Wafer polishing pad surface contaminant cleaning apparatus

Abstract

The utility model discloses a kind of wafer polishing disc surface pollutant cleaning devices, it is related to polishing disc cleaning technical field, including shell, import and export are set on the shell, fixed mounting is equipped with stage on the shell, polishing disc is equipped above the stage, cleaning mechanism is installed in the shell, the cleaning mechanism includes fixed mounting in the guide rod of shell, fixed mounting is equipped with pedestal on the guide rod, cleaning tank is installed in the front end of the pedestal, ultrasonic frequency power supply is installed in the pedestal, transducer is fixedly installed in the bottom of the cleaning tank, drainage assembly is fixedly installed in the bottom of the cleaning tank, the cleaning mechanism further includes fixed mounting in the shell back air cylinder, and the output end of air cylinder is fixedly installed on pedestal, this wafer polishing disc surface pollutant cleaning device, cleaning mechanism can conveniently and quickly clean polishing disc, and after completion, drainage assembly can automatically discharge sewage in cleaning tank.

Description

Technical Field

[0001] This utility model relates to the field of grinding disc cleaning technology, specifically a device for cleaning contaminants on the surface of a wafer grinding disc. Background Technology

[0002] Wafer grinding discs are key consumables used in semiconductor manufacturing to achieve global wafer planarization. They are typically made of a composite of high-purity polymer materials and precision abrasives. Wafer grinding discs are usually used in conjunction with grinding machines.

[0003] During the grinding process, the surface of the grinding disc continuously absorbs a large amount of impurities. These impurities include various fine particles, debris, and other residues, which adhere tightly to the grinding disc. Because the grinding disc is mounted on and tightly connected to the grinding machine, cleaning the grinding disc becomes quite cumbersome.

[0004] For example, in the prior art, the authorized announcement number CN202420499836.X discloses a lifting device, trimming device and wafer grinding device for a wafer grinding disc, including a housing, a power unit, a first position sensor and a second position sensor; the power unit is located in the housing, and the power unit includes a lifting drive assembly and a lifting shaft, the lifting drive assembly being used to control the lifting of the lifting shaft.

[0005] In the above solution, the grinding disc is fixed on the lifting shaft. During cleaning, the grinding disc needs to be removed from the lifting shaft, which affects the cleaning efficiency. Therefore, a device for cleaning contaminants on the surface of a wafer grinding disc is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a device for cleaning contaminants on the surface of a wafer grinding disc, so as to solve the problems in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a device for cleaning contaminants on the surface of a wafer grinding disc, comprising a housing, an inlet and outlet on the housing, a platform fixedly mounted on the housing, a grinding disc above the platform, a cleaning mechanism installed inside the housing, the cleaning mechanism comprising a guide rod fixedly mounted inside the housing, a base fixedly mounted on the guide rod, a cleaning tank installed at the front end of the base, an ultrasonic power supply installed inside the base, a transducer fixedly mounted at the bottom of the cleaning tank, and a drainage assembly fixedly mounted at the bottom of the cleaning tank.

[0008] Preferably, the cleaning mechanism further includes a cylinder fixedly installed on the back of the housing, and the output end of the cylinder is fixedly installed on the base. Sliding sleeves are fixedly installed on both sides of the base, and the sliding sleeves are slidably installed on the guide rod.

[0009] Preferably, the base has a mounting groove, and the ultrasonic power supply is installed in the base through the mounting groove.

[0010] Preferably, the back of the housing has a through hole, the output end of the cylinder extends into the housing through the through hole, the base is slidably installed in the housing through a guide rod, and the cleaning tank extends out of the housing through an inlet and outlet.

[0011] Preferably, the drainage assembly includes a drain pipe fixedly installed at the bottom of the cleaning tank and a water receiving trough fixedly installed on the inner wall of the outer shell. A drain outlet is fixedly installed at the bottom of the water receiving trough, a drive frame is fixedly installed at the upper end of the water receiving trough, a positioning frame is fixedly installed at the edge of the end of the drain pipe, and the positioning frame is fixedly installed at the bottom of the base. A movable frame is rotatably installed on the positioning frame, a sealing cover is fixedly installed on the movable frame, and a leaf spring is installed between the movable frame and the positioning frame.

[0012] Preferably, a rotating shaft is installed on the positioning frame, and the movable frame is rotatably mounted on the positioning frame via the rotating shaft.

[0013] Preferably, the drive frame and the movable frame on the water receiving tank are aligned front and back.

[0014] Preferably, one end of the leaf spring is fixed to the positioning frame, and the other end of the leaf spring is fixedly installed on the movable frame.

[0015] Compared with the prior art, the beneficial effects of this utility model are: 1. In this application, after the cylinder extends, it will drive the base to slide forward along the guide rod, causing the cleaning tank to move below the grinding disc. When the cleaning tank is below the grinding disc, the grinding disc can enter the cleaning tank, and cleaning agent can be injected into the cleaning tank. The electrical signal generated by the ultrasonic power supply drives the transducer, converting electrical energy into mechanical vibration, generating high-frequency pressure waves of tens of thousands of times per second in the cleaning fluid, thereby using ultrasonic waves to clean the grinding disc.

