An embedded manifold microchannel heat sink suitable for miniaturized electronic devices

Abstract

The utility model provides a kind of embedded manifold microchannel heat sink suitable for miniaturization electronic equipment, belong to the technical field of electronic equipment heat dissipation, including bearing mechanism, including support, first radiating shell cover fixedly installed in the support outer side, second radiating shell cover fixedly installed in the support side away from first radiating shell cover.The utility model can effectively reduce the impurities that may cause microchannel blockage in cooling liquid, such as mineral deposits, small particles, etc., by filtering assembly and the filtering of its internal filter cartridge, can ensure the smooth flow of cooling liquid in microchannel, avoid microchannel blockage caused by impurity accumulation, so as to maintain stable heat dissipation performance, prolong the service life of microchannel, as the erosion and accumulation of impurities on microchannel are reduced, the inner wall of microchannel is not easy to be damaged, the service life of microchannel can be prolonged, the possibility of replacing the entire heat dissipation device due to microchannel blockage is reduced, and the maintenance cost of equipment is reduced.

Description

Technical Field

[0001] This utility model belongs to the technical field of heat dissipation for electronic devices, and specifically relates to an embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices. Background Technology

[0002] In recent years, with the continuous development of electronic technology, miniaturized electronic devices have been widely used in many fields. The number of integrated electronic components has increased and the power density has continued to increase. However, the trend of miniaturization makes it difficult for traditional heat dissipation methods to meet their heat dissipation needs. Traditional heat dissipation solutions often occupy a large space, and the heat dissipation efficiency is greatly reduced in the limited space of small devices. In this case, embedded manifold microchannel heat dissipation devices are used to provide heat dissipation guarantee for the stable operation of miniaturized electronic devices.

[0003] Currently, microchannels are extremely small and easily clogged by impurities, dirt, or sediment in the coolant. When using unfiltered or low-purity coolant, mineral deposits in the coolant or tiny particles generated during equipment operation may gradually accumulate in the microchannels. Once a blockage occurs, the flow of coolant will be hindered, heat dissipation performance will drop sharply, and it may even lead to overheating and damage to the equipment. Utility Model Content

[0004] The purpose of this invention is to provide an embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices, aiming to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices includes,

[0007] The support mechanism includes a bracket, a first heat dissipation shell fixedly installed on the outside of the bracket, a second heat dissipation shell fixedly installed on the side of the bracket away from the first heat dissipation shell, and a partition fixedly installed on the top of the bracket.

[0008] The heat dissipation mechanism includes a heat dissipation pipe fixedly installed in the inner cavity of the bracket, heat dissipation fins fixedly installed in the cavity at the bend of the heat dissipation pipe, and a filter assembly disposed on the top of the heat dissipation pipe.

[0009] As a preferred embodiment of the present invention, the supporting mechanism further includes a first ventilation pipe fixedly installed on the top of the first heat dissipation shell, a second ventilation pipe fixedly installed on the top of the second heat dissipation shell, and a heat dissipation groove plate fixedly installed in the inner cavity of the second heat dissipation shell.

[0010] As a preferred embodiment of the present invention, the heat dissipation mechanism further includes a plurality of microchannels fixedly installed in the inner cavity of the heat dissipation pipe, and an outlet manifold fixedly installed at the bottom of the heat dissipation pipe.

[0011] In a preferred embodiment of this utility model, there are six microchannels arranged vertically and evenly inside the heat dissipation pipe. One end of each microchannel extends to the outside of one end of the heat dissipation pipe, and the other end of each microchannel is fixedly connected to the outlet manifold and communicates with it.

[0012] As a preferred embodiment of this utility model, the filter assembly includes a housing fixedly installed at the liquid inlet of the heat dissipation pipe, a sealing plug threadedly installed at the top opening of the housing, a threaded sealing head fixedly installed at the bottom of the sealing plug, and a connecting pipe fixedly installed at the bottom of the threaded sealing head.

[0013] As a preferred embodiment of the present invention, the filter assembly further includes a sedimentation hopper fixedly installed at the bottom of the connecting pipe, a filter cartridge movably engaged with the groove at the bottom of the sedimentation hopper, and an inlet manifold fixedly installed on the outside of the housing.

[0014] As a preferred embodiment of this utility model, a through hole is provided on the outer side of the connecting pipe, and the end of the inlet manifold penetrates through the shell until it is fixedly connected to the through hole and is interconnected with it.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: through the filtration of the filter component and its internal filter cartridge, impurities that may cause microchannel blockage in the coolant, such as mineral deposits and tiny particles, can be effectively reduced. This ensures the smooth flow of coolant in the microchannel, avoids microchannel blockage caused by impurity accumulation, maintains stable heat dissipation performance, and extends the service life of the microchannel. Since the erosion and accumulation of impurities on the microchannel are reduced, the inner wall of the microchannel is not easily damaged, which can extend the service life of the microchannel, reduce the possibility of needing to replace the entire heat dissipation device due to microchannel blockage, and reduce the maintenance cost of the equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2This is a partial cross-sectional view of the load-bearing mechanism and a schematic diagram of the heat dissipation mechanism of this utility model;

[0019] Figure 3 This is a partial cross-sectional view of the heat dissipation pipe structure of this utility model;

[0020] Figure 4 This is a cross-sectional view of the filter assembly structure of this utility model;

[0021] Figure 5 This is a bottom view of the overall structure of this utility model.

