Wafer deformation apparatus and bonding apparatus

Abstract

The application relates to the technical field of semiconductors, and provides a wafer deformation device and a bonding equipment. The wafer deformation device comprises an adsorption assembly and a deformation assembly. The adsorption assembly is formed with an adsorption platform used for adsorbing the wafer. The deformation assembly is arranged on the adsorption assembly and is configured to deform the wafer to correspond to the warping degree of a chip. The wafer deformation device and the bonding equipment provided by the application can improve the bonding efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a wafer deformation device and bonding apparatus. Background Technology

[0002] In die-to-wafer (D2W) chip bonding process, alignment is a critical parameter after bonding, and the effect of expansion is very important. The root cause of expansion is chip warping.

[0003] In related technologies, chip warpage is adjusted by depositing a thin film on the chip and utilizing the stress of the deposited film. However, this method requires depositing thin films of different thicknesses and properties according to different morphologies, resulting in low efficiency. Summary of the Invention

[0004] This application provides a wafer deformation device and a bonding apparatus that can improve bonding efficiency.

[0005] The technical solution of this application embodiment is implemented as follows: One embodiment of this application provides a wafer deformation device, comprising: An adsorption assembly having an adsorption platform, the adsorption platform being used to adsorb the wafer; A deformation component is disposed in the adsorption component, the deformation component being configured to deform the wafer to correspond to the warpage of the chip.

[0006] In one embodiment, the adsorption platform has multiple adsorption ports, which are spaced apart and used to adsorb the wafer.

[0007] In one embodiment, the adsorption platform includes multiple intersecting channels, and multiple adsorption ports are connected through the channels, with one of the multiple adsorption ports configured as a vacuum port.

[0008] In one embodiment, the adsorption assembly includes an adsorption disk and an adsorption cover. The adsorption disk forms a receiving cavity and a cover opening communicating with the receiving cavity. The adsorption cover is disposed on the cover opening. The adsorption disk forms the adsorption platform. The deformation assembly is disposed in the receiving cavity. The deformation assembly can deform the wafer by squeezing the adsorption cover.

[0009] In one embodiment, the deformation component includes a drive member and an extruder, the extruder being connected to the drive member, the drive member being configured to extend to cause the extruder to extrude the adsorption cap.

[0010] In one embodiment, the surface of the extruder facing the adsorption cap is convex.

[0011] In one embodiment, the deformation device includes a pressure sensor and a controller. The controller is connected to the drive member and the pressure sensor, respectively. The pressure sensor is used to acquire the bonding force of the bonding head. The controller is configured to control the drive member to retract the extruder based on the bonding force of the bonding head.

[0012] In one embodiment, the adsorption cap is made of an antistatic elastic material.

[0013] In one embodiment, there are multiple deformation components, and the multiple deformation components are arranged at intervals.

[0014] Another aspect of this application discloses a bonding apparatus, including the deformation device in any of the above embodiments.

[0015] This application discloses a wafer deformation device and a bonding apparatus. By setting up an adsorption component and a deformation component, the adsorption component forms an adsorption platform, while the deformation component is positioned within the adsorption component to deform the wafer. On one hand, by adsorbing the wafer through the adsorption platform, wafer wobbling during wafer deformation or bonding can be reduced. This allows the wafer deformation to more accurately correspond to the chip warpage, thus improving bonding accuracy and stability. On the other hand, the deformation device provided in this application does not directly manipulate the chip but uses the wafer as the manipulation object. That is, the deformation component deforms the wafer to adapt to the chip warpage. Therefore, when dealing with chips of different sizes, only the wafer needs to be deformed, thus reducing chip damage and operational difficulty, further improving bonding efficiency and bonding accuracy. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a deformation device provided in an embodiment of this application; Figure 2 This is a partial schematic diagram of a deformation device provided in another embodiment of this application; Figure 3 This is a schematic diagram of the structure of a deformation device, a wafer, a chip, and a bonding head provided in another embodiment of this application; Figure 4 This is a schematic diagram of the structure of a deformation component provided in another embodiment of this application; Figure 5 This is a schematic diagram illustrating the principle of how the extrusion section deforms the wafer.

