A high-precision eutectic bonding device for semiconductors

Abstract

This application discloses a high-precision eutectic bonding equipment for semiconductors, including a feeding assembly comprising a feeding platform on which semiconductor material is placed; a eutectic heating assembly comprising a eutectic heating stage for eutectic bonding of the semiconductor material; a bonding head assembly comprising a ZR bonding head, a height sensor, and a head vision system, wherein the ZR bonding head is used for transferring the semiconductor material between the feeding platform and the heating stage, and the height sensor is used to measure the height between the ZR bonding head and the feeding platform and the eutectic heating stage; a calibration assembly comprising an origin calibration sensor and a force control sensor, wherein the origin calibration sensor cooperates with the head vision system to detect the translational state of the ZR bonding head, and the force control sensor contacts the ZR bonding head to measure the downward pressure of the ZR bonding head; and a three-axis translation assembly that drives the bonding head assembly to translate in the X, Y, and Z directions; this application can achieve high-precision assembly between chips and carriers.

Description

Technical Field

[0001] This application relates to the field of automation equipment technology, and more specifically to a high-precision eutectic bonding device for semiconductors. Background Technology

[0002] With the continuous development of microelectronic packaging technology, the requirements for miniaturization and efficiency of electronic components are becoming increasingly stringent, making the need to improve the accuracy and efficiency of chip mounting equipment increasingly urgent. Fully automated eutectic bonding machines are the core equipment for completing eutectic bonding of carrier chips (ChiponCarrierCoC), primarily used in semiconductor laser production. Their function is to rapidly heat and melt the gold-tin solder (Au80Sn20) on the substrate, eutectic bonding the chip onto the substrate. Most packaging plants use manual eutectic bonding, relying on manual visual alignment, resulting in placement misalignment generally >30μm, leading to increased risks of microbump bridging or poor soldering. Manual pressing pressure fluctuations >±10g can easily cause chip breakage (15% yield loss) or insufficient bond strength. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this application is to provide a high-precision eutectic bonding device for semiconductors, which solves the above-mentioned technical problems, realizes high-precision assembly between chips and carriers, and improves production efficiency.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] This application provides a high-precision eutectic bonding device for semiconductors, comprising:

[0006] The feeding assembly includes a feeding platform on which semiconductor material is placed;

[0007] A eutectic heating assembly includes a eutectic heating stage, which is used for eutectic mounting of semiconductor materials.

[0008] A placement head assembly, comprising a ZR placement head, a height sensor, and a head vision system, wherein the ZR placement head is used for transferring semiconductor materials between the material table and the heating table, and the height sensor is used to measure the height between the ZR placement head and the material table and the eutectic heating table;

[0009] The calibration component includes an origin calibration sensor and a force control sensor. The origin calibration sensor works in conjunction with the head vision system to detect the translational state of the ZR placement head. The force control sensor contacts the ZR placement head to measure the downward pressure of the ZR placement head.

[0010] The three-axis translation assembly includes a placement head assembly mounted on it, which drives the placement head assembly to translate in the X, Y, and Z directions.

[0011] Furthermore, the feeding assembly also includes a material box, and the semiconductor material includes a substrate, a solder pad, and a chip, all of which are placed inside the material box.

[0012] Furthermore, it also includes a bottom vision system, which is disposed below the eutectic heating stage and is used to detect the placement position of the substrate, solder pads and chips on the eutectic heating stage.

[0013] Furthermore, it also includes a nozzle replacement assembly for replacing the nozzles on the ZR placement head. The assembly includes a fixture plate on which several nozzles are placed. A cover plate is provided on the top of the fixture plate, and a through hole is provided on the cover plate. The ZR placement head can pass through the through hole to replace the nozzle. A lifting cylinder is provided at the bottom of the fixture plate, and the working end of the lifting cylinder is connected to the fixture plate.

[0014] Furthermore, it also includes a base, and the material platform includes a first material platform and a second material platform. The first material platform and the second material platform are respectively disposed on the base, and multiple material boxes are evenly placed on the first material platform and the second material platform.

[0015] Furthermore, the eutectic heating stage is disposed on the base, the first material stage is located on one side of the eutectic heating stage, the second material stage is located on the other side of the eutectic heating stage, and the first material stage and the second material stage are symmetrically arranged along the eutectic heating stage.

[0016] Furthermore, the three-axis translation component includes a marble gantry three-axis linear motor platform.

