A device for solving the problem of 210N wet process alkali etching of wafer strip liquid
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 弘元新材料(徐州)有限公司
- Filing Date
- 2025-07-31
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]本实用新型的目的在于提供一种解决210N湿制程碱抛贴片带液的装置，以解决上述背景技术中提出的在花篮倾斜过程中，硅片因重力向一侧倾斜，可能会发生相互碰撞的问题
[0018] By installing limiting plates and buffer pads, multiple limiting plates and buffer pads are set between the inner walls of the front and rear ends of the basket. When the silicon wafer tilts, it will abut against the buffer pads on one side of the left and right ends of the limiting plate. The limiting plate can prevent the silicon wafer from tilting excessively, ensuring that the silicon wafer tilts within a predetermined range, so that the position of each silicon wafer after tilting is relatively fixed and predictable. When the silicon wafer tilts and abuts against the limiting plate, the buffer pad plays a buffering role, avoiding damage to the edge of the silicon wafer or scratches on the surface, and also reducing collisions between adjacent silicon wafers.
Smart Images
Figure CN224611234U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of solar cell manufacturing, specifically relating to a device for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding. Background Technology
[0002] In the Topcon solar cell manufacturing process, the wet alkaline polishing process is used to remove excess borosilicate glass layers on the back and sides of the cell after removing BSG, and to polish the back and sides of the cell. This ensures that the back of the cell has sufficient reflectivity and increases light utilization. However, due to subsequent processes, the front oxide layer cannot be removed during this process, so HF cannot be used in the corresponding pickling tank. As a result, the silicon wafer is in a good hydrophilic state after alkaline polishing, leading to a large amount of liquid residue on the wafers after drying. The rework rate reached 0.1%, and the automated unloading camera cannot completely reject NG baskets with liquid residue. Each unloading results in approximately 0.1% of the wafers being defective in appearance and EL.
[0003] However, during the tilting of the basket, the silicon wafers may tilt to one side due to gravity and collide with each other, resulting in damage to the silicon wafers. Utility Model Content
[0004] The purpose of this invention is to provide a device for solving the problem of liquid residue on silicon wafers during the 210N wet process alkaline polishing and bonding, thereby addressing the issue mentioned in the background art where silicon wafers may collide with each other due to gravity tilting to one side during the basket tilting process.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a device for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding, comprising a fixing frame and a connecting plate installed at the lower end of the fixing frame;
[0006] The lower outer wall of the fixing frame is provided with fixing plates near the left and right sides respectively;
[0007] A fixing seat is provided on the lower side of the connecting plate;
[0008] Multiple flower baskets are arranged between the fixed base and the fixed plate. Cylinders are arranged inside the fixed base and near the front and rear sides respectively. Push rods are arranged inside the two cylinders to push the flower baskets to tilt upwards at an angle.
[0009] Multiple limiting plates are fixedly connected at equal intervals to the inner walls of the front and rear ends of the multiple flower baskets, and buffer pads are fixedly connected to the outer walls of the left and right ends of the multiple limiting plates.
[0010] Preferably, multiple limiting sleeves are fixedly connected at equal intervals to the lower inner walls of the multiple flower baskets, and an upward-opening limiting groove is opened inside the center of the upper outer wall of each of the multiple limiting sleeves.
[0011] Preferably, the left and right ends of the outer walls of the plurality of limiting sleeves are provided with through holes that extend from left to right.
[0012] Preferably, all of the plurality of limiting grooves are arc-shaped.
[0013] Preferably, a top plate is fixedly connected to the upper outer wall of the two push rods, and a connecting shaft is fixedly connected between the left and right outer walls of the two top plates and the flower basket to limit the position of the flower basket.
[0014] Preferably, multiple limiting shafts are fixedly connected between the multiple flower baskets and the fixing plate.
[0015] Preferably, guide grooves are provided on the upper side of the plurality of limiting shafts and inside the fixing plate to limit the maximum upward tilt angle of the flower basket.
[0016] Preferably, the fixed base has multiple limiting grooves inside and near the left and right sides to limit the maximum movable angle of the connecting shaft, and the inner walls of the front and rear ends of the fixed base have openings for the cylinder pipeline to pass through.
[0017] Compared with the prior art, this utility model provides a device for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding, which has the following beneficial effects:
[0018] By installing limiting plates and buffer pads, multiple limiting plates and buffer pads are set between the inner walls of the front and rear ends of the basket. When the silicon wafer tilts, it will abut against the buffer pads on one side of the left and right ends of the limiting plate. The limiting plate can prevent the silicon wafer from tilting excessively, ensuring that the silicon wafer tilts within a predetermined range, so that the position of each silicon wafer after tilting is relatively fixed and predictable. When the silicon wafer tilts and abuts against the limiting plate, the buffer pad plays a buffering role, avoiding damage to the edge of the silicon wafer or scratches on the surface, and also reducing collisions between adjacent silicon wafers. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the device structure for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding.
