Aircraft power module

Abstract

The application relates to the technical field of power supply, and discloses an aircraft power supply module. The aircraft power supply module comprises a shell, heat dissipation fins arranged outside the shell, an integrated circuit board arranged in the shell, and a heating component arranged on the integrated circuit board. The heating component is in a sheet structure and is vertically distributed at the edge of the integrated circuit board. A heating surface of the heating component is close to the shell, and the heating surface is in thermal conduction contact with one surface of a heat conduction plate. The other surface of the heat conduction plate is in thermal conduction contact with the shell. The heat of the heating component is transmitted to the shell through the heat conduction plate, and the shell is heat-dissipated through the heat dissipation fins. The application designs an integrated power supply module, which can effectively realize efficient heat dissipation of a system and meet insulation requirements.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and more particularly to an aircraft power supply module. Background Technology

[0002] Traditional power modules face severe heat dissipation challenges during long-term high-load operation: Power devices (such as MOSFETs and IGBTs) inside DC-DC converters generate significant Joule heat during energy conversion. When the heat dissipation design is inadequate, this heat accumulates continuously within the enclosed space. This heat buildup triggers a triple negative effect: First, it increases the junction temperature of semiconductor devices, leading to increased on-resistance, exacerbated switching losses, and a 5-15% decrease in overall efficiency. Second, the high-temperature environment accelerates the aging of components such as electrolytic capacitors, significantly shortening equipment lifespan. More severely, it may trigger thermal protection mechanisms for forced shutdown, or in extreme cases, cause permanent damage such as solder joint melting and chip burnout. Especially in continuous high-power applications such as industrial automation and new energy inverters, insufficient heat dissipation has become a key bottleneck restricting the reliability of power modules. Utility Model Content

[0003] The purpose of this application is to provide an aircraft power module. This application designs an integrated power module that can effectively achieve efficient heat dissipation of the system while meeting insulation requirements.

[0004] To address the aforementioned technical problems, this application provides an aircraft power module, comprising: a housing with heat dissipation fins arranged on its exterior; an integrated circuit board disposed inside the housing; and heat-generating components disposed on the integrated circuit board. The heat-generating components are sheet-like structures vertically distributed along the edge of the integrated circuit board. The heat-generating surface of each component faces the housing and is in thermal conductive contact with one side of a heat-conducting plate. The other side of the heat-conducting plate is in thermal conductive contact with the housing. The heat from the heat-generating components is transferred to the housing through the heat-conducting plate, and the housing dissipates heat through the heat dissipation fins.

[0005] Optionally, a thermally conductive adhesive layer is further included between the heating element and the heat-conducting plate, and a thermally conductive adhesive layer is further included between the heat-conducting plate and the housing.

[0006] Optionally, the thermally conductive adhesive layer is thermally conductive silicone grease with a thermal conductivity greater than 12 W / (m·K).

[0007] Optionally, the heating element and the heat-conducting plate are pressed together and fixed to the housing by a fastener.

[0008] Optionally, the fixing member includes a pressure plate and an elastic pressure plate. The elastic pressure plate is arranged between the pressure plate and the heating element. The elastic pressure plate generates pressure through its own deformation, thereby pressing the heating element, the heat-conducting plate and the housing together.

[0009] Optionally, it also includes a voltage conversion component, which includes a transformer housing and an electromagnet inside the transformer housing. The gap between the electromagnet and the transformer housing is filled with potting compound, and the transformer housing is in thermal conductive contact with the electromagnet.

[0010] Optionally, the housing extends inward on opposite sides to clamp the transformer housing, so that the transformer housing and the housing make thermal conductive contact, and an outer groove is formed on the outside of the housing, with groove fins provided in the outer groove.

[0011] Optionally, the housing includes an upper shell and a lower shell, the lower shell being integrally formed and having an opening at the upper end, the upper shell being configured to cover the upper opening, and a sealing ring being provided at the joint between the upper shell and the lower shell to seal the housing.

[0012] Optionally, the shell is made of AL6061-T6 material, which has an elastic modulus of 6.89E04, a Poisson's ratio of 0.33, and a density of 2750 kg / m3.

[0013] Optionally, the heat-conducting plate is an aluminum nitride ceramic sheet.

[0014] This application designs an integrated power module that can effectively achieve efficient heat dissipation of the system while meeting insulation requirements. Attached Figure Description

[0015] Figure 1 The diagram shown is a structural schematic of an aircraft power module according to an embodiment of this application.

