1, effectively preventing the silicon wafer from falling off or shifting during processing, thereby further improving the precision and reliability of silicon wafer processing. Of course, in other optional embodiments, the adsorption part 11 includes an annular air groove 112 surrounding the suction hole 111 to improve the uniformity of adsorption.

[0036] In the preferred embodiment of this utility model, such as Figure 3 As shown, both the first air groove 1121 and the second air groove 1122 are elongated grooves. It should be understood that the depth, length, and width of the first air groove 1121 and the second air groove 1122 can be adjusted according to actual needs to optimize the adsorption effect. The turntable mechanism 100 of this invention exhibits higher stability and reliability when processing silicon wafers, providing a strong guarantee for the processing of high-quality silicon wafers.

[0037] In a preferred embodiment of this utility model, such as Figure 2 As shown, the adsorption turntable 1 has multiple through holes 12, which are used to assist in breaking the vacuum. It should be understood that the shape, size, and number of through holes 12 can be adjusted according to actual needs. The preferred number of through holes 12 is four. By creating multiple through holes 12 on the adsorption turntable 1, the speed of breaking the vacuum after silicon wafer processing can be accelerated, thereby improving production efficiency.

[0038] In a preferred embodiment of this utility model, such as Figure 1 As shown, the turntable support 2 mainly consists of a support body 21 and multiple mounting brackets 22 arranged around the body. The support body 21 is connected to the drive assembly, while each mounting bracket 22 is connected to the corresponding adsorption turntable 1 and the support body 21. Preferably, there are four mounting brackets 22, each fixed to the corresponding adsorption turntable 1 by three bolts 23. This fixing method not only facilitates loading and unloading but also reduces the requirements for the machining accuracy of the mounting brackets 22. Furthermore, each bolt 23 is equipped with an insulating fixing block to prevent current from being transmitted to the adsorption turntable 1, thereby effectively improving the machining accuracy of the silicon wafer.

[0039] In a preferred embodiment of this utility model, such as Figure 1As shown, the drive assembly mainly consists of a motor 31 and a mounting component 32. The motor 31's shaft is connected to the turntable bracket 2. The motor 31 is securely fixed to the worktable surface via the mounting component 32. It should be noted that the mounting component 32 mainly consists of stacked mounting plates 321 and mounting sleeves 322. Furthermore, as... Figure 4 As shown, the mounting component 32 also includes a sealing plate 323 for sealing the motor 31 to prevent foreign objects from entering.

[0040] In a preferred embodiment of this utility model, such as Figure 1 As shown, a zero-point positioning assembly is provided between the mounting component 32 and the turntable bracket 2. This zero-point positioning assembly includes a photoelectric bracket, a photoelectric sensor, and a light-shielding plate 43. The photoelectric sensor is fixed to the mounting component 32 via the photoelectric bracket, while the light-shielding plate 43 is mounted on the turntable bracket 2 and works in conjunction with the photoelectric sensor for positioning the zero point of the motor 31 in the drive assembly. It should be noted that the photoelectric bracket mainly consists of two parts: a photoelectric mounting plate 41 and a photoelectric limiting block 42, which are interconnected. The photoelectric mounting plate 41 is fixed to the mounting square plate 321, while the photoelectric limiting block 42 is installed at the end of the photoelectric mounting plate 41 furthest from the mounting square plate 321.

[0041] In a preferred embodiment of this utility model, such as Figure 1 As shown, the vacuum assembly mainly consists of a series of key components, including but not limited to connecting air pipes, a garland sleeve 50, an air pipe pressure plate 51, a vacuum generator 52, a generator mounting plate 53, a pressure regulating valve 54, a valve mounting plate 55, a rotary joint (including a rotary joint adapter 56), a joint mounting plate 57, a joint connecting plate 58, and a fixing sheet metal 59. These components work together to achieve the vacuum function. Specifically, the vacuum generator 52 and the pressure regulating valve 54 are fixed to the bottom of the mounting component 32 via the generator mounting plate 53 and the valve mounting plate 55, respectively. The vacuum generator 52, the pressure regulating valve 54, the rotary joint, the connecting air pipe, and the adsorption turntable 1 are interconnected to form a complete vacuum system. When the turntable mechanism 100 is working, the motor 31 drives the four adsorption turntables 1 to rotate, while the vacuum generator 52 provides the necessary suction force to the adsorption turntables 1, ensuring that the silicon wafers can be firmly adsorbed onto the adsorption turntables 1, thereby ensuring the stability and accuracy of the silicon wafers during processing.

