An automatic positioning wafer profilometer
Patent Information
- Application Number
- CN202522693554.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-19
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-19
AI Technical Summary
Traditional wafer profilometers often rely on manual wafer placement, resulting in low measurement efficiency, large deviations, and an inability to accurately measure wafer diameter and flat edge length. Furthermore, existing automated equipment is expensive and has low compatibility.
An automatic wafer profilometer was designed, including a rotation mechanism, a lifting mechanism, a Y-axis adjustment mechanism, an edge measurement module, and a NOTCH measurement module. The automatic positioning of the wafer is achieved through the transmission and cooperation of these mechanisms. It is compatible with 2-12 inch wafers and can measure wafer profile, thickness, diameter, NOTCH shape, and flat length.
It enables high-precision wafer positioning without human intervention, shortens measurement preparation time, improves the automation level and measurement consistency of the production line, reduces equipment procurement and maintenance costs, and provides comprehensive and reliable data support.
Smart Images
Figure CN224933449U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer profilometer technology, and more specifically, to an automatically positioned wafer profilometer. Background Technology
[0002] With the rapid development of the semiconductor industry, the demand for wafer processing has also increased significantly. In order to improve production efficiency and ensure product quality, measuring wafer profile has become a key link in ensuring product quality.
[0003] A wafer profilometer is a precision measuring device capable of scanning and measuring the minute structures on a wafer surface with high accuracy. This helps engineers and technicians monitor and control key parameters in the production process. This technology plays a crucial role in the semiconductor industry, effectively detecting and correcting defects in the production process, improving the automation and accuracy of production lines, and thus ensuring product stability and reliability. By monitoring and analyzing production data in real time, wafer profilometer technology can help companies quickly identify problems and take corresponding measures, improving production line efficiency and flexibility, reducing production costs, and improving product quality. For example, after wafers undergo processes such as edge grinding and chamfering, the process effects need to be inspected using appropriate methods. Accurate results obtained from wafer profilometer measurements provide a reference and theoretical basis for subsequent processes.
[0004] Traditional wafer profilometers often rely on manual wafer placement, which is time-consuming, inefficient, and prone to significant deviations, greatly impacting measurement accuracy. Furthermore, they cannot measure wafer diameter and flat edge length. Existing automated measurement equipment is expensive and limited by the size of the robotic arm, making it incompatible with measuring wafers of various sizes. To address the problems of large deviations and low efficiency in manual measurements, and the high cost and low compatibility of automated equipment, as well as to accurately measure wafer diameter and flat edge length, an automatically positioned wafer profilometer was designed. Utility Model Content
[0005] The purpose of this invention is to provide an automatically positioned wafer profiler to solve the problems mentioned in the background art, such as the traditional wafer profiler requiring manual placement of the wafer, long time, low efficiency, large deviation, and significant impact on measurement accuracy, and the inability to measure the wafer diameter and flat edge length.
[0006] To achieve the above objectives, this utility model provides an automatic positioning wafer profilometer, including a rotation mechanism, a lifting mechanism, a Y-axis adjustment mechanism, an edge measurement module, and a NOTCH measurement module; the rotation mechanism, lifting mechanism, and Y-axis adjustment mechanism are connected by a transmission to achieve automatic wafer positioning; the edge measurement module and NOTCH measurement module are used to collect wafer edge profile and NOTCH profile data, respectively; the profilometer is compatible with 2-12 inch wafers and can measure wafer profile, thickness, diameter, NOTCH shape, and flat length.
[0007] This setup, through the coordinated operation of a rotation mechanism, a lifting mechanism, and a Y-axis adjustment mechanism, enables wafer centering and NOTCH / FLAT positioning without manual intervention. It completely solves the problems of low measurement efficiency, large human error, and poor positioning accuracy inherent in traditional manual wafer placement, significantly reducing preparation time for each measurement and improving the automation level and measurement consistency of the production line. It is explicitly compatible with 2-12 inch wafer measurement, breaking the limitations of existing automated profilometers that are restricted by the size or structural design of the robotic arm and can only adapt to a single or limited number of wafer sizes. Enterprises no longer need to configure separate measurement equipment for different wafer sizes, significantly reducing equipment procurement and maintenance costs and improving equipment utilization.
[0008] Preferably, the rotating mechanism includes a DDR motor, a rotating shaft, a vacuum chuck, and a laser beam sensor; the DDR motor is driven and connected to the rotating shaft, the vacuum chuck is located at the end of the rotating shaft, and the laser beam sensor is used to detect the eccentricity between the wafer and the vacuum chuck.