[0016] Figure 2 The diagram shown is a schematic diagram of the insulating and heat dissipation structure in the aircraft power module according to an embodiment of this application.

[0017] Figure 3 Displayed as Figure 2 A magnified view of a portion of position A in the middle;

[0018] Figure 4 The diagram shown is an exploded structural diagram of the shell according to an embodiment of this application;

[0019] Figure 5 The diagram shown is a structural schematic of the cover plate portion according to an embodiment of this application.

[0020] Figure 6 The diagram shown is a structural schematic of an aircraft power module without a top shell, according to an embodiment of this application.

[0021] Figure 7 The diagram shown is a structural schematic of the integrated circuit board and voltage conversion device according to an embodiment of this application.

[0022] Figure 8 The diagram shown is a structural schematic of the fastener in an embodiment of this application.

[0023] Figure 9 The diagram shown is a structural schematic of the elastic compression sheet according to an embodiment of this application.

[0024] Figure 10 The diagram shown is a structural schematic of the lower shell and transformer housing according to an embodiment of this application.

[0025] Figure 11 The diagram shown is a schematic representation of the outer structure of the lower shell in an embodiment of this application. Detailed Implementation

[0026] The following embodiments further illustrate the technical solutions of this application. It should be understood that the specific embodiments described herein are merely for explaining this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not all of them.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The term "aircraft" is defined as a flight transport system of any size having at least one lift propeller as its propulsion source. The term "aircraft" can include both "manned" and "unmanned" flight transport systems. A manned aircraft can mean a flight transport system carrying one or more human passengers, none of whom have control over the aircraft. A manned aircraft can also mean a flight transport system carrying one or more human passengers, some of whom, or one of whom, has partial or full control over the aircraft. An unmanned aircraft can mean a flight transport system that does not carry any human passengers and flies autonomously or is remotely controlled by someone at a distance.

[0030] In this specification, "aircraft" includes manned aircraft and any unmanned vehicle, such as unmanned aerial vehicles (UAVs), unmanned aircraft, remotely piloted aircraft, unmanned aircraft systems, any aircraft classified by the International Civil Aviation Organization (ICAO) under cycle 328AN / 190, and so on. As an example, a drone can take the form of a single- or multi-rotor helicopter (such as a quadcopter) or a fixed-wing aircraft. Furthermore, certain portions of this disclosure can be used in conjunction with drones in the form of other types of unmanned vehicles (e.g., wheeled, tracked, and / or watercraft).

[0031] The aircraft requires power modules in multiple locations, but existing power module designs have significant shortcomings. The core problem lies in the dispersed layout of components and low integration. This structure results in excessively large overall module weight (typically exceeding 5 kg), significantly occupying space, increasing the aircraft's payload burden, and encroaching on the installation space of other critical equipment. Figure 1 An exemplary embodiment of the power module of this application is shown. Its length does not exceed 22cm, its width does not exceed 12cm, and its weight is less than 1.5kg. By reconstructing the power design through modular integration technology, higher energy density is achieved within a limited volume, which not only reduces the overall weight but also optimizes space utilization.

[0032] Embodiments of this application are described below with reference to the accompanying drawings, such as Figure 2 and Figure 3 As shown, the aircraft power module of this application embodiment includes: a housing 1, an integrated circuit board 2, a heat-generating component 3, and a heat-conducting plate 4. Heat dissipation fins 10 are arranged on the exterior of the housing 1. The integrated circuit board 2 is disposed inside the housing 1. The heat-generating component 3 is disposed on the integrated circuit board 2, wherein the heat-generating component 3 has a sheet-like structure and is vertically distributed along the edge of the integrated circuit board 2. The heat-generating surface of the heat-generating component 3 faces the housing 1, and the heat-generating surface is in thermal conductive contact with one side of the heat-conducting plate 4. The other side of the heat-conducting plate 4 is in thermal conductive contact with the housing 1. The heat from the heat-generating component 3 is transferred to the housing 1 through the heat-conducting plate 4, and the housing 1 dissipates heat through the heat dissipation fins 10.

[0033] The integrated circuit board 2 is mounted inside the housing 1 and has a safe gap between it and the bottom and sides of the housing 1, forming an anti-creep structure to reduce the risk of high voltage discharge and ensure electrical safety.

