Printed circuit board with attached IC, printed circuit board and method for manufacturing the printed circuit board with attached IC

Abstract

Printed circuit board (1) with an integrated circuit attached thereto, comprising a printed circuit board (2) and an IC bare chip (3) attached to the printed circuit board (2), wherein: - the printed circuit board (2) has a metal base (30), an insulating element made of an insulating material and arranged on the metal base (30), and a wiring pattern (10) arranged on the insulating element; - the wiring pattern (10) has an electrode section (10a-10f) to which the IC bare chip (3) is electrically connected via a conducting wire (5) or a bond mound; - the insulating element has a sub-region in a thickness direction of the insulating element on a side opposite the electrode section (10a-10f); - the metal base (30) has a metal substrate (30a) and a metal section (6) projecting from the metal substrate (30a); and - the metal section (6) is embedded only in the sub-region of the insulating element.

Description

[0001] The present invention relates to a printed circuit board with an integrated circuit attached thereto, a printed circuit board and a method for Manufacturing of a printed circuit board with an integrated circuit attached to it.

[0002] In a conventional printed circuit board with an integrated circuit attached to it, a bare chip of an integrated circuit consists of a Semiconductors, such as silicon, are mounted on a printed circuit board. The printed circuit board consists of insulating layers made of an insulating material and a Wiring patterns with conductors made of, for example, copper arranged on a metal base.

[0003] In a conventional method for manufacturing the printed circuit board with the integrated circuit attached to it, a wire bond connection can be used. or a flip-chip connection can be made. In wire bonding, contact points of the bare chip and electrodes of the Wiring pattern connected via conductor wires. In the flip-chip connection, the integrated circuit is connected via contact points of the Naked chips formed bond mounds connected to the circuit board.

[0004] If, in the wire bond connection or the flip-chip connection, gold is used for the conductor wires or the bond hills (hereinafter referred to as When used as a connecting medium, an ultrasonic wave thermocompression process can be applied. In the ultrasonic wave thermocompression process, the circuit board is attached to a heating stage (ceramic or metal) that is heated to a temperature of The surface is heated to 150 to 200°C, and an ultrasonic wave vibration is applied to the connecting medium on the circuit board.

[0005] In a printed circuit board with an integrated circuit attached to it, glass fiber reinforced plastic or phenolic paper is usually used. used as an insulating material. When a printed circuit board with an integrated circuit attached to it is used for processing or handling a When used with high-frequency signals, such as millimeter waves, fluoropolymers such as polytetrafluoroethylene (PTFE) can be used with a lower dielectric loss tangent than the insulating material described above, such as, for example, as described in JP-A-7-323501. If an insulating material with a low dielectric loss tangent is used, the Energy loss (dielectric loss) can be limited, which is proportional to a signal frequency and the dielectric loss tangent.

[0006] An elastic modulus of an insulating material, such as fluoropolymer and liquid crystalline polymer (LCP), which is used for processing The performance, or suitability for handling at high frequencies, can decrease drastically at high temperatures of 150 to 200°C.

[0007] Consequently, if the wire bond connection and the flip-chip connection are made during a process for manufacturing the printed circuit board with the integrated circuit attached, it can happen that the insulating material in the circuit board on the thermal stage It contains an ultrasonic wave and scatters a load applied to the bonding medium. This causes the wire bond to... and the flip-chip connection may be faulty, thus compromising the reliability of the circuit board with its attached integrated The circuit is reduced.

[0008] It is therefore an object of the present invention to provide a printed circuit board with an integrated circuit attached to it, in which an IC- A bare chip can be electrically connected to a printed circuit board with certainty. It is further an object of the present invention to provide a printed circuit board to provide a device with which an IC bare chip can be electrically connected with certainty. It is further an object of the present invention to provide a To provide a method for manufacturing a printed circuit board with an integrated circuit attached to it, in which an IC bare chip is precisely can be electrically connected to a circuit board.

