A stamping die for a heat sink

Abstract

The utility model discloses a stamping die of fin, including lower die seat, the top of lower die seat is equipped with a plurality of float and sink pin, the top of lower die seat is equipped with the groove of being suitable for with the position of float and sink pin, the top of lower die seat is equipped with the material belt groove, lower die seat is provided with pin angle riveting seat in material belt groove, the top of lower die seat is provided with upper die seat, and upper die seat is fixedly connected with pin angle riveting head on one side close to lower die seat, and material belt groove is provided with SPCC electroplated PIN angle material belt, and the top of lower die seat is provided with fin main body material belt, and SPCC electroplated PIN angle material belt and fin main body material belt are perpendicular distribution, and the first sliding slot and the second sliding slot are seted up on lower die seat, and the first sliding slot is provided with moving block, and the one end of moving block is equipped with the slot. The utility model realizes the high degree of automatic, synchronous integration production of fin stamping and PIN angle riveting, reduces the number of mould and complicated process operation, reduces mould purchase, maintenance and artificial cost.

Description

Technical Field

[0001] This utility model relates to the field of heat sink manufacturing technology, and in particular to a stamping die for a heat sink. Background Technology

[0002] By riveting the heat sink to the SPCC plated pin corner, mechanical stability can be ensured, and assembly efficiency and product durability can be improved. This is a common connection method in electronic equipment manufacturing. When riveting the heat sink to the SPCC plated pin corner, a stamping die is generally used to stamp the heat sink and the SPCC plated pin corner together.

[0003] Traditional heat sink stamping dies cannot simultaneously stamp the heat sink and rivet it to the SPCC electroplated pin corners. Generally, at least two dies are needed to stamp and rivet, involving multiple steps, each of which must be completed step by step before proceeding to the next. This increases overall production time, reduces capacity, requires multiple dies, and increases costs. Therefore, it is necessary to design a heat sink stamping die to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a stamping die for heat sinks.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A stamping die for a heat sink includes a lower die base. A plurality of floating pins are disposed on the top of the lower die base. Grooves corresponding to the floating pins are formed on the top of the lower die base. A strip groove is formed on the top of the lower die base. A pin corner rivet seat is provided within the strip groove on the lower die base. An upper die base is provided on the top of the lower die base. A pin corner rivet head is fixedly connected to the upper die base on one side near the lower die base. SPCC electroplated pin corner strip is provided within the strip groove. A heat sink body strip is provided on the top of the lower die base. The SPCC electroplated pin corner strip and the heat sink body strip are vertically distributed. A first sliding groove and a second sliding groove are formed on the lower die base. A movable block is disposed within the first sliding groove. One end of the movable block... The upper die has a slot. A feeding block is fixedly connected to one side of the moving block. The feeding block is located in a second slide groove. Both the moving block and the feeding block are slidably connected to the lower die base. A feeding pin is fixedly connected to the top of the feeding block. A positioning pin is provided on one side of the feeding pin. The positioning pin is fixedly connected to the lower die base. A feeding rod is fixedly connected to one side of the moving block. The feeding rod passes through the lower die base and is slidably connected to the lower die base. A feeding spring is sleeved on the feeding rod and is located on one side of the lower die base. A pin is fixedly connected to the upper die base on the side near the lower die base. The pin is beveled on the side away from the upper die base. The upper die base and the lower die base work together to stamp the heat sink body strip, and the upper die base drives the pin corner rivet joint. This technique involves moving the SPCC electroplated PIN corner piece closer to the lower die and driving it during the stamping process. The lower and upper die bases work together to stamp the heatsink body strip into a heatsink. The upper die base moves the pin corner rivet head to contact the SPCC electroplated PIN corner piece. Through the cooperation of the pin corner rivet head and the pin corner rivet head, the SPCC electroplated PIN corner piece is riveted to the heatsink body strip. This combines the stamping of the heatsink and the riveting of the SPCC electroplated PIN corner piece into a single mold or completes the process in a continuous motion, significantly reducing the number of steps. When the upper die base moves closer to the lower die base, it also moves the pin. The inclined surface contacts the moving block, causing the moving block to move laterally, which in turn drives... As the feeding block moves, it drives the feeding pin, which in turn moves the SPCC electroplated PIN corner strip. When the pin moves away from the lower die, the contracted feeding spring extends, returning the moving block to its initial position, which in turn returns the feeding pin to its initial position, allowing it to re-insert into the round hole on the SPCC electroplated PIN corner strip. This effectively solves the problem mentioned in the background technology that traditional heat sink stamping dies cannot simultaneously stamp the heat sink and rivet the heat sink to the SPCC electroplated PIN corner, resulting in numerous processes, increased overall production time, reduced capacity, and increased costs. This solution achieves highly automated, synchronous, and integrated production of heat sink stamping and PIN corner riveting, reducing the number of dies and complex process operations.The technical benefits include reducing mold procurement, maintenance, and labor costs.