[0009] This setup clearly defines the core components and connections of the rotating mechanism. It uses a laser beam sensor to accurately detect the eccentricity between the wafer and the vacuum chuck, and works in conjunction with the DDR motor and the rotating shaft to provide key eccentricity data for subsequent automatic positioning. The vacuum chuck ensures the stability of the wafer during rotation, laying the foundation for positioning accuracy.
[0010] Preferably, the lifting mechanism includes a lifting cylinder and a precision linear guide; the lifting cylinder is driven and connected to the rotating mechanism, and the precision linear guide provides guidance for the lifting of the rotating mechanism.
[0011] This setting limits the composition and function of the lifting mechanism. The lifting cylinder provides stable lifting power, and the precision linear guide ensures the smoothness and guiding accuracy of the lifting action, ensuring that the wafer does not deviate during the picking, placing, and adjustment process, and providing reliable lifting support for eccentric calibration.
[0012] Preferably, the Y-axis adjustment mechanism includes a servo motor, a coupling, a precision ball screw, and a linear guide; the servo motor is driven and connected to the precision ball screw through the coupling, and the linear guide provides guidance for the movement of the rotation mechanism and the lifting mechanism to adjust the eccentricity between the wafer and the vacuum chuck.
[0013] This setting clearly defines the transmission structure of the Y-axis adjustment mechanism. The servo motor drives the precision ball screw through the coupling, and with the help of the linear guide rail, it realizes the precise Y-axis movement of the rotation mechanism and the lifting mechanism, effectively eliminating wafer eccentricity and ensuring the alignment accuracy between the wafer and the rotation center.
[0014] Preferably, the edge measurement module includes an X-axis telecentric lens, a first CCD camera, a three-dimensional adjustment seat, a two-dimensional adjustable aperture, and a first light source; the three-dimensional adjustment seat is used to adjust the position of the X-axis telecentric lens according to the wafer diameter, and the first CCD camera, in conjunction with the X-axis telecentric lens and the first light source, acquires wafer edge contour images.
[0015] This feature refines the component configuration of the edge measurement module. The three-dimensional adjustment base can adapt to the measurement needs of wafers with different diameters, and the two-dimensional adjustable aperture optimizes the lighting conditions. The first CCD camera, together with the X-axis telecentric lens and the first light source, works together to accurately acquire wafer edge contour images, providing high-quality data support for edge contour and thickness measurement.
[0016] Preferably, the NOTCH measurement module includes a Z-axis telecentric lens, a second CCD camera, an adjustment base, a second light source, and a switching cylinder; the switching cylinder is driven and connected to the Z-axis telecentric lens and is used to switch the NOTCH observation position of the 8-inch and 12-inch wafers.
[0017] This setting limits the core structure of the NOTCH measurement module. The switching cylinder can quickly switch the Z-axis telecentric lens position to adapt to NOTCH measurement of 8-inch and 12-inch wafers, improve the equipment's compatibility with wafers of different sizes, and ensure the accuracy of NOTCH profile acquisition.
[0018] Preferably, the DDR motor is a high-precision motor, which, when combined with a high-precision machined rotary shaft, can achieve high-precision angular error control.
[0019] This feature emphasizes the high-precision characteristics of the DDR motor and the high-precision machining of the rotating shaft, achieving high-precision angular error control, reducing positioning deviations during rotation, and further improving the overall positioning and measurement accuracy.
[0020] Preferably, the Y-axis adjustment mechanism is equipped with a servo closed-loop drive system, and the built-in encoder of the rotation mechanism can provide real-time feedback of position information. The two work together to achieve high-precision control of position, speed, and torque. The wafer diameter and FLAT length are calculated as follows: the area of the wafer blocking the laser is detected by a laser beam sensor, and the relative position relationship between the DDR motor rotation axis and the laser beam sensor is calculated by an algorithm. The automatic positioning process includes: the wafer is placed on a vacuum chuck and fixed by a robotic arm or manually; the DDR motor drives the wafer to rotate; the laser beam sensor calculates the eccentricity based on the area blocking the laser; the lifting mechanism drives the rotation mechanism to descend and place the wafer on the adjustment stage; the Y-axis adjustment mechanism drives the rotation mechanism and the lifting mechanism to move to adjust the eccentricity; the lifting mechanism rises to return the wafer to the vacuum chuck, realizing that the wafer coincides with the rotation center, and simultaneously positioning the NOTCH or FLAT position.
