TO package photodiode fixing support

Abstract

The utility model provides a kind of TO encapsulation photodiode fixed bolster, and photodiode includes package shell and pin, package shell is equipped with photosensitive chip inside, fixed bolster includes: female head, for installing photodiode, female head is equipped with light hole along axial direction, and light hole is used for photosensitive chip receiving light source;Male head includes supporting part and abutting portion, and abutting portion is used for cooperating with female head and fixing photodiode, pin passes through abutting portion and is welded with circuit board along axial direction, and supporting part is welded with circuit board.The photodiode is fixed in female head by the cooperation of male head and female head, the pin of photodiode is welded with circuit board by passing through abutting portion, and is fixed by being welded with circuit board by supporting part, so that photodiode has enough supporting capacity in strong vibration environment, the pin of photodiode does not deform or de-soldering with circuit board, avoid the risk of photosensitive chip and light source forming angle and falling, and then avoid affecting normal output signal of photosensitive chip.

Description

Technical Field

[0001] This utility model relates to the field of optical sensor technology, and in particular to a TO packaged photodiode mounting bracket. Background Technology

[0002] Photodiodes are optical devices based on semiconductor materials that convert light signals into electrical signals. They are widely used in optical communication, optical measurement, photoelectric switches, and consumer electronics. They are packaged in various forms, including TO (metal-on-a-chip) packages, plastic packages, and ceramic packages. TO packages, with their metal casing, offer excellent thermal conductivity and electromagnetic shielding, and are highly standardized, making them the most commonly used. A TO package consists of a cylindrical Kovar alloy thin-walled shell, a glass window, and two or three leads. However, under strong vibration conditions, the two or three leads of a TO package may no longer provide sufficient support. The photodiode, especially at the leads, may deform or detach, causing the photosensitive chip to form an angle with the light source or even fall off, thus affecting the normal output signal of the photosensitive chip.

[0003] Currently, existing technologies typically mount photodiodes tightly to the circuit board, which does increase stability, but it is detrimental to chip heat dissipation and may cause leakage current. It is also inconvenient to adjust the mounting height. Some manufacturers have improved the packaging process, mainly by increasing the number of pins to enhance the support effect. However, the number of photodiodes that need to be used in strong vibration environments is not large, and the models are not fixed. Therefore, customizing the packaging process is too costly. There is an urgent need in the market for a fixture to assist ordinary photodiodes in being used in special environments. Summary of the Invention

[0004] This invention provides a mounting bracket for a TO-packaged photodiode to solve the problem that conventional TO-packaged structures of existing photodiodes cannot guarantee structural stability under strong vibration environments.

[0005] This utility model provides a mounting bracket for a TO-packaged photodiode. The photodiode includes a package housing and leads, and a photosensitive chip is disposed inside the package housing. The mounting bracket includes:

[0006] A female connector is used to mount the photodiode. The female connector has a light-passing hole along the axial direction, which is used by the photosensitive chip to receive a light source.

[0007] The male connector includes a support portion and a contact portion. The contact portion is used to cooperate with the female connector to fix the photodiode. The pin passes through the contact portion axially and is soldered to the circuit board. The support portion is also soldered to the circuit board.

[0008] In one embodiment of the present invention, the female head is provided with a limiting portion around the light-transmitting hole, and the limiting portion extends radially along the female head.

[0009] In one embodiment of the present invention, the encapsulation shell includes a small diameter section and a large diameter section. The diameter of the small diameter section is smaller than the diameter of the light-transmitting hole, and the diameter of the large diameter section is smaller than the inner diameter of the female head and larger than the diameter of the light-transmitting hole. The large diameter section abuts against the limiting part.

[0010] In one embodiment of this utility model, the outer diameter of the abutting part is smaller than the inner diameter of the female head, but larger than the diameter of the light-transmitting hole.

[0011] In one embodiment of this utility model, the abutting part is welded and fixed to the female head.

[0012] In one embodiment of the present invention, the female head is provided with an internal thread along the circumferential direction, the abutting part is provided with an external thread along the circumferential direction, and the abutting part is threadedly connected to the female head.

[0013] In one embodiment of the present invention, the abutting portion has multiple supporting portions distributed circumferentially.

[0014] In one embodiment of this utility model, the supporting part and the abutting part are welded and fixed.

[0015] In one embodiment of the present invention, the abutting part is provided with a threaded hole, and the supporting part is threadedly connected to the abutting part.

[0016] In one embodiment of the present invention, the abutting portion is provided with a through hole along the axial direction, and the pin passes through the through hole and is welded and fixed to the circuit board.

