molding apparatus

CN224928342UActive Publication Date: 2026-11-03NANTONG RESHINE NEW MATERIAL TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522646431.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-12
Publication Date
2026-11-03
Estimated Expiration
2035-12-12

AI Technical Summary

Technical Problem

In the current process of cutting foam sealing strips, the rubber hammer causes the mold to deform, resulting in non-compliant sealing strip dimensions. This affects the coating process and makes the strips prone to deformation, leading to material leakage. Existing technologies cannot effectively solve this problem.

Method used

Design a molding device including an upper mold plate, a cutting tool, an upper sealing plate, a guide rod module, and a lower mold module. By closing the upper mold plate and the lower mold module, and cooperating with the cutting tool to cut and extrude the material, the sealing material can be accurately molded and unloaded.

Benefits of technology

The process of preparing the sealing strip has been simplified, work efficiency has been improved, the size and shape of the sealing strip meet the requirements, the service life of the device has been extended, and the operation difficulty and failure rate have been reduced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of mold forming, in particular to a forming device configured to form a sealing material into a sealing strip, characterized in that the forming device comprises a mold upper plate, a cutter, an upper sealing plate, a guide rod module and a lower mold module; the top of the mold upper plate along a first direction is provided with a receiving groove, and the upper sealing plate is configured to be detachably connected with the receiving groove; the cutter comprises a forming hole, the cutter is configured to be installed at the bottom of the receiving groove along the first direction, the forming hole is configured to penetrate through the mold upper plate along the first direction, and the forming hole is configured to accommodate the sealing material; the guide rod module is configured to connect the mold upper plate and the lower mold module along the first direction, the mold upper plate is configured to move along the first direction through the guide rod module and close with the lower mold module, and the upper sealing plate is configured to fill the receiving groove so that the sealing material is extruded into the sealing strip. The forming device can reduce the working time of cutting the sealing strip, simplify the working process and improve the working efficiency.
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Description

Technical Field

[0001] This application relates to the field of mold forming technology, and in particular to a forming apparatus. Background Technology

[0002] The sealing strips for the coating roller side baffles of the laboratory-compatible coating equipment are all made of freshly cut foam. The existing method for obtaining foam sealing strips is as follows: first, use a mold to align with the position to be cut on the foam board, use a rubber hammer to tap the foam board evenly, use the mold to cut out the corresponding shape of the foam sealing strip, and then use a tool to push out the cut sealing strip from the reserved hole of the mold.

[0003] However, in the above method, the tapping step with the rubber hammer can easily cause mold deformation. Moreover, the cut sealing strip is too thick to be directly installed into the side baffle. It is necessary to manually tap the sealing strip with the rubber hammer to the appropriate thickness. The tapping can easily cause the sealing strip to deform. Even if the deformed sealing strip can be installed on the side baffle, it will cause material leakage during subsequent coating, affecting the coating process. In severe cases, it may even lead to the inability to coat. Utility Model Content

[0004] In view of this, this application provides a molding apparatus that can solve at least one of the above-mentioned technical problems.

[0005] This application provides a molding apparatus configured to form a sealing strip from a sealing material. The molding apparatus includes a mold upper plate, a cutting tool, an upper sealing plate, a guide rod module, and a lower mold module. The mold upper plate has a receiving groove at its top along a first direction. The cutting tool includes a forming hole and is configured to be installed at the bottom of the receiving groove along the first direction. The forming hole is configured to penetrate the mold upper plate along the first direction and to receive the sealing material. The guide rod module is configured to connect the mold upper plate and the lower mold module along the first direction. The mold upper plate is configured to move along the first direction via the guide rod module and close with the lower mold module. The upper sealing plate is configured to fill the receiving groove, thereby extruding the sealing material into the sealing strip. The moving direction of the mold upper plate is the first direction.

[0006] In the above solution, the extrusion molding process of the sealing material can be completed by closing the upper mold plate and the lower mold module. At the same time, the cutting tool on the upper mold plate can cut the sealing strip to the required size. After the upper mold plate separates from the receiving groove, the sealing strip in the molding hole is exposed, and the sealing strip can be quickly removed. That is, the molding device of this application has the functions of extrusion thinning, cutting and unloading, which can reduce the working time of preparing sealing strips in the laboratory, simplify the workflow of preparing sealing strips, and improve work efficiency. The extrusion molding process and the sealing strip removal process do not affect the structural integrity of the molding device, which can extend the service life of the molding device.

