Electron collector

Abstract

The utility model relates to hydrogen negative accelerator technical field discloses an electron collector, including base body, cooling insert, pipeline subassembly, flange, sealing assembly and apron, be provided with cooling cavity in the base body, cooling insert includes the adapter and the adapter, and the adapter is inserted and is arranged in the cooling cavity and is surrounded with the cooling cavity and forms the cooling flow channel, the adapter is fixed in the base body and is abutted with the adapter, and the adapter is provided with the adapter flow channel in, and the adapter flow channel is linked together with the cooling flow channel, pipeline subassembly includes first pipe, second pipe and insulating pipe, and the first pipe is connected with the adapter and is linked together with the adapter flow channel, the flange ring is arranged in the position of pipeline subassembly close to the second pipe, the sealing assembly is arranged outside the adapter and pipeline subassembly, and the sealing assembly includes the first sealing ring, second sealing ring and insulating sealing ring, the apron is set up in the flange, and the second pipe is by the apron and is worn out. The utility model avoids the problem that the cooling liquid leaks and contacts the vacuum, improves the sealing property and use reliability of electron collector.

Description

Technical Field

[0001] This utility model relates to the field of negative hydrogen accelerator technology, and in particular to an electron collector. Background Technology

[0002] A negative hydrogen accelerator is a particle accelerator system that uses negative hydrogen ions as the acceleration target. It usually consists of a negative hydrogen ion linear accelerator and a fast-cycle synchrotron. Its ultimate goal is to accelerate negative hydrogen ions to high energies, strip them of electrons to become protons, and then inject them into the synchrotron for further accumulation and acceleration to obtain a high-current, high-energy proton beam.

[0003] In negative hydrogen accelerators, the initial velocity of stripped electrons is the same as that of negative hydrogen ions, but their density is twice that of negative hydrogen ions. To reduce beam loss and protect other components, an electron collection device needs to be designed to collect and remove these electrons. The electron collection device operates in a vacuum environment with complex magnetic fields, high radioactivity, and difficult maintenance, thus requiring extremely high reliability. In existing technologies, the cooling channels of electron collection devices typically have their weld joints located on the substrate surface. This easily leads to coolant leakage through the weld joints, causing contact between the coolant and the vacuum, thereby affecting the reliability of the electron collection device.

[0004] Therefore, there is an urgent need for an electron collector to solve the above-mentioned technical problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide an electron collector that can prevent coolant leakage and contact with vacuum, thereby improving the reliability of the electron collector.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Electron collectors, including:

[0008] The substrate has a cooling cavity disposed therein;

[0009] A cooling insert includes a connector and an adapter. The connector is inserted into the cooling cavity and surrounds the cooling cavity to form a cooling channel. The adapter is fixed to the base and abuts against the connector. The adapter has an adapter channel inside and is connected to the cooling channel.

[0010] A piping assembly includes a first pipe, a second pipe, and an insulating pipe connecting the first pipe and the second pipe, wherein the first pipe is connected to the adapter and communicates with the adapter flow channel;

[0011] A flange is provided around the piping assembly near the second pipe;

[0012] A sealing assembly is provided around the adapter and the pipeline assembly. The sealing assembly includes a first sealing ring, a second sealing ring, and an insulating sealing ring. The first sealing ring is fixed to the end of the base body, the second sealing ring is fixed to the flange, and the insulating sealing ring is fixed between the first sealing ring and the second sealing ring.

[0013] A cover plate is disposed on the side of the flange opposite to the second sealing ring, and the second pipe extends through the cover plate.

[0014] In some possible implementations, the electron collector further includes a protective cover circumferentially disposed around the outer periphery of the insulating sealing ring, with one end of the protective cover spaced apart from the end of the substrate.

[0015] In some possible implementations, the piping assembly further includes a bellows connecting the insulating pipe and the second pipe, with the flange ring disposed outside the bellows.

[0016] In some possible implementations, the corrugated pipe is provided with a first adapter ring and a second adapter ring at both ends, and the insulating pipe is provided with a third adapter ring and a fourth adapter ring at both ends; the first pipe is connected to the insulating pipe through the third adapter ring; the insulating pipe is connected to the corrugated pipe through the fourth adapter ring and the first adapter ring; and the corrugated pipe is connected to the second pipe through the second adapter ring.