[0021] This setup achieves high-precision control of position, speed, and torque through the cooperation of a servo closed-loop drive system and a built-in encoder; it clarifies the scientific calculation method for diameter and FLAT length to ensure accurate measurement of key parameters; and it refines the automatic positioning process to achieve automated eccentric calibration and NOTCH / FLAT positioning, replacing manual operation and improving positioning efficiency and consistency.
[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0023] In this automatic positioning wafer profilometer, the rotation mechanism, lifting mechanism and Y-axis adjustment mechanism work together to complete wafer centering and NOTCH / FLAT positioning without manual intervention. This completely solves the problems of low measurement efficiency, large human error and poor positioning accuracy that exist in traditional manual wafer placement. It significantly shortens the preparation time for a single measurement and improves the automation level and measurement consistency of the production line.
[0024] It is clearly compatible with the measurement of all wafer sizes from 2 to 12 inches, breaking the limitations of existing automated profilometers that are restricted by the size or structural design of the robotic arm and can only adapt to a single or a few wafer sizes. Enterprises do not need to configure measurement equipment separately for wafers of different sizes, significantly reducing equipment procurement and maintenance costs and improving equipment utilization.
[0025] By leveraging the synergy between the edge measurement module and the NOTCH measurement module, integrated measurement of wafer profile, thickness, diameter, NOTCH shape, and flat length is achieved in one go. This solves the technical blind spot of traditional manual measurement or simple profilometers being unable to accurately obtain key parameters such as wafer diameter and flat length. It provides comprehensive and reliable data support for subsequent processes such as wafer grinding and chamfering, and helps with quality control and process optimization in the production process.
[0026] The structured design of the positioning mechanism and measurement module creates a synergistic effect. Automatic positioning provides a precise reference position for subsequent measurements, avoiding measurement errors caused by positioning deviations. Multiple modules work together to collect data, ensuring the relevance and accuracy of each parameter measurement, ultimately providing technical support for the quality stability of semiconductor products. Attached Figure Description
[0027] Figure 1 This is one of the overall structural schematic diagrams of this utility model;
[0028] Figure 2 This is one of the overall structural schematic diagrams of this utility model;
[0029] Figure 3 This is a partial structural schematic diagram of the present invention;
[0030] The meanings of the labels in the diagram are as follows:
[0031] 1. DDR motor; 2. Rotary shaft; 3. Vacuum suction cup; 4. Laser beam sensor; 5. Lifting cylinder; 6. Precision linear guide; 7. Servo motor; 8. Coupling; 9. Precision ball screw; 10. Linear guide; 11. X-axis telecentric lens; 12. First CCD camera; 13. Three-dimensional adjustment base; 14. Two-dimensional adjustable aperture; 15. First light source; 16. Z-axis telecentric lens; 17. Second CCD camera; 18. Adjustment base; 19. Second light source; 20. Switching cylinder. Detailed Implementation
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] This utility model provides an automatic positioning wafer profiler, such as... Figures 1-3 As shown, it includes a rotation mechanism, a lifting mechanism, a Y-axis adjustment mechanism, an edge measurement module, and a NOTCH measurement module; the rotation mechanism, lifting mechanism, and Y-axis adjustment mechanism are connected by a transmission to achieve automatic wafer positioning; the edge measurement module and NOTCH measurement module are used to collect wafer edge contour and NOTCH contour data, respectively. The contour meter is compatible with 2-12 inch wafers and can measure wafer contour, thickness, diameter, NOTCH shape, and flat length.
[0034] The automatic positioning system achieves high-precision centering and efficient operation, significantly improving the reliability of the measurement reference. By using a high-precision DDR motor paired with a precision-machined rotating shaft, combined with real-time position feedback from the encoder built into the rotating mechanism, and a servo closed-loop drive system and high-precision ball screw for the Y-axis adjustment mechanism, a closed-loop control link is formed, enabling precise control of position, speed, and torque. A laser beam sensor accurately calculates the eccentricity by detecting the area of the wafer blocking the laser beam. The eccentricity is then corrected through the coordinated action of the lifting mechanism and the Y-axis adjustment mechanism, ensuring efficient alignment of the wafer with the rotation center and precise positioning of the NOTCH or FLAT position. This design completely eliminates the efficiency bottlenecks and human error inherent in traditional manual positioning, significantly shortening positioning preparation time. The positioning accuracy and consistency far exceed those of manual operation, providing a stable and reliable reference for subsequent measurements.
