Wafer transport box with shock absorption function

Abstract

The utility model relates to wafer transportation box technical field discloses a wafer transportation box with shock attenuation function including inside shock attenuation fixed assembly and outside shock attenuation subassembly, inside shock attenuation fixed assembly includes the placing box, and the inside of placing box is connected with inside shock attenuation damping, and the outside of inside shock attenuation damping is connected with inside shock attenuation spring, and the one end of inside shock attenuation damping is connected with fixed clamp, and the one side of fixed clamp is provided with the placing plate, is equipped with placing recess on placing plate simultaneously, and the inside of placing plate is connected with telescopic link, and the outside of telescopic link is connected with fixed spring simultaneously, and the one end of telescopic link is connected with the clamping ring, and this multilayer shock attenuation design can effectively reduce the vibration and impact that wafer received in the transportation process, ensure wafer's integrity and security.

Description

Technical Field

[0001] This utility model relates to the field of wafer transport box technology, specifically a wafer transport box with shock absorption function. Background Technology

[0002] In semiconductor manufacturing, wafer transport is a critical step. Wafers are very fragile and easily damaged by vibration and impact, which not only increases production costs but also affects chip performance and yield. Traditional wafer transport boxes are ineffective at shock absorption and lack stability during transport. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer transport box with shock absorption function.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a wafer transport box with shock absorption function, comprising an inner shock absorption fixing component and an outer shock absorption component. The inner shock absorption fixing component includes a placement box, and an inner shock absorption damper is connected to the inner side of the placement box. An inner shock absorption spring is sleeved on the outer side of the inner shock absorption damper, and a fixing clip is connected to one end of the inner shock absorption damper. A placement plate is provided on one side of the fixing clip, and a placement groove is provided on the placement plate. A telescopic rod is connected to the inner side of the placement plate, and a fixing spring is sleeved on the outer side of the telescopic rod. A clamping ring is connected to one end of the telescopic rod.

[0005] As a further description of the above technical solution: The external damping assembly includes a connecting bottom shell, with a side damping damper connected to one side of the connecting bottom shell, and a side damping spring sleeved on the outer side of the side damping damper. At the same time, a bottom damping damper is connected to the lower bottom side of the connecting bottom shell, and a bottom damping spring sleeved on the outer side of the bottom damping damper.

[0006] As a further description of the above technical solution: One end of the inner shock-absorbing spring is fixedly connected to the inside of the placement box, and the other end of the inner shock-absorbing spring is fixedly connected to one side of the fixing clamp. The fixing clamp is U-shaped and slides on the inside of the placement box.

[0007] As a further description of the above technical solution: One end of the fixing spring is fixedly installed inside the placement plate, and the other end of the fixing spring is fixedly connected to one side of the clamping ring. The clamping ring is provided in two sets and is symmetrically fitted to both sides of the wafer.

[0008] As a further description of the above technical solution: One end of the side damping spring is fixedly connected to the inner side of the connecting bottom shell, and the other end of the side damping spring is fixedly connected to one side of the placement box. Multiple sets of side damping dampers and side damping springs are provided and evenly distributed on the inner side of the connecting bottom shell and the outer side of the placement box.

[0009] As a further description of the above technical solution: The two ends of the bottom damping spring are fixedly connected to the bottom side of the connecting bottom shell and the bottom side of the placement box, respectively. The bottom damping and bottom damping spring are provided in multiple sets and are evenly distributed on the bottom side of the placement box and the bottom side of the connecting bottom shell.

[0010] As a further description of the above technical solution: The upper side of the placement box is hinged with a lid, which is locked to the placement box by bolts.

[0011] This utility model has the following beneficial effects: 1. This wafer transport box employs a dual-layer shock absorption structure consisting of an inner shock-absorbing fixing component and an outer shock-absorbing component. The inner shock-absorbing component directly buffers and secures the wafer through components such as inner shock-absorbing dampers, inner shock-absorbing springs, telescopic rods, and fixing springs. The outer shock-absorbing component absorbs external impacts as a whole through side shock-absorbing dampers, side shock-absorbing springs, bottom shock-absorbing dampers, and bottom shock-absorbing springs. This multi-layer shock absorption design effectively reduces the vibration and impact experienced by the wafer during transportation, ensuring the integrity and safety of the wafer.