[0017] In some possible implementations, a first through hole is provided through the cover plate, and the second tube passes through the first through hole; a limiting step is provided on the side of the cover plate near the flange, and the second transition ring abuts against the limiting step; a retaining spring is provided on the side of the cover plate away from the flange, and the retaining spring is clamped and installed on the outer wall of the second tube, and the retaining spring is engaged with the outside of the first through hole.

[0018] In some possible implementations, a second through hole is also provided through the cover plate, through which a voltage line and a signal line are passed. The voltage line is used to apply a positive voltage to the substrate, and the signal line is used to detect the current signal of the substrate.

[0019] In some possible implementations, the substrate is made of dispersed copper, the cooling insert is made of oxygen-free copper, and the cooling insert is fixed to the substrate by brazing.

[0020] In some possible implementations, the first sealing ring and the second sealing ring are both made of titanium alloy TC4, the insulating sealing ring is made of ceramic, the first sealing ring is fixed to the substrate and the insulating sealing ring by brazing, and the second sealing ring is fixed to the insulating sealing ring and the flange by brazing; the insulating tube is made of ceramic.

[0021] In some possible implementations, the protective cover is made of stainless steel and overlaps the second sealing ring.

[0022] In some possible implementations, the cooling chamber includes two spaced-apart chambers, and the connector includes two inserts, which are inserted into the two chambers in a one-to-one correspondence to form the cooling channel; the transition channel includes an inlet channel and an outlet channel, the inlet channel being connected to the inlet of the cooling channel and the outlet channel being connected to the outlet of the cooling channel; the piping assembly is provided in two sets, one set of piping assembly being connected to the inlet channel and the other set of piping assembly being connected to the outlet channel.

[0023] The beneficial effects of this utility model are:

[0024] The electron collector provided by this utility model forms a cooling channel by interlocking a cooling insert with the substrate. The cooling channel is then connected to the piping assembly via a transition channel, thus forming a circulating cooling loop. This design avoids the need for welding joints on the substrate, eliminating weld points at the contact points between the substrate and the vacuum environment, as well as at the contact points between the coolant and the cooling channel. This effectively prevents coolant leakage and potential vacuum exposure, improving the sealing performance and reliability of the electron collector. Furthermore, this utility model incorporates a sealing assembly on the outer periphery of the piping assembly, ensuring the overall sealing of the device and effectively isolating the cooling structure from the external vacuum environment, further preventing contact with the vacuum due to coolant leakage. In addition, the piping assembly of this utility model includes an insulating tube between the first and second tubes, and an insulating sealing ring between the first and second sealing rings, ensuring insulation between the flange and the substrate, and guaranteeing the reliable application of positive high pressure to the substrate. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the electron collector provided in this embodiment of the utility model;

[0026] Figure 2 This is a cross-sectional view of the electron collector provided in an embodiment of the present invention;

[0027] Figure 3 This is an exploded view of the electron collector provided in an embodiment of the present invention;

[0028] Figure 4 This is an assembly drawing of the second pipe, the corrugated pipe, the first adapter ring, and the second adapter ring provided in this embodiment of the utility model;

[0029] Figure 5 This is an assembly drawing of the insulating tube, the third adapter ring, and the fourth adapter ring provided in this embodiment of the utility model;

[0030] Figure 6 This is an assembly drawing of the pipeline assembly provided in this embodiment of the utility model;

[0031] Figure 7 This is an assembly drawing of the base and connector provided in an embodiment of the present utility model;

[0032] Figure 8 This is an assembly drawing of the base, connector, and adapter provided in this embodiment of the utility model;

[0033] Figure 9 This is an assembly drawing of the first intermediate body provided in this embodiment of the utility model;

[0034] Figure 10 This is an assembly drawing of the second intermediate body provided in this embodiment of the utility model;

[0035] Figure 11 This is an assembly drawing of the third intermediate provided in this embodiment of the utility model;

[0036] Figure 12 This is an assembly drawing of the fourth intermediate provided in this embodiment of the utility model;

[0037] Figure 13 This is an assembly drawing of the fourth intermediate body and the cover plate provided in this embodiment of the utility model;

[0038] Figure 14 This is a cross-sectional view of the substrate provided in an embodiment of the present utility model;

[0039] Figure 15 This is a schematic diagram of the structure of the connector provided in this embodiment of the utility model;

[0040] Figure 16 This is an assembly cross-sectional view of the base and cooling plug provided in this embodiment of the utility model;

[0041] Figure 17 This is a schematic diagram of the structure of the cover plate provided in an embodiment of this utility model.