[0007] In some embodiments, the lower mold module includes a lower mold plate and a lower sealing plate, the lower sealing plate being configured to connect to the bottom of the lower mold plate along the first direction, and the lower mold plate being configured to press the sealing material at both ends along the first direction, respectively, along with the upper sealing plate.

[0008] By matching the upper and lower plates of the mold, a sealing strip with the required thickness can be obtained.

[0009] In some embodiments, the molding apparatus includes a pair of guide rod modules configured to be mounted on the lower sealing plate, with the lower mold plate located between the pair of guide rod modules along a second direction; each guide rod module includes a guide rod and an elastic element, the guide rod being configured to connect the upper mold plate and the lower sealing plate along a first direction, the upper mold plate being configured to move along the first direction via the guide rod; the elastic element being configured to be sleeved on the guide rod, and the elastic element being configured to reset the upper mold plate.

[0010] The guide rod ensures that the upper plate of the mold moves along a strictly preset path, eliminating deflection and jamming, improving the positioning accuracy and device stability during repeated use, and the elastic element can drive the upper plate of the mold to reset.

[0011] In some embodiments, the lower mold plate is configured to be detachably connected to the lower sealing plate, and the upper mold plate is configured to be detachably connected to the guide rod.

[0012] Both the upper and lower plates of the mold can be replaced according to the specifications and shape of the sealing strip, making the molding device adaptable to different working scenarios.

[0013] In some embodiments, the molding apparatus further includes a pair of force-applying modules, which are configured to be mounted on the lower sealing plate, and the lower mold plate is located between the pair of force-applying modules along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other; the lower sealing plate is provided with a first connecting block, and the upper mold plate is provided with a second connecting block; the force-applying module includes a force-applying rod, a connecting rod, a connecting plate, and a snap-fit ​​member, wherein the first connecting block is configured to be hinged to one end of the force-applying rod, one end of the connecting rod is configured to be hinged to the force-applying rod, the other end of the connecting rod is configured to be hinged to the connecting plate, one end of the snap-fit ​​member is configured to be hinged to the connecting plate, and the other end of the snap-fit ​​member is configured to be snap-fitted to the second connecting block, and the force-applying rod is configured to receive a force, thereby configuring the upper mold plate to move along the first direction via the guide rod module, and the upper mold plate and the lower mold plate close together.

[0014] The force application module is designed so that the entire upper plate of the mold can move along the first direction through the force application rod, reducing the difficulty of operating the molding device.

[0015] In some embodiments, the elastic element includes a spring.

[0016] Using a spring as the elastic element provides a simple, fast-responding automatic reset method that requires no external power source. It has a low failure rate and is easy to maintain. When used in conjunction with a guide rod, it can improve the running stability of the upper plate of the mold.

[0017] In some embodiments, at least a portion of the cutting tool is configured to protrude from the bottom surface of the upper mold plate along the first direction; the lower mold plate includes a cutting groove configured to match the shape of the cutting tool, such that the cutting groove is configured to receive the cutting tool.

[0018] The design of the tool groove can protect the tool, reduce the impact of the tool during the mold closing process, and extend the service life of the tool.

[0019] In some embodiments, the molding apparatus further includes a base configured to mount the lower mold module.

[0020] The base can evenly distribute the load, effectively resist vibrations during the operation of the molding device, and ensure the stable operation of the molding device.

[0021] In some embodiments, the cutting tool and the upper mold plate are configured as an integrally formed structure.

[0022] The integrated molding of the cutting tool and the upper plate of the mold can reduce the wobbling of the cutting tool during the cutting process of the sealing strip, improve the cutting accuracy, and obtain a sealing strip with the required size.

[0023] In some embodiments, the molding apparatus further includes a connecting assembly, wherein the upper sealing plate is configured to be floatingly connected to the receiving groove via the connecting assembly.