[0012] 2. The internal shock-absorbing and fixing components, including the clamps and rings, precisely secure the wafer, preventing displacement during transport. This precise fixing mechanism, combined with shock absorption, further enhances the wafer's stability during transport and reduces the risk of wafer damage due to vibration. Attached Figure Description

[0013] Figure 1 A three-dimensional structural diagram of a wafer transport box with shock absorption function proposed in this utility model. Figure 1 ; Figure 2 A three-dimensional structural diagram of a wafer transport box with shock absorption function proposed in this utility model. Figure 2 ; Figure 3 This is a partial structural cross-sectional view of a wafer transport box with shock absorption function proposed in this utility model. Figure 4 This is a partial exploded view of the structure of a wafer transport box with shock absorption function proposed in this utility model.

[0014] Legend: 1. Internal shock absorber fixing assembly; 11. Placement box; 12. Internal shock absorber damper; 13. Internal shock absorber spring; 14. Fixing clamp; 15. Placement plate; 16. Placement groove; 17. Telescopic rod; 18. Fixing spring; 19. Clamping ring; 2. External shock absorber assembly; 21. Connecting bottom shell; 22. Side shock absorber damper; 23. Side shock absorber spring; 24. Bottom shock absorber damper; 25. Bottom shock absorber spring; 3. Box cover; 4. Bolts. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Reference Figures 1-4 This utility model provides a wafer transport box with shock absorption function, including an inner shock absorption fixing component 1 and an outer shock absorption component 2. The inner shock absorption fixing component 1 includes a placement box 11, and an inner shock absorption damper 12 is connected to the inner side of the placement box 11. An inner shock absorption spring 13 is sleeved on the outer side of the inner shock absorption damper 12, and a fixing clip 14 is connected to one end of the inner shock absorption damper 12. A placement plate 15 is provided on one side of the fixing clip 14, and a placement groove 16 is provided on the placement plate 15. A telescopic rod 17 is connected to the inner side of the placement plate 15, and a fixing spring 18 is sleeved on the outer side of the telescopic rod 17. At the same time, a clamping ring 19 is connected to one end of the telescopic rod 17. The outer shock absorption assembly 2 includes a connecting bottom shell 21, and a side shock absorption damper 22 is connected to one side of the connecting bottom shell 21. A side shock absorption spring 23 is sleeved on the outer side of the side shock absorption damper 22. At the same time, a bottom shock absorption damper 24 is connected to the lower bottom side of the connecting bottom shell 21, and a bottom shock absorption spring 25 is sleeved on the outer side of the bottom shock absorption damper 24.

[0017] Specifically, one end of the inner damping spring 13 is fixedly connected to the inner side of the placement box 11, and the other end of the inner damping spring 13 is fixedly connected to one side of the fixing clamp 14. The fixing clamp 14 is U-shaped and slides inside the placement box 11. One end of the fixing spring 18 is fixedly disposed inside the placement plate 15, and the other end of the fixing spring 18 is fixedly connected to one side of the clamping ring 19. The clamping ring 19 has two sets and is symmetrically fitted on both sides of the wafer. One end of the side damping spring 23 is fixedly connected to the inner side of the connecting bottom shell 21. The other end of 23 is fixedly connected to one side of the placement box 11, and multiple sets of side damping dampers 22 and side damping springs 23 are evenly distributed on the inner side of the connecting bottom shell 21 and the outer side of the placement box 11. The two ends of the bottom damping springs 25 are fixedly connected to the lower bottom side of the connecting bottom shell 21 and the lower side of the placement box 11, respectively. Multiple sets of bottom damping dampers 24 and bottom damping springs 25 are evenly distributed on the bottom side of the placement box 11 and the lower bottom side of the connecting bottom shell 21. The upper side of the placement box 11 is hinged with a box cover 3, and the box cover 3 is locked to the placement box 11 by bolts 4.