[0017] The beneficial effects of this utility model are as follows: This utility model proposes a TO-packaged photodiode fixing bracket, which achieves precise positioning and stable clamping of the TO-packaged photodiode through the matching design of a female and a male connector. The light-passing hole of the female connector is adapted to the photodiode package shell, and the abutment part of the male connector fits tightly with the female connector, which can effectively limit the axial and radial displacement of the photodiode and avoid loosening or displacement caused by vibration, external impact, etc. Furthermore, the leads of the TO-packaged photodiode pass through the abutment part of the male connector along the axial direction and are soldered to the circuit board. At the same time, the support part of the male connector is soldered to the circuit board, which further enhances the mechanical strength and reliability of the electrical connection. This gives the TO-packaged photodiode sufficient support capacity in the strong vibration environment, and the leads of the photodiode will not deform or desolder from the circuit board, avoiding the risk of the photosensitive chip and the light source forming an angle and falling off, thereby avoiding affecting the normal output signal of the photosensitive chip. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] In the attached diagram:

[0020] Figure 1 This is a schematic diagram of the structure of a TO-packaged photodiode mounting bracket provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the assembly of a TO-packaged photodiode and a fixing bracket provided in one embodiment of the present invention;

[0022] Figure 3 This is a cross-sectional structural diagram of the TO-packaged photodiode and the mounting bracket provided in one embodiment of the present invention.

[0023] The attached figures are labeled as follows:

[0024] Photodiode 1, package housing 101, small diameter section 101a, large diameter section 101b, lead 102, female connector 2, light-passing hole 201, limiting part 202, male connector 3, support part 301, abutment part 302, and through hole 302a. Detailed Implementation

[0025] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0026] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0027] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0028] Please combine Figures 1 to 3 As shown, this utility model provides a mounting bracket for a TO-packaged photodiode.

[0029] In an exemplary embodiment of this application, the photodiode 1 includes a package housing 101 and pins 102. A photosensitive chip is disposed within the package housing 101, and the mounting bracket includes:

[0030] The female connector 2 is used to install the photodiode 1. The female connector 2 has a light-passing hole 201 along the axial direction. The light-passing hole 201 is used for the photosensitive chip to receive the light source.

[0031] The male connector 3 includes a support portion 301 and an abutment portion 302. The abutment portion 302 is used to cooperate with the female connector 2 to fix the photodiode 1. The pin 102 passes through the abutment portion 302 axially and is soldered to the circuit board, and the support portion 301 is soldered to the circuit board.

[0032] In this embodiment, the female connector 2 and male connector 3 cooperate to form an all-around clamp for the photodiode 1. The female connector 2 mounts the photodiode 1, and the male connector 3's abutment portion 302 cooperates with the female connector 2 to firmly fix the photodiode 1. Compared to relying solely on pin 102 for support, this structure can effectively disperse the external force generated by vibration, preventing deformation or desoldering of the photodiode 1, especially at pin 102, ensuring that the photosensitive chip can maintain the correct working posture and stably output signals even under strong vibration environments. The fixing bracket maintains a certain distance between the photodiode 1 and the circuit board, changing the traditional method of mounting it tightly against the circuit board, effectively improving the chip's heat dissipation conditions, reducing the risk of leakage current due to poor heat dissipation, ensuring the normal working performance of the photodiode 1, and improving its electrical stability and service life. Furthermore, the fixing bracket is independent of the photodiode 1 and the circuit board, used as an auxiliary fixture, and is not limited by the photodiode 1 model, adapting to various common TO packaged photodiodes 1. By adjusting the cooperation method and installation position of the female connector 2 and male connector 3, the installation height of the photodiode 1 can be flexibly adjusted to meet the usage requirements in different scenarios. The light-passing hole 201 arranged along the axial direction of the female head 2 provides a stable light path for the photosensitive chip to receive the light source. Even in a strong vibration environment, it can ensure that the light is accurately projected onto the photosensitive chip, avoid the light path deviation caused by the displacement of the photodiode 1, ensure the accuracy and stability of the light signal conversion, and improve the detection accuracy and signal response capability of the photodiode 1.

[0033] In an exemplary embodiment of this application, the female head 2 is provided with a limiting portion 202 around the light-transmitting hole 201, and the limiting portion 202 extends radially along the female head 2.