[0024] The design of the connecting components ensures that the upper sealing plate is always connected to the upper mold plate, eliminating the need for additional placement space for the upper sealing plate. Furthermore, the floating design of the upper sealing plate and the upper mold plate facilitates the repositioning of the upper sealing plate, improving work efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the molding apparatus provided in this application.

[0026] Figure 2 for Figure 1 The diagram shows the structure of the upper mold plate and the cutting tool of the forming device.

[0027] Figure 3 for Figure 1 The diagram shows the structure of the force application module of the forming device.

[0028] Explanation of key component symbols: 10. Molding device; 1. Mold upper plate; 11. Receiving groove; 12. Second connecting block; 2. Cutting tool; 21. Forming hole; 3. Upper sealing plate; 4. Guide rod module; 41. Guide rod; 42. Elastic element; 5. Lower mold module; 51. Mold lower plate; 511. Cutting groove; 52. Lower sealing plate; 521. First connecting block; 522. Hinge hole; 6. Force application module; 61. Force application rod; 611. Hinge area; 62. Connecting rod; 63. Connecting plate; 631. Hinge shaft; 64. Snap-fit ​​component; 641. Snap hook; 7. Base; Z, first direction; X, second direction; Y, third direction. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0030] To address the issues of complex processes and low product yield in existing laboratory-prepared sealing strip manufacturing processes, this application provides a molding apparatus that simplifies the sealing strip manufacturing process and improves work efficiency through a centralized structural design.

[0031] In some embodiments, the molding apparatus 10 is configured to form a sealing strip from a sealing material, including a foam material. In the molding apparatus 10, the foam material is continuously compressed to compensate for the volume shrinkage of the foam material during cooling, ensuring that the foam material is dense and has a clear outline. After cooling and shaping, a foam seal of the desired shape and size is obtained.

[0032] Please refer to Figure 1 The molding device 10 includes a mold upper plate 1, a cutting tool 2, an upper sealing plate 3, a guide rod module 4, and a lower mold module 5. In this application, the direction of movement of the mold upper plate 1 is defined as the first direction Z, and the directions perpendicular to the first direction Z are defined as the second direction X and the third direction Y.

[0033] The upper mold plate 1 is used to receive the injected sealing material, the cutter 2 is used to limit the sealing material along the second direction X and the third direction Y and cut it into a sealing strip, the upper sealing plate 3 is used to squeeze the top of the sealing material along the first direction Z, the guide rod module 4 is used to guide the movement of the upper mold plate 1, and the lower mold module 5 is used to squeeze the bottom of the sealing material along the first direction Z. Thus, through the cooperation of the above components, a sealing strip that meets the usage requirements can be obtained.

[0034] Please refer to Figure 1 and Figure 2 The upper mold plate 1 is a rectangular plate structure with a recessed receiving groove 11 at its top along the first direction Z. The cutting tool 2 includes a forming hole 21 that matches the shape of the sealing element. The cutting tool 2 is configured to be installed at the bottom of the receiving groove 11 along the first direction Z. The forming hole 21 is configured to penetrate the upper mold plate 1 along the first direction Z, so that the forming hole 21 connects the receiving groove 11 and the bottom surface of the upper mold plate 1 along the first direction Z. In actual production, sealing material can be injected into the forming hole 21. When the sealing material is compressed, the forming hole 21 can shape the sealing material along the second direction X and the third direction Y, thereby obtaining a sealing element of the desired shape.

[0035] In some embodiments, the cutter 2 and the upper mold plate 1 are configured as an integral molding structure. This integral molding configuration can reduce the shaking of the cutter 2 during the cutting of the sealing strip, improve the cutting accuracy, and obtain a sealing strip with the required dimensions.

[0036] In some embodiments, the shape and size of the receiving groove 11 match the upper sealing plate 3, specifically it can be rectangular, circular or other polygonal, and the shapes of the receiving groove 11 and the upper sealing plate 3 can be selected according to actual needs. Optionally, the shapes of the receiving groove 11 and the upper sealing plate 3 are rectangular, and the upper sealing plate 3 is configured to be detachably connected to the receiving groove 11, so that the upper sealing plate 3 can be filled in the receiving groove 11, and then the upper sealing plate 3 can apply a compressive force to the top of the sealing material along the first direction Z.