[0042] In the picture:

[0043] 1. Base; 11. Cooling channel; 10. Chamber; 2. Cooling insert; 21. Connector; 211. Insert rod; 22. Adapter; 221. Inlet channel; 222. Outlet channel; 3. Piping assembly; 31. First pipe; 32. Second pipe; 33. Insulating pipe; 331. Third adapter ring; 332. Fourth adapter ring; 34. Bellows; 341. First adapter ring; 342. Second adapter ring; 4. Flange; 5. Sealing assembly; 51. First sealing ring; 52. Second sealing ring; 53. Insulating sealing ring; 6. Cover plate; 61. First through hole; 62. Limiting step; 63. Second through hole; 7. Protective cover; 8. Snap ring. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0045] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this utility model, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are merely used for distinction in description and have no special meaning.

[0048] like Figures 1 to 17 As shown, this embodiment provides an electron collector for use in the high-radioactivity, vacuum region of a negative hydrogen accelerator. The electron collector includes a substrate 1, a cooling insert 2, a piping assembly 3, a flange 4, a sealing assembly 5, and a cover plate 6. A voltage is applied between the substrate 1 and the flange 4, with a positive high voltage on the substrate 1 and the flange 4 serving as a ground terminal, thus enabling electron absorption through the substrate 1. Since the positive voltage applied to the substrate 1 is approximately 100-200V, the substrate 1 attracts electrons, resulting in a high temperature; therefore, heat dissipation is required for the substrate 1. In this embodiment, a cooling chamber is provided within the substrate 1 to cooperate with the cooling insert 2. The cooling insert 2 includes a connector 21 and an adapter 22. The connector 21 is inserted into the cooling cavity, and the connector 21 and the cooling cavity together form a cooling channel 11. The adapter 22 is fixed to the base 1 and abuts against the connector 21. An adapter channel is provided inside the adapter 22. One end of the adapter channel is connected to the cooling channel 11, and the other end is connected to the piping assembly 3. This allows circulating coolant to be introduced into the cooling channel 11 to achieve liquid cooling heat dissipation for the base 1. In this embodiment, the cooling insert 2 and the base 1 are interlocked to form the cooling channel 11, and the cooling channel 11 is then connected to the piping assembly 3 through the adapter channel, thereby forming a circulating cooling loop. This design avoids the need for welding joints on the base 1, so there are no weld points at the contact points between the base 1 and the vacuum environment, and there are also no weld points at the contact points between the coolant and the cooling channel 11. This effectively avoids the problem of coolant leakage and contact with the vacuum, improving the sealing performance and reliability of the electron collector.

[0049] Optionally, in this embodiment, the material of the substrate 1 is dispersed copper. Compared with oxygen-free copper, the dispersed copper substrate 1 has a higher softening temperature and melting point, which can prevent the substrate 1 from melting due to heat, improving the reliability of the electron collector. Furthermore, the dispersed copper substrate 1 also has good heat transfer and electron absorption capabilities. In addition, dispersed copper has good machinability, facilitating the fabrication of cooling chambers within it, thus achieving a channel-free weld joint on the substrate 1 in a vacuum environment. Optionally, in this embodiment, the material of the cooling insert 2 is oxygen-free copper, and the cooling insert 2 is fixed to the substrate 1 by brazing. The cooling insert 2 made of oxygen-free copper and the dispersed copper substrate 1 have good brazing characteristics, enabling reliable sealing of the water channels.

