Wafer holder

Abstract

The utility model relates to wafer cleaning technical field, concretely is a kind of wafer support, including the carousel being set in cleaning equipment, the top of carousel is provided with the fixed mechanism for fixing wafer, and fixed mechanism includes multiple fixed parts that are annular equiangular distribution, control element for driving multiple fixed parts start is arranged between multiple fixed parts, the outside of carousel is provided with two extrusion mechanisms and cleaning equipment inner side surface fixed connection. In the utility model, by setting two extrusion mechanisms in cleaning equipment, then by carousel drive fixed part sequentially with two extrusion mechanisms contact, multiple fixed parts can be made to rotate with wafer separation then contact again, so that the area of fixed part and wafer contact can be cleaned, wafer does not need to be disassembled then installed again, and the cleaning efficiency of wafer can be improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically a wafer support. Background Technology

[0002] Wafers are the fundamental material in semiconductor manufacturing, typically made of high-purity single-crystal silicon. They are crucial for manufacturing microelectronic devices such as integrated circuits, microprocessors, memory, and sensors. The wafer manufacturing process involves multiple complex steps, such as photolithography, etching, and deposition. Each step can leave contaminants on the wafer surface. If these contaminants are not removed promptly, they can affect subsequent processes, reducing chip performance and yield. Therefore, wafers require cleaning after manufacturing. Because wafers are relatively fragile, they need to be held in place during cleaning to prevent displacement, collisions, or other physical damage such as scratches and cracks, ensuring the wafer's integrity.

[0003] Currently, existing racks use multiple cylindrical clamping rollers (similar to pulleys) to hold the edges of the wafer. The rack is then driven by a rotating mechanism inside the cleaning equipment to rotate the wafer. During the cleaning process, the multiple clamping blocks on the rack come into contact with the wafer, making it difficult to clean the contact surfaces and leaving contaminants on them. The wafer needs to be removed from the rack and rotated at a certain angle before the other areas of the wafer are held by the multiple clamping rollers. This operation is cumbersome and reduces the wafer cleaning efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a wafer support to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer holder includes a turntable disposed within a cleaning device. A fixing mechanism for fixing the wafer is disposed on the top of the turntable. The fixing mechanism includes multiple fixing members distributed at equal angles in a ring. A control member for driving the multiple fixing members to start is disposed between the multiple fixing members. Two pressing mechanisms are disposed on the outer side of the turntable and fixedly connected to the inner side of the cleaning device.

[0007] The top surface of the turntable has multiple sliding holes that are equidistantly circumferentially opened. The fixing component includes a slider that slides in the corresponding sliding holes. L-shaped blocks are provided on both sides of the slider. A fixed post with a groove is fixedly connected to the top of the L-shaped block. Two connecting shafts are fixedly connected between two L-shaped blocks at opposite positions. One of the connecting shafts rotates through the slider at the corresponding position.

[0008] Furthermore, the bottom of the slider is fixedly connected to a connecting frame, and the extrusion mechanism includes a rectangular sleeve two fixedly connected to the inner side of the cleaning equipment. An L-shaped plate two is slidably connected inside the rectangular sleeve two, and a protrusion is fixedly connected to one end of the L-shaped plate two.

[0009] Furthermore, the connecting bracket is located between two protrusions, and a fastening bolt is screwed through the side of the rectangular sleeve.

[0010] Furthermore, the control component includes a cylindrical block, with a screw screw that is rotatably connected to the turntable through the bottom of the cylindrical block, and multiple rectangular sleeves fixedly connected at equal angles on the outer side of the cylindrical block, with an L-shaped plate rotatably connected to another connecting shaft at the corresponding position slidingly fitted inside the rectangular sleeve.

[0011] Furthermore, an anti-slip sleeve with an interference fit to a rectangular sleeve at the corresponding position is provided on the outer side of the L-shaped plate, and a spring is provided between the cylindrical block and the turntable and on the outer side of the screw.