[0017] Beneficial effects

[0018] This application provides a high-precision eutectic bonding equipment for semiconductors. Through the cooperation of all components of the machine, the substrate, solder pads, and chips in the material box are sequentially transported to the eutectic heating stage to achieve fully automatic eutectic bonding. By adopting full automation and using high-precision moving parts, high-precision assembly between the chip and the carrier is achieved, which greatly improves production efficiency, reduces costs, and ensures product quality. Attached Figure Description

[0019] The accompanying drawings are provided to illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this application.

[0020] Figure 1 This is a schematic diagram of the overall structure of the device provided in an embodiment of this application.

[0021] Figure 2 This is a schematic diagram of the mounting head assembly structure provided in one embodiment of this application.

[0022] Figure 3 This is a schematic diagram of the calibration component structure provided in one embodiment of this application.

[0023] Figure 4 This is a schematic diagram of the nozzle replacement assembly provided in one embodiment of this application.

[0024] In the above attached figures,

[0025] 1. Feeding assembly; 2. Eutectic heating assembly; 3. Placement head assembly; 4. Calibration assembly; 5. Three-axis translation assembly; 6. Nozzle replacement assembly; 7. Base;

[0026] 11. First material platform; 12. Second material platform; 13. Material box;

[0027] 21. Eutectic heating stage; 22. Bottom vision system;

[0028] 31. ZR placement head; 32. Height sensor; 33. Head vision system;

[0029] 41. Origin calibration sensor; 42. Force control sensor;

[0030] 61. Fixture plate; 62. Suction nozzle; 63. Cover plate; 64. Lifting cylinder; 65. Through hole. Detailed Implementation

[0031] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.

[0032] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this document, "electrical connection" includes the situation where constituent elements are connected together by an element having some electrical function. There is no particular limitation on the "electrically functioning element," as long as it enables the transmission and reception of electrical signals between the connected constituent elements. An "electrically functioning element" can be, for example, an electrode or wiring, a switching element such as a transistor, or other functional elements such as a resistor, inductor, or capacitor. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] In this application, the terms "upper," "lower," "inner," "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0034] Example

[0035] One embodiment of this application provides a high-precision eutectic bonding device for semiconductors, such as... Figure 1 As shown, the equipment includes a feeding assembly 1, a eutectic heating assembly 2, a placement head assembly 3, a calibration assembly 4, a three-axis translation assembly 5, and a nozzle changing assembly 6.

[0036] like Figure 1 As shown, the feeding assembly 1 includes a feeding platform on which semiconductor materials are placed. The feeding platform is set on the base 7. The feeding platform includes a first feeding platform 11 and a second feeding platform 12. Multiple material boxes 13 are evenly placed on the first feeding platform 11 and the second feeding platform 12 respectively to realize the feeding of various products. The semiconductor materials include substrates, solder pads and chips. The substrates, solder pads and chips are all placed in the material boxes 13.

[0037] like Figure 1As shown, the eutectic heating assembly 2 includes a eutectic heating stage 21, which is used for eutectic mounting of semiconductor materials. The eutectic heating stage 21 is mounted on the base 7. The first material stage 11 is located on one side of the eutectic heating stage 21, and the second material stage 12 is located on the other side of the eutectic heating stage 21. The first material stage 11 and the second material stage 12 are symmetrically arranged along the eutectic heating stage 21.

[0038] like Figure 1 As shown, it also includes a bottom vision system 22, which is located below the eutectic heating stage 21. The bottom vision system 22 is used to detect the placement position of the substrate, solder pads and chips on the eutectic heating stage 21, so as to ensure that the substrate, solder pads and chips are in the specified position during heating and soldering, thereby improving the placement accuracy and ensuring product quality.

[0039] like Figure 2 As shown, the placement head assembly 3 includes a ZR placement head 31, a height sensor 32, and a head vision system 33. The ZR placement head 31 is used for transferring semiconductor materials between the material table and the heating stage. The substrate, solder pads, and chips can be sequentially picked up and transferred via the suction nozzle 62 on the ZR placement head 31. The height sensor 32 is used to measure the height between the ZR placement head 31 and the material table and eutectic heating stage 21. Using a flexible placement head assembly composed of a high-precision ZR axis, a vision system, and a height sensor 32, high-precision force control and high-precision placement are achieved. Ultimately, placement parameters of 30-300g ± 3g and ± 3μm can be achieved.