[0050] In some embodiments, the cooling chamber includes two spaced-apart chambers 10. The connector 21 includes two inserts 211, which are inserted into the two chambers 10 in a one-to-one correspondence, with a gap between the bottom of the insert 211 and the bottom of the chamber 10. This allows the formation of a cooling channel 11 with four parallel channels connected in an S-shape within the cooling chamber. The inlet and outlet of the cooling channel 11 are respectively located on the two channels on either side. This arrangement helps to increase the cooling circulation area of ​​the substrate 1 and improve the heat dissipation capacity of the substrate 1. The transition channel includes an inlet channel 221 and an outlet channel 222, wherein the inlet channel 221 is connected to the inlet of the cooling channel 11, and the outlet channel 222 is connected to the outlet of the cooling channel 11. Two sets of pipe assemblies 3 are provided, one set of which is connected to the inlet channel 221, and the other set of which is connected to the outlet channel 222. During operation, the coolant flows into the inlet channel 221 along a set of pipe assemblies 3, and then enters the cooling channel 11 through the inlet of the cooling channel 11 to achieve heat exchange with the substrate 1. After that, the coolant flows out from the outlet of the cooling channel 11 to the outlet channel 222, and then flows out through another set of pipe assemblies 3, thus forming the entire circulation loop.

[0051] The piping assembly 3 includes a first pipe 31, a second pipe 32, and an insulating pipe 33 connecting the first pipe 31 and the second pipe 32. The first pipe 31 is connected to the adapter 22 and communicates with the adapter flow channel, thus enabling the flow of coolant between the piping assembly 3 and the cooling flow channel 11. A flange 4 is annularly disposed on the piping assembly 3 near the second pipe 32, and a cover plate 6 is disposed on the side of the flange 4 away from the base 1. The second pipe 32 passes through the cover plate 6, which facilitates the connection of the piping assembly 3 to an external coolant circulation device. Furthermore, in this embodiment, the piping assembly 3 has an insulating pipe 33 between the first pipe 31 and the second pipe 32, ensuring insulation between the flange 4 and the base 1, so that the potential at the first pipe 31 is the same as the potential at the base 1, and the potential at the second pipe 32 is the same as the potential at the flange 4. Optionally, the first tube 31 and the second tube 32 are made of stainless steel, which has high structural strength and good resistance to high temperature and pressure, as well as corrosion resistance; the insulating tube 33 is made of ceramic, which has a high melting point and can maintain good insulation performance even in high-temperature environments, making it suitable for insulation support and fluid transportation in high-temperature, high-pressure, and highly corrosive environments. For example, the insulating tube 33 can be made of silicon nitride, alumina, mullite, etc.

[0052] Furthermore, the piping assembly 3 also includes a bellows 34, which connects the insulating pipe 33 and the second pipe 32, with a flange 4 annularly disposed around the bellows 34. In this embodiment, the bellows 34 acts as a buffer, reducing the impact on the piping assembly 3 and alleviating the stress on the insulating pipe 33, effectively ensuring the reliability of the piping assembly 3. For example, the bellows 34 can be a 0.2mm thick hydraulic bellows to improve its ability to withstand high-pressure hydraulic flow.

[0053] Furthermore, a first adapter ring 341 and a second adapter ring 342 are respectively provided at both ends of the corrugated pipe 34, and a third adapter ring 331 and a fourth adapter ring 332 are respectively provided at both ends of the insulating pipe 33; the first pipe 31 is connected to the insulating pipe 33 through the third adapter ring 331; the insulating pipe 33 is connected to the corrugated pipe 34 through the fourth adapter ring 332 and the first adapter ring 341; the corrugated pipe 34 is connected to the second pipe 32 through the second adapter ring 342. This arrangement facilitates the assembly of each pipe component, and ensures reliable welding between the adapter rings and between the adapter rings and the corrugated pipe 34 and the insulating pipe 33.

