Wafer and chuck cleaning apparatus

Abstract

The utility model discloses a wafer and sucking disc cleaning device, including being located on the base on wafer cleaning unit and sucking disc cleaning unit, wafer cleaning unit includes the brush roller of being set in the brush roller groove, and the brush roller is linked by the axle of motor, the brush roller groove is suspended in the top of base through the first pneumatic cylinder telescopic along the longitudinal direction, in the brush roller one side, the brush roller groove is equipped with first liquid injection pipe, sucking disc cleaning unit includes the oil stone seat of being equipped with oil stone in the top, and the oil stone seat is located in the top of base through the second pneumatic cylinder telescopic along the lateral direction, in the at least one side of oil stone, the top of oil stone seat is equipped with second liquid injection pipe. Its through the integration of wafer cleaning and sucking disc cleaning, can be realized in the same base on wafer cleaning and sucking disc cleaning process, effectively improved the efficiency of cleaning, especially solved the cleaning problem of sucking disc, effectively avoided the secondary pollution of the wafer of cleaning, reduced the influence to wafer because of the adsorption efficiency reduction of sucking disc.

Description

Technical Field

[0001] This utility model specifically relates to a wafer and suction cup cleaning device, belonging to the field of semiconductor equipment technology. Background Technology

[0002] Wafer processing refers to the further processing of a substrate after circuitry has been installed on it. Common operations include backside thinning and edge trimming. Both of these operations require a wafer cleaning process, which thoroughly removes any adhering processing particles or chemical residues from the wafer to meet the ultra-cleanliness requirements of chip manufacturing plants.

[0003] Currently, most wafer cleaning equipment is placed vertically and uses nozzles to rinse the wafer surface. This rinsing method is ineffective for sticky particles or strong chemical adhesives, often requiring large amounts of water for multiple rinses, which can easily lead to substandard cleaning and seriously affect cleaning quality and production efficiency.

[0004] The biggest advantage of cleaning wafers laid flat is the ease of brushing, because the bottom surface is supported when laid flat, making the brushing operation more convenient. However, there is also a challenge: how to achieve high-efficiency cleaning, namely: (1) How to hold the wafer well so that it can rotate on the plane to facilitate cleaning; (2) How to effectively clean the wafer with the help of an external cleaning device while maintaining good wafer condition, and avoid uneven stress on the wafer that could cause it to break. Wafers are very expensive, and once they break, the loss is huge, meaning all the previous processes are wasted.

[0005] Therefore, it is necessary to provide a wafer cleaning device. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide a wafer and suction cup cleaning device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A wafer and chuck cleaning apparatus includes a wafer cleaning unit and a chuck cleaning unit mounted on a base. The wafer cleaning unit includes a roller brush trough and a roller brush; the roller brush is horizontally arranged in the roller brush trough and is linked by the shaft of a motor located outside the roller brush trough through the trough wall; the roller brush trough is suspended on the top of the base by a first cylinder that extends and retracts longitudinally; a first spray pipe is provided in the roller brush trough on one side of the roller brush. The suction cup cleaning unit includes an oilstone seat with an oilstone on its top surface. The oilstone seat is mounted on the top of the base via a second cylinder that extends laterally. A second spray pipe is provided on the top surface of the oilstone seat on at least one side of the oilstone.

[0008] On both sides of the first cylinder, the base is provided with a first guide hole, and the bottom of the roller brush groove is provided with a first guide rod that matches the first guide hole.

[0009] The side of the aforementioned oilstone base is fitted with the side of the roller brush groove.

[0010] When the wafer is being cleaned, the top surface of the roller brush is higher than the top surface of the oilstone; when the wafer is not being cleaned, the top surface of the roller brush is lower than the top surface of the oilstone.

[0011] The top surface of the aforementioned oilstone base is provided with a T-shaped groove, and the oilstone is placed in the T-shaped groove through a T-shaped plate.

[0012] The advantages of this utility model are: This utility model discloses a wafer and chuck cleaning device that integrates wafer cleaning and chuck cleaning into one unit. It enables the wafer cleaning and chuck cleaning processes to be completed on the same base, effectively improving the cleaning efficiency. In particular, it solves the problem of chuck cleaning, effectively avoiding secondary contamination of the cleaned wafer and reducing the impact on the wafer due to the reduced adsorption efficiency of the chuck.

[0013] This utility model discloses a wafer and suction cup cleaning device, which has a simple structure and is easy to use. It effectively solves the technical problems of poor cleaning effect and inability to clean suction cups in the existing cleaning devices, and has strong practicality and wide applicability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the wafer and suction cup cleaning device.

[0015] Figure 2 This is a schematic diagram of the motor assembly.

[0016] Figure 3 This is a side view of a schematic diagram of a wafer and chuck cleaning device.

[0017] Figure 4 This is a schematic diagram of the robotic arm and suction cup.

[0018] Figure 5 This is a schematic diagram of the second cylinder.

[0019] The meanings of the markings in the attached diagram are as follows: 1. Oilstone base, 2. Roller brush groove, 3. Second spray pipe, 4. Oilstone, 5. T-shaped plate, 6. Side plate, 7. Roller brush, 8. First spray pipe, 9. Slot, 10. First cylinder, 11. Second cylinder. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0021] A wafer and suction cup cleaning device comprises a wafer cleaning unit and a suction cup cleaning unit mounted on a base.