[0022] In the diagram: 100, bearing mechanism; 101, bracket; 102, first heat dissipation shell; 103, second heat dissipation shell; 104, partition; 105, first ventilation pipe; 106, second ventilation pipe; 107, heat dissipation slot plate; 200, heat dissipation mechanism; 201, heat dissipation pipe; 202, heat dissipation fins; 203, filter assembly; 203a, shell; 203b, sealing plug; 203c, threaded sealing head; 203d, connecting pipe; 203e, sedimentation hopper; 203f, filter cartridge; 203g, inlet manifold; 204, microchannel; 205, outlet manifold. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0026] Example

[0027] Reference Figures 1-5 This is an embodiment of the present invention, which provides an embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices, comprising:

[0028] The support mechanism 100 includes a bracket 101, a first heat dissipation shell 102 fixedly installed on the outside of the bracket 101, a second heat dissipation shell 103 fixedly installed on the side of the bracket 101 away from the first heat dissipation shell 102, and a partition 104 fixedly installed on the top of the bracket 101.

[0029] The heat dissipation mechanism 200 includes a heat dissipation pipe 201 fixedly installed in the inner cavity of the bracket 101, heat dissipation fins 202 fixedly installed in the cavity at the bend of the heat dissipation pipe 201, and a filter assembly 203 disposed on the top of the heat dissipation pipe 201.

[0030] The supporting mechanism 100 ensures the relative position stability of components such as heat dissipation pipe 201, heat dissipation fins 202, and filter assembly 203, which is conducive to the normal operation of the heat dissipation system. The filter assembly can effectively reduce impurities in the coolant that may clog the microchannel 204, such as mineral deposits and tiny particles, and can ensure the smooth flow of coolant in the microchannel 204.

[0031] Specifically, the support mechanism 100 also includes a first ventilation pipe 105 fixedly installed on the top of the first heat dissipation shell 102, a second ventilation pipe 106 fixedly installed on the top of the second heat dissipation shell 103, and a heat dissipation groove plate 107 fixedly installed in the inner cavity of the second heat dissipation shell 103.

[0032] The first ventilation pipe 105 and the second ventilation pipe 106 are respectively distributed on both sides of the bracket 101, which increases the contact area between the heat dissipation device and the external environment. Through heat conduction, the heat generated by the internal components such as the heat dissipation pipe 201 can be more effectively dissipated to the surrounding environment, reducing the internal temperature of the heat dissipation device. The presence of the first heat dissipation shell 102 and the second heat dissipation shell 103 also provides a certain degree of protection for the internal components, preventing external objects from colliding with or damaging the internal precision heat dissipation components.

[0033] Furthermore, the heat dissipation mechanism 200 also includes a number of microchannels 204 fixedly installed in the inner cavity of the heat dissipation pipe 201, and an outlet manifold 205 fixedly installed at the bottom of the heat dissipation pipe 201. There are six microchannels 204, which are arranged vertically and evenly in the inner cavity of the heat dissipation pipe 201. One end of the microchannel 204 extends to the outside of one end of the heat dissipation pipe 201, and the other end of the microchannel 204 is fixedly connected to the outlet manifold 205 and communicates with each other.

[0034] The uniform arrangement of the microchannels 204 helps to distribute the coolant evenly within them, reducing the likelihood of impurities accumulating in certain microchannels due to excessively fast or slow flow rates. The uniform arrangement and reasonable connectivity make the coolant flow in the microchannels 204 more stable and uniform, effectively removing heat while reducing the risk of impurities depositing within them. This helps maintain the unobstructed flow of the microchannels 204, ensuring the efficient heat dissipation performance of the heat dissipation device and preventing a sharp decline in heat dissipation performance and overheating damage to the equipment caused by microchannel blockage.

[0035] Preferably, the filter assembly 203 includes a housing 203a fixedly installed at the liquid inlet of the heat dissipation pipe 201, a sealing plug 203b threadedly installed at the top opening of the housing 203a, a threaded sealing head 203c fixedly installed at the bottom of the sealing plug 203b, and a connecting pipe 203d fixedly installed at the bottom of the threaded sealing head 203c. The filter assembly 203 also includes a sedimentation hopper 203e fixedly installed at the bottom of the connecting pipe 203d, a filter cartridge 203f movably engaged in the bottom groove of the sedimentation hopper 203e, and an inlet manifold 203g fixedly installed on the outside of the housing 203a. A through hole is provided on the outside of the connecting pipe 203d, and the end of the inlet manifold 203g penetrates the housing 203a until it is fixedly connected to the through hole and communicates with it.