[0054] A sealing assembly 5 is annularly disposed around the adapter 22 and the piping assembly 3. The sealing assembly 5 includes a first sealing ring 51, a second sealing ring 52, and an insulating sealing ring 53. The first sealing ring 51 is fixed to the end of the base 1, the second sealing ring 52 is fixed to the flange 4, and the insulating sealing ring 53 is fixed between the first sealing ring 51 and the second sealing ring 52. In this embodiment, the sealing assembly 5 is disposed around the outer periphery of the piping assembly 3, ensuring the overall airtightness of the equipment and effectively isolating the cooling structure from the external vacuum environment, further preventing contact with the vacuum due to coolant leakage. The insulating sealing ring 53, disposed between the first sealing ring 51 and the second sealing ring 52, ensures the insulation between the flange 4 and the base 1, guaranteeing the reliable application of positive high voltage to the base 1. Optionally, the first sealing ring 51, the second sealing ring 52, and the flange 4 are all made of titanium alloy TC4, and the insulating sealing ring 53 is made of ceramic. TC4 titanium alloy exhibits excellent high-temperature stability, making it suitable for use in vacuum equipment with fluctuating temperatures. Furthermore, its magnetic permeability is less than 1.05, preventing interference with the beam and surrounding complex magnetic fields. The insulating sealing ring 53 is made of ceramic material with a high melting point, maintaining good insulation performance even at high temperatures, thus achieving insulation between the first sealing ring 51 and the second sealing ring 52. For example, the material of the insulating sealing ring 53 can be silicon nitride, alumina, mullite, etc. Further, in this embodiment, the first sealing ring 51 can be fixed to the substrate 1 and the insulating sealing ring 53 by brazing, and the second sealing ring 52 can be fixed to the insulating sealing ring 53 and the flange 4 by brazing, which facilitates processing and ensures high reliability.

[0055] Since electron sputtering onto the insulating sealing ring 53 reduces its insulation, this embodiment's electron collector also includes a protective cover 7. The protective cover 7 is arranged around the outer periphery of the insulating sealing ring 53, with one end overlapping the second sealing ring 52 and the other end spaced apart from the end of the substrate 1. The protective cover 7 is made of metal, which attracts electrons and prevents insulation failure of the insulating sealing ring 53 due to electron bombardment. In some embodiments, the protective cover 7 is made of stainless steel and undergoes non-magnetic treatment to avoid affecting the magnetic field of the surrounding environment. In some embodiments, the protective cover 7 is made of titanium alloy TC4, resulting in a permeability of less than 1.05 for the entire device, achieving zero interference from the negative hydrogen beam and the surrounding complex magnetic field. Since even a small gap in a vacuum can provide excellent insulation, this embodiment spaces one end of the protective cover 7 from the end of the substrate 1, ensuring reliable insulation between the substrate 1 and the protective cover 7.

[0056] In this embodiment, a first through hole 61 is provided through the cover plate 6, and the second pipe 32 extends outward from the first through hole 61. Specifically, there are two first through holes 61, corresponding one-to-one with the second pipes 32 of the two sets of pipe assemblies 3. A limiting step 62 is provided on the side of the cover plate 6 near the flange 4, and the second transition ring 342 abuts against the limiting step 62 to prevent the pipe assembly 3 from moving away from the base 1; at the same time, a retaining spring 8 is provided on the side of the cover plate 6 away from the flange 4. The retaining spring 8 is clamped and installed on the outer wall of the second pipe 32 and is engaged with the outside of the first through hole 61, thus preventing the pipe assembly 3 from moving towards the base 1. Furthermore, the retaining spring 8 can be fixed to the cover plate 6 by spot welding. In this embodiment, the axial movement of the pipe assembly 3 is restricted by the limiting step 62 and the retaining spring 8, reducing the stress on the welds of the pipe assembly 3 caused by manual pulling. Furthermore, two second through holes 63 are also provided on the cover plate 6. One of the second through holes 63 is equipped with a voltage line for applying a positive voltage to the substrate 1; the other second through hole 63 is equipped with a signal line for detecting the current signal of the substrate 1 in order to monitor and control the beam characteristics.

[0057] This embodiment also provides a method for processing an electron collector. In this method, all brazing steps involve furnace welding. Since the electron collector requires multiple furnace welding processes, to ensure that the welding in the next step does not affect the welding effect of the previous step and to avoid melting the welding structure of the previous step, this embodiment sets different welding temperatures in different welding steps (e.g., ensuring that the welding temperature of the next step does not exceed the welding temperature of the previous step), or selects different welding materials (e.g., ensuring that the solder and the substrate can form a welding compound with a higher melting point during the welding in the previous step), thereby ensuring the reliability of each welding step. Specifically, this embodiment designs the following multi-level gradient welding according to different base materials, wherein the melting point relationship of the various solders used is: Copper oxide TU1 > AgCuPd28-20 > AgCuPd31-10 > AgCu28.