[0009] According to a first embodiment of the present invention, a printed circuit board with an integrated circuit attached to it has a a printed circuit board and an IC bare chip attached to the printed circuit board, wherein the printed circuit board has a metal base, an insulating element consisting of a is constructed of insulating material and arranged on the metal base, and has a wiring pattern arranged on the insulating element; the wiring pattern includes an electrode section to which the IC bare chip is electrically connected; the insulating element includes a The lower region is opposite the electrode section; the metal base has a metal substrate and a metal section projecting from the metal substrate; and the metal section is embedded in the lower region of the insulating element.

[0010] In the circuit board described above with the integrated circuit attached to it, the IC bare chip can certainly be electrically to be connected to the circuit board.

[0011] According to a second embodiment of the present invention, a printed circuit board has a metal base, an insulating element and a Wiring The pattern is shown. The metal base has a metal substrate and a metal section protruding from the metal substrate. The insulating element is made of constructed from an insulating material and arranged on a metal base. The wiring pattern is arranged on the insulating element and features an electrode section designed to be electrically connected to an IC bare chip. The insulating element has a lower The area is located opposite the electrode section. The metal section is embedded in the lower area.

[0012] The circuit board described above can certainly be electrically connected to an IC bare chip.

[0013] In a method according to a third embodiment of the present invention, a printed circuit board with an integrated attached Circuit manufactured with a printed circuit board and an IC bare chip attached to the printed circuit board, wherein the printed circuit board has a metal base, several It has insulating layers and a wiring pattern; the metal base comprises a metal substrate and a metal section projecting from the metal substrate. exhibits; which are constructed of multiple insulating layers made of an insulating material and arranged on a metal base; the wiring pattern is arranged on several insulating layers and has an electrode section to which the IC bare chip is electrically connected; the several insulating layers, a first insulating layer on which the electrode section is arranged, and a second insulating layer which is on a is arranged on the opposite side of the first insulating layer from the electrode section; and the multiple insulating layers further have a lower region opposite the electrode section, the method comprising the following steps: forming a cavity such that in the lower area, that the cavity the several insulating layers from one surface of the several insulating layers on an opposite side from the electrode section to a surface of the second insulating layer adjacent to the first insulating layer penetrates; and arrangement of the several insulating layers on the metal base in such a way that the metal section fits into the cavity.

[0014] In the manufacturing process described above, the metal section can be embedded in the multiple insulating layers. Consequently, the IC bare chip can certainly be electrically connected to the circuit board.

[0015] Further problems and advantages of the present invention will become apparent from the following description, which refers to the The attached drawing will show more clearly what was done. The drawing shows:

[0016] Fig. 1 is an illustration showing a cross-sectional view of a printed circuit board with an integrated circuit attached to it according to a first embodiment of the present invention;

[0017] Fig. 2A is an illustration showing a top view of the printed circuit board with the integrated circuit of the first attached to it. Design;

[0018] Fig. 2B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line IIB-IIB in Fig. 2A;

[0019] Fig. 2C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line IIC-IIC in Fig. 2A;

[0020] Figs. 3A to 3E are illustrations illustrating exemplary processes for manufacturing the printed circuit board 1 with the attached integrated circuit according to the first embodiment;

[0021] Fig. 4 is an illustration showing a cross-sectional view of a printed circuit board with an integrated circuit attached to it according to a second embodiment of the present invention;

[0022] Fig. 5A to Fig. 5E are illustrations illustrating exemplary processes for manufacturing the printed circuit board 1 with the attached integrated circuit of the second embodiment;

[0023] Fig. 6A is an illustration showing a top view of the printed circuit board with an integrated circuit attached to it, according to a further embodiment of the present invention;

[0024] Fig. 6B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIB-VIB in Fig. 6A;

[0025] Fig. 6C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIC-VIC in Fig. 6A;

