High-precision intelligent mounting equipment
CN309885167SActive Publication Date: 2026-03-31恩纳基智能装备(无锡)股份有限公司
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2026-03-31
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: high-precision intelligent mounting equipment. 2. The use of the design product: die bonding in chip packaging. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1. 5. Other circumstances that need to be explained: the shaded part in the reference figure shows transparent or translucent material.
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