[0006] As a further embodiment of this utility model, the top of the lower mold base is provided with four positioning grooves arranged in a square pattern, and the bottom of the upper mold base is fixedly connected with four positioning shafts arranged in a square pattern, wherein the positioning grooves and positioning shafts are adapted to each other.

[0007] As a further embodiment of this utility model, the lower mold base is fixedly connected to a lower fixing base on the side away from the upper mold base.

[0008] As a further embodiment of this utility model, the upper mold base is fixedly connected to a first fixing plate on the side away from the lower mold base, and the first fixing plate is provided with a second fixing plate on the side away from the upper mold base. The first fixing plate and the second fixing plate are provided with four guide rods in a square layout on the side close to each other. The guide rods are slidably connected to the first fixing plate and the second fixing plate. The first fixing plate and the second fixing plate are provided with four return springs in a square layout on the side close to each other.

[0009] As a further embodiment of this utility model, both the first fixing plate and the second fixing plate have grooves that are adapted to the guide rod and the return spring at their respective positions.

[0010] As a further embodiment of this utility model, the second fixing plate is fixedly connected to an upper fixing seat on the side away from the first fixing plate.

[0011] The beneficial effects of this utility model are as follows: By employing a combination of a lower and upper die base to stamp the heat sink body strip, and the upper die base moving the pin corner rivet head closer to the SPCC electroplated PIN corner strip during the stamping process, the lower and upper die bases stamp the heat sink body strip into a heat sink. The upper die base moves the pin corner rivet head to contact the SPCC electroplated PIN corner strip, and the SPCC electroplated PIN corner strip is riveted to the heat sink body strip through the cooperation of the pin corner rivet head and the pin corner rivet head. This combines the two processes of stamping the heat sink and riveting the SPCC electroplated PIN corner strip into a single mold or completes them in a continuous motion, significantly reducing the number of process steps. When the upper die base moves closer to the lower die base, it also moves the pin, and the inclined surface contacts the moving block, allowing the moving block to move laterally. The moving block drives the feeding block, which in turn drives the feeding pin, which in turn moves the SPCC electroplated PIN corner strip. When the pin moves away from the lower die, the contracted feeding spring extends, allowing the moving block to return to its initial position, which in turn allows the feeding pin to return to its initial position and re-insert into the round hole on the SPCC electroplated PIN corner strip. This effectively solves the problem mentioned in the background technology that traditional heat sink stamping dies cannot simultaneously stamp the heat sink and rivet the heat sink to the SPCC electroplated PIN corner, resulting in many processes, increased overall production time, reduced capacity, and increased costs. This technology achieves highly automated, synchronous, and integrated production of heat sink stamping and PIN corner riveting, reducing the number of dies and complex process operations, and lowering the costs of die procurement, maintenance, and labor. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of a stamping die for a heat sink proposed in this utility model; Figure 2 This is a schematic diagram of the lower die base structure of a stamping die for a heat sink according to the present invention. Figure 3 This is a schematic diagram of the upper die base structure of a stamping die for a heat sink according to the present invention. Figure 4 This is a schematic cross-sectional view of the upper die base of a stamping die for a heat sink according to the present invention. Figure 5 This is a schematic diagram of the heat sink structure of a stamping die for a heat sink according to the present invention. Figure 6 This is a schematic diagram of the lower die base of a stamping die for a heat sink according to the present invention. Figure 7 This is a cross-sectional structural diagram of the moving block of the stamping die for a heat sink proposed in this utility model.