[0012] Furthermore, a cylindrical shell is fixedly connected to the bottom surface of the turntable and the outer side of the cylindrical block. One end of the screw penetrates the side of the cylindrical shell. A mounting base is provided at the bottom of the cylindrical shell. Multiple connecting posts are fixedly connected to the mounting base and the cylindrical shell at equal angles in a ring. Multiple top posts are provided on the top surface of the turntable.

[0013] Furthermore, a through hole is provided on the outer side of the cylindrical shell corresponding to a rectangular sleeve.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. By setting two extrusion mechanisms inside the cleaning equipment, and then using a turntable to drive the fixing parts to contact the two extrusion mechanisms in sequence, multiple fixing parts can be separated from the wafer in turn and then contacted again. This allows for cleaning of the area where the fixing parts contact the wafer without disassembling and reinstalling the wafer, thus improving the cleaning efficiency of the wafer.

[0016] 2. By providing an anti-slip sleeve on the outer side of the L-shaped plate 1 that is interference-fitted with the rectangular sleeve 1 at the corresponding position, the multiple fixing parts can be stably fixed between the multiple fixing parts by the action of the screw and the anti-slip sleeve. Furthermore, the sliding between the L-shaped plate 1 217 and the rectangular sleeve 1 can fix wafers of different sizes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the turntable, fixing mechanism, and extrusion mechanism in this utility model;

[0019] Figure 3 This is a schematic diagram of the support frame in this utility model;

[0020] Figure 4 This is a schematic diagram of the fixing mechanism in this utility model;

[0021] Figure 5 This is a schematic diagram of the fastener structure in this utility model;

[0022] Figure 6 This is a schematic diagram of the extrusion mechanism in this utility model.

[0023] In the diagram: 1. Turntable; 11. Sliding hole; 12. Cylindrical shell; 13. Top column; 14. Mounting base; 15. Connecting column; 2. Fixing mechanism; 21. Fixing component; 211. Slider; 212. L-shaped block; 213. Fixing column; 214. Connecting shaft; 215. Connecting frame; 216. Rectangular sleeve one; 217. L-shaped plate one; 22. Cylindrical block; 23. Screw; 24. Spring; 3. Extrusion mechanism; 31. Rectangular sleeve two; 32. L-shaped plate two; 33. Protrusion; 34. Fastening bolt. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1 - Figure 6 In this embodiment of the present invention, a wafer support includes a turntable 1 disposed within a cleaning device. A fixing mechanism 2 for fixing the wafer is disposed on the top of the turntable 1. The fixing mechanism 2 includes multiple fixing members 21 arranged in annular angles. A control member for driving the multiple fixing members 21 is disposed between the multiple fixing members 21. Two pressing mechanisms 3 are disposed on the outer side of the turntable 1 and fixedly connected to the inner side of the cleaning device. Multiple sliding holes 11 are opened through the top surface of the turntable 1 in annular angles. The fixing members 21 include sliders 211 that slide within the sliding holes 11 at corresponding positions. L-shaped blocks 212 are disposed on both sides of the sliders 211. A fixing post 213 with a groove is fixedly connected to the top of the L-shaped blocks 212. Two connecting shafts 214 are fixedly connected between two L-shaped blocks 212 at opposite positions. One of the connecting shafts 214 rotates through the slider 211 at the corresponding position.

[0026] Specifically, firstly, the turntable 1 is installed on the rotating mechanism inside the cleaning equipment, and then the wafers to be cleaned are clamped and fixed by multiple fixing parts 21 (e.g., Figure 1 As shown, the rotating mechanism inside the cleaning equipment drives the turntable 1 to rotate, which in turn drives the wafer to rotate. The wafer is then cleaned by a spray mechanism within the cleaning equipment. During the rotation of the turntable 1, multiple fixing parts 21 contact two extrusion mechanisms 3. When one of the fixing parts 21 contacts the extrusion mechanism 3, it is forced by the extrusion mechanism 3 and moves along the sliding hole 11, separating from the wafer (the remaining fixing parts 21 can still stably fix the wafer). Then, the spray mechanism can clean the area where the fixing parts 21 were originally in contact with the wafer. During cleaning, when the fixing member 21 moves to another extrusion mechanism 3 while the turntable 1 is rotating, the fixing member 21 is subjected to the extrusion force of the extrusion mechanism 3 and moves back to its original position to clamp the wafer. The next fixing member 21 contacts the first extrusion mechanism 3 and separates from the wafer while the turntable 1 is rotating. This process is repeated so that multiple fixing members 21 can take turns separating from and contacting the wafer, thereby cleaning the area where the clamping member contacts the wafer without disassembling and reinstalling the wafer, thus improving the cleaning efficiency of the wafer.