[0018] In use, the inner damping element is connected to the inside of the placement box, and an inner damping spring is sleeved on its outside. This structural design allows the inner damping element to absorb some of the vibration energy through its elastic deformation when the wafer is subjected to external vibration, while the inner damping spring further buffers the vibration, reducing the impact on the wafer. One end of the inner damping spring is fixedly connected to the inside of the placement box, and the other end is fixedly connected to one side of the fixing clamp. The fixing clamp is U-shaped and can slide inside the placement box. This design allows the fixing clamp to move within a certain range, thus better adapting to changes in wafer size. At the same time, the spring's extension and contraction further buffers the vibration. When the wafer is placed in the placement groove, the clamping ring clamps the wafer tightly through the elastic force of the fixing spring, ensuring that the wafer will not loosen during transportation. The design of the telescopic rod and the fixing spring allows the clamping ring to be finely adjusted according to the wafer diameter, further improving the stability and reliability of the clamping. When the transport box is subjected to external lateral impact, the side damping element and the side damping spring can effectively absorb and buffer lateral vibration, reducing the impact on the placement box and the wafer. This multi-unit, evenly distributed design ensures effective cushioning of lateral impacts from all directions. When the transport box is impacted from the bottom, the bottom shock-absorbing dampers and springs effectively absorb and cushion the bottom vibrations, reducing the impact on the placement box and wafers. This design ensures effective cushioning of vibrations from any direction during transportation, thereby maximizing wafer protection. A lid is hinged to the top of the placement box and secured with bolts. This design not only facilitates wafer placement and removal but also ensures the lid's stability during transportation, preventing it from loosening or opening due to vibration, further protecting the wafers.

[0019] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0020] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer transport box with shock absorption function, characterized in that: The device includes an inner damping fixing assembly (1) and an outer damping assembly (2). The inner damping fixing assembly (1) includes a placement box (11), and an inner damping damper (12) is connected to the inner side of the placement box (11). An inner damping spring (13) is sleeved on the outer side of the inner damping damper (12). A fixing clip (14) is connected to one end of the inner damping damper (12). A placement plate (15) is provided on one side of the fixing clip (14). A placement groove (16) is provided on the placement plate (15). A telescopic rod (17) is connected to the inner side of the placement plate (15). A fixing spring (18) is sleeved on the outer side of the telescopic rod (17). A clamping ring (19) is connected to one end of the telescopic rod (17).

2. A wafer transport box with shock absorption function according to claim 1, characterized in that: The external damping assembly (2) includes a connecting bottom shell (21), and a side damping damper (22) is connected to one side of the connecting bottom shell (21), and a side damping spring (23) is sleeved on the outside of the side damping damper (22). At the same time, a bottom damping damper (24) is connected to the bottom side of the connecting bottom shell (21), and a bottom damping spring (25) is sleeved on the outside of the bottom damping damper (24).

3. A wafer transport box with shock absorption function according to claim 2, characterized in that: One end of the inner shock-absorbing spring (13) is fixedly connected to the inside of the placement box (11), and the other end of the inner shock-absorbing spring (13) is fixedly connected to one side of the fixing clip (14). The fixing clip (14) is U-shaped and slides on the inside of the placement box (11).

4. A wafer transport box with shock absorption function according to claim 3, characterized in that: One end of the fixing spring (18) is fixedly disposed inside the placement plate (15), and the other end of the fixing spring (18) is fixedly connected to one side of the clamping ring (19). The clamping ring (19) is provided in two sets and is symmetrically attached to both sides of the wafer.

5. A wafer transport box with shock absorption function according to claim 4, characterized in that: One end of the side damping spring (23) is fixedly connected to the inner side of the connecting bottom shell (21), and the other end of the side damping spring (23) is fixedly connected to one side of the placement box (11). The side damping damper (22) and the side damping spring (23) are provided in multiple sets and are evenly distributed on the inner side of the connecting bottom shell (21) and the outer side of the placement box (11).

6. A wafer transport box with shock absorption function according to claim 5, characterized in that: The two ends of the bottom damping spring (25) are fixedly connected to the bottom side of the connecting bottom shell (21) and the bottom side of the placement box (11), and the bottom damping damper (24) and the bottom damping spring (25) are provided in multiple sets and evenly distributed on the bottom side of the placement box (11) and the bottom side of the connecting bottom shell (21).

7. A wafer transport box with shock absorption function according to claim 6, characterized in that: The upper side of the placement box (11) is hinged with a box cover (3), and the box cover (3) is locked onto the placement box (11) by bolts (4).

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