[0037] In some embodiments, the molding apparatus 10 further includes a connecting component (not shown in the figure). The connecting component connects the bottom surface of the receiving groove 11 and the upper sealing plate 3 along the first direction Z. The upper sealing plate 3 can be moved and reset along the first direction Z by the connecting component, thereby achieving a floating connection between the upper sealing plate 3 and the receiving groove 11. When the sealing material needs to be compressed, the upper sealing plate 3 is pressed down, and the upper sealing plate 3 moves along the connecting component. When the sealing element needs to be removed, the connecting component drives the upper sealing plate 3 to reset, exposing the sealing element. The design of the connecting component in this application ensures that the upper sealing plate 3 is always connected to the upper mold plate 1. The upper sealing plate 3 does not require additional placement space, and the floating design of the upper sealing plate 3 and the upper mold plate 1 facilitates the reset of the upper sealing plate 3, improving work efficiency.

[0038] It should be noted that this application does not limit the specific connection position and connection method of the connecting component, the upper sealing plate 3 and the receiving groove 11, so that after the upper sealing plate 3 moves along the first direction Z through the connecting component, the bottom of the upper plate is in contact with the bottom surface of the receiving groove 11.

[0039] In some embodiments, please refer to Figure 1 The lower mold module 5 includes a lower mold plate 51 and a lower sealing plate 52, both of which are plate-shaped structures. The length and width of the lower sealing plate 52 are both greater than those of the lower mold plate 51. The lower sealing plate 52 is configured to connect to the bottom of the lower mold plate 51 along the first direction Z. The upper mold plate 1 can move towards the lower mold plate 51, so that the lower mold plate 51 is configured to compress the sealing material at both ends along the first direction Z. After the molding device 10 closes the mold, the upper sealing plate 3, the cutter 2, and the lower mold plate 51 can enclose and form a sealed molding cavity (not shown in the figure). The molding cavity can position the shape and size of the sealing material, thereby obtaining a sealing strip that meets the thickness and shape requirements.

[0040] In some embodiments, please refer to Figure 2 At least a portion of the cutting tool 2 is configured to protrude from the bottom surface of the upper mold plate 1 along the first direction Z. The lower mold plate 51 has a cutting groove 511 at its top along the first direction Z. The cutting groove 511 is configured to match the shape of the cutting tool 2, so that when the molding device 10 closes the mold, the cutting groove 511 is configured to receive the cutting tool 2. The design of the cutting groove 511 can provide protection for the cutting tool 2, reduce the impact of the cutting tool 2 during the mold closing process, and extend the service life of the cutting tool 2. At the same time, the extended portion of the cutting tool 2 can accommodate more sealing material. With the volume of the molding cavity remaining unchanged after mold closing, this part of the material can compensate for the volume shrinkage of the molten sealing material during the cooling and solidification process, thereby ensuring that the sealing strip has a clear outline, stable dimensions, and dense internal structure.

[0041] Please refer to Figure 1The molding device 10 includes a pair of guide rod modules 4, which are configured to be installed on the lower sealing plate 52, and the lower mold plate 51 is located between the pair of guide rod modules 4 along the second direction X. Specifically, the guide rod module 4 includes a guide rod 41 and an elastic element 42. The connection between one end of the guide rod 41 and the lower sealing plate 52 includes, but is not limited to, bonding, welding, or fastener connection. The upper mold plate 1 has a guide hole (not shown in the figure) that matches the size of the guide rod 41, so that the upper mold plate 1 can be sleeved on the guide rod 41, and the guide rod 41 is configured to connect the upper mold plate 1 and the lower sealing plate 52 along the first direction Z. The upper mold plate 1 is configured to move along the first direction Z through the guide rod 41. The setting of the guide rod 41 can ensure that the upper mold plate 1 moves along a strictly preset path, eliminating deflection and jamming, and improving the positioning accuracy and device stability of the molding device 10 when it is reused. Meanwhile, the elastic element 42 is configured to be sleeved on the guide rod 41, and the elastic element 42 is configured to reset the upper mold plate 1, making the reset method of the upper mold plate 1 simpler and faster.