[0034] The heat-generating component 3 is a power device, such as an insulated gate bipolar transistor (IGBT). However, it is understood that there are no particular restrictions on the specific type, and those skilled in the art can set it reasonably according to the actual situation.

[0035] In one embodiment, the heating element 3 adopts a single-sided heating design, which is vertically distributed on the edge of the integrated circuit board 2, and the heating surface is close to and in close contact with the housing 1, so that the heat is mainly transferred out through the heat-conducting plate 4 through the side close to the housing 1, resulting in higher heat dissipation efficiency.

[0036] In another embodiment, the heating element 3 generates heat as a whole. One side of the heating element 3 is a metal surface, which has better thermal conductivity and a higher temperature. Therefore, it can be set as the heating surface against the housing 1.

[0037] In one embodiment, such as Figure 3 As shown, a thermally conductive adhesive layer 5 is further included between the heat-generating component 3 and the heat-conducting plate 4, and also between the heat-conducting plate 4 and the housing 1. In this embodiment, the thermally conductive adhesive layer is thermally conductive silicone grease, with a thermal conductivity greater than 12 W / (m·K). Common thermally conductive silicone greases typically have a thermal conductivity between 1.0 and 6.0 W / (m·K), suitable for the heat dissipation needs of ordinary electronic devices. This embodiment uses thermally conductive silicone grease with a thermal conductivity greater than 12 W / (m·K), which can significantly improve heat conduction efficiency and prevent overheating of the device.

[0038] In one embodiment, the heat-conducting plate 4 is a double-layer ceramic sheet. During aircraft flight, the heat-conducting plate 4 may develop cracks due to vibration and other external forces. Because the pins of the heating element 3 have high voltage (e.g., 800V), if creepage occurs at the cracks, it can lead to insulation failure. This embodiment uses a double-layer heat-conducting plate 4. Creepage can only occur if both layers of the heat-conducting plate crack simultaneously and the cracks align. Therefore, as a double-layer insulating structure, the heat-conducting plate can effectively reduce the potential for crack creepage.

[0039] In one embodiment, the ceramic sheet can be 1mm thick, and thermal grease can be applied between the two layers of the ceramic sheet.

[0040] Furthermore, the heat-conducting plate 4 is an aluminum nitride ceramic sheet. In one embodiment, the aluminum nitride ceramic sheet can be a 1mm thick sheet. The aluminum nitride ceramic sheet can form an anti-creep structure inside the housing, ensuring insulation. Aluminum nitride ceramic is a high-performance ceramic material with a thermal conductivity more than 5 times that of alumina ceramic, making it suitable for the heat dissipation needs of high-power electronic devices. Aluminum nitride ceramic also possesses good electrical insulation properties, high resistivity, and a suitable dielectric constant. Unlike alumina ceramic, it also has excellent thermal conductivity, enabling it to provide both insulation and efficient heat dissipation in electronic fields where both electrical and thermal performance are required, such as in the fabrication of integrated circuit substrates.

[0041] like Figure 4 As shown, the housing 1 includes an upper shell 1a and a lower shell 1b. The lower shell 1b is integrally formed and has an opening at its upper end. The upper shell 1a is configured to cover the upper opening. A sealing ring is provided at the joint between the upper shell 1a and the lower shell 1b to seal the housing 1 and achieve a waterproof effect. Specifically, grooves can be made on the ports of the upper shell 1a and the lower shell 1b to accommodate the sealing ring. Preferably, the sealing ring can be made of high-temperature resistant silicone material, with a circular cross-section and a compression set of no more than 5%.

[0042] However, it is understandable that the lower shell 1b can also be assembled. Those skilled in the art can make reasonable arrangements according to the actual situation.

[0043] The heat dissipation fins 10 are densely distributed on the upper shell 1a and the lower shell 1b. There are no particular restrictions on their specific distribution positions, and those skilled in the art can set them reasonably according to the actual situation.

[0044] In addition, such as Figure 4 As shown, a heat dissipation opening 11a can also be provided on the upper shell 1a, and the heat dissipation opening 11a can be opened and closed through the cover plate portion 12a. Figure 5 As shown, the cover portion 12a includes an upper cover 121a and a heat dissipation cavity 122a. The upper cover 121a is provided with heat dissipation fins 10. The heat dissipation cavity 122a is a cavity with an opening at the bottom, which can dissipate heat from the heat-generating device by encapsulating the relevant heat-generating device (such as an inductor) in the cavity and filling it with potting compound.

