A grinding device for ultra-thin diamond polycrystalline wafers

Abstract

This utility model discloses a grinding device for ultrathin diamond polycrystalline wafers, relating to the field of ultrathin diamond polycrystalline wafer production technology. The utility model includes a retainer, a counterweight at the top of the retainer, a threaded post threaded to the top of the counterweight, a lifting rod fixedly connected to the top of the threaded post, and a grinding groove at the bottom of the retainer. This utility model utilizes the grinding groove, a permanent magnet, and steel balls to securely adhere the diamond polycrystalline wafer to the grinding groove using the uniform magnetic attraction generated by the permanent magnet, replacing traditional glue bonding. This avoids thickness deviation problems caused by uneven glue distribution and product unevenness, while also eliminating the waiting time for glue to solidify and be removed, thus improving the processing efficiency of ultrathin diamond polycrystalline wafers. The steel balls roll within the ball bearing holes to transmit pressure, further ensuring uniform force distribution and product surface flatness during the grinding process.

Description

Technical Field

[0001] This utility model belongs to the field of ultra-thin diamond polycrystalline wafer production technology, and in particular relates to a grinding device for ultra-thin diamond polycrystalline wafers. Background Technology

[0002] Ultrathin diamond polycrystalline wafers are polycrystalline composite materials formed by sintering nano-diamond microcrystals and binders through a high-temperature and high-pressure process. The material presents an ultrathin sheet-like shape and combines the high hardness and high thermal conductivity of diamond with the impact resistance of polycrystalline structures. Its microstructure is uniform and the grain size is controlled at the nanoscale, ensuring the consistency and stability of performance.

[0003] In the preparation of ultrathin polydiamond wafers, grinding is required. During grinding, the polydiamond wafer is placed in a grinding fixture, which is placed on the grinding disc of the grinding equipment and equipped with a weight. Diamond powder is sprinkled on the grinding disc, and the equipment is started to cause the polydiamond wafer and the diamond powder to rub against each other, thereby achieving the purpose of thinning the polydiamond wafer. In order to prevent the polydiamond wafer from falling off during processing, glue is used to adhere it to the grinding fixture. Although this method can solve the problem of product detachment, the uneven distribution of glue makes the adhered product uneven. During processing, the higher points will have a greater amount of material removed than the lower points, resulting in the thickness of the processed product exceeding the tolerance. Moreover, since the glue takes time to solidify and remove, the processing of ultrathin polydiamond wafers is slow and the processing efficiency is low.

[0004] To address these issues, we provide a grinding apparatus for ultrathin diamond polycrystalline wafers. Utility Model Content

[0005] The purpose of this invention is to provide a grinding device for ultra-thin diamond polycrystalline wafers. By combining a grinding tank, a permanent magnet, and a steel ball, this invention solves the problem that existing grinding devices for ultra-thin diamond polycrystalline wafers require the use of glue to fix them during installation. Since the glue takes a long time to solidify and remove, this results in a reduction in overall work efficiency.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution.

[0007] This utility model relates to a grinding device for ultra-thin polycrystalline diamond wafers, comprising a retainer, a counterweight at the top of the retainer, a threaded post at the top of the counterweight, a lifting rod fixedly connected to the top of the threaded post, a grinding groove at the bottom of the retainer, ball bearing holes in the inner wall of the grinding groove, steel balls in the inner cavity of the ball bearing holes, a permanent magnet fixedly connected to the top of the inner cavity of the grinding groove, a polycrystalline diamond wafer body in the inner cavity of the grinding groove, a rubber pad in the inner cavity of the retainer, and locking mechanisms on both sides of the inner cavity of the counterweight.

[0008] The present invention is further configured such that the locking mechanism includes two movable plates, the top and bottom of which are slidably connected to the inner wall of the counterweight. A spring and a push rod are fixedly connected to the top and bottom of opposite sides of the two movable plates, respectively. The side of the push rod away from the movable plate extends into the inner cavity of the retainer. The inner wall of the retainer has an annular groove that cooperates with the push rod. A ramp block is fixedly connected to opposite sides of the two movable plates. Screws are provided on both sides of the top of the counterweight. The bottom of the screws passes through the counterweight and is movably connected to a pressure block. The movable plates can control the movement of the push rod, and the push rod can be inserted into the annular groove to lock the counterweight. The spring can reset the movable plates when the ramp block is not compressed. The screws can control the height of the pressure block, and the pressure block can compress the ramp block, thus controlling the movement of the movable plates.