[0013] In the diagram: 1. Lower mold base; 101. Lower fixed base; 102. Floating pin; 103. Pin corner rivet base; 104. Material strip groove; 2. Upper mold base; 201. Upper fixed base; 202. Guide rod; 203. Return spring; 204. First fixed plate; 205. Second fixed plate; 206. Pin corner rivet joint; 3. Positioning groove; 4. Positioning shaft; 5. SPCC electroplated PIN corner material strip; 6. Heat sink body material strip; 7. First slide groove; 8. Second slide groove; 9. Moving block; 10. Slot; 11. Feeding block; 12. Feeding pin; 13. Positioning pin; 14. Feeding rod; 15. Feeding spring; 16. Pin; 1601. Inclined surface. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Reference Figure 1-7A stamping die for a heat sink includes a lower die base 1. A plurality of floating pins 102 are inserted through the top of the lower die base 1. Grooves matching the floating pins 102 are formed at the positions of the floating pins 102 on the top of the lower die base 1. A strip groove 104 is formed on the top of the lower die base 1. A pin corner rivet seat 103 is provided within the strip groove 104. An upper die base 2 is formed on the top of the lower die base 1. A pin corner rivet head 206 is fixedly connected to the upper die base 2 on the side near the lower die base 1. SPCC electroplated pin corner strip 5 is provided within the strip groove 104. Circular holes matching the tips of the feed pins 12 and positioning pins 13 are formed on the SPCC electroplated pin corner strip 5. The top of the lower die base 1 is provided with heat sink body material. The strips 6, 5, and 6 are vertically distributed, consisting of SPCC electroplated PIN scrap strip and heat sink body strip. The lower mold base 1 has a first groove 7 and a second groove 8. A moving block 9 is installed in the first groove 7, with a slot 10 at one end. A feeding block 11 is fixedly connected to one side of the moving block 9. The feeding block 11 is located in the second groove 8. Both the moving block 9 and the feeding block 11 are slidably connected to the lower mold base 1. A feeding pin 12 is fixedly connected to the top of the feeding block 11, and a positioning pin 13 is installed on one side of the feeding pin 12. The positioning pin 13 is fixedly connected to the lower mold base 1. A feeding rod 14 is fixedly connected to one side of the moving block 9, passing through the lower mold base 1 and slidably connected to it. The feeding rod 14 is fitted with a feeding device. Spring 15, the feeding spring 15 is set on one side of the lower die base 1. The upper die base 2 is fixedly connected to a pin 16 on the side near the lower die base 1. The side of the pin 16 away from the upper die base 2 is an inclined surface 1601. Due to the use of the lower die base and the upper die base cooperating to stamp the heat sink body strip and the upper die base driving the pin corner rivet head to move closer to the SPCC electroplated PIN corner strip, and being able to drive the SPCC electroplated PIN corner strip to move during the stamping process, the lower die base and the upper die base cooperate to stamp the heat sink body strip into a heat sink. The upper die base drives the pin corner rivet head to move and contact the SPCC electroplated PIN corner strip. Through the cooperation of the pin corner rivet head and the pin corner rivet head, the S The PCC electroplated PIN corner strip is riveted onto the heat sink body strip, combining the two processes of stamping the heat sink and riveting the SPCC electroplated PIN corner strip into a single mold or in a continuous operation. This significantly reduces the number of process steps. When the upper mold base moves closer to the lower mold base, it also drives the pin to move. The inclined surface contacts the moving block, causing the moving block to move laterally. The moving block then drives the feeding block, which in turn drives the feeding pin, thus moving the SPCC electroplated PIN corner strip. When the pin moves away from the lower mold base, the contracted feeding spring extends, returning the moving block to its initial position, which in turn returns the feeding pin to its initial position, allowing the feeding pin to re-insert into the round hole on the SPCC electroplated PIN corner strip.This technology effectively solves the problem mentioned in the background art: traditional heat sink stamping dies cannot simultaneously stamp the heat sink and rivet the heat sink to the SPCC electroplated pin corners. This results in numerous processes, increased overall production time, reduced capacity, and increased costs. Instead, it achieves highly automated, synchronous, and integrated production of heat sink stamping and pin corner riveting, reducing the number of dies and complex processes, and lowering the costs of die procurement, maintenance, and labor.