[0027] Example 1

[0028] like Figure 4 river Figure 5 As shown, in this embodiment, the control component includes a cylindrical block 22. A screw 23, which is rotatably connected to the turntable 1, is screwed through the bottom of the cylindrical block 22. A plurality of rectangular sleeves 216 are fixedly connected to the outer side of the cylindrical block 22 at equal angles. An L-shaped plate 217, which is rotatably connected to another connecting shaft 214 at the corresponding position, is slidably sleeved inside the rectangular sleeve 216. An anti-slip sleeve that is interference-fitted with the rectangular sleeve 216 at the corresponding position is provided on the outer side of the L-shaped plate 217. A spring 24 is provided between the cylindrical block 22 and the turntable 1 and outside the screw 23.

[0029] In this embodiment, firstly, one hand rotates the screw 23 while the other hand holds the cylindrical block 22. The rotation of the screw 23 causes the cylindrical block 22 to move downwards. The downward-moving cylindrical block 22, through the action of the rectangular sleeve 216 and the L-shaped plate 217, causes the two L-shaped blocks 212 at the corresponding positions to rotate along the axis of the connecting shaft 214 that passes through the slider 211, causing the fixing post 213 to tilt. Then, the wafer is placed on the turntable 1, and the screw 23 is rotated in the opposite direction to restore the multiple L-shaped blocks 212 to their original position and keep them vertical, so that the wafer is stuck between the grooves on the multiple fixing posts 213. Since the outer side of the L-shaped plate 217 is provided with an anti-slip sleeve that is interference-fitted with the rectangular sleeve 216 at the corresponding position, the multiple fixing parts 21 can be stably fixed between the multiple fixing parts 21 by the action of the screw 23 and the anti-slip sleeve. Furthermore, wafers of different sizes can be fixed by sliding between the L-shaped plate 217 and the rectangular sleeve 216.

[0030] Example 2

[0031] like Figure 3 As shown, in this embodiment, a cylindrical shell 12 is fixedly connected to the bottom surface of the turntable 1 and the outer side of the cylindrical block 22. One end of the screw 23 penetrates the side of the cylindrical shell 12. A mounting base 14 is provided at the bottom of the cylindrical shell 12. Multiple connecting posts 15 are fixedly connected to the mounting base 14 and the cylindrical shell 12 at equal angles in a ring. Multiple top posts 13 are provided on the top surface of the turntable 1. A through hole is provided on the outer side of the cylindrical shell 12 corresponding to the rectangular sleeve 216.

[0032] In this embodiment, the mounting base 14 is fixed on the rotating mechanism inside the cleaning equipment. The rotating mechanism can drive the turntable 1 and multiple fixing parts 21 to rotate. Multiple connecting columns 15 are fixedly connected between the mounting base 14 and the cylindrical shell 12 so that the operator can rotate the screw 23.

[0033] Example 3

[0034] like Figure 2 , Figure 5 and Figure 6 As shown, in this embodiment, the bottom of the slider 211 is fixedly connected to the connecting frame 215, the extrusion mechanism 3 includes a rectangular sleeve 31 fixedly connected to the inner side of the cleaning device, an L-shaped plate 32 is slidably connected inside the rectangular sleeve 31, a protrusion 33 is fixedly connected to one end of the L-shaped plate 32, the connecting frame 215 is located between the two protrusions 33, and a fastening bolt 34 is screwed through the side of the rectangular sleeve 31.