[0020] Figure 2 This is a partial structural schematic diagram of the front cross-section of the fixed column area of this utility model.
[0021] Figure 3 This is a partial structural schematic diagram of the frontal cross-section of the flower basket area of this utility model.
[0022] Figure 4 This is a partial structural diagram of the limiting plate area of this utility model.
[0023] Figure 5 This is a partial structural schematic diagram of the front cross-section of the flower basket area of this utility model.
[0024] In the diagram: 1. Fixing frame; 2. Connecting plate; 3. Fixing plate; 4. Flower basket; 5. Fixing seat; 6. Cylinder; 7. Push rod; 8. Connecting shaft; 9. Top plate; 10. Limiting shaft; 11. Buffer pad; 12. Limiting plate; 13. Limiting sleeve; 14. Through hole; 15. Limiting groove. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] This utility model provides, for example Figure 1-5 The device shown is for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding. It includes a fixing frame 1 and a connecting plate 2 installed at the lower end of the fixing frame 1.
[0027] Fixing plates 3 are provided on the lower outer wall of the fixing frame 1, near the left and right sides respectively;
[0028] A fixing seat 5 is provided on the lower side of the connecting plate 2;
[0029] Multiple baskets 4 are arranged between the fixing base 5 and the fixing plate 3. Cylinders 6 are installed inside the fixing base 5, near the front and rear sides. Two of the cylinders 6 have push rods 7 inside to push the baskets 4 upwards at a predetermined angle, neatly placing the cleaned 210N silicon wafers inside. This ensures the wafers are arranged in the baskets according to process requirements. The control system activates the cylinders 6 inside the fixing base 5, causing the push rods 7 to extend gradually, pushing the bottom of the baskets 4 upwards. When the baskets 4 reach the preset tilt angle... The external control system sends a signal to stop cylinder 6 and maintain the current tilt state. At this time, the silicon wafer tilts to one side under the action of gravity. Then, basket 4 tilts into the water and soaks for ten seconds. The fixing frame 1 begins to rise slowly at a speed of five millimeters per second. When basket 4 is completely removed from the liquid surface, that is, the robotic arm reaches the middle position, the solenoid valve is disconnected, cylinder 6 descends, and basket 4 returns to the horizontal position on both sides. The robotic arm accelerates upward at a speed of 500 millimeters per second and reaches the origin position. It then moves horizontally to the drying tank, places the basket, and completes the entire slow lifting, dehydration, and anti-sticking wafer action.
[0030] Multiple limiting plates 12 are fixedly connected at equal intervals to the inner walls of the front and rear ends of multiple flower baskets 4. Buffer pads 11 are fixedly connected to the outer walls of the left and right ends of multiple limiting plates 12. Under the action of gravity, the silicon wafer tilts to one side and contacts the limiting plate 12 and the buffer pad 11. The limiting plate 12 restricts the position of the silicon wafer, and the buffer pad 11 buffers the impact force of the silicon wafer.
[0031] like Figure 5 As shown, multiple flower baskets 4 are fixedly connected to multiple limiting sleeves 13 at equal intervals on the lower inner wall. The upper outer wall of each limiting sleeve 13 has an upward-opening limiting groove 15 at its center. The left and right outer walls of each limiting sleeve 13 have through holes 14 that pass through from left to right. The limiting grooves 15 are all arc-shaped.
[0032] The operator holds the silicon wafer, aligns the bottom edge of the silicon wafer with the limiting groove 15, and slowly lowers the silicon wafer so that the bottom edge of the silicon wafer is embedded in the limiting groove 15. After the basket 4 is tilted, the silicon wafer will be restricted by the limiting groove 15 to limit the center position of the tilt. At the same time, the through hole 14 allows the bottom of the silicon wafer placed inside the limiting groove 15 to contact the pool water.
[0033] like Figure 2 As shown, the upper outer walls of the two push rods 7 are fixedly connected to the top plate 9, and the left and right outer walls of the two top plates 9 are fixedly connected to the flower basket 4 to restrict the position of the flower basket 4.
[0034] As the top plate 9 rises, the connecting shaft 8 causes the flower basket 4 to tilt downwards around the contact point with the top plate 9.
[0035] like Figure 3 As shown, multiple limiting shafts 10 are fixedly connected between multiple flower baskets 4 and fixed plate 3. Guide grooves are provided on the upper side of the multiple limiting shafts 10 and inside the fixed plate 3 to limit the maximum upward tilt angle of the flower baskets 4.