[0034] In this embodiment, the limiting part 202 cooperates with the photodiode 1 package housing 101 to precisely limit its circumferential and axial position within the female connector 2, preventing the photodiode 1 from shifting or rotating during installation or vibration. The presence of the limiting part 202 provides a clear positioning reference for the installation of the photodiode 1, allowing assembly personnel to quickly and accurately place it into the appropriate position within the female connector 2, reducing trial and error and adjustment time, and improving production efficiency.

[0035] In an exemplary embodiment of this application, the encapsulation housing 101 includes a small diameter section 101a and a large diameter section 101b. The diameter of the small diameter section 101a is smaller than the diameter of the light-transmitting hole 201, and the diameter of the large diameter section 101b is smaller than the inner diameter of the female head 2 and larger than the diameter of the light-transmitting hole 201. The large diameter section 101b abuts against the limiting part 202.

[0036] In this embodiment, the diameter of the small-diameter segment 101a of the encapsulation shell 101 is smaller than the diameter of the light-transmitting hole 201. During installation, the small-diameter segment 101a extends from inside the female connector 2 and is located outside the female connector 2, ensuring that the photodiode 1 can receive light signals. The diameter of the large-diameter segment 101b is between the light-transmitting hole 201 and the inner diameter of the female connector 2, and it abuts tightly against the limiting part 202, forming a stepped limiting structure. The abutting cooperation between the large-diameter segment 101b and the limiting part 202 ensures that the photosensitive chip of the photodiode 1 can always be kept on the central axis of the light-transmitting hole 201, ensuring that the light source can be accurately projected onto the surface of the photosensitive chip along the preset light path.

[0037] In an exemplary embodiment of this application, the outer diameter of the contact portion 302 is smaller than the inner diameter of the female head 2, but larger than the diameter of the light-transmitting hole 201.

[0038] In this embodiment, the outer diameter of the abutment portion 302 is smaller than the inner diameter of the female connector 2, ensuring that it can be smoothly inserted into the female connector 2 and fit tightly with it. Simultaneously, its design, larger than the diameter of the light-transmitting hole 201, allows the abutment portion 302 to form an annular contact surface with the inner wall of the female connector 2, increasing the friction and fixing area between them. Under strong vibration conditions, this structure can effectively disperse external forces, preventing the photodiode 1 from shifting or loosening. Compared to conventional fixing methods, it significantly enhances the clamping force and stability of the fixing bracket on the photodiode 1, reducing the risk of pin 102 desoldering and chip misalignment.

[0039] In an exemplary embodiment of this application, the abutment portion 302 is welded and fixed to the female head 2.

[0040] In this embodiment, under harsh environments such as strong vibration and impact, the welded and fixed structure can evenly distribute external forces, effectively avoid the positional displacement of photodiode 1 caused by loosening, ensure the stable connection between pin 102 and the circuit board, and significantly improve the overall mechanical strength and durability of the fixing bracket.

[0041] In an exemplary embodiment of this application, the female head 2 has an internal thread along the circumferential direction, and the abutment portion 302 has an external thread along the circumferential direction, and the abutment portion 302 is threadedly connected to the female head 2.

[0042] In this embodiment, the threaded connection allows for quick assembly and disassembly of the contact portion 302 and the female head 2. When the photodiode 1 malfunctions or needs replacement, it can be separated from the mounting bracket without complex tools, greatly shortening maintenance time. Compared to welding, this design avoids the problem of overall scrapping due to damage to the welded parts, reducing maintenance costs.

[0043] In an exemplary embodiment of this application, the abutment portion 302 has a plurality of support portions 301 distributed circumferentially.

[0044] In this embodiment, multiple support parts 301 are distributed circumferentially, forming multi-point contact support with the circuit board, which is like building a stable "tripod" for the photodiode 1. Compared with single-point or double-point support, this three-dimensional support structure can more effectively disperse vibration and impact force, and significantly improve the deformation resistance of the fixed bracket in a strong vibration environment.

[0045] Specifically, the contact portion 302 shown in this application is provided with two support portions 301.

[0046] In an exemplary embodiment of this application, the support portion 301 and the abutment portion 302 are welded and fixed.

[0047] In this embodiment, under harsh environments such as strong vibration and impact, the welded fixing structure can evenly distribute external forces throughout the entire support system, preventing the support part 301 from loosening or breaking due to local stress concentration, thereby providing more stable support for the photodiode 1. Compared with other connection methods, welding fixing can improve the overall vibration resistance of the support and effectively ensure the stable operation of the photodiode 1 under complex working conditions.

[0048] In an exemplary embodiment of this application, the abutment portion 302 is provided with a threaded hole, and the support portion 301 is threadedly connected to the abutment portion 302.