[0035] In this embodiment, the rotation mechanism includes a DDR motor 1, a rotation shaft 2, a vacuum chuck 3, and a laser beam sensor 4. The DDR motor 1 is driven and connected to the rotation shaft 2. The vacuum chuck 3 is located at the end of the rotation shaft 2. The laser beam sensor 4 is used to detect the eccentricity between the wafer and the vacuum chuck 3. The lifting mechanism includes a lifting cylinder 5 and a precision linear guide 6. The lifting cylinder 5 is driven and connected to the rotation mechanism. The precision linear guide 6 provides guidance for the lifting and lowering of the rotation mechanism. The Y-axis adjustment mechanism includes a servo motor 7, a coupling 8, a precision ball screw 9, and a linear guide 10. The servo motor 7 is driven and connected to the precision ball screw 9 through the coupling 8. The linear guide 10 provides guidance for the movement of the rotation mechanism and the lifting mechanism to adjust the eccentricity between the wafer and the vacuum chuck 3. The edge measurement module includes an X-axis telecentric lens 11, a first CCD camera 12, a three-dimensional adjustment seat 13, a two-dimensional adjustable aperture 14, and a first light source 15. The three-dimensional adjustment seat 13 is used to adjust the position of the X-axis telecentric lens 11 according to the wafer diameter. The first CCD camera 12, in conjunction with the X-axis telecentric lens 11 and the first light source 15, acquires images of the wafer edge contour. The NOTCH measurement module includes a Z-axis telecentric lens 16, a second CCD camera 17, an adjustment seat 18, a second light source 19, and a switching cylinder 20. The switching cylinder 20 is driven and connected to the Z-axis telecentric lens 16, and is used to switch the NOTCH observation position of 8-inch and 12-inch wafers. The DDR motor 1 is a high-precision motor, which, in conjunction with the high-precision machined rotary shaft 2, enables high-precision angular error control.
[0036] The multi-module collaborative design overcomes size compatibility limitations, enabling multifunctional integrated measurement of wafers of all sizes. The three-dimensional adjustment base of the edge measurement module can flexibly adjust the position of the X-axis telecentric lens according to the diameter of wafers of different sizes from 2 to 12 inches. The switching cylinder of the NOTCH measurement module can quickly switch the observation position between 8-inch and 12-inch wafers, breaking the size adaptation limitations of existing automated equipment. At the same time, through the combination of X-axis and Z-axis telecentric lenses with CCD cameras and dedicated light sources, combined with light optimization by two-dimensional adjustable apertures, precise images of wafer edge contours and NOTCH contours can be acquired. With the collaborative calculation of laser sensors and algorithms, comprehensive measurement of wafer contours, thickness, diameter, NOTCH shape, and FLAT length can be achieved, filling the gap of incomplete measurement parameters in traditional equipment. It can meet the inspection needs of wafers of different sizes without the need for additional equipment, significantly reducing the equipment investment and maintenance costs for enterprises.
[0037] The Y-axis adjustment mechanism is equipped with a servo closed-loop drive system. The built-in encoder of the rotation mechanism can provide real-time feedback of position information. The two work together to achieve high-precision control of position, speed, and torque. The wafer diameter and FLAT length are calculated as follows: the area of the wafer blocking the laser is detected by the laser beam sensor 4, and the relative position relationship between the DDR motor 1 rotation axis and the laser beam sensor 4 is calculated by algorithm. The automatic positioning process includes: the wafer is placed on the vacuum chuck 3 by a robot or manually and fixed by adsorption; the DDR motor 1 drives the wafer to rotate; the laser beam sensor 4 calculates the eccentricity based on the area blocking the laser; the lifting mechanism drives the rotation mechanism to descend and place the wafer on the adjustment stage; the Y-axis adjustment mechanism drives the rotation mechanism and the lifting mechanism to move to adjust the eccentricity; the lifting mechanism rises to return the wafer to the vacuum chuck 3, realizing that the wafer coincides with the rotation center, and simultaneously positioning the NOTCH or FLAT position.