[0026] Fig. 7A is an illustration showing a top view of the printed circuit board with an integrated circuit attached to it, according to a further embodiment of the present invention;

[0027] Fig. 7B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIIB-VIIB in Fig. 7A;

[0028] Fig. 7C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIIC-VIIC in Fig. 7A;

[0029] Fig. 8A is an illustration showing a top view of the printed circuit board with an integrated circuit attached to it, according to a further embodiment of the present invention;

[0030] Fig. 8B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIIIB-VIIIB in Fig. 8A;

[0031] Fig. 8C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line VIIIC-VIIIC in Fig. 8A;

[0032] Fig. 9A is an illustration showing a top view of the printed circuit board with an integrated circuit attached to it, according to a further embodiment of the present invention;

[0033] Fig. 9B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line IXB-IXB in Fig. 9A;

[0034] Fig. 9C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line IXC-IXC in Fig. 9A;

[0035] Fig. 10A is an illustration showing a top view of the printed circuit board with an integrated circuit attached to it, according to a further embodiment of the present invention;

[0036] Fig. 10B is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line XB-XB in Fig. 10A; and

[0037] Fig. 10C is an illustration showing a cross-sectional view of the printed circuit board with an integrated circuit attached to it along the line XC-XC in Fig. 10A.

[0038] First, various aspects of the present invention are described before the exemplary embodiments of the The present invention is described.

[0039] According to a first embodiment of the present invention, a printed circuit board with an integrated circuit attached to it comprises a printed circuit board and a bare IC (integrated circuit) chip mounted on the circuit board. The circuit board is formed by a Wiring patterns are formed on an insulating element made of an insulating material, and the insulating element is arranged on a metal base. The metal base comprises a metal substrate and a metal section protruding from the metal substrate. The printed circuit board and the IC bare chip are electrically connected. The wiring pattern includes an electrode section to which the IC bare chip is electrically connected.

[0040] In an area in the insulating element opposite the electrode section of the wiring pattern (hereinafter referred to as the lower area) The metal section protruding from the metal substrate is embedded (designated as such). If the thickness direction of the insulating element is the z-axis direction... As described, the lower area is a predetermined area in the insulating element below the electrode section in the z-axis direction.

[0041] In the printed circuit board with the integrated circuit attached to it, the strength of the lower area in the insulating element is achieved by the metal section is improved. Consequently, it will then be the case when the IC bare chip and the wiring pattern are connected via a medium such as... for example, a conductor wire and a bonding hill, an ultrasonic wave and a load applied to the circuit board. enables it to be transferred in the z-axis direction.

[0042] Regardless of the insulating material of the insulating element, the connecting medium can be determined by the fact that the metal section has a Since it has a higher strength than the insulating material, it can certainly be fused to the electrode section. Consequently, the IC- The bare chip will definitely be electrically connected to the circuit board.

[0043] The insulating material of the insulating element can be a thermoplastic polymer. The insulating material can, for example, be Fluorinated resin, such as PTFE, a plastic resin, such as polyetherketone (PEEK), and a liquid crystalline polymer (LCP) are examples. They usually have a lower dielectric loss tangent than glass fiber reinforced plastic and phenolic paper.

[0044] The printed circuit board with the integrated circuit attached to it can limit an energy loss (dielectric loss) that is proportional to to a signal frequency and the dielectric loss tangent. Consequently, the integrated circuit can be suitably configured for a device. used to process a high-frequency signal, such as a millimeter wave.

[0045] If the electrode section has multiple electrodes, the lower region can have a region that accommodates all of the electrodes opposite, or the lower area can have several areas, each opposite one of the electrodes.

[0046] If the lower area has the multiple areas, an area of ​​the metal section that is buried in the insulating element can be can be reduced. Consequently, the wiring density of the wiring pattern formed on the insulating element can be increased if the The wiring pattern has multiple patterns, or if the wiring pattern has a microstrip wire structure.