[0017] Explanation of reference numerals in the attached figures 100. Deformation device; 1. Adsorption assembly; 1a. Adsorption platform; 1b. Adsorption port; 1c. Channel; 11. Adsorption plate; 11a. Receiving cavity; 11b. Cover; 12. Adsorption cover; 2. Deformation assembly; 21. Extrusion part; 211. Extrusion section; 212. Connecting part; 22. Driving part; 200. Wafer; 300. Chip; 400. Bonding head. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0020] In the following description, the terms "first, second, third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0021] Unless otherwise defined, all technical and scientific terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the embodiments of this application is for the purpose of describing the embodiments of this application only and is not intended to limit this application.

[0022] To better understand the deformation device 100 of the wafer 200 provided in this application, the bonding equipment will be described first.

[0023] One embodiment of this application provides a bonding apparatus, including a deformation device 100 for a wafer 200 as described in the following embodiments.

[0024] For example, the bonding apparatus includes a bonding head 400, which is capable of gripping the chip 300 and placing it on the wafer 200 located on the deformation device 100 for bonding.

[0025] Another embodiment of this application provides a deformation device 100 for a wafer 200. Please refer to [link to relevant documentation]. Figures 1 to 4The deformation device 100 includes an adsorption component 1 and a deformation component 2. The adsorption component 1 has an adsorption platform 1a for adsorbing the wafer 200. The deformation component 2 is disposed on the adsorption component 1 and is configured to deform the wafer 200 to correspond to the warpage of the chip 300.

[0026] Adsorption component 1 refers to a structure that can support and adsorb wafer 200.

[0027] Deformation component 2 refers to a structure that causes the wafer 200 to deform through direct or indirect contact.

[0028] The deformation component 2 can be entirely disposed within the adsorption component 1, or partially disposed within the adsorption component 1. Of course, the adsorption component 1 can also be disposed outside the adsorption component 1.

[0029] The warping of chip 300 can be a bulge bending towards wafer 200 in a smile-like shape, or a depression bending towards wafer 200 in a crying shape, or other curved shapes.

[0030] By deforming the wafer 200 to correspond to the warpage of the chip 300, the wafer 200 is deformed to have a certain deformation, which can cause the bonding area on the wafer 200 corresponding to the chip 300 to also warp, so as to match the amount of warpage of the chip 300 and compensate for the warpage of the chip 300.

[0031] The wafer 200 deformation device 100 provided in this application, by setting an adsorption component 1 and a deformation component 2, forms an adsorption platform 1a in the adsorption component 1, and the deformation component 2 is set in the adsorption component 1 to deform the wafer 200. In this way, on the one hand, by adsorbing the wafer 200 through the adsorption platform 1a, the wobbling of the wafer 200 during the adjustment of the deformation of the wafer 200 or during bonding can be reduced. Thus, the deformation of the wafer 200 can more accurately correspond to the warp of the chip 300, thereby improving bonding accuracy and stability. On the other hand, the deformation device 100 provided in this application does not directly operate on the chip 300, but uses the wafer 200 as the operating object, that is, the wafer 200 is deformed by the deformation component 2 to correspond to and adapt to the warp of the chip 300. Thus, when dealing with chips 300 of different sizes, only the wafer 200 needs to be operated to deform it. This reduces damage to the chip 300 and the difficulty of operation, and further improves bonding efficiency and bonding accuracy.

[0032] For example, in one embodiment, the adsorption platform 1a can be circular or other shapes, primarily to adapt to the shape of the wafer 200.

[0033] In one embodiment, please refer to Figure 1 and Figure 2 The adsorption platform 1a has multiple adsorption ports 1b, which are spaced apart and used to adsorb wafers 200.