[0016] 2. In this application, during the cleaning process, the thrust provided by the leaf spring ensures that the sealing cap fits tightly against the end of the drain pipe, effectively preventing leakage of the cleaning fluid in the cleaning tank. After the cleaning operation is completed, the cylinder is retracted. After the cylinder retracts, the cleaning tank will shrink into the housing. When the cleaning tank is fully retracted into the housing, the drive frame will push the movable frame forward, causing the sealing cap to disengage from the front end of the drain pipe, releasing the closed state of the drain pipe, thereby achieving automatic discharge of wastewater from the cleaning tank. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a partial structural schematic diagram of the present invention; Figure 3This is a schematic diagram of the cleaning mechanism of this utility model; Figure 4 This is a partial schematic diagram of the cleaning mechanism of this utility model; Figure 5 This is a schematic diagram of the drainage mechanism of this utility model.

[0018] The diagram shows the following markings: 1. Outer shell; 2. Grinding disc; 3. Platform; 4. Inlet / outlet; 5. Cleaning mechanism; 501. Cylinder; 502. Base; 503. Cleaning tank; 504. Guide rod; 505. Sliding sleeve; 506. Mounting slot; 507. Ultrasonic power supply; 508. Transducer; 6. Drainage assembly; 601. Drain pipe; 602. Positioning frame; 603. Movable frame; 604. Drive frame; 605. Sealing cover; 606. Water receiving tank; 607. Drain outlet; 608. Leaf spring. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figure 1 and Figure 2 As shown, this utility model provides a technical solution for a wafer grinding disc surface contaminant cleaning device, including a housing 1 with an inlet and outlet 4, a platform 3 fixedly installed on the housing 1, a grinding disc 2 positioned above the platform 3, a cleaning mechanism 5 installed inside the housing 1, and a drainage component 6 fixedly installed at the bottom of the cleaning tank 503. The cleaning mechanism 5 can conveniently and quickly clean the grinding disc 2, and after completion, the drainage component 6 can automatically discharge the wastewater in the cleaning tank 503.

[0021] Example 1: As Figure 2 , Figure 3 and Figure 4 As shown, the cleaning mechanism 5 includes a guide rod 504 fixedly installed inside the housing 1, a base 502 fixedly installed on the guide rod 504, a cleaning tank 503 installed at the front end of the base 502, an ultrasonic power supply 507 installed inside the base 502, and a transducer 508 fixedly installed at the bottom of the cleaning tank 503. The cleaning mechanism 5 also includes a cylinder 501 fixedly installed on the back of the housing 1, and the output end of the cylinder 501 is fixedly installed on the base 502. Sliding sleeves 505 are fixedly installed on both sides of the base 502, and the sliding sleeves 505 are slidably installed on the guide rod 504. An installation groove 506 is opened inside the base 502, and the ultrasonic power supply 507 is installed inside the base 502 through the installation groove 506.

[0022] Specifically, after cylinder 501 extends, it drives base 502 to slide forward along guide rod 504, causing cleaning tank 503 to move below grinding disc 2. Once cleaning tank 503 is in position, grinding disc 2 can enter and cleaning agent can be injected. The electrical signal generated by ultrasonic power supply 507 drives transducer 508, converting electrical energy into mechanical vibration, forming high-frequency pressure waves of tens of thousands of times per second in the cleaning fluid. As the sound waves propagate in the liquid, alternating high-pressure and low-pressure zones are generated. The low-pressure zone causes localized vaporization of the liquid, forming micron-sized vacuum bubbles; the high-pressure zone compresses the bubbles to implosion. The cavitation effect generated when the bubbles collapse creates localized high pressure and high temperature exceeding 1000 atmospheres, capable of penetrating surface cracks and effectively removing dirt from the surface of grinding disc 2 through physical impact.

[0023] Example 2: Figure 2 Figure 5 As shown, the drainage assembly 6 includes a drain pipe 601 fixedly installed at the bottom of the cleaning tank 503 and a water receiving tank 606 fixedly installed on the inner wall of the outer casing 1. A drain outlet 607 is fixedly installed at the bottom of the water receiving tank 606. A drive frame 604 is fixedly installed at the upper end of the water receiving tank 606. A positioning frame 602 is fixedly installed at the edge of the end of the drain pipe 601 and is fixedly installed at the bottom of the base 502. A movable frame 603 is rotatably installed on the positioning frame 602. A sealing cover 605 is fixedly installed on the movable frame 603. A leaf spring 608 is installed between the movable frame 603 and the positioning frame 602. A rotating shaft is installed on the positioning frame 602. The movable frame 603 is rotatably installed on the positioning frame 602 through the rotating shaft. The drive frame 604 on the water receiving tank 606 is aligned with the movable frame 603.

