A positioning tool for a grinding head of a thinning machine

Abstract

The utility model discloses a kind of thinning machine grinding head positioning tool, including grinding head positioning ring, locating pin, limit support, CT positioning disc, the locating pin is detachably installed on grinding head positioning ring, limit support is also installed on grinding head positioning ring, and opening is opened on limit support, locating pin is worn from the opening, the diameter of the circumference where locating pin, opening center is corresponding with the outer diameter of grinding head;The center position of the CT positioning disc is opened with positioning hole, when CT positioning disc is installed on thinning machine, CT positioning disc and CT disc center coincide.The utility model reduces the position error of grinding head and wafer center to 0.1-0.2mm by the cooperation of grinding head positioning ring, locating pin, limit support, CT positioning disc, realizes accurate positioning wafer center, avoids that wafer is not uniform when processing thinning.

Description

Technical Field

[0001] This utility model relates to the field of positioning device technology, and in particular to a positioning fixture for a thinning machine grinding head. Background Technology

[0002] Thinning machines are processing equipment used for the precision grinding of semiconductor wafers. They are equipped with fine grinding heads and coarse grinding heads to grind wafers placed on a CT (Chuck Table) disk with different precision. When processing wafers, the grinding head of existing thinning machines usually has a positional error of 1-2mm from the wafer center. The edge of the grinding head cannot accurately locate the wafer center. This error may lead to uneven wafer thinning or even cause the wafer to be scrapped. Utility Model Content

[0003] Purpose of the invention: To address the shortcoming that the edge of the grinding head of a thinning machine cannot accurately position the center of the wafer, this utility model provides a positioning fixture for the grinding head of a thinning machine.

[0004] Technical Solution: To solve the above problems, this utility model adopts a grinding head positioning fixture for a thinning machine, including a grinding head positioning ring, a positioning pin, a limiting frame, and a CT positioning disk. The positioning pin is detachably installed on the grinding head positioning ring, and the limiting frame is also installed on the grinding head positioning ring. The limiting frame has an opening through which the positioning pin passes. The circumference diameter of the center of the positioning pin and the opening corresponds to the outer diameter of the grinding head. The CT positioning disk has a positioning hole at its center. When the CT positioning disk is installed on the thinning machine, the center of the CT positioning disk coincides with the center of the CT disk.

[0005] Furthermore, the grinding head positioning ring is provided with a threaded hole, and one end of the positioning pin is provided with an external thread. The positioning pin is detachably installed on the grinding head positioning ring through a threaded connection.

[0006] Furthermore, the positioning pin has a sliding section in the middle that is equal to the inner diameter of the opening, and the sliding section is located inside the opening.

[0007] Furthermore, the diameter of the external thread is larger than the diameter of the sliding section.

[0008] Furthermore, the limiting frame is an arc-shaped curved panel, which is vertically mounted on the grinding head positioning ring.

[0009] Furthermore, the grinding head positioning ring has multiple mounting holes for connecting to the grinding head.

[0010] Furthermore, a retaining ring is provided at the bottom of the CT positioning disk, and the inner diameter of the retaining ring is equal to the outer diameter of the CT disk.

[0011] Beneficial effects: Compared with the prior art, the significant advantage of this utility model is that by cooperating with the grinding head positioning ring, positioning pin, limiting frame and CT positioning plate, the positional error between the grinding head and the wafer center is reduced to 0.1-0.2mm, so as to achieve precise positioning of the wafer center and avoid uneven wafer thinning during processing. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of the positioning tooling of this utility model;

[0013] Figure 2 This is a schematic diagram of the positioning ring structure of the grinding head of this utility model;

[0014] Figure 3 This is a schematic diagram of the positioning pin structure of this utility model;

[0015] Figure 4 This is a schematic diagram of the limiting frame structure of this utility model;

[0016] Figure 5 This is a schematic diagram of the CT positioning disc structure of this utility model. Detailed Implementation

[0017] like Figures 1 to 5 As shown, a grinding head positioning fixture for a thinning machine in this embodiment includes a grinding head positioning ring 1, a positioning pin 2, a limiting frame 3, and a CT positioning plate 4. The grinding head positioning ring 1 has multiple mounting holes 12, into which bolts are installed to fix the grinding head positioning ring 1 onto the grinding head. The grinding head positioning ring 1 also has threaded holes 11 for mounting the positioning pin 2. One end of the positioning pin 2 has an external thread 21, and the positioning pin 2 is detachably mounted on the grinding head positioning ring 1 via a threaded connection.