[0045] The internal heat-generating components (such as inductors) are filled with potting compound through the heat dissipation opening 11a and encapsulated in the heat dissipation cavity 122a, thereby increasing the heat conduction area and dissipating heat through the heat dissipation fins 10 of the upper cover 121a, thereby improving heat dissipation efficiency.

[0046] The heat dissipation fins 10 are preferably made of aluminum alloy with a thickness of 1mm and a spacing of 4mm between them to ensure better heat dissipation.

[0047] In one embodiment, the surface of the heat dissipation fins 10 is sandblasted and anodized to enhance its corrosion resistance.

[0048] In this embodiment, the shell 1 is manufactured from AL6061-T6 material, which has an elastic modulus of 6.89E04, a Poisson's ratio of 0.33, and a density of 2750 kg / m³. AL6061-T6 is an aluminum-magnesium-silicon alloy, a heat-treatable corrosion-resistant alloy. It exhibits good strength and corrosion resistance, good uniformity, excellent processing performance, and good oxidation effect. It is free of pinholes and pores, and has good flatness. This improves processing efficiency and reduces material costs.

[0049] This application embodiment performs modal analysis on the power module housing made of the above-mentioned material parameters to predict whether the natural frequencies of each order of the power module structure will resonate within a given speed range, thereby suppressing damage to the power module.

[0050] Based on the above assumptions and equivalents, modal finite element simulation was performed on the obtained prototype structure, with the material parameters of each part of the shell remaining consistent with the aforementioned material parameters. The finite element modal shape diagrams, displayed through color contour plots or animations, show the deformation modes of the structure at specific natural frequencies. The darkest area in the shape diagram (e.g., red) represents the location of maximum displacement. Experimental results showed no red area in the simulation model, indicating minimal displacement, i.e., small amplitude, thus proving the ability to suppress power module damage.

[0051] Figure 6 A schematic diagram showing the power module with the top casing 1a removed is shown, and Figure 7 An integrated circuit board 2, featuring a voltage converter 7 and various electronic components, is shown. (See reference...) Figure 6 The heating element 3 and the heat-conducting plate 4 are pressed together and fixed to the housing 1 by a fastener 6.

[0052] Specifically, such as Figure 8 As shown, the fastener 6 includes a pressure plate 61 and an elastic pressure sheet 62. In one embodiment, the pressure plate 61 adopts a door handle-like structure with both ends bent, and can be fixed to the housing 1 by screws 63 at both ends. However, it is understood that the fixing structure of the fastener 6 is not particularly limited, and those skilled in the art can reasonably set it according to the actual situation.

[0053] The elastic pressure plate 62 is arranged between the pressure plate 61 and the heating element 3. The elastic pressure plate 62 generates pressure through its own deformation, thereby pressing the heating element 3, the heat-conducting plate 4 and the shell 1 together. The contact pressure is greater than 20N, so that the heating element 3, the heat-conducting plate 4 and the shell 1 can always remain pressed together even under the condition of force and vibration, thereby ensuring the heat dissipation effect.

[0054] like Figure 9As shown in the attached figure, the elastic pressure plate 62 can be a double-bent shape with a through hole in the middle. The elastic pressure plate 62 can be fixed to the bolts on the pressure plate 61 through the through hole. The spring pressure plate is made of SS301 stainless steel, which has good physical properties, including good corrosion resistance, heat resistance, strength, and hardness.

[0055] Continue to refer to Figure 7 The voltage conversion component 7 includes a transformer housing 70 and an electromagnet 71 inside the transformer housing 70. The gap between the electromagnet 71 and the transformer housing 70 is filled with potting compound, so that the electromagnet 71 and the transformer housing 70 form a better thermal conductivity contact. At the same time, the transformer housing 70 maintains thermal conductivity contact with the housing 1, thereby transferring the heat generated by the electromagnet 71 to the housing 1, and then dissipating heat through the fins on the outside of the housing 1.

[0056] Furthermore, such as Figure 10 As shown, the housing 1 extends inward on both sides to form inward protrusions 11 on both sides, which clamp the transformer housing 70, so that the transformer housing 70 and the housing 1 maintain good thermal conductivity contact. In some embodiments, a thermally conductive adhesive layer can also be coated between the transformer housing 70 and the inward protrusions 11. The thermally conductive adhesive layer can be filled with thermally conductive silicone grease, which has a thermal conductivity greater than 12 W / (m·K) to ensure good heat dissipation.