[0024] Specifically, during the cleaning process, the thrust provided by the leaf spring 608 presses the sealing cover 605 tightly against the end of the drain pipe 601, effectively preventing the cleaning fluid in the cleaning tank 503 from leaking. After the cleaning work is completed, the cylinder 501 is retracted, at which point the cleaning tank 503 will retract into the outer shell 1. When the cleaning tank 503 is completely retracted into the outer shell 1, the drive frame 604 will push the movable frame 603 forward, causing the sealing cover 605 to disengage from the front end of the drain pipe 601, thereby releasing the closed state of the drain pipe 601 and realizing the automatic discharge of sewage in the cleaning tank 503.

[0025] Working Principle: During operation, cylinder 501 extends, causing base 502 to slide forward along guide rod 504, moving cleaning tank 503 below grinding disc 2. Once below, grinding disc 2 can be inserted into cleaning tank 503, and cleaning agent is injected. The ultrasonic power supply 507 generates an electrical signal that drives transducer 508, converting electrical energy into mechanical vibration, generating high-frequency pressure waves tens of thousands of times per second in the cleaning fluid. As the sound waves propagate in the liquid, alternating high-pressure and low-pressure zones are formed. The low-pressure zone causes localized vaporization of the liquid, producing micron-sized vacuum bubbles, while the high-pressure zone compresses these bubbles until they implode. The cavitation effect of the collapsing bubbles creates localized high pressure and high temperature exceeding 1000 atmospheres, capable of penetrating surface crevices and removing dirt from the surface of grinding disc 2 through physical impact. This facilitates cleaning of grinding disc 2 for the user. During the cleaning process, the thrust provided by the leaf spring 608 will press the sealing cover 605 tightly against the end of the drain pipe 601 to prevent the cleaning fluid in the cleaning tank 503 from leaking. After cleaning is completed, the cylinder 501 is retracted. After the cylinder 501 is retracted, the cleaning tank 503 will retract into the housing 1. After the cleaning tank 503 is completely retracted into the housing 1, the drive frame 604 will press the movable frame 603 forward, so that the sealing cover 605 leaves the front end of the drain pipe 601 and contacts the closed state of the drain pipe 601, thereby automatically draining the sewage in the cleaning tank 503.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A device for cleaning contaminants on the surface of a wafer grinding disc, comprising a housing (1), wherein an inlet and outlet (4) are provided on the housing (1), a stage (3) is fixedly mounted on the housing (1), and a grinding disc (2) is provided above the stage (3), characterized in that: A cleaning mechanism (5) is installed inside the outer shell (1). The cleaning mechanism (5) includes a guide rod (504) fixedly installed inside the outer shell (1). A base (502) is fixedly installed on the guide rod (504). A cleaning tank (503) is installed at the front end of the base (502). An ultrasonic power supply (507) is installed inside the base (502). A transducer (508) is fixedly installed at the bottom of the cleaning tank (503). A drainage component (6) is fixedly installed at the bottom of the cleaning tank (503).

2. The wafer grinding pad surface contaminant cleaning device according to claim 1, characterized in that: The cleaning mechanism (5) further includes a cylinder (501) fixedly installed on the back of the housing (1), and the output end of the cylinder (501) is fixedly installed on the base (502). Sliding sleeves (505) are fixedly installed on both sides of the base (502), and the sliding sleeves (505) are slidably installed on the guide rod (504).

3. The wafer grinding pad surface contaminant cleaning device according to claim 2, characterized in that: The base (502) has an installation groove (506) inside, and the ultrasonic power supply (507) is installed in the base (502) through the installation groove (506).

4. The wafer grinding pad surface contaminant cleaning device according to claim 3, characterized in that: The back of the outer shell (1) has a through hole, the output end of the cylinder (501) extends into the outer shell (1) through the through hole, the base (502) is slidably installed in the outer shell (1) through the guide rod (504), and the cleaning tank (503) extends out of the outer shell (1) through the inlet and outlet (4).

5. The wafer grinding pad surface contaminant cleaning device according to claim 4, characterized in that: The drainage assembly (6) includes a drain pipe (601) fixedly installed at the bottom of the cleaning tank (503) and a water receiving tank (606) fixedly installed on the inner wall of the outer shell (1). A drain outlet (607) is fixedly installed at the bottom of the water receiving tank (606). A drive frame (604) is fixedly installed at the upper end of the water receiving tank (606). A positioning frame (602) is fixedly installed at the edge of the end of the drain pipe (601). The positioning frame (602) is fixedly installed at the bottom of the base (502). A movable frame (603) is rotatably installed on the positioning frame (602). A sealing cover (605) is fixedly installed on the movable frame (603). A leaf spring (608) is installed between the movable frame (603) and the positioning frame (602).

6. The wafer grinding pad surface contaminant cleaning device according to claim 5, characterized in that: The positioning frame (602) is equipped with a rotating shaft, and the movable frame (603) is rotatably mounted on the positioning frame (602) via the rotating shaft.

7. The wafer grinding pad surface contaminant cleaning device according to claim 6, characterized in that: The drive frame (604) on the water receiving tank (606) is aligned with the movable frame (603) front and back.

8. The wafer grinding pad surface contaminant cleaning device according to claim 7, characterized in that: One end of the leaf spring (608) is fixed on the positioning frame (602), and the other end of the leaf spring (608) is fixedly installed on the movable frame (603).

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