[0047] The printed circuit board can be a multilayer printed circuit board in which the insulating element has several insulating layers, which The wiring pattern has multiple wiring layers, with each wiring layer positioned on one of the insulating layers. In such a case, an area or surface of the circuit board can be reduced.

[0048] If the thickness of the insulating layers is reduced, scattering of the ultrasound wave and the load during a The fusion bonding is limited. Consequently, with multiple insulating layers, if one insulating layer, on which the The electrode section is called the first insulating layer, and an insulating layer is formed on an opposite side of the first insulating layer. The insulating layer formed by the electrode section is referred to as the second insulating layer; the metal section is present in all of the multiple insulating layers. including the second insulating layer and excluding the first insulating layer. That is, the metal section can be embedded in the multiple Insulating layers from one surface of the several insulating layers adjacent to the metal base to a surface of the second insulating layer penetrate adjacent to the first insulating layer.

[0049] The thickness of the first insulating layer can be less than the thickness of an insulating layer in the multiple insulating layers that are distinguished from The first insulating layer differs. For example, if the first insulating layer has a first thickness and the second insulating layer has a second thickness. The first thickness can be less than the second thickness.

[0050] By reducing the thickness of the first insulating layer, the scattering of the ultrasound wave and the load during the The number of fusion bonds is limited. Consequently, the IC bare chip can be electrically connected to the circuit board with certainty.

[0051] If the wiring pattern has a microstrip conductor structure, then when the thickness of the insulating layer is reduced, a The width of a signal line can be reduced to lower the characteristic impedance of the printed circuit board to a predetermined value (for example, 50 Ω). to set. If the width of the signal line is too small, this can lead to signal loss in the stripline and a loss in the entire circuit. gain weight.

[0052] In the multilayer printed circuit board, the wiring pattern can have a microstrip conductor structure and the multiple The wiring layers have a striped wire pattern structure and two ground pattern layers. The multiple insulating layers... The signal conduction layer can be formed on a surface of the first insulating layer, on which the electrode section is formed. will be (first surface). On a surface of the first insulating layer adjacent to the second insulating layer (second surface), one of the Mass pattern layers are only formed in one section corresponding to the lower area. On a surface of the second insulating layer The other mass pattern layers can be formed on the opposite side of the first insulating layer (third surface). The The mass pattern layer arranged on the second surface and the mass pattern layer arranged on the third surface can be connected via a The second insulating layer is connected via a through-hole (via plug).

[0053] The printed circuit board described above with the integrated circuit attached to it essentially corresponds to a case in which a thickness The first insulating layer is only reduced in one section corresponding to the lower area. Consequently, the IC bare chip can be considered with certainty. electrically connected to the circuit board. Furthermore, this can be contingent on the other insulating layers having a sufficient thickness. This ensures that the line loss of the strip line is limited without unnecessarily reducing the width of the signal lines.

[0054] In a case in which an additional material is added in advance to the insulating material of the insulating element such that a The linear expansion coefficient of the insulating element is essentially equal to the linear expansion coefficient of the wiring pattern. If this is the case, the metal substrate and the metal section can be formed from a material that has a linear coefficient of expansion equal to that of the wiring pattern. The metal substrate and the metal section can, for example, be made of the same material as the Wiring patterns are formed. The additional material can be an insulating material with a low coefficient of expansion, such as... They do not necessarily have to have the same linear expansion coefficient.

[0055] In the printed circuit board described above with the integrated circuit attached to it, a detachment of the printed circuit board and the The metal base can be restricted. Furthermore, the detachment of the wiring pattern and the insulating element can be restricted.

[0056] A printed circuit board according to a second embodiment of the present invention has an insulating element, a component mounted on the insulating element The wiring pattern is arranged and the insulating element is mounted on a metal base. The wiring pattern has a The electrode section is designed to be electrically connected to a bare IC chip. The metal base has a metal substrate. and a metal section protruding from the metal substrate. The insulating element has a lower region corresponding to the electrode section. opposite each other. The metal section is embedded in the lower part of the insulating element. The circuit board described above can in a suitable manner for a printed circuit board with an integrated circuit attached to it according to the first embodiment of the present invention be used.