[0057] like Figure 11 As shown, the inner protrusion 11 inside the housing 1 forms an outer groove 12 on the outer side of the housing 1, and groove fins 13 are provided in the outer groove 12. The area of ​​the groove fins 13 is larger than that of the heat dissipation fins 10 in other positions to improve the heat dissipation effect.

[0058] In addition, continue to refer to Figure 6 The power module also includes multiple connectors 8. Connectors 8 are used for external cable entry and exit and are all waterproofed. For example, sealing gaskets may be used; the specific location and structure are not particularly limited, and those skilled in the art can set them appropriately according to the actual situation.

[0059] In addition, such as Figure 6 As shown, the power module housing 1 has multiple through holes 9 on its exterior, which can be recessed to the external body using M6 screws. When vibration is required, screw fastening adhesive should be applied to the screw threads, and silicone sealant should be applied to the screws and nuts to prevent loosening. The length of the M6 ​​screws should be considered in conjunction with the wall thickness.

[0060] This application designs an integrated power module that can effectively achieve efficient heat dissipation of the system while meeting insulation requirements.

[0061] The above embodiments are merely illustrative of the principles and effects of this application. Any person skilled in the art can modify or alter the above embodiments without departing from the purpose of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the purpose disclosed in this application should still be covered by the claims of this application.

Claims

1. An aircraft power module, characterized by, include: The housing (1) has heat dissipation fins (10) arranged on its exterior; an integrated circuit board (2) is disposed inside the housing (1); a heat-generating element (3) is disposed on the integrated circuit board (2); the heat-generating element (3) is a sheet structure and is vertically distributed on the edge of the integrated circuit board (2), the heat-generating surface of the heat-generating element (3) is close to the housing (1) and the heat-generating surface is in thermal conductive contact with one side of a heat-conducting plate (4), the other side of the heat-conducting plate (4) is in thermal conductive contact with the housing (1), the heat of the heat-generating element (3) is transferred to the housing (1) through the heat-conducting plate (4), and the housing (1) dissipates heat through the heat dissipation fins (10).

2. The aircraft power module of claim 1, wherein, A thermally conductive adhesive layer (5) is further provided between the heating element (3) and the heat-conducting plate (4), and a thermally conductive adhesive layer (5) is further provided between the heat-conducting plate (4) and the housing (1).

3. The aircraft power module of Claim 2, wherein, The thermally conductive adhesive layer (5) is a thermally conductive silicone grease with a thermal conductivity greater than 12 W / (m·K).

4. The aircraft power module of Claim 1, wherein, The heating element (3) and the heat-conducting plate (4) are pressed together by a fastener (6) and fixed to the housing (1).

5. The aircraft power module of Claim 4, wherein, The fastener (6) includes a pressure plate (61) and an elastic pressure plate (62). The elastic pressure plate (62) is arranged between the pressure plate (61) and the heating element (3). The elastic pressure plate (62) generates pressure through its own deformation, thereby pressing the heating element (3), the heat-conducting plate (4) and the housing (1) together.

6. The aircraft power module of Claim 1, wherein, It also includes a voltage conversion component (7), which includes a transformer housing (70) and an electromagnet (71) inside the transformer housing (70). The gap between the electromagnet (71) and the transformer housing (70) is filled with potting compound, and the transformer housing (70) is in thermal conductive contact with the electromagnet (71).

7. The aircraft power module of Claim 6, wherein, The housing (1) extends inward on opposite sides to clamp the transformer housing (70), so that the transformer housing (70) and the housing (1) are in thermal conductive contact. At the same time, an outer groove (11) is formed on the outside of the housing (1), and groove fins (12) are provided in the outer groove (11).

8. The aircraft power module of Claim 1, wherein, The housing (1) includes an upper shell (1a) and a lower shell (1b). The lower shell (1b) is integrally formed and has an opening at the upper end. The upper shell (1a) is configured to cover the upper opening. A sealing ring is provided at the joint between the upper shell (1a) and the lower shell (1b) to seal the housing (1).

9. The aircraft power module of Claim 1, wherein, The shell (1) is made of AL6061-T6 material, which has an elastic modulus of 6.89E04, a Poisson's ratio of 0.33, and a density of 2750 kg / m3.

10. The aircraft power module of Claim 1, wherein, The heat-conducting plate (4) is an aluminum nitride ceramic sheet.

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