[0058] The electron collector processing method of this embodiment includes the following steps:

[0059] S1. Assemble the pipeline assembly 3: Weld the first pipe 31 and the second pipe 32 to the two ends of the insulating pipe 33 respectively to form the pipeline assembly 3;

[0060] In some embodiments, the conduit assembly 3 further includes a corrugated pipe 34 disposed between the insulating pipe 33 and the second pipe 32. Therefore, step S1 specifically includes:

[0061] S11, such as Figure 4 As shown, a first adapter ring 341 and a second adapter ring 342 are brazed to both ends of the bellows 34, and the second pipe 32 is fixed to the second adapter ring 342 by brazing, so as to realize the connection between the second pipe 32 and one end of the bellows 34.

[0062] In step S11, the material of the corrugated pipe 34 is stainless steel, the material of the first adapter ring 341 and the second adapter ring 342 is stainless steel, the material of the second pipe 32 is stainless steel, the solder used for welding is copper oxide TU1, the welding temperature is 1100 degrees Celsius, and the holding time is 3 minutes.

[0063] S12, such as Figure 5 As shown, a third transition ring 331 and a fourth transition ring 332 are brazed to both ends of the insulating tube 33, respectively.

[0064] In step S12, the insulating tube 33 is made of ceramic, the third adapter ring 331 and the fourth adapter ring 332 are made of stainless steel, the solder used for welding is copper oxide TU1, the welding temperature is 1100 degrees Celsius, and the holding time is 3 minutes.

[0065] It should be noted that steps S11 and S12 are not in any particular order. Step S11 can be executed first, or step S12 can be executed first, or they can be processed simultaneously.

[0066] S13, such as Figure 6 As shown, the first adapter ring 341 and the fourth adapter ring 332 are brazed to connect the other end of the bellows 34 to one end of the insulating tube 33; the third adapter ring 331 is brazed to the first tube 31 to connect the other end of the insulating tube 33 to the first tube 31.

[0067] Step S13 is performed after steps S11 and S12 are completed. In step S13, the material of the first tube 31 is stainless steel, the solder used for welding is AgCuPd28-20 solder wire, the welding temperature is 910 degrees Celsius, and the holding time is 5 minutes.

[0068] S2. Assemble the first intermediate, which specifically includes the following three sub-steps:

[0069] S21, such as Figure 7 As shown, the connector 21 is inserted into the cooling cavity of the base 1 to form a cooling channel 11, and the connector 21 is brazed to the base 1 for fixation.

[0070] In step S21, the material of the substrate 1 is dispersed copper, the material of the connector 21 is oxygen-free copper, the solder used for welding is AgCuPd28-20 solder wire, the welding temperature is 950 degrees Celsius, and the holding time is 30 minutes.

[0071] S22, such as Figure 8 As shown, the adapter 22 is brazed onto the base 1 so that the adapter flow channel inside the adapter 22 is connected to the cooling flow channel 11;

[0072] In step S22, the material of adapter 22 is oxygen-free copper, the solder used for welding is AgCu28 solder wire, and the weld is coated with titanium powder. The welding temperature is 850 degrees Celsius, and the temperature is maintained for 5 minutes.

[0073] S23, such as Figure 9 As shown, the first sealing ring 51 is brazed onto the base 1, so that the first sealing ring 51 surrounds the adapter 22.

[0074] In step S23, the material of the first sealing ring 51 is titanium alloy TC4, the solder used during welding is AgCu28 solder wire, the welding temperature is 850 degrees, and the holding time is 5 minutes.

[0075] S3, such as Figure 10 As shown, assemble the second intermediate body: braze the adapter 22 in the first intermediate body to the first pipe 31 in the pipeline assembly 3 to make the pipeline assembly 3 connected to the adapter flow channel;

[0076] Step S3 is performed after steps S1 and S2 are completed. In step S3, the solder used is AgCuPd31-10 solder wire, the welding temperature is 805 degrees Celsius, and the holding time is 4 minutes.