[0057] A manufacturing method according to a third embodiment of the present invention is a method for manufacturing a printed circuit board with attached integrated circuit, in which a bare IC chip is attached to a multilayer printed circuit board, and the bare IC chip and the The layers of the multilayer printed circuit board are electrically connected to each other. The multilayer printed circuit board has several insulating layers made of a insulating material, a wiring pattern formed on the multiple insulating layers, and a metal base on which the multiple Insulating layers are arranged. The wiring pattern includes an electrode section to which the IC bare chip is electrically connected. The multiple insulating layers have a first insulating layer on which the electrode section is arranged, and a second insulating layer which is located on the opposite side of the first insulating layer from the electrode section.

[0058] The multiple insulating layers also have a lower region opposite the electrode section. In the In the manufacturing process, a cavity is formed in the lower area in such a way that the cavity separates the several insulating layers from a surface of the several insulating layers on a side opposite the electrode section to a surface of the second insulating layer penetrates to the first insulating layer, and the multiple insulating layers are arranged on the metal base in such a way that the metal section is embedded in the The cavity is fitted.

[0059] In the above-described manufacturing process of the printed circuit board with the integrated circuit attached to it, the metal base embedded within multiple insulating layers. Consequently, the IC bare chip can certainly be electrically connected to the multilayer printed circuit board. be connected. (First embodiment)

[0060] Below is a printed circuit board 1 with an integrated circuit attached to it according to a first embodiment of the present The invention is described with reference to Fig. 1 and Fig. 2.

[0061] The printed circuit board 1 with the integrated circuit attached to it has, as shown in Fig. 1, a metal base 30, a multilayer Printed circuit board 2, an IC (integrated circuit) bare chip 3 and a chip section 4. In the multilayer printed circuit board 2 is a Wiring pattern 10 is formed from copper. Wiring pattern 10 has several wiring layers arranged in a layered fashion. The IC bare chip 3 is made of a semiconductor, such as silicon. Chip section 4, for example, contains a capacitor and a resistor. The IC bare chip 3 and the chip section 4 are attached to a surface of the multilayer printed circuit board 2.

[0062] The IC bare chip 3 and the surface of the multilayer printed circuit board 2 are connected via conductor wires 5 made of, for example, gold or copper electrically connected to each other. The metal base 30 has a copper substrate 30a and copper sections 6 projecting from the copper substrate 30a. The metal base 30 can, for example, be used as a heat sink.

[0063] The IC bare chip 3 is an unencapsulated semiconductor element. The multilayer printed circuit board 2 has a recessed section 2a. The IC bare chip 3 is arranged on the recessed section 2a using an adhesive, such as silver epoxy resin and silicone resin. The IC- The naked chip 3 has contact points 3a and 3b to which the conductor wires 5 are connected.

[0064] The multilayer printed circuit board 2 has an insulating element made of an insulating material. The insulating element has several Insulating layers 20. Each of the insulating layers 20 can be made up of prepreg, which is formed by bonding a fiberglass fabric with Polytetrafluoroethylene (PTFE) impregnation The fiberglass fabric can serve as an additional material. Each of the wiring layers is formed on one of the insulating layers 20. The insulating layers 20 are arranged on the metal base 30. The glass fiber fabric is arranged in a ratio in accordance with a The amount of PTFE impregnating agent present in the insulating layers 20 is such that a linear coefficient of expansion of the insulating layers 20 is achieved. Essentially, it is equivalent to a linear expansion coefficient of the wiring pattern 10.