[0042] Please refer to the following: Figure 5A preferred embodiment of this utility model also provides a laser sintering device for silicon wafer laser sintering processing. This laser sintering device includes a turntable mechanism 100 for transferring silicon wafers between the loading station 612, the unloading station 615, and the laser sintering station. The turntable mechanism 100 adopts the aforementioned design for silicon wafer processing, which will not be repeated here. Its main advantage lies in improving the uniformity of adsorption, thereby reducing the risk of silicon wafer breakage due to excessive localized force during processing, and reducing processing errors caused by displacement of the silicon wafer relative to the adsorption turntable 1 due to uneven force. The design and construction of this turntable mechanism 100 are optimized for precise silicon wafer processing, ensuring the efficiency and accuracy of the laser sintering process.

[0043] To provide a clearer understanding, the overall structure of the laser sintering equipment will be described in detail below.

[0044] In a preferred embodiment of this utility model, such as Figure 5 As shown, the laser sintering equipment consists of several key components, including but not limited to: a loading docking section 601, a swing arm loading assembly 602, a whole-piece assembly 603, a turntable mechanism 100, a laser sintering assembly 605, a swing arm unloading assembly 606, an unloading rejection box 607, and an unloading docking section 608. In addition, the equipment also includes a rejection station 609, a temporary storage station 610, a whole-piece assembly station 611, a loading station 612, a first laser sintering station 613, a second laser sintering station 614, and an unloading station 615. Each component plays an indispensable role, working together to ensure the smoothness and efficiency of the laser sintering process.

[0045] Among them, such as Figures 1 to 4As shown, the turntable mechanism 100 consists of four adsorption turntables 1, enabling the transfer of silicon wafers between the loading station 612, the first laser sintering station 613, the second laser sintering station 614, and the unloading station 615. Taking a single adsorption turntable 1 as an example, during the operation of the turntable mechanism 100, when the adsorption turntable 1 is located at the loading station 612, the vacuum component is activated, causing the adsorption part 11 of the adsorption turntable 1 to generate suction, thereby adsorbing and fixing the silicon wafer, completing the loading. Subsequently, the motor 31 drives the turntable support 2 to rotate 90° each time, moving the silicon wafer to the next station. After two laser sintering processes, the silicon wafer reaches the unloading station 615 for unloading. During unloading, the vacuum component is turned off, the adsorption part 11 of the adsorption turntable 1 stops suction, and the through hole 12 of the adsorption turntable 1 breaks the vacuum on the silicon wafer. Then, the suction cup on the robotic arm picks up the sintered silicon wafer, completing the unloading. Subsequently, motor 31 drives the turntable support 2 to rotate 90° again, returning it to the loading station 612 to begin a new round of loading. The overall process is: loading - laser sintering 1 - laser sintering 2 - unloading. In actual operation, the four adsorption turntables 1 operate simultaneously at four different stations, thereby achieving continuous and efficient silicon wafer processing.

[0046] The loading docking section 601 receives silicon wafers from other main process units and can be transported using a docking conveyor belt or an AGV (Automated Guided Vehicle). Silicon wafers pass one by one along the conveyor belt of the loading docking section 601, which is equipped with a vision inspection device to determine whether the wafers are qualified. A movable suction cup is located above the conveyor belt, and a rejection station 609 and a temporary storage station 610 are located on the side of the conveyor belt. Unqualified silicon wafers are placed at the rejection station 609 via the movable suction cup. In the event of equipment failure or shutdown, the movable suction cup will place the silicon wafer at the temporary storage station 610 to ensure uninterrupted operation of the upstream main process unit. Qualified silicon wafers are transported to the end of the conveyor belt, and then the swing arm loading assembly 602 moves the silicon wafers to the wafer assembly 603. After the wafer assembly 603 aligns the silicon wafers, the swing arm loading assembly 602 precisely moves the silicon wafers onto the adsorption turntable 1 of the turntable mechanism 100, where the adsorption turntable 1 uses suction to fix the silicon wafers. The swing-arm loading assembly 602 can be designed as a double-arm structure to simultaneously move the silicon wafers to be shaped from the conveyor belt to the whole-wafer assembly 603, and then move the shaped silicon wafers from the whole-wafer assembly 603 to the adsorption turntable 1. The turntable mechanism 100 drives the silicon wafers to rotate, causing them to pass sequentially through two laser sintering stations. The laser sintering assembly 605 is located above the two laser sintering stations and processes the silicon wafers. After processing, the silicon wafers are transferred to the unloading station 615, at which point the adsorption turntable 1 stops suction and performs vacuum breaking on the silicon wafers. A vision inspection assembly is installed above the unloading station 615 to detect whether the processed silicon wafers are qualified. Unqualified silicon wafers are placed into the unloading rejection box 607 via the swing-arm unloading assembly 606, while qualified silicon wafers are moved to the unloading docking section 608 via the swing-arm unloading assembly 606 and sent to the next host machine. The entire process achieves automation and precise control, ensuring the quality and efficiency of silicon wafer processing.