[0077] S4, such as Figure 11 As shown, assemble the third intermediate body: braze the second sealing ring 52 to one side of the flange 4;

[0078] In step S4, the materials of the second sealing ring 52 and the flange 4 are both titanium alloy TC4, the welding material is AgCu28 welding wire, the welding temperature is 805 degrees, and the holding time is 5 minutes.

[0079] It should be noted that steps S1, S2 and S4 are not in any particular order; any one of them can be performed first, or they can be processed simultaneously.

[0080] S5, such as Figure 12 As shown, assembling the fourth intermediate body: one end of the insulating sealing ring 53 is brazed to the first sealing ring 51 in the second intermediate body, and the other end of the insulating sealing ring 53 is brazed to the second sealing ring 52 in the third intermediate body, so that the insulating sealing ring 53 and the second sealing ring 52 surround the outside of the pipeline assembly 3.

[0081] Step S5 is performed after steps S1-S4 are completed. In step S5, the insulating sealing ring 53 is made of ceramic, the solder used for welding is AgCu28 solder sheet, the welding temperature is 805 degrees Celsius, and the holding time is 5 minutes.

[0082] S6, such as Figure 13 As shown, assembling the cover plate 6: The cover plate 6 is fixed to the flange 4 in the fourth intermediate body, so that the second pipe 32 passes through the cover plate 6. Specifically, the cover plate 6 is fixed to the flange 4 by bolts, and a first through hole 61 is provided on the cover plate 6, through which the second pipe 32 passes outward.

[0083] In this embodiment, step S6 is performed after steps S1-S5 are completed. To reliably fix the pipeline assembly 3 and prevent it from moving up and down, step S6 further includes: making the second adapter ring 342 of the pipeline assembly 3 abut against the limiting step 62 on the inner side of the cover plate 6, making the retaining spring 8 clamped and installed on the outer wall of the second pipe 32, and spot welding the retaining spring 8 to the outer side of the cover plate 6. With this configuration, the axial movement of the pipeline assembly 3 is restricted by the limiting step 62 and the retaining spring 8, reducing the stress on the welds of the pipeline assembly 3 caused by manual pulling. Furthermore, the cover plate 6 is also provided with a second through hole 63. Step S6 further includes: passing a voltage line and a signal line through the second through hole 63 of the cover plate 6, wherein the voltage line is used to apply a positive voltage to the substrate 1, and the signal line is used to detect the current signal of the substrate 1.

[0084] Furthermore, the electron collector in this embodiment also includes a protective cover 7. Therefore, after step S5 and before step S6, the following steps are also included:

[0085] S51. Assemble the protective cover 7: Overlap one end of the protective cover 7 onto the second sealing ring 52, so that the protective cover 7 surrounds the outside of the insulating sealing ring 53, and the other end of the protective cover 7 is spaced apart from the base 1. Specifically, the material of the protective cover 7 is stainless steel, titanium alloy TC4, or other metal materials.

[0086] The electron collector processing method provided by this utility model involves first welding the pipeline assembly 3 separately, welding the first intermediate body separately, and then welding the pipeline assembly 3 to the first intermediate body to form the second intermediate body; simultaneously, the third intermediate body is welded separately; then, the two ends of the insulating sealing ring 53 are welded to the first sealing ring 51 in the second intermediate body and the second sealing ring 52 in the third intermediate body respectively, thereby forming the fourth intermediate body; finally, the cover plate 6 is assembled on the flange 4 of the fourth intermediate body to complete the processing of the entire electron collector. This method of processing the electron collector in multiple modules improves processing efficiency and enhances the welding reliability between components, preventing welding failure of corresponding components due to repeated furnace welding.