[0038] The accuracy and stability of measurement data have been significantly improved, providing reliable data support for subsequent process optimization. A high-resolution CCD camera equipped with a telecentric lens, along with specially designed first and second light sources, effectively ensures image clarity of minute structures such as wafer edges and notches, providing high-quality raw material for data processing. Wafer diameter and FLAT length are calculated using an algorithm based on the relative position of data detected by the laser beam sensor and the DDR motor's rotation axis, avoiding errors from direct measurement. Combined with a precise benchmark formed by automatic positioning, high-precision control is achieved throughout the entire process from positioning to measurement, ensuring the accuracy and repeatability of all measurement parameters. This reliable data directly reflects the effects of front-end processes such as wafer grinding and chamfering, providing a scientific basis for subsequent process adjustments, helping the production line optimize process parameters, reduce defective products, and ensure the stability of semiconductor product quality.
[0039] When using the automatic positioning wafer profilometer of this utility model, the wafer to be measured is first placed on the vacuum chuck 3 of the rotating mechanism by a robotic arm or manually. The vacuum adsorption system is then activated, and the wafer is firmly adsorbed onto the surface of the vacuum chuck 3 by vacuum negative pressure, which avoids displacement or shift of the wafer during subsequent rotation and adjustment, and provides a basic fixed guarantee for subsequent positioning and measurement.
[0040] After the wafer is fixed, the equipment enters the automatic positioning process: ① The high-precision DDR motor 1 of the rotating mechanism is activated. The DDR motor 1 drives the rotating shaft 2 and the wafer adsorbed on the vacuum suction cup 3 to rotate synchronously. During this process, the laser beam sensor 4 detects the area of the wafer blocking the laser in real time, and calculates the eccentricity between the center of the wafer and the center of the rotating shaft 2 based on the preset algorithm. At the same time, the built-in encoder of the rotating mechanism provides real-time feedback on the rotation position information. ② After receiving the positioning signal, the lifting mechanism activates the lifting cylinder 5, which drives the rotating mechanism to descend smoothly along the precision linear guide rail 6, placing the wafer smoothly on the adjustment table. At this time, the vacuum suction remains closed to facilitate wafer position adjustment. ③ The Y-axis adjustment mechanism is activated. The servo motor 7 drives the precision ball screw 9 to rotate through the coupling 8. Under the guidance of the linear guide rail 10, the rotating mechanism and the lifting mechanism move together along the Y-axis. Based on the eccentricity data detected by the laser beam sensor 4, the wafer position is precisely adjusted until the eccentricity deviation is eliminated. ④ After the eccentric adjustment is completed, the lifting cylinder 5 moves again, driving the rotating mechanism to rise, so that the wafer re-fits the vacuum chuck 3, and restarts the vacuum adsorption to fix the wafer; at the same time, the DDR motor 1 continues to drive the wafer to rotate, and the laser beam sensor 4 detects the sudden change in the area of the blocked laser (the blocked area at the NOTCH or FLAT decreases), and combined with the position feedback of the rotating axis 2, accurately locates the NOTCH or FLAT position of the wafer, completing the entire automatic positioning and calibration process.
[0041] After positioning and calibration, the equipment enters the measurement phase, where each measurement module works together to complete full-parameter detection: ① Edge contour and thickness measurement: Based on the size of the wafer to be measured, the position of the X-axis telecentric lens 11 is adjusted by the three-dimensional adjustment seat 13 of the edge measurement module to align it with the wafer edge; the first light source 15 is turned on, and the lighting conditions are optimized by the two-dimensional adjustable aperture 14. The first CCD camera 12, in conjunction with the X-axis telecentric lens 11, acquires wafer edge contour images in real time. After software image processing, the wafer edge contour and thickness data are accurately obtained. ② NOTCH contour measurement: The DDR motor 1 drives the wafer to rotate to a preset angle, aligning the positioned NOTCH with the NOTCH measurement module; based on the wafer size (8 inches or 12 inches), the cylinder 20 is switched to move the Z-axis telecentric lens 16 to the appropriate observation position; the second light source 19 is turned on, and the second CCD camera 17 acquires NOTCH contour images through the Z-axis telecentric lens 16. After data processing, the NOTCH shape parameters are obtained. ③ Diameter and FLAT length measurement: During the process of the DDR motor 1 driving the wafer to rotate, the laser beam sensor 4 continuously collects the area data of the wafer blocking the laser. Combined with the relative position relationship between the rotating shaft 2 and the sensor fed back by the built-in encoder, the wafer diameter is directly obtained through algorithm calculation. At the same time, the length data of the flat edge FLAT is calculated based on the change of the blocking area corresponding to the FLAT position and the center reference.