[0016] In this embodiment, the top of the lower die holder 1 is provided with four positioning grooves 3 arranged in a square pattern, and the bottom of the upper die holder 2 is fixedly connected with four positioning shafts 4 arranged in a square pattern. The positioning grooves 3 and the positioning shafts 4 are adapted to each other. When the stamping operation is performed, the upper die holder 2 is lowered, and the upper die holder 2 will drive the positioning shafts 4 to lower and insert into the positioning grooves 3, so as to position the position between the lower die holder 1 and the upper die holder 2 and ensure the accuracy of stamping.

[0017] In this embodiment, the lower mold base 1 is fixedly connected to a lower fixing base 101 on the side away from the upper mold base 2.

[0018] In this embodiment, the upper mold base 2 is fixedly connected to a first fixing plate 204 on the side away from the lower mold base 1. The first fixing plate 204 is provided with a second fixing plate 205 on the side away from the upper mold base 2. The first fixing plate 204 and the second fixing plate 205 are provided with four square-arranged guide rods 202 on the side close to each other. The guide rods 202 are slidably connected to the first fixing plate 204 and the second fixing plate 205. The first fixing plate 204 and the first fixing plate 205 are provided with four square-arranged reset springs 203 on the side close to each other.

[0019] In this embodiment, the first fixing plate 204 and the second fixing plate 205 are both provided with grooves that are adapted to the guide rod 202 and the reset spring 203.

[0020] In this embodiment, the second fixing plate 205 is fixedly connected to the upper fixing seat 201 on the side away from the first fixing plate 204.