[0042] In some embodiments, the elastic element 42 includes a spring, which can provide a simple, non-external power source-free and fast-responding automatic reset method with low failure rate and simple maintenance. When used in conjunction with the guide rod 41, it can improve the running stability of the upper plate 1 of the mold.

[0043] In some embodiments, the lower mold plate 51 and the lower sealing plate 52 of this application are detachably connected, and the upper mold plate 1 and the guide rod 41 are also detachably connected, so that the upper mold plate 1 and the lower mold plate 51 can be replaced according to the specifications and shape of the sealing strip, and the molding device 10 can adapt to different working scenarios.

[0044] In some embodiments, please refer to Figure 1The lower sealing plate 52 is provided with a first connecting block 521, and the upper mold plate 1 is provided with a second connecting block 12, which is an inclined locking block. The molding device 10 also includes a pair of force-applying modules 6, which are configured to be installed on the lower sealing plate 52, and the lower mold plate 51 along the third direction Y is located between the pair of force-applying modules 6. Specifically, the force-applying module 6 includes a strip-shaped force-applying rod 61, a strip-shaped connecting rod 62, a plate-shaped connecting plate 63, and a locking member 64 with a hook 641. The middle section of the force-applying rod 61 is provided with a hinge area 611. The first connecting block 521 is configured to be hinged to one end of the force-applying rod 61, one end of the connecting rod 62 is configured to be hinged to the hinge area 611 of the force-applying rod 61, and the other end of the connecting rod 62 is configured to be hinged to the connecting plate 63. The locking member 64 is provided with a hook 641. One end of the 4 is configured to be hinged to the connecting plate 63, and the other end of the snap-fit ​​64 is configured to snap-fit ​​to the second connecting block 12. When a force is applied to the force-applying rod 61, the force-applying rod 61 can rotate around the first connecting block 521, moving the connecting rod 62, connecting plate 63, and snap-fit ​​64. Ultimately, the upper mold plate 1 is configured to move along the first direction Z via the guide rod module 4, and the upper mold plate 1 and lower mold plate 51 are closed, reducing the operational difficulty of the molding device 10. When the upper mold plate 1 needs to be disassembled, the snap-fit ​​hook 641 of the snap-fit ​​64 can be separated from the second connecting block 12.

[0045] In some embodiments, please refer to Figure 1 and Figure 3 The hinge structure in the force application module 6 includes a hinge hole 522 and a hinge shaft 631. The hinge shaft 631 can be inserted into the hinge hole 522 and rotate freely around the axis of the hinge hole 522. This application does not limit the distribution of the hinge hole 522 and the hinge shaft 631 on the first connecting block 521, the force application rod 61, the connecting rod 62, the connecting plate 63 and the snap-fit ​​member 64. In the connection part of the two components, one of them contains the hinge shaft 631 and the other contains the hinge hole 522. Optionally, hinge holes 522 are provided at the locations where the first connecting block 521, the force-applying rod 61 connects to the connecting rod 62, the connecting rod 62 connects to the connecting plate 63, and the connection points of the snap-fit ​​component 64 and the connecting plate 63, so that the force-applying rod 61 can be hinged to the first connecting block 521 with a hinge shaft 631, the connecting rod 62 can be hinged to the hinge area 611 of the force-applying rod 61 with a hinge shaft 631, the connecting rod 62 can be hinged to the connecting plate 63 with a hinge shaft 631, and the snap-fit ​​component 64 can be hinged to the connecting plate 63 with a hinge shaft 631.

[0046] In some embodiments, please refer to Figure 1The molding device 10 also includes a plate-shaped base 7, which is configured to mount the lower mold module 5. The base 7 can evenly distribute the load and effectively resist the vibration during the operation of the molding device 10, ensuring the smooth operation of the molding device 10. Optionally, a buffer pad (not shown in the figure) can be installed on the bottom surface of the base 7 that contacts the worktable to further improve the stability of the molding device 10.