[0009] The present invention is further configured such that a knob is fixedly connected to the top of the screw, and threaded holes for use with the screw are opened on both sides of the top of the counterweight. The knob can control the rotation of the screw, and the surface of the knob is provided with anti-slip texture to increase its anti-slip effect. The threaded holes can facilitate the screw to control the working height of the pressure block.

[0010] The present invention is further configured such that slide rails are fixedly connected to both sides of the bottom of the inner cavity of the counterweight block, and a slide groove is provided at the bottom of the movable plate to cooperate with the slide rails. The slide rails and slide grooves can limit the movable plate so that it can move smoothly left and right and prevent it from tilting or deviating during the movement.

[0011] The present invention is further configured such that the top of the counterweight is provided with a fixing hole for use with a threaded post, and the top of both sides of the lifting rod are fixedly connected with handles. The fixing hole facilitates the threaded post to install the lifting rod on the top of the counterweight, and the handles facilitate the worker to lift the counterweight using the lifting rod.

[0012] The present invention is further configured such that the permanent magnet is installed inside the grinding tank, and the number of permanent magnets in each grinding tank cavity is three, which are evenly distributed at the top of the grinding tank cavity. The permanent magnets evenly installed inside the grinding tank can stably adsorb the diamond polycrystalline wafer body and prevent it from falling out of the grinding tank.

[0013] The present invention is further configured such that the counterweight is cylindrical in shape, the diameter of the steel ball is smaller than that of the ball bearing hole, the cylindrical counterweight can be stably installed inside the cage and provide uniform downward pressure on the steel ball, and the diameter of the steel ball is smaller than that of the inner diameter of the ball bearing hole, so that the steel ball can rotate smoothly inside the ball bearing hole.

[0014] The present invention has the following beneficial effects.

[0015] 1. This utility model utilizes the combination of a grinding tank, a permanent magnet, and a steel ball. The permanent magnet generates a uniform magnetic attraction force on the diamond polycrystalline wafer body, which firmly attracts it into the grinding tank, replacing the traditional glue bonding method. This avoids the problem of uneven thickness caused by uneven glue distribution. At the same time, it saves the waiting time for glue to solidify and be removed, improving the processing efficiency of ultra-thin diamond polycrystalline wafers. The steel ball rolls in the ball bearing hole to transmit pressure, further ensuring the uniformity of force and the flatness of the product surface during the grinding process.

[0016] 2. This utility model uses a locking mechanism to achieve rapid locking and releasing of the counterweight and the retainer through the cooperation of the movable plate, the top rod and the annular groove. Combined with the squeezing action of the screw adjusting pressure block on the slope block, the counterweight can be installed and removed without tools, simplifying the operation process and improving the loading and unloading efficiency. The lifting rod and threaded column structure facilitates the overall handling and positioning, further increasing the production efficiency of ultra-thin diamond polycrystalline wafers. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0018] Figure 1 A perspective view of a grinding device for ultrathin diamond polycrystalline wafers;

[0019] Figure 2 A bottom view of a grinding device for ultrathin diamond polycrystalline wafers;

[0020] Figure 3 An exploded view of a grinding device for ultrathin diamond polycrystalline wafers;

[0021] Figure 4 A schematic diagram of a holder and grinding groove in a grinding device for ultrathin diamond polycrystalline wafers;

[0022] Figure 5This is a partial cross-sectional view of the counterweight block in a grinding device for ultrathin diamond polycrystalline wafers.

[0023] In the attached diagram: 1. Cage; 2. Counterweight; 3. Threaded post; 4. Lifting rod; 5. Grinding groove; 6. Ball bearing hole; 7. Steel ball; 8. Permanent magnet; 9. Diamond polycrystalline wafer body; 10. Rubber pad; 11. Locking mechanism; 111. Movable plate; 112. Spring; 113. Top rod; 114. Annular groove; 115. Sloping block; 116. Screw; 117. Pressure block; 118. Knob. Detailed Implementation

[0024] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Example 1

[0026] Please see Figures 1-5 This utility model is a grinding device for ultra-thin diamond polycrystalline wafers, including a retainer 1, a counterweight 2 on the top of the retainer 1, a threaded post 3 threadedly connected to the top of the counterweight 2, a lifting rod 4 fixedly connected to the top of the threaded post 3, a grinding groove 5 at the bottom of the retainer 1, a ball bearing hole 6 on the inner wall of the grinding groove 5, a steel ball 7 in the inner cavity of the ball bearing hole 6, a permanent magnet 8 fixedly connected to the top of the inner cavity of the grinding groove 5, a diamond polycrystalline wafer body 9 in the inner cavity of the grinding groove 5, a rubber pad 10 in the inner cavity of the retainer 1, and locking mechanisms 11 on both sides of the inner cavity of the counterweight 2.