[0018] The positioning pin 2 comprises multiple cylindrical sections with progressively varying radii. One end is a stud with external threads 21, the middle is a sliding section, and the other end is a fine needle with an extremely small radius; in this embodiment, the radius of the fine needle is 0.2 mm. The limiting frame 3 is an arc-shaped curved panel perpendicular to the grinding head positioning ring 1. Multiple threaded holes are opened at the bottom of the limiting frame 3, which is bolted to the grinding head positioning ring 1. An opening 31 is opened on the limiting frame 3. The inner diameter of the opening 31 is equal to the outer diameter of the sliding section 22. When the positioning pin 2 passes through the opening 31, the sliding section 22 is located within the opening 31. The circumference diameter of the center of the positioning pin 2 and the opening 31 corresponds to the outer diameter of the grinding head.

[0019] The CT positioning disk 4 has a positioning hole 41 at its center and a retaining ring 42 at its bottom. The inner diameter of the retaining ring 42 is equal to the outer diameter of the CT disk. During installation, the retaining ring 42 is put on the CT disk so that the center of the CT positioning disk 4 coincides with the center of the CT disk.

[0020] The working principle of this utility model is as follows: First, install the grinding head positioning ring 1 on the grinding head and the CT positioning disk 4 on the CT disk. After the CT disk rotates to the position below the grinding head positioning ring 1, manually adjust the position of the grinding head positioning ring 1 so that the positioning pin 2 is aligned with the positioning hole 41 on the CT positioning disk 4. When the positioning pin 2 is visually aligned with the positioning hole 41, the positioning pin 2 can be manually unscrewed from the threaded hole. At this time, the sliding section 22 can slide up and down in the opening 31. Then, finely adjust the position of the grinding head so that the positioning pin 2 can fall into the positioning hole 41, indicating that the outer edge of the grinding head is aligned with the center of the wafer, and the positioning is completed. After the positioning is completed, remove the positioning fixture from the thinning machine, and the thinning machine will carry out subsequent processing. By manually unscrewing the positioning pin 2 for further fine-tuning of the positioning, it is possible to avoid the positioning pin not being fully aligned with the positioning hole when directly manipulating the grinding head to fall, which would cause excessive pressure on the positioning pin tip and damage to the positioning pin. The positioning fixture of this invention can reduce the positional error between the outer edge of the grinding head and the center of the wafer to 0.1-0.2mm, thereby achieving precise positioning of the wafer center and avoiding uneven wafer thinning during processing.

Claims

1. A positioning fixture for a grinding head of a thinning machine, characterized in that, The equipment includes a grinding head positioning ring (1), a positioning pin (2), a limiting frame (3), and a CT positioning plate (4). The positioning pin (2) is detachably installed on the grinding head positioning ring (1), and the limiting frame (3) is also installed on the grinding head positioning ring (1). The limiting frame (3) has an opening (31) through which the positioning pin (2) passes. The circumference diameter of the center of the positioning pin (2) and the opening (31) corresponds to the outer diameter of the grinding head. The CT positioning plate (4) has a positioning hole (41) at its center. When the CT positioning plate (4) is installed on the thinning machine, the center of the CT positioning plate (4) coincides with the center of the CT plate.

2. The thinning machine grinding head positioning fixture as described in claim 1, characterized in that, The grinding head positioning ring (1) is provided with a threaded hole (11), and one end of the positioning pin (2) is provided with an external thread (21). The positioning pin (2) is detachably installed on the grinding head positioning ring (1) through a threaded connection.

3. The thinning machine grinding head positioning fixture as described in claim 2, characterized in that, The positioning pin (2) has a sliding section (22) in the middle that is equal to the inner diameter of the opening (31), and the sliding section (22) is located inside the opening (31).

4. The thinning machine grinding head positioning fixture as described in claim 2, characterized in that, The diameter of the external thread (21) is greater than the diameter of the sliding section (22).

5. The thinning machine grinding head positioning fixture as described in claim 1, characterized in that, The limiting frame (3) is an arc-shaped curved panel, which is vertically installed on the grinding head positioning ring (1).

6. The thinning machine grinding head positioning fixture as described in claim 1, characterized in that, The grinding head positioning ring (1) has multiple mounting holes (12) for connecting to the grinding head.

7. The thinning machine grinding head positioning fixture as described in claim 1, characterized in that, The bottom of the CT positioning disk (4) is provided with a retaining ring (42), the inner diameter of which is equal to the outer diameter of the CT disk.

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