[0036] When the flower basket 4 is tilted at an angle, the side closer to the fixed plate 3 tilts upward under the restriction of the limiting shaft 10, and the maximum angle of upward tilt is limited by the guide groove.
[0037] like Figure 1 and Figure 2 As shown, multiple limiting grooves are provided inside the fixed base 5 and near the left and right sides respectively to limit the maximum movable angle of the connecting shaft 8. Openings are provided inside the outer walls at both the front and rear ends of the fixed base 5 to allow the cylinder 6 pipeline to pass through.
[0038] The limiting groove limits the maximum downward tilt angle of the connecting shaft 8, and works with the guide groove to ensure that the basket 4 can tilt at a good angle. The air pipe of the cylinder 6 is connected to the cylinder 6 through the port to ensure that the cylinder 6 can work normally.
[0039] The implementation principle of this embodiment is as follows: The cleaned 210N silicon wafers are neatly placed in the basket 4, ensuring that the arrangement of the wafers in the basket 4 meets the process requirements. The control system activates the cylinder 6 inside the fixing base 5. The cylinder 6 begins to work, and the push rod 7 gradually extends, pushing the bottom of the basket 4 upwards. When the basket 4 reaches the preset tilt angle, the external control system sends a signal to stop the cylinder 6, maintaining the current tilt state. At this time, the silicon wafers tilt to one side under the action of gravity. Subsequently, the basket 4 is tilted into the water for immersion. Ten seconds later, the fixed frame 1 begins to rise slowly at a speed of five millimeters per second until the basket 4 is completely detached from the liquid surface, that is, the robotic arm reaches the midpoint value. The solenoid valve is disconnected, the cylinder 6 descends, and the basket 4 returns to the horizontal position on both sides. The robotic arm accelerates upward at a speed of 500 millimeters per second, reaches the origin position, moves horizontally to the drying tank, places the basket, and completes the entire slow lifting, dehydration, and anti-sticking wafer action. Under the action of gravity, the silicon wafer tilts to one side and contacts the limiting plate 12 and the buffer pad 11. The limiting plate 12 restricts the position of the silicon wafer, and the buffer pad 11 buffers the impact force of the silicon wafer.
[0040] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and patching, comprising a fixing frame (1) and a connecting plate (2) installed at the lower end of the fixing frame (1); The lower outer wall of the fixing frame (1) is provided with fixing plates (3) near the left and right sides respectively. A fixing seat (5) is provided on the lower side of the connecting plate (2); Multiple flower baskets (4) are provided between the fixed base (5) and the fixed plate (3). Cylinders (6) are provided inside the fixed base (5) and near the front and rear sides respectively. Push rods (7) are provided inside the two cylinders (6) to push the flower baskets (4) to tilt upwards at an angle. Its features are: Multiple limiting plates (12) are fixedly connected at equal intervals to the inner walls of the front and rear ends of the multiple flower baskets (4), and buffer pads (11) are fixedly connected to the outer walls of the left and right ends of the multiple limiting plates (12).
2. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding as described in claim 1, characterized in that: Multiple limiting sleeves (13) are fixedly connected at equal intervals to the lower inner walls of the multiple flower baskets (4), and a limiting groove (15) with an upward opening is opened inside the center of the upper outer wall of the multiple limiting sleeves (13).
3. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding pads according to claim 2, characterized in that: Each of the left and right ends of the limiting sleeve (13) has a through hole (14) that runs through the left and right sides.
4. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding pads according to claim 2, characterized in that: All of the aforementioned limiting grooves (15) are arc-shaped.
5. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding as described in claim 1, characterized in that: The upper outer walls of the two push rods (7) are fixedly connected to the top plate (9), and the left and right outer walls of the two top plates (9) and the flower basket (4) are fixedly connected to the connecting shaft (8) to limit the position of the flower basket (4).
6. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding as described in claim 1, characterized in that: Multiple limiting shafts (10) are fixedly connected between the multiple flower baskets (4) and the fixing plate (3).
7. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding as described in claim 6, characterized in that: Guide grooves are provided on the upper side of the multiple limiting shafts (10) and inside the fixing plate (3) to limit the maximum upward tilt angle of the flower basket (4).
8. The apparatus for solving the problem of liquid residue on 210N wet process alkaline polishing and bonding as described in claim 1, characterized in that: Multiple limiting grooves are provided inside the fixed seat (5) and near the left and right sides respectively to limit the maximum movable angle of the connecting shaft (8). The inner walls of the front and rear ends of the fixed seat (5) are provided with openings for the cylinder (6) pipeline to pass through.