[0027] Specifically: the retainer 1 facilitates the fixing of the counterweight 2, the counterweight 2 can compress the steel ball 7, and the steel ball 7 can evenly deliver the downward pressure to the diamond polycrystalline wafer body 9. The ball bearing hole 6 can limit the position of the steel ball 7. The permanent magnet 8 can attract the diamond polycrystalline wafer body 9, so that it can be stably fixed inside the grinding tank 5, which is convenient for workers to quickly assemble and disassemble it and improve its grinding efficiency. The rubber pad 10 can protect the counterweight 2, and the locking mechanism 11 can make the counterweight 2 securely installed inside the retainer 1.

[0028] Example 2

[0029] Please see Figures 1-5Based on Embodiment 1, the locking mechanism 11 includes two movable plates 111. The top and bottom of the movable plates 111 are slidably connected to the inner wall of the counterweight 2. The top and bottom of opposite sides of the two movable plates 111 are respectively fixedly connected to a spring 112 and a push rod 113. The side of the push rod 113 away from the movable plates 111 extends into the inner cavity of the retainer 1. The inner wall of the retainer 1 has an annular groove 114 that cooperates with the push rod 113. The opposite sides of the two movable plates 111 are fixedly connected to a slope block 115. Screws 116 are provided on both sides of the top of the counterweight 2. The bottom of the screws 116 penetrates the counterweight 2 and is movably connected to a pressure plate. A knob 118 is fixedly connected to the top of the screw 116 and the top of the counterweight 2. Threaded holes for use with the screw 116 are opened on both sides of the top of the counterweight 2. Slide rails are fixedly connected to both sides of the bottom of the inner cavity of the counterweight 2. A slide groove for use with the slide rail is opened at the bottom of the movable plate 111. A fixing hole for use with the threaded post 3 is opened on the top of the counterweight 2. Rod handles are fixedly connected to the top of both sides of the lifting rod 4. Permanent magnets 8 are installed inside the grinding groove 5. There are three permanent magnets 8 in each inner cavity of the grinding groove 5, and they are evenly distributed on the top of the inner cavity of the grinding groove 5. The counterweight 2 is cylindrical in shape, and the diameter of the steel ball 7 is smaller than that of the ball bearing hole 6.

[0030] Specifically: the movable plate 111 can control the movement of the top rod 113, which can be inserted into the annular groove 114 to lock the counterweight 2; the spring 112 can reset the movable plate 111 when the ramp block 115 is not compressed; the screw 116 can control the working height of the pressure block 117, which can compress the ramp block 115 to control the movement of the movable plate 111; the knob 118 can control the rotation of the screw 116; the surface of the knob 118 is provided with anti-slip texture to increase its anti-slip effect; the threaded hole facilitates the screw 116 to control the working height of the pressure block 117; the slide rail and slide groove can... The movable plate 111 is limited to ensure smooth left and right movement and prevent tilting during movement. The fixing hole allows the threaded column 3 to install the lifting rod 4 on top of the counterweight 2. The handle allows the operator to easily lift the counterweight 2 using the lifting rod 4. The permanent magnet 8, evenly installed inside the grinding groove 5, can stably attract the diamond polycrystalline wafer body 9, preventing it from falling out of the grinding groove 5. The cylindrical counterweight 2 can be stably installed inside the retainer 1 and provides uniform downward pressure to the steel ball 7. The diameter of the steel ball 7 is smaller than the inner diameter of the ball bearing hole 6, allowing the steel ball 7 to rotate smoothly inside the ball bearing hole 6.