[0035] In this embodiment, when the turntable 1 drives multiple sliders 211 to rotate, the connecting frame 215 fixed at the bottom of the multiple sliders 211 takes turns contacting the two protrusions 33. When the connecting frame 215 contacts the first protrusion 33, the connecting frame 215 is pushed out by force. At this time, the L-shaped plate 217 slides part of the rectangular sleeve 216 at the corresponding position. When the connecting frame 215 contacts the other protrusion 33, the connecting frame 215 is pushed back to its original position by force, so that the two fixing posts 213 contact the wafer again. Through the sliding between the L-shaped plate 32 and the rectangular sleeve 31, and by the fastening bolt 34, when multiple fixing parts 21 are fixing wafers of different diameters, by adjusting the distance between the L-shaped plate 32 and the rectangular sleeve 31, the two protrusions 33 can still push out and push back the multiple fixing parts 21 in turn when the turntable 1 rotates.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer support, characterized in that, The equipment includes a turntable (1) installed inside the cleaning device. The top of the turntable (1) is provided with a fixing mechanism (2) for fixing the wafer. The fixing mechanism (2) includes multiple fixing members (21) arranged in a ring at equal angles. A control member for driving the multiple fixing members (21) to start is provided between the multiple fixing members (21). Two extrusion mechanisms (3) are provided on the outer side of the turntable (1) and fixedly connected to the inner side of the cleaning device. The top surface of the turntable (1) is provided with a plurality of sliding holes (11) through it at equal angles. The fixing member (21) includes a slider (211) that slides in the corresponding sliding holes (11). Both sides of the slider (211) are provided with L-shaped blocks (212). The top of the L-shaped blocks (212) is fixedly connected with a fixing post (213) with a groove. Two connecting shafts (214) are fixedly connected between two L-shaped blocks (212) at opposite positions. One of the connecting shafts (214) rotates through the slider (211) at the corresponding position.

2. The wafer support according to claim 1, characterized in that, The bottom of the slider (211) is fixedly connected to a connecting frame (215). The extrusion mechanism (3) includes a rectangular sleeve (31) fixedly connected to the inner side of the cleaning device. An L-shaped plate (32) is slidably connected inside the rectangular sleeve (31). A protrusion (33) is fixedly connected to one end of the L-shaped plate (32).

3. The wafer support according to claim 2, characterized in that, The connecting frame (215) is located between two protrusions (33), and the side of the rectangular sleeve (31) is screwed with a fastening bolt (34).

4. The wafer support according to claim 3, characterized in that, The control component includes a cylindrical block (22), with a screw (23) screwed through the bottom of the cylindrical block (22) and rotatably connected to the turntable (1). Multiple rectangular sleeves (216) are fixedly connected to the outer side of the cylindrical block (22) at equal angles. An L-shaped plate (217) is slidably sleeved inside the rectangular sleeve (216) and rotatably connected to another connecting shaft (214) at the corresponding position.

5. The wafer support according to claim 4, characterized in that, The outer side of the L-shaped plate (217) is provided with an anti-slip sleeve that is interference-fitted with the rectangular sleeve (216) at the corresponding position, and a spring (24) is provided between the cylindrical block (22) and the turntable (1) and located on the outer side of the screw (23).

6. The wafer support according to claim 5, characterized in that, A cylindrical shell (12) is fixedly connected to the bottom surface of the turntable (1) and outside the cylindrical block (22). One end of the screw (23) penetrates the side of the cylindrical shell (12). A mounting base (14) is provided at the bottom of the cylindrical shell (12). Multiple connecting posts (15) are fixedly connected to the mounting base (14) and the cylindrical shell (12) at equal angles in a ring. Multiple top posts (13) are provided on the top surface of the turntable (1).

7. The wafer support according to claim 6, characterized in that, A through hole is provided on the outer side of the cylindrical shell (12) at the location corresponding to the rectangular sleeve (216).

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