[0036] Before entering the heat dissipation pipe 201, the coolant first passes through the filter cartridge 203f. When the coolant enters the filter assembly 203, impurities, dirt, and possible mineral deposits are intercepted by the filter cartridge 203f. The coolant then passes through the sedimentation hopper 203e at the bottom of the connecting pipe 203d before reaching the filter cartridge 203f for filtration. This structural design allows the coolant to undergo multiple filtration processes before entering the microchannel 204, achieving effective filtration.

[0037] During use, the coolant enters the filter assembly 203 through the inlet manifold 203g. First, it passes through the sedimentation hopper 203e to settle larger particles of impurities, and then passes through the filter cartridge 203f to filter out small impurities. The filtered coolant enters the heat dissipation pipe 201, flows in the microchannel 204, carries away heat, and is discharged through the outlet manifold 205.

[0038] The heat dissipation fins 202 at the bend of the heat dissipation pipe 201 increase the heat dissipation area. Heat is transferred to the external environment through the first heat dissipation shell 102 and the second heat dissipation shell 103, and air convection is achieved through the first ventilation pipe 105 and the second ventilation pipe 106 to ensure the operation of the entire heat dissipation device.

[0039] In summary, the filtration of the filter assembly 203 and its internal filter cartridge 203f effectively reduces impurities in the coolant that may clog the microchannels 204, such as mineral deposits and tiny particles. This ensures smooth flow of the coolant in the microchannels 204, preventing clogging caused by impurity accumulation, thus maintaining stable heat dissipation performance and extending the service life of the microchannels 204. Because the erosion and accumulation of impurities in the microchannels 204 are reduced, the inner wall of the microchannels 204 is less likely to be damaged, extending the service life of the microchannels 204 and reducing the possibility of needing to replace the entire heat dissipation device due to clogging of the microchannels 204, thereby reducing equipment maintenance costs.

[0040] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0041] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0042] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0043] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices, characterized in that: include, The support mechanism (100) includes a bracket (101), a first heat dissipation shell (102) fixedly installed on the outside of the bracket (101), a second heat dissipation shell (103) fixedly installed on the side of the bracket (101) away from the first heat dissipation shell (102), and a partition (104) fixedly installed on the top of the bracket (101). The heat dissipation mechanism (200) includes a heat dissipation pipe (201) fixedly installed in the inner cavity of the bracket (101), heat dissipation fins (202) fixedly installed in the cavity of the bend of the heat dissipation pipe (201), and a filter assembly (203) disposed on the top of the heat dissipation pipe (201).

2. The embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 1, characterized in that: The supporting mechanism (100) further includes a first ventilation pipe (105) fixedly installed on the top of the first heat dissipation shell (102), a second ventilation pipe (106) fixedly installed on the top of the second heat dissipation shell (103), and a heat dissipation groove plate (107) fixedly installed in the inner cavity of the second heat dissipation shell (103).

3. The embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 2, characterized in that: The heat dissipation mechanism (200) also includes a number of microchannels (204) fixedly installed in the inner cavity of the heat dissipation pipe (201), and an outlet manifold (205) fixedly installed at the bottom of the heat dissipation pipe (201).

4. The embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 3, characterized in that: The number of microchannels (204) is six, which are arranged vertically and evenly in the inner cavity of the heat dissipation pipe (201). One end of the microchannel (204) extends to the outside of one end of the heat dissipation pipe (201), and the other end of the microchannel (204) is fixedly connected to the outlet manifold (205) and interconnected with each other.

5. An embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 4, characterized in that: The filter assembly (203) includes a housing (203a) fixedly installed at the liquid inlet of the heat dissipation pipe (201), a sealing plug (203b) threadedly installed at the top opening of the housing (203a), a threaded sealing head (203c) fixedly installed at the bottom of the sealing plug (203b), and a connecting pipe (203d) fixedly installed at the bottom of the threaded sealing head (203c).

6. An embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 5, characterized in that: The filter assembly (203) further includes a sedimentation hopper (203e) fixedly installed at the bottom of the connecting pipe (203d), a filter cartridge (203f) movably snapped into the groove at the bottom of the sedimentation hopper (203e), and an inlet manifold (203g) fixedly installed on the outside of the housing (203a).

7. An embedded manifold microchannel heat dissipation device suitable for miniaturized electronic devices according to claim 6, characterized in that: The outer side of the connecting pipe (203d) has a through hole, and the end of the inlet manifold (203g) penetrates the shell (203a) until it is fixedly connected to the through hole and they are interconnected.

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