[0047] The turntable mechanism and laser sintering equipment for silicon wafer processing provided by this utility model effectively improve the uniformity of adsorption by modifying the adsorption turntable. Specifically, an air groove is added next to the air intake hole of the adsorption turntable to prevent the silicon wafer from cracking due to excessive force at a single point, or from shifting relative to the copper disk assembly during rotation due to uneven force, thereby causing processing errors. In addition, the adsorption turntable and the turntable support are fixed with three-point bolts instead of the traditional welding process, which reduces the processing difficulty while ensuring accuracy. At the same time, the laser sintering equipment realizes precise positioning and rapid loading and unloading of silicon wafers through the swing arm loading and unloading components and the whole wafer assembly.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A turntable mechanism for silicon wafer processing, comprising a plurality of adsorption turntables for adsorbing and fixing silicon wafers, a turntable support for fixing the adsorption turntables, a drive assembly for driving the turntable support to rotate, and a vacuuming assembly for evacuating the internal cavity of the adsorption turntables, characterized in that, The adsorption turntable is provided with multiple adsorption sections, each adsorption section including an air intake hole and at least one air groove located next to the air intake hole.

2. The turntable mechanism for silicon wafer processing as described in claim 1, characterized in that, The adsorption section includes a first air groove and a second air groove arranged symmetrically about the air intake hole.

3. The turntable mechanism for silicon wafer processing as described in claim 2, characterized in that, Both the first and second air grooves are elongated grooves.

4. The turntable mechanism for silicon wafer processing as described in claim 1, characterized in that, The adsorption turntable has multiple through holes to assist in breaking the vacuum.

5. The turntable mechanism for silicon wafer processing as described in any one of claims 1-4, characterized in that, The turntable support includes a support body and a plurality of mounting brackets arranged around the support body, wherein the support body is connected to the drive assembly, and the mounting brackets are respectively connected to the corresponding adsorption turntable and the support body.

6. The turntable mechanism for silicon wafer processing as described in claim 5, characterized in that, The mounting bracket is connected to the corresponding adsorption turntable by several bolts.

7. The turntable mechanism for silicon wafer processing as described in claim 6, characterized in that, The bolt is equipped with an insulating fixing block to prevent current from being transmitted to the adsorption turntable.

8. The turntable mechanism for silicon wafer processing as described in any one of claims 1-4, characterized in that, The drive assembly includes a motor and a mounting component, wherein the motor shaft is connected to the turntable bracket, and the motor is fixed to the worktable surface by the mounting component.

9. The turntable mechanism for silicon wafer processing as described in claim 8, characterized in that, A zero-point positioning component is provided between the mounting component and the turntable bracket. The zero-point positioning component includes a photoelectric bracket, a photoelectric sensor, and a light-shielding plate. The photoelectric sensor is fixed on the mounting component by the photoelectric bracket, and the light-shielding plate is mounted on the turntable bracket and cooperates with the photoelectric sensor for positioning.

10. A laser sintering apparatus for laser sintering silicon wafers, the laser sintering apparatus comprising a turntable mechanism for transferring the silicon wafers between a loading station, a unloading station, and a laser sintering station, characterized in that, The turntable mechanism is a turntable mechanism for silicon wafer processing as described in any one of claims 1-9.

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