[0049] In this embodiment, the threaded connection allows the support part 301 and the abutment part 302 to be quickly separated and assembled without tools or with only simple tools, significantly reducing equipment maintenance time. When a support part 301 is damaged or needs to be replaced, only the corresponding support part 301 needs to be unscrewed for individual repair or replacement, without the need to disassemble the entire bracket, significantly reducing maintenance costs.

[0050] In an exemplary embodiment of this application, the abutment portion 302 has a through hole 302a along the axial direction, and the pin 102 passes through the through hole 302a and is soldered and fixed to the circuit board.

[0051] In this embodiment, the through-hole 302a provides a precise positioning channel for the pin 102 of the photodiode 1. After passing through the through-hole 302a, the pin 102 is soldered to the circuit board, forming a stable three-point support structure (package housing 101, abutment portion 302, and circuit board). This design effectively disperses the stress borne by the pin 102 under vibration. Compared with direct soldering to the circuit board, it can effectively improve the fatigue strength of the pin 102, significantly reduce the risk of the pin 102 desoldering due to shaking, ensure the long-term stability of the electrical connection, and ensure that the photodiode 1 continues to work stably under complex operating conditions.

[0052] Working principle: This application utilizes the mating design of female connector 2 and male connector 3 to achieve precise positioning and stable clamping of the TO-packaged photodiode 1. The light-passing hole 201 of the female connector 2 is adapted to the package shell 101 of the photodiode 1, and the abutment portion 302 of the male connector 3 is tightly fitted with the female connector 2. This effectively restricts the axial and radial displacement of the photodiode 1, preventing loosening or displacement caused by vibration, external impact, or other factors. Furthermore, the pins 102 of the TO-packaged photodiode 1 pass axially through the abutment portion 302 of the male connector 3 and are soldered to the circuit board. Simultaneously, the support portion 301 of the male connector 3 is soldered to the circuit board, further enhancing the mechanical strength and reliability of the electrical connection. This ensures that the TO-packaged photodiode 1 has sufficient support capacity under strong vibration environments, preventing deformation or detachment of the pins 102 from the circuit board. This avoids the risk of the photosensitive chip and the light source forming an angle and falling off, thereby preventing any impact on the normal output signal of the photosensitive chip.

[0053] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A mounting bracket for a TO-packaged photodiode, the photodiode comprising a package housing and leads, wherein a photosensitive chip is disposed within the package housing, characterized in that, The fixing bracket includes: A female connector is used to mount the photodiode. The female connector has a light-passing hole along the axial direction, which is used by the photosensitive chip to receive a light source. The male connector includes a support portion and a contact portion. The contact portion is used to cooperate with the female connector to fix the photodiode. The pin passes through the contact portion axially and is soldered to the circuit board. The support portion is also soldered to the circuit board.

2. The TO-packaged photodiode mounting bracket according to claim 1, characterized in that: The female head is provided with a limiting part around the light-transmitting hole, and the limiting part extends radially along the female head.

3. The TO-packaged photodiode mounting bracket according to claim 2, characterized in that: The encapsulation shell includes a small diameter section and a large diameter section. The diameter of the small diameter section is smaller than the diameter of the light-transmitting hole, and the diameter of the large diameter section is smaller than the inner diameter of the female head but larger than the diameter of the light-transmitting hole. The large diameter section abuts against the limiting part.

4. The TO-packaged photodiode mounting bracket according to claim 1, characterized in that: The outer diameter of the abutment portion is smaller than the inner diameter of the female head, but larger than the diameter of the light-transmitting hole.

5. The TO-packaged photodiode mounting bracket according to claim 4, characterized in that: The abutting part is welded and fixed to the female head.

6. The TO-packaged photodiode mounting bracket according to claim 4, characterized in that: The female head has an internal thread along the circumference, and the abutting part has an external thread along the circumference. The abutting part is threadedly connected to the female head.

7. The TO-packaged photodiode mounting bracket according to claim 1, characterized in that: The abutment portion has multiple supporting portions distributed circumferentially.

8. The TO-packaged photodiode mounting bracket according to claim 7, characterized in that: The supporting part is welded and fixed to the abutting part.

9. The TO-packaged photodiode mounting bracket according to claim 7, characterized in that: The abutting part is provided with a threaded hole, and the supporting part is threadedly connected to the abutting part.

10. The TO-packaged photodiode mounting bracket according to claim 1, characterized in that: The abutment portion has a through hole along the axial direction, and the pin passes through the through hole and is soldered and fixed to the circuit board.

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