[0042] After all parameters are measured, the vacuum adsorption system is shut down and the wafer is released. Then, the measured wafer is removed from the vacuum chuck 3 by a robotic arm or manually, completing a single measurement operation. The equipment can then enter the measurement cycle for the next wafer.
[0043] Finally, it should be noted that the electronic components in the servo motor 7 and other components in this embodiment are all general standard parts or parts known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. In the idle part of this device, all the above-mentioned electrical components are connected by wires. The specific connection method should refer to the working order between each electrical component in the above working principle to complete the electrical connection. All of these are technologies known in the art.
[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. An automatic positioning wafer profiler, characterized in that: It includes a rotation mechanism, a lifting mechanism, a Y-axis adjustment mechanism, an edge measurement module, and a NOTCH measurement module; the rotation mechanism, lifting mechanism, and Y-axis adjustment mechanism are connected by a transmission to achieve automatic wafer positioning; the edge measurement module and NOTCH measurement module are used to collect wafer edge contour and NOTCH contour data, respectively; the contour meter is compatible with 2-12 inch wafers and can measure wafer contour, thickness, diameter, NOTCH shape, and flat length.
2. The automatically positioned wafer profiler according to claim 1, characterized in that: The rotating mechanism includes a DDR motor (1), a rotating shaft (2), a vacuum chuck (3), and a laser beam sensor (4); the DDR motor (1) is driven to the rotating shaft (2), the vacuum chuck (3) is located at the end of the rotating shaft (2), and the laser beam sensor (4) is used to detect the eccentricity between the wafer and the vacuum chuck (3).
3. The automatically positioned wafer profiler according to claim 1, characterized in that: The lifting mechanism includes a lifting cylinder (5) and a precision linear guide (6); the lifting cylinder (5) is driven to the rotating mechanism, and the precision linear guide (6) provides guidance for the lifting of the rotating mechanism.
4. The automatically positioned wafer profiler according to claim 1, characterized in that: The Y-axis adjustment mechanism includes a servo motor (7), a coupling (8), a precision ball screw (9), and a linear guide (10). The servo motor (7) is driven to the precision ball screw (9) through the coupling (8), and the linear guide (10) provides guidance for the movement of the rotation mechanism and the lifting mechanism to adjust the eccentricity between the wafer and the vacuum chuck (3).
5. The automatically positioned wafer profiler according to claim 1, characterized in that: The edge measurement module includes an X-axis telecentric lens (11), a first CCD camera (12), a three-dimensional adjustment seat (13), a two-dimensional adjustable aperture (14), and a first light source (15). The three-dimensional adjustment seat (13) is used to adjust the position of the X-axis telecentric lens (11) according to the wafer diameter. The first CCD camera (12) works with the X-axis telecentric lens (11) and the first light source (15) to acquire wafer edge contour images.
6. The automatically positioned wafer profiler according to claim 1, characterized in that: The NOTCH measurement module includes a Z-axis telecentric lens (16), a second CCD camera (17), an adjustment seat (18), a second light source (19), and a switching cylinder (20); the switching cylinder (20) is driven and connected to the Z-axis telecentric lens (16) and is used to switch the NOTCH observation position of the 8-inch and 12-inch wafers.
7. The automatically positioned wafer profiler according to claim 2, characterized in that: The DDR motor (1) is a high-precision motor, which, together with the high-precision machined rotating shaft (2), can achieve high-precision corner error control.
8. The automatically positioned wafer profiler according to claim 1, characterized in that: The Y-axis adjustment mechanism is equipped with a servo closed-loop drive system, and the built-in encoder of the rotation mechanism can provide real-time feedback of position information. The two work together to achieve high-precision control of position, speed and torque. The calculation method of wafer diameter and FLAT length is as follows: the area of the wafer blocking the laser is detected by the laser beam sensor (4), and the relative position relationship between the DDR motor (1) rotation axis and the laser beam sensor (4) is calculated by the algorithm. The automatic positioning process includes: the wafer is placed on the vacuum chuck (3) by a robot or manually and is fixed by adsorption. The DDR motor (1) drives the wafer to rotate. The laser beam sensor (4) calculates the eccentricity by the area blocking the laser. The lifting mechanism drives the rotation mechanism to descend and place the wafer on the adjustment table. The Y-axis adjustment mechanism drives the rotation mechanism and the lifting mechanism to move to adjust the eccentricity. The lifting mechanism rises to return the wafer to the vacuum chuck (3) to realize the wafer and the rotation center coincide, and at the same time, the NOTCH or FLAT position is positioned.