[0087] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. An electron collector, characterized in that, include: The substrate (1) has a cooling cavity inside it; The cooling plug (2) includes a connector (21) and an adapter (22). The connector (21) is inserted into the cooling cavity and surrounds the cooling cavity to form a cooling channel (11). The adapter (22) is fixed to the base (1) and abuts against the connector (21). The adapter (22) has an adapter channel inside and is connected to the cooling channel (11). The piping assembly (3) includes a first pipe (31), a second pipe (32) and an insulating pipe (33) connected between the first pipe (31) and the second pipe (32), wherein the first pipe (31) is connected to the adapter (22) and communicates with the adapter channel; Flange (4) is circumferentially disposed on the piping assembly (3) near the second pipe (32); A sealing assembly (5) is arranged around the adapter (22) and the pipeline assembly (3). The sealing assembly (5) includes a first sealing ring (51), a second sealing ring (52) and an insulating sealing ring (53). The first sealing ring (51) is fixed to the end of the base (1), the second sealing ring (52) is fixed to the flange (4), and the insulating sealing ring (53) is fixed between the first sealing ring (51) and the second sealing ring (52). A cover plate (6) is disposed on the side of the flange (4) away from the second sealing ring (52), and the second pipe (32) extends out from the cover plate (6).

2. The electron collector according to claim 1, characterized in that, The electron collector also includes a protective cover (7), which is arranged around the outer periphery of the insulating sealing ring (53), with one end of the protective cover (7) spaced apart from the end of the substrate (1).

3. The electron collector according to claim 1, characterized in that, The piping assembly (3) also includes a bellows (34) connected between the insulating pipe (33) and the second pipe (32), and the flange (4) is arranged around the bellows (34).

4. The electron collector according to claim 3, characterized in that, The corrugated pipe (34) is provided with a first adapter ring (341) and a second adapter ring (342) at both ends, and the insulating pipe (33) is provided with a third adapter ring (331) and a fourth adapter ring (332) at both ends; the first pipe (31) is connected to the insulating pipe (33) through the third adapter ring (331); the insulating pipe (33) is connected to the corrugated pipe (34) through the fourth adapter ring (332) and the first adapter ring (341); the corrugated pipe (34) is connected to the second pipe (32) through the second adapter ring (342).

5. The electron collector according to claim 4, characterized in that, The cover plate (6) has a first through hole (61) through it, and the second tube (32) passes through the first through hole (61); the cover plate (6) has a limiting step (62) on the side near the flange (4), and the second transition ring (342) abuts against the limiting step (62); the cover plate (6) has a retaining ring (8) on the side away from the flange (4), and the retaining ring (8) is clamped and installed on the outer wall of the second tube (32), and the retaining ring (8) is engaged with the outside of the first through hole (61).

6. The electron collector according to claim 1, characterized in that, A second through hole (63) is also provided on the cover plate (6). A voltage line and a signal line are provided in the second through hole (63). The voltage line is used to apply a positive voltage to the substrate (1), and the signal line is used to detect the current signal of the substrate (1).

7. The electron collector according to claim 2, characterized in that, The material of the substrate (1) is dispersed copper, the material of the cooling plug (2) is oxygen-free copper, and the cooling plug (2) is fixed to the substrate (1) by brazing.

8. The electron collector according to claim 7, characterized in that, The first sealing ring (51) and the second sealing ring (52) are both made of titanium alloy TC4, and the insulating sealing ring (53) is made of ceramic. The first sealing ring (51) is fixed to the substrate (1) and the insulating sealing ring (53) by brazing, and the second sealing ring (52) is fixed to the insulating sealing ring (53) and the flange (4) by brazing. The insulating tube (33) is made of ceramic.

9. The electron collector according to claim 8, characterized in that, The protective cover (7) is made of stainless steel and is attached to the second sealing ring (52).

10. The electron collector according to any one of claims 1-9, characterized in that, The cooling chamber includes two chambers (10) spaced apart. The connector (21) includes two inserts (211), which are inserted into the two chambers (10) in a corresponding manner to form the cooling channel (11). The transition channel includes an inlet channel (221) and an outlet channel (222). The inlet channel (221) is connected to the inlet of the cooling channel (11), and the outlet channel (222) is connected to the outlet of the cooling channel (11). The pipeline assembly (3) is provided in two sets, one set of which is connected to the inlet channel (221), and the other set of which is connected to the outlet channel (222).

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