[0034] For example, there can be nine adsorption ports 1b, one of which is located in the center of the adsorption platform 1a, and the other eight are divided into two groups, with four ports arranged at intervals in each group, and the two groups are arranged perpendicularly.

[0035] Here, by setting multiple adsorption ports 1b on the adsorption platform 1a, the wafer 200 can be stably adsorbed, reducing the shaking that occurs when the deformation component 2 adjusts the deformation of the wafer 200 and during the bonding process, resulting in good stability.

[0036] In one embodiment, please refer to Figure 1 and Figure 2 The adsorption platform 1a includes multiple intersecting channels 1c, multiple adsorption ports 1b are connected through channels 1c, and one of the multiple adsorption ports 1b is configured as a vacuum port.

[0037] For example, channel 1c can be a portion of the adsorption platform 1a that is recessed in the direction away from the wafer 200 to form a trench. That is, the side of channel 1c facing the wafer 200 is open, which allows the wafer 200 to be adsorbed, further improving the stability of the wafer 200 on the adsorption platform 1a. In other embodiments, channel 1c can be hidden within the adsorption platform 1a.

[0038] For example, the multiple channels 1c can be divided into two parts, and the channels 1c in the two parts are arranged in a crisscross pattern. The adsorption port 1b is located at the intersection of the multiple channels 1c to form a chessboard-like structure.

[0039] Among the multiple adsorption ports 1b, the edge adsorption port 1b closest to the adsorption platform 1a can be a vacuum port, which can avoid the deformation component 2 to a certain extent.

[0040] A vacuum port refers to a structure that is directly connected to a vacuum device. For example, a vacuum device includes a vacuum pump and a suction tube. The suction tube is connected to the vacuum pump and the vacuum port at opposite ends, respectively. The vacuum pump is driven to adsorb the wafer 200.

[0041] Here, by setting multiple channels 1c to connect each adsorption port 1b, and one of them is configured as a vacuum port, multiple adsorption ports 1b can be used to adsorb the wafer 200 using multiple channels 1c and one vacuum port, thereby reducing the use of vacuum equipment and lowering the bonding cost.

[0042] In one embodiment, please refer to Figures 1 to 3The adsorption assembly 1 includes an adsorption disk 11 and an adsorption cover 12. The adsorption disk 11 forms a receiving cavity 11a and a cover opening 11b communicating with the receiving cavity 11a. The adsorption cover 12 is placed on the cover opening 11b. The adsorption disk 11 forms an adsorption platform 1a. The deformation assembly 2 is disposed in the receiving cavity 11a. The deformation assembly 2 can deform the wafer 200 by squeezing the adsorption cover 12.

[0043] For example, the shape of the adsorption disk 11 can be disc-shaped.

[0044] In this way, by setting the shape component in the receiving cavity 11a, the deformation component 2 can be protected to a certain extent, thereby improving its service life and operational stability. Here, by the deformation component 2 squeezing the adsorption cover 12, the wafer 200 adsorbed on the adsorption platform 1a is indirectly deformed, which can reduce damage to the wafer 200.

[0045] In one embodiment, please refer to Figure 3 and Figure 4 The deformation component 2 includes a drive member 22 and an extruder 21. The extruder 21 is connected to the drive member 22. The drive member 22 is configured to extend to drive the extruder 21 to extrude the adsorption cover 12.

[0046] For example, the driving component 22 can be a cylinder, which includes a cylinder body and a telescopic rod. The telescopic rod is telescopically disposed in the cylinder body, and the cylinder body can drive the telescopic rod to extend and retract, so as to drive the extruder 21 to extrude the adsorption cover 12.

[0047] In other embodiments, the drive element 22 may be a motor, a hydraulic cylinder, etc.

[0048] Here, by setting up a driving component 22 and an extrusion component 21, the driving component 22 is connected to the extrusion component 21. When it is necessary to apply deformation to the wafer 200, the driving component 22 can be extended to drive the extrusion rod to extrude the adsorption cover 12, and then the wafer 200 is extruded at intervals to deform in order to adapt to the warpage of the chip 300 and compensate for it, which has high working efficiency.