[0031] The working principle of this utility model is as follows: First, the ultra-thin diamond polycrystalline wafer body 9 is placed inside the grinding tank 5. The permanent magnet 8 at the top of the inner cavity of the grinding tank 5 generates a uniform magnetic attraction force, which firmly attracts the diamond polycrystalline wafer body 9, preventing it from falling off during processing. No glue is needed for fixing, thus improving efficiency. Then, the counterweight 2 is placed on top of the retainer 1. The knob 118 is turned, which controls the screw 116 to rotate. The rotation of the screw 116, in conjunction with the threaded hole, controls the pressure block 117 to squeeze the slope block 115, causing the slope block 115 to control the movement of the movable plate 111 and the top rod 113. The top rod 113 moves and inserts into the annular groove 114, thereby locking the counterweight 2 inside the retainer 1. Reverse Knob 118 stops the pressure block 117 from pressing the inclined surface of the slope block 115. Spring 112 resets and controls the movement of movable plate 111 and top rod 113. The top rod 113 retracts into the inner cavity of the counterweight 2, making it easy to remove the counterweight 2. During the grinding process, the counterweight 2 acts on the steel ball 7 through bottom pressure. The steel ball 7 evenly transmits the pressure to the surface of the diamond polycrystalline wafer body 9, ensuring consistent grinding force and avoiding thickness deviation. Diamond micro powder is evenly spread on the top of the grinding disc. The grinding disc is rotated by controlling the grinding equipment. Grinding is achieved by the mutual friction between the diamond micro powder and the diamond polycrystalline wafer body 9. The entire device combines magnetic attraction and mechanical locking, simplifying operation and improving the grinding efficiency and quality of ultra-thin diamond polycrystalline wafers.

[0032] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific implementation methods described. The present specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present utility model, so that those skilled in the art can better understand and utilize the present utility model.

Claims

1. A grinding apparatus for ultrathin diamond polycrystalline wafers, comprising a holder (1), characterized in that: The top of the retainer (1) is provided with a counterweight (2), the top of the counterweight (2) is threadedly connected with a threaded post (3), and the top of the threaded post (3) is fixedly connected with a lifting rod (4). The bottom of the retainer (1) is provided with a grinding groove (5), the inner wall of the grinding groove (5) is provided with a ball hole (6), the inner cavity of the ball hole (6) is provided with a steel ball (7), the top of the inner cavity of the grinding groove (5) is fixedly connected with a permanent magnet (8), the inner cavity of the grinding groove (5) is provided with a diamond polycrystalline wafer body (9), the inner cavity of the retainer (1) is provided with a rubber pad (10), and both sides of the inner cavity of the counterweight (2) are provided with locking mechanisms (11).

2. The grinding apparatus for ultrathin diamond polycrystalline wafers according to claim 1, characterized in that: The locking mechanism (11) includes two movable plates (111). The top and bottom of the movable plates (111) are slidably connected to the inner wall of the counterweight (2). The top and bottom of the opposite sides of the two movable plates (111) are respectively fixedly connected to a spring (112) and a push rod (113). The side of the push rod (113) away from the movable plates (111) extends into the inner cavity of the retainer (1). The inner wall of the retainer (1) is provided with an annular groove (114) that cooperates with the push rod (113). The opposite sides of the two movable plates (111) are fixedly connected to a slope block (115). The top of the counterweight (2) is provided with screws (116) on both sides. The bottom of the screws (116) extends through the counterweight (2) and is movably connected to a pressure block (117).

3. The grinding apparatus for ultrathin diamond polycrystalline wafers according to claim 2, characterized in that: A knob (118) is fixedly connected to the top of the screw (116), and threaded holes that cooperate with the screw (116) are opened on both sides of the top of the counterweight (2).

4. The grinding apparatus for ultrathin polycrystalline diamond wafers according to claim 2, characterized in that: The counterweight (2) has slide rails fixedly connected to both sides of the bottom of the inner cavity, and the bottom of the movable plate (111) has a slide groove that works in conjunction with the slide rails.

5. The grinding apparatus for ultrathin polycrystalline diamond wafers according to claim 1, characterized in that: The top of the counterweight (2) is provided with a fixing hole for use with the threaded column (3), and the top of both sides of the lifting rod (4) are fixedly connected with handles.

6. The grinding apparatus for ultrathin diamond polycrystalline wafers according to claim 1, characterized in that: The permanent magnets (8) are installed inside the grinding tank (5). There are three permanent magnets (8) in the inner cavity of each grinding tank (5), and they are evenly distributed at the top of the inner cavity of the grinding tank (5).

7. The grinding apparatus for ultrathin polycrystalline diamond wafers according to claim 1, characterized in that: The counterweight (2) is cylindrical in shape, and the diameter of the steel ball (7) is smaller than that of the ball bearing hole (6).

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