[0065] In the multilayer printed circuit board 2 of the present embodiment, the wiring pattern 10 has a microstrip conductor structure. The widths of the signal lines and the distances between the signal lines and the ground lines are determined in such a way that a The characteristic impedance of the multilayer printed circuit board 2 assumes a predetermined value. The predetermined value is, for example, 50 Ω. Wiring pattern 10 has electrodes 10a and 10b on the signal lines and ground contact points 10c to 10f. The conductor wires 5 are connected to electrodes 10a and 10b and ground contact points 10c to 10f. Electrodes 10a and 10b and the ground contact points 10c to 10f can serve as an electrode section.

[0066] The insulating layers 20 comprise first to third insulating layers 20. The first insulating layer 20, the second insulating layer 20 and The third insulating layers 20 are arranged in this order in a thickness direction from one side on which the electrodes 10a and 10b and the Ground contact points 10c to 10f are arranged. The copper sections 6 of the metal base 30 are, as shown in Fig. 2B, each arranged in areas of the second insulating layer 20 and the third insulating layer 20, which are located below the electrodes 10a and 10b and the Ground contact points 10c to 10f are located (hereinafter referred to as the lower areas).

[0067] Each of the lower areas of the insulating layers 20 lies between one of the electrodes 10a and 10b and the ground contact points 10c to 10f. opposite. In areas of the first insulating layer 20 below the ground contact points 10c to 10f, there are vias (via plugs) 7. Through-holes 7 are also provided at the intermediate layers of the insulating layers 20 to carry the signal lines or the To electrically connect ground wires formed on different insulating layers 20.

[0068] An exemplary method for manufacturing the printed circuit board 1 with an integrated circuit attached to it is described below with reference to The manufacturing process shown in Figures 3A to 3E is described. A build-up process is used in the manufacturing process shown in Figures 3A to 3E. Procedures) applied.

[0069] During a process shown in Fig. 3A, through holes are created in the prepregs, for example by means of a laser device. provided. Each of the through-holes is filled with a conductive paste to form the prepregs with the vias 7. Subsequently Thin copper layers are attached to both sides of one of the prepregs via the vias 7, for example by a Laminating presses or heat pressing using a laminating roller machine is applied. The thin copper films are etched in such a way that the wiring layers are formed on the insulating layer 20. The insulating layer 20, on which the wiring layers are formed The two prepregs with the vias 7 are formed and are arranged between them, and the two prepregs and the insulating layer 20 are arranged between two thin copper films. The two thin copper films, the two prepregs and the insulating layer 20 are connected by The two thin copper layers on either side are joined together using heat presses. Then, the copper layers are etched to create a protective coating. to form the wiring layers. In this way, the base substrate 8 is formed with the three insulating layers 20 and the four wiring layers. educated.

[0070] A method for producing the base substrate 8 is not limited to the example described above. For example, A thin layer of copper can be attached to one side of each of the prepregs; the thin layer of copper can be etched to reveal the To form wiring layers, the through-holes can be filled with the conductive element to create the vias 7. They form, and the prepregs can be layered and pressed. Other build-up methods can also be used. The number of The number of insulating layers 20 and the number of wiring layers can be changed. For example, more than three insulating layers 20 are possible. and more than four wiring layers are formed.

[0071] During the processes shown in Fig. 3B and Fig. 3C, a through-hole corresponding to the recess section 2a is created by The first to third insulating layers 20 of the base substrate 8 are formed, for example by using a laser device. Subsequently, Several cavities of predetermined width are formed in the second insulating layer 20 and the third insulating layer 20 such that they are adjacent to the through holes are arranged. Subsequently, the base substrate 8 and the metal base 30 are connected to each other or joined together in this manner. bonded so that each of the copper sections 6 was fitted into one of the cavities is used to form the multilayer printed circuit board 2. The copper substrate 30a and the copper sections 6 are placed in the metal base 30. For example, they are formed in one piece by die casting or pressing. In die casting, molten copper is forced under pressure into a mold. cast and then hardened. The base substrate 8 and the metal base 30 are joined together using a conductive adhesive. bonded together.