[0049] In one embodiment, please refer to Figure 4 The surface of the extruder 21 facing the adsorption cover 12 is convex.

[0050] For example, the extrusion member 21 includes an extrusion portion 211 and a connecting portion 212 connected to each other. A portion of the driving member 22 is disposed in the connecting portion 212. The extrusion portion 211 is mushroom-shaped or crown-shaped, that is, the surface near the wafer 200 is convex.

[0051] Here, by setting the surface of the extruder 21 facing the adsorption cover 12 as a convex surface, compared with a flat surface, the extrusion area gradually increases during the process of the convex surface extruding the adsorption cover 12, that is, the extrusion area gradually expands from the middle to the outside. In this way, not only can the generation of air bubbles be reduced during the extrusion process, but it can also better adapt to the warping of the chip 300 and improve the subsequent bonding accuracy.

[0052] In one embodiment, the deformation device 100 includes a pressure sensor and a controller. The controller is connected to the drive member 22 and the pressure sensor, respectively. The pressure sensor is used to obtain the bonding force of the bonding head 400. The controller is configured to control the drive member 22 to retract the extruder 21 according to the bonding force of the bonding head 400.

[0053] Here, when the bonding head 400 drives the chip 300 to bond with the wafer 200, the bonding force of the bonding head 400 can be obtained by the pressure sensor and transmitted to the controller. After receiving the pressure value, the controller determines that the chip 300 has made contact with the wafer 200. At this time, the controller can send a retraction signal to the drive unit 22. After receiving the retraction signal, the drive unit 22 will slowly retract until the chip 300 is fully covered on the corresponding bonding area on the wafer 200. This can improve the bonding accuracy.

[0054] For example, the controller also adapts to the warpage of the chip 300 by controlling the elongation of the drive 22.

[0055] In related technologies, in addition to depositing a thin film on the chip, a custom bonding head is also used to solve the warpage problem. However, the custom bonding head can only be used for chips of a single size. Therefore, for chips of other sizes, custom bonding heads are required, which is costly and has a long process cycle.

[0056] In one embodiment, please refer to Figure 2 There are multiple deformation components 2, and the multiple deformation components 2 are set at intervals.

[0057] For example, it can be adapted to chips 300 ranging from 1 mm * 1 mm to 52 mm * 62 mm.

[0058] Here, by setting multiple deformation components 2, the corresponding number of deformation components 2 can be controlled to cause the corresponding bonding area on the wafer 200 to undergo corresponding deformation for different warpages of chips 300 of different sizes. In this way, it can be compatible with chips 300 of different sizes, and the bonding cost is lower and the process cycle is shorter.

[0059] In one embodiment, the adsorption cap 12 is made of an antistatic elastic material.

[0060] In this way, by setting the material of the adsorption cover 12 to an antistatic elastic material, it is not only convenient to squeeze the deformation component 2 and deform the wafer 200, but also the antistatic material can reduce the generation of static electricity during the contact and friction process between the wafer 200 and the adsorption cover 12, thereby reducing the impact on the conductive components on the wafer 200.

[0061] For example, in one embodiment, the adsorption plate 11 may also be made of an antistatic elastic material.

[0062] For example, in one embodiment, the bonding region on the wafer 200 corresponding to the chip 300 can be obtained through wafer mapping. After obtaining the bonding region on the wafer 200 corresponding to the chip 300, the controller can determine the number of deformation components 2 according to the warpage of the chip 300 and control the corresponding drive component 22 to extend so that the bonding region generates a corresponding deformation to adapt to the warpage of the chip 300.

[0063] For example, in one embodiment, measurements can be taken using a measuring device before bonding of the chip 300, and then used as adjustment values ​​to adjust the deformation of the corresponding bonding region on the wafer 200 during bonding. If the chip 300 does not warp before bonding, but warps during bonding, this can be calculated using the bonding head 400.