[0021] Working principle: During the stamping process, the heat sink main body strip 6 is placed on the lower die base 1, and the SPCC electroplated PIN scrap strip 5 is placed in the strip groove 104. The SPCC electroplated PIN scrap strip 5 is then placed on the heat sink main body strip 6, and both the heat sink main body strip 6 and the SPCC electroplated PIN scrap strip 5 are positioned between the floating pins 102. These pins limit and guide the SPCC electroplated PIN scrap strip 5 and the heat sink main body strip 6, allowing them to move along the floating pins 102. This ensures stability during movement and effectively prevents displacement of the SPCC electroplated PIN scrap strip 5 and the heat sink main body strip 6. The offset is achieved by using an external feeder to move the heat sink body strip 6. When the upper mold base 2 moves closer to the lower mold base 1, the upper mold base 2 will also move the pin 16. The inclined surface 1601 on the pin 16 will contact the moving block 9. If the pin 16 continues to move, it will press the moving block 9, causing it to move laterally. The movement of the moving block 9 will then move the feed rod 14 and the feed block 11. The moving block 9 will move within the first slide groove 7, and the feed block 11 will move within the second slide groove 8. When the feed rod 14 moves, it will press the feed spring 15, causing it to contract. The movement of the feed block 11 will then move the feed needle 12. The tips of the feed needle 12 and the positioning needle 13 will pass through the round hole on the SPCC electroplated PIN corner strip 5. When the feed pin 12 moves, it drives the SPCC electroplated PIN scrap strip 5 to move, thus feeding the SPCC electroplated PIN scrap strip 5. When the pin 16 is inserted into the slot 10 and the inclined surface 1601 is in the slot 10, the SPCC electroplated PIN scrap strip 5 can move a certain distance for feeding, completing the stamping and riveting. When the upper die base 2 moves away from the lower die base 1, the pin 16 can move out of the slot 10. The pin 16 no longer applies pressure to the moving block 9, and the contracted feed spring 15 will extend, allowing the feed rod 14 to move back to its initial position. The feed rod 14 will then drive the moving block 9 to move back to its initial position, and the moving block 9 will drive the feed block 11 to move back to its initial position. The feed block 11 will then drive... The feed pin 12 moves back to its initial position, and its tip passes through the round hole on the SPCC electroplated PIN scrap strip 5 again. During the next stamping and riveting, the feed pin 12 moves again to feed the SPCC electroplated PIN scrap strip 5. When the heat sink body strip 6 moves to the riveting position of the SPCC electroplated PIN scrap strip 5, the upper fixing seat 201 descends. The upper fixing seat 201 then drives the second fixing plate 205 to descend, which in turn drives the guide rod 202 and the return spring 203 to descend. The guide rod 202 and the return spring 203 then drive the first fixing plate 204 to descend, which in turn drives the upper mold base 2 to descend and stamp the heat sink body strip 6 to form the heat sink.As the upper die holder 2 descends, it also causes the pin corner rivet joint 206 to descend and contact the SPCC electroplated PIN corner strip 5 for stamping. Through the cooperation of the pin corner rivet seat 103 and the pin corner rivet joint 206, the SPCC electroplated PIN corner strip 5 is riveted to the heat sink body strip 6. During the descent of the upper die holder 2, the positioning shaft 4 descends and inserts into the positioning groove 3, thus positioning the lower die holder 1 and the upper die holder 2 to ensure accurate positioning. After stamping is completed, an external feeder continues to pull and move the heat sink body strip 6, removing the stamped heat sink from the die.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A stamping die for a heat sink, comprising a lower die base (1), characterized in that, The top of the lower die base (1) is provided with several sinker pins (102). The top of the lower die base (1) has grooves that match the sinker pins (102). The top of the lower die base (1) has a strip groove (104). The lower die base (1) has a pin corner rivet seat (103) in the strip groove (104). The top of the lower die base (1) is provided with an upper die base (2). The upper die base (2) is fixed on the side near the lower die base (1). A pin corner rivet joint (206) is fixedly connected. SPCC electroplated PIN corner strip (5) is provided in the strip groove (104). A heat sink body strip (6) is provided on the top of the lower mold base (1). The SPCC electroplated PIN corner strip (5) and the heat sink body strip (6) are vertically distributed. A first slide groove (7) and a second slide groove (8) are provided on the lower mold base (1). A moving block (9) is provided in the first slide groove (7). One end of the moving block (9) is provided with a slot (10), and a feeding block (11) is fixedly connected to one side of the moving block (9). The feeding block (11) is set in the second slide groove (8). The moving block (9) and the feeding block (11) are both slidably connected to the lower mold base (1). A feeding pin (12) is fixedly connected to the top of the feeding block (11). A positioning pin (13) is provided on one side of the feeding pin (12). The positioning pin (13) is fixedly connected to the lower mold base (1). The moving block (9) A feeding rod (14) is fixedly connected to one side of the upper mold base (1). The feeding rod (14) passes through the lower mold base (1) and is slidably connected to the lower mold base (1). A feeding spring (15) is sleeved on the feeding rod (14). The feeding spring (15) is located on one side of the lower mold base (1). A pin (16) is fixedly connected to the upper mold base (2) on the side close to the lower mold base (1). The pin (16) is inclined (1601) on the side away from the upper mold base (2).

2. The stamping die for the heat sink according to claim 1, characterized in that, The lower mold base (1) has four square-shaped positioning grooves (3) on its top, and the upper mold base (2) has four square-shaped positioning shafts (4) fixedly connected to its bottom. The positioning grooves (3) and positioning shafts (4) are compatible.

3. The stamping die for the heat sink according to claim 2, characterized in that, The lower mold base (1) is fixedly connected to a lower fixing base (101) on the side away from the upper mold base (2).

4. The stamping die for the heat sink according to claim 3, characterized in that, The upper mold base (2) is fixedly connected to a first fixing plate (204) on the side away from the lower mold base (1). The first fixing plate (204) is provided with a second fixing plate (205) on the side away from the upper mold base (2). The first fixing plate (204) and the second fixing plate (205) are provided with four square-shaped guide rods (202) on the side close to each other. The guide rods (202) are slidably connected to the first fixing plate (204) and the second fixing plate (205). The first fixing plate (204) and the first fixing plate (205) are provided with four square-shaped return springs (203) on the side close to each other.

5. The stamping die for the heat sink according to claim 4, characterized in that, The first fixing plate (204) and the second fixing plate (205) are both provided with grooves that are compatible with the guide rod (202) and the return spring (203).

6. The stamping die for the heat sink according to claim 5, characterized in that, The second fixing plate (205) has an upper fixing seat (201) fixedly connected to the side away from the first fixing plate (204).

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