[0047] The solution of this application completes the extrusion molding process of the sealing material by closing the upper mold plate 1 and the lower mold module 5. At the same time, the cutter 2 of the upper mold plate 1 can cut the sealing strip to the required size. After the upper mold plate 1 separates from the receiving groove 11, the sealing strip in the forming hole 21 is exposed, and the sealing strip can be quickly removed. That is, the forming device 10 of this application has the functions of extrusion thinning, cutting and unloading, which can reduce the working time of preparing sealing strips in the laboratory, simplify the workflow of preparing sealing strips, and improve work efficiency. The extrusion molding process and the sealing strip removal process do not affect the structural integrity of the forming device 10, which can extend the service life of the forming device 10.

[0048] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A molding apparatus configured to mold a sealing material into a sealing strip, characterized in that, The molding device includes an upper mold plate, a cutting tool, an upper sealing plate, a guide rod module, and a lower mold module; The upper plate of the mold is provided with a receiving groove at the top along the first direction, and the upper sealing plate is configured to be detachably connected to the receiving groove; the cutting tool includes a forming hole, the cutting tool is configured to be installed at the bottom of the receiving groove along the first direction, the forming hole is configured to penetrate the upper plate of the mold along the first direction, and the forming hole is configured to receive the sealing material; The guide rod module is configured to connect the upper mold plate and the lower mold module along a first direction. The upper mold plate is configured to move along the first direction via the guide rod module and close with the lower mold module. The upper sealing plate is configured to fill the receiving groove so that the sealing material is extruded into the sealing strip. The moving direction of the upper mold plate is the first direction.

2. The molding apparatus according to claim 1, characterized in that, The lower mold module includes a lower mold plate and a lower sealing plate. The lower sealing plate is configured to connect to the bottom of the lower mold plate along the first direction. The lower mold plate is configured to press the sealing material at both ends along the first direction, respectively, along with the upper sealing plate.

3. The molding apparatus according to claim 2, characterized in that, The molding device includes a pair of guide rod modules, which are configured to be mounted on the lower sealing plate, and the lower mold plate is located between the pair of guide rod modules along the second direction; The guide rod module includes a guide rod and an elastic element. The guide rod is configured to connect the upper mold plate and the lower sealing plate along a first direction. The upper mold plate is configured to move along the first direction via the guide rod. The elastic element is configured to be sleeved on the guide rod and to reset the upper mold plate.

4. The molding apparatus according to claim 3, characterized in that, The lower mold plate is configured to be detachably connected to the lower sealing plate, and the upper mold plate is configured to be detachably connected to the guide rod.

5. The molding apparatus according to claim 3, characterized in that, The molding device further includes a pair of force-applying modules, which are configured to be installed on the lower sealing plate and the lower mold plate is located between the pair of force-applying modules along the third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other; the lower sealing plate is provided with a first connecting block, and the upper mold plate is provided with a second connecting block; The force-applying module includes a force-applying rod, a connecting rod, a connecting plate, and a snap-fit ​​component. The first connecting block is configured to be hinged to one end of the force-applying rod, one end of the connecting rod is configured to be hinged to the force-applying rod, and the other end of the connecting rod is configured to be hinged to the connecting plate. One end of the snap-fit ​​component is configured to be hinged to the connecting plate, and the other end of the snap-fit ​​component is configured to be snap-fitted to the second connecting block. The force-applying rod is configured to receive the applied force, causing the upper mold plate to be configured to move along the first direction via the guide rod module, and the upper mold plate and the lower mold plate to close the mold.

6. The molding apparatus according to claim 3, characterized in that, The elastic element includes a spring.

7. The molding apparatus according to claim 2, characterized in that, At least a portion of the cutting tool is configured to protrude from the bottom surface of the upper mold plate along the first direction; The lower mold plate includes a cutting groove configured to match the shape of the cutting tool, such that the cutting groove is configured to receive the cutting tool.

8. The molding apparatus according to claim 1, characterized in that, The molding apparatus also includes a base configured to mount the lower mold module.

9. The molding apparatus according to claim 1, characterized in that, The cutting tool and the upper plate of the mold are configured as an integral molding structure.

10. The molding apparatus according to claim 1, characterized in that, The molding apparatus further includes a connecting assembly, wherein the upper sealing plate is configured to be floatingly connected to the receiving groove via the connecting assembly.