[0064] For example, in one embodiment, the deformation of the wafer 200 is adjusted by controlling the number of deformation components 2 for chips 300 of different sizes to accommodate the warpage of the chip 300. The following explanation uses a single deformation component 2 as an example. Please refer to [link to relevant documentation]. Figure 5 The extrusion section 211 is spherical, and its rising height can be obtained using the following formula: 2θ = L / R, θ = L / (2R) H(Bow)=CD=OD-OC=RR·cosθ=R(1- cosθ)=R(1-cos(L / (2R)) Where AB=L, which is the arc length of the corresponding chip 300 on wafer 200 when warping occurs, 2θ is the central angle of the circle containing AB, and R is the radius of the circle containing AB.

[0065] After obtaining the warpage of chip 300, the required rise height can be calculated based on the warpage using the above formula, thereby adapting the deformation of the bonding region corresponding to wafer 200 to the warpage.

[0066] It should be noted that when the warpage of chip 300 bulges towards wafer 200, the deformation component 2 can be used to make the bonding area of ​​wafer 200 bulge towards chip 300. This allows the center of chip 300 to contact the center of the bonding area first. During bonding, bubbles can diffuse from the center to the edge along with the bonding wave, thus reducing bubble formation. When the warpage of chip 300 is recessed towards wafer 200, the deformation component 2 can be used to make the bonding area of ​​wafer 200 recessed towards chip 300.

[0067] The core principle of adjusting wafer 200 through deformation component 2 is: Bow 吸附盖 +EXP 晶圆 =EXP 芯片 +EXP 键合头 Within a certain range, the deformation formed by the adsorption cap 12 and the deformation of the wafer 200 exhibit an approximately linear relationship, that is: Bow 吸附盖 =a·EXP 晶圆 +b The final result is: Bow 吸附盖 =A·(EXP 芯片 -EXP 晶圆 )+B The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. All modifications, equivalent substitutions, improvements, etc., within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A wafer deformation device, characterized in that, include: An adsorption assembly having an adsorption platform, the adsorption platform being used to adsorb the wafer; A deformation component is disposed in the adsorption component, the deformation component being configured to deform the wafer to correspond to the warpage of the chip.

2. The deformation device according to claim 1, characterized in that, The adsorption platform has multiple adsorption ports, which are spaced apart and used to adsorb the wafer.

3. The deformation device according to claim 2, characterized in that, The adsorption platform includes multiple intersecting channels, and multiple adsorption ports are connected through the channels. One of the multiple adsorption ports is configured as a vacuum port.

4. The deformation device according to claim 1, characterized in that, The adsorption assembly includes an adsorption disk and an adsorption cover. The adsorption disk forms a receiving cavity and a cover opening communicating with the receiving cavity. The adsorption cover is placed on the cover opening. The adsorption disk forms the adsorption platform. The deformation assembly is disposed in the receiving cavity. The deformation assembly can deform the wafer by squeezing the adsorption cover.

5. The deformation device according to claim 4, characterized in that, The deformation component includes a drive member and an extruder, the extruder being connected to the drive member, and the drive member being configured to extend to drive the extruder to extrude the adsorption cap.

6. The deformation device according to claim 5, characterized in that, The surface of the extruder facing the adsorption cover is convex.

7. The deformation device according to claim 5, characterized in that, The deformation device includes a pressure sensor and a controller. The controller is connected to the drive member and the pressure sensor respectively. The pressure sensor is used to obtain the bonding force of the bonding head. The controller is configured to control the drive member to retract the extruder according to the bonding force of the bonding head.

8. The deformation device according to claim 4, characterized in that, The adsorption cover is made of antistatic elastic material.

9. The deformation device according to any one of claims 1 to 7, characterized in that, There are multiple deformation components, and the multiple deformation components are arranged at intervals.

10. A bonding apparatus, characterized in that, Includes the deformation device as described in any one of claims 1 to 9.

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