[0022] The suction cup cleaning unit consists of an oilstone base 1 and a second cylinder 11. The oilstone base 1 is slidably placed on a base, and the second cylinder 11 is horizontally fixed to the base. The end of the cylinder is fixed to the bottom side of the oilstone base 1 via a connector, meaning that the second cylinder 11 can link the oilstone base 1 to swing back and forth horizontally relative to the base. The top surface of the oilstone base 1 is provided with a T-slot, and the oilstone 4 is placed in the T-slot through a T-plate 5, meaning that the oilstone 4 is replaceable.

[0023] Along the transverse direction, on one side of the oilstone 4, the top surface of the oilstone base 1 is also provided with a second spray pipe 3.

[0024] Preferably, a side plate 6 is fixed on the base, the side of the oilstone seat 1 is in contact with the side plate 6, or the side plate 6 provides a guide rail for the lateral movement of the oilstone seat 1.

[0025] The wafer cleaning unit is located on the other side of the side substrate 6. The wafer cleaning unit consists of a roller brush groove 2 and a second cylinder 11. Preferably, the side of the roller brush groove 2 is in contact with the side substrate 6, or the side substrate 6 provides a guide rail for the longitudinal movement of the roller brush groove 2.

[0026] The roller brush 7 is horizontally arranged in the roller brush groove 2, parallel to the oilstone 4. The end of the roller brush groove 2 is provided with a motor assembly that links the roller brush 7 to rotate, that is, the shaft of the motor passes through the groove wall of the roller brush groove 2 to link the roller brush 7 to roll in the roller brush groove 2.

[0027] The first cylinder 10 is longitudinally positioned at the bottom of the roller brush groove 2, meaning that the roller brush groove 2 is laterally suspended from the top of the base via the first cylinder 10. On both sides of the first cylinder 10, a pair of first guide rods are provided at the bottom of the roller brush groove 2, and the base is provided with first guide holes that match the first guide rods.

[0028] Preferably, the roller brush 7 is a detachable and replaceable component. A detachment mechanism may be provided, for example, a groove 9 may be provided at the other end of the roller brush shaft, and a resiliently rotatable locking pin may be provided on the corresponding inner wall of the roller brush groove.

[0029] On one or both sides of the roller brush 7, a first spray pipe 8 is also provided in the roller brush groove 2.

[0030] When using, A robotic arm equipped with suction cups places the wafer onto the roller brush 7. The motor starts, causing the flexible absorbent roller brush 7 to rotate and rub against the wafer surface; the suction cups on the robotic arm also rotate simultaneously, thereby causing the wafer to rotate horizontally, thus thoroughly cleaning the surface of the wafer to be cleaned.

[0031] After cleaning is complete, the robotic arm moves to deliver the cleaned wafer to the next process, where it replaces the wafer to be cleaned and repeats the above actions.

[0032] Because the suction cup can move the wafer, it can ensure that the surface of the wafer to be cleaned has a more comprehensive cleaning coverage, so as to avoid dust residue on the wafer; the friction of the roller brush 7 has a better cleaning effect on the wafer surface; the roller brush 7 needs to be replaced after cleaning a certain number of wafers.

[0033] After multiple wafers are sent for cleaning, some residual dirt remains on the suction cups. To avoid affecting the adsorption effect and causing secondary contamination or defective damage to the cleaned wafers, the suction cups also need to be cleaned after a period of operation.

[0034] The cleaning process involves the robotic arm swinging the suction cup onto the oilstone 4, which is then driven by the second cylinder 11 to move back and forth. At the same time, the suction cup rotates horizontally, and the cleaning fluid from the second spray pipe 3 is used to clean the suction cup.

[0035] When the wafer is being cleaned, the top surface of the roller brush 7 is higher than the top surface of the oilstone 4; when not in wafer cleaning mode, the top surface of the roller brush 7 is lower than the top surface of the oilstone 4. This prevents the wafer and suction cup from being affected by adjacent components during the cleaning process. This adjustment is accomplished by the first cylinder 10 pushing the roller brush groove 2.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that the above embodiments do not limit this utility model in any way, and all technical solutions obtained by equivalent substitution or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A wafer and chuck cleaning apparatus, characterized in that, Includes a wafer cleaning unit and a suction cup cleaning unit mounted on the base. The wafer cleaning unit includes a roller brush trough and a roller brush; the roller brush is horizontally arranged in the roller brush trough and is linked by the shaft of a motor located outside the roller brush trough through the trough wall; the roller brush trough is suspended on the top of the base by a first cylinder that extends and retracts longitudinally; a first spray pipe is provided in the roller brush trough on one side of the roller brush. The suction cup cleaning unit includes an oilstone seat with an oilstone on its top surface. The oilstone seat is mounted on the top of the base via a second cylinder that extends laterally. A second spray pipe is provided on the top surface of the oilstone seat on at least one side of the oilstone.

2. The cleaning device according to claim 1, characterized in that, On both sides of the first cylinder, the base is provided with a first guide hole, and the bottom of the roller brush groove is provided with a first guide rod that matches the first guide hole.

3. The cleaning device according to claim 1, characterized in that, The side of the oilstone seat is attached to the side of the roller brush groove.

4. The cleaning device according to claim 1, characterized in that, When the wafer is being cleaned, the top surface of the roller brush is higher than the top surface of the oilstone; when the wafer is not being cleaned, the top surface of the roller brush is lower than the top surface of the oilstone.

5. The cleaning device according to claim 1, characterized in that, The top surface of the oilstone base is provided with a T-shaped groove, and the oilstone is placed in the T-shaped groove through a T-shaped plate.

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