[0040] like Figure 2 and Figure 3 As shown, the calibration component 4 includes an origin calibration sensor 41 and a force control sensor 42. The origin calibration sensor 41 works in conjunction with the head vision system 33 to detect the translational state of the ZR placement head 31, improving the accuracy of the ZR placement head 31's translation and ensuring that the ZR placement head 31 places the semiconductor material at the designated position on the eutectic heating stage 21. The force control sensor 42 contacts the ZR placement head 31 to measure the downward pressure of the ZR placement head 31. When the ZR placement head 31 descends and contacts the force control sensor 42, the force control sensor 42 can accurately detect the downward pressure of the ZR placement head 31. If the downward pressure is too low or too high, the equipment system can adjust it to ensure that the ZR placement head 31 picks up or puts down the semiconductor material with the specified downward pressure, avoiding damage to the semiconductor material due to excessive downward pressure or failure to pick up the semiconductor material due to insufficient downward pressure.

[0041] like Figure 4As shown, the nozzle replacement assembly 6 is used to replace the nozzles 62 on the ZR placement head 31. It includes a fixture plate 61 on which several nozzles 62 are placed. A cover plate 63 is provided above the fixture plate 61, with through holes 65 on it. The ZR placement head 31 can pass through the through holes 65 to replace the nozzles 62. A lifting cylinder 64 is provided at the bottom of the fixture plate 61, with its actuating end connected to the fixture plate 61, driving the fixture plate 61 to rise and fall. Since the nozzles 62 have a limited lifespan, and different products require different models of nozzles 62, the ZR placement head 31 needs to be replaced in some cases. The nozzle replacement assembly 6 enables automatic nozzle replacement of the ZR placement head 31, further improving the automation level of the equipment and ensuring work efficiency.

[0042] like Figure 1 As shown, the placement head assembly 3 is mounted on the three-axis translation assembly 5. The three-axis translation assembly 5 drives the placement head assembly 3 to translate in the X, Y and Z directions. The three-axis translation assembly 5 includes a marble gantry three-axis linear motor platform, which adopts a combination of linear motor and grating ruler, and uses a marble base 7 to maximize the accuracy of the equipment.

[0043] The above embodiments are only for illustrating the technical concept and features of this application, and are intended to enable those skilled in the art to understand the content of this application and implement it accordingly. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be included within the scope of protection of this application.

Claims

1. A semiconductor high-precision eutectic die bonding apparatus, characterized by: include: The feeding assembly includes a feeding platform on which semiconductor material is placed; A eutectic heating assembly includes a eutectic heating stage, which is used for eutectic mounting of semiconductor materials. A placement head assembly, comprising a ZR placement head, a height sensor, and a head vision system, wherein the ZR placement head is used for transferring semiconductor materials between the material table and the heating table, and the height sensor is used to measure the height between the ZR placement head and the material table and the eutectic heating table; The calibration component includes an origin calibration sensor and a force control sensor. The origin calibration sensor works in conjunction with the head vision system to detect the translational state of the ZR placement head. The force control sensor contacts the ZR placement head to measure the downward pressure of the ZR placement head. The three-axis translation assembly includes a placement head assembly mounted on it, which drives the placement head assembly to translate in the X, Y, and Z directions.

2. The high-precision eutectic bonding equipment for semiconductors as described in claim 1, characterized in that: The feeding assembly also includes a material box, and the semiconductor material includes a substrate, a solder pad, and a chip, all of which are placed inside the material box.

3. The high-precision eutectic bonding equipment for semiconductors as described in claim 1, characterized in that: It also includes a bottom vision system, which is disposed below the eutectic heating stage and is used to detect the placement position of the substrate, solder pads and chips on the eutectic heating stage.

4. The high-precision eutectic bonding equipment for semiconductors as described in claim 1, characterized in that: It also includes a nozzle replacement assembly for replacing the nozzles on the ZR placement head. The assembly includes a fixture plate on which several nozzles are placed. A cover plate is provided on the top of the fixture plate, and a through hole is provided on the cover plate. The ZR placement head can pass through the through hole to replace the nozzle. A lifting cylinder is provided at the bottom of the fixture plate, and the working end of the lifting cylinder is connected to the fixture plate.

5. The high-precision eutectic bonding equipment for semiconductors as described in claim 1, characterized in that: It also includes a base, and the material platform includes a first material platform and a second material platform. The first material platform and the second material platform are respectively disposed on the base, and multiple material boxes are evenly placed on the first material platform and the second material platform.

6. The high-precision eutectic bonding equipment for semiconductors as described in claim 5, characterized in that: The eutectic heating platform is disposed on the base, the first material platform is located on one side of the eutectic heating platform, and the second material platform is located on the other side of the eutectic heating platform. The first material platform and the second material platform are symmetrically arranged along the eutectic heating platform.

7. The high-precision eutectic bonding equipment for semiconductors as described in claim 1, characterized in that: The three-axis translation component includes a marble gantry three-axis linear motor platform.

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