[0072] During a process shown in Fig. 3D, the chip section 4, such as a capacitor and a resistor, is applied to a predetermined section of the signal lines and the ground lines is soldered to the surface of the multilayer printed circuit board 2. During In a process shown in Fig. 3E, the IC bare chip 3 is attached to the adhesive, such as silver epoxy resin or silicone resin, via the adhesive. The recessed section 2a of the multilayer printed circuit board 2 is bonded. The multilayer printed circuit board 2 with the IC bare chip 3 is placed on the A heating stage is arranged, which is heated to a temperature of 150 to 200°C. Subsequently, the contact points 3a of the IC bare chip 3 are heated. and the electrodes 10a and 10b on the surface of the multilayer circuit board 2 via the conductor wires 5 made of, for example, gold or copper connected using a bonding device. Furthermore, the contact points 3b of the IC bare chip 3 and the ground contact points 10c to 10f are connected. connected to the surface of the multilayer printed circuit board 2 via the conductor wires 5.

[0073] In the printed circuit board 1 with the integrated circuit attached to it in the present embodiment, the copper sections 6 are connected to the lower areas of electrodes 10a and 10b and ground contact points 10c to 10f are provided. Consequently, the copper sections 6 themselves then, when an ultrasonic wave and a load are applied to the multilayer circuit board 2, when the contact points 3a and 3b of the IC naked chip 3 and the electrodes 10a and 10b and the ground contact points 10c to 10f are connected or bonded, a scattering of the Ultrasound wave and load limit. Accordingly, the conductor wires 5 can be connected with certainty to the electrodes 10a and 10b and the Ground contact points 10c to 10f are fused together.

[0074] In the printed circuit board 1 with integrated circuit attached to it, manufactured by the method described above, the IC- The bare chip 3 is suitably connected to the multilayer printed circuit board 2. Consequently, the reliability of the printed circuit board 1 can be ensured. The attached integrated circuit can be improved. In printed circuit board 1 with the integrated circuit attached to it, the insulating layers 20 The multilayer printed circuit board uses PTFE, which has a lower dielectric loss tangent than glass fiber reinforced plastic. Consequently The printed circuit board 1 with the integrated circuit attached to it can limit a dielectric loss and be used in a suitable manner for a device used to process or handle a high-frequency signal, such as a millimeter wave.

[0075] In the printed circuit board 1 with integrated circuit attached to it, the copper sections 6 of the metal base 30 are each attached to the lower Areas of the insulating layers 20 are provided. Consequently, an area of ​​the copper sections 6 in the insulating layers 20 can be reduced and a density can be achieved. of the wiring pattern 10 in the insulating layers 20 are increased.

[0076] Furthermore, the glass fiber fabric in the printed circuit board 1 with the integrated circuit attached to it is provided in advance in the PTFE in such a way that that the linear expansion coefficient of the insulating layers 20 is essentially the same as the linear expansion coefficient of the wiring pattern 10 corresponds, where the copper sections 6 in the metal base 30 and the wiring pattern 10 are made of the same material. Consequently The detachment of the wiring pattern 10 from the metal base 30 can be restricted. Furthermore, the detachment of the wiring pattern 10 from The insulating layers are limited to 20. (Second embodiment)

[0077] Below is a printed circuit board 1 with an integrated circuit attached to it according to a second embodiment of the present The invention is described with reference to Fig. 4.

[0078] The circuit board 1 with integrated circuit attached to it comprises the multilayer circuit board 2, the IC bare chip 3 and the Chip section 4 contains components such as a capacitor and a resistor. Electrodes 10a and 10b are located on the surface of the multilayer printed circuit board 2. The IC bare chip 3 has contact points 3a and 3b. The electrodes 10a and 10b of the multilayer Circuit board 2 is electrically connected to contact points 3a and 3b of the IC bare chip via contact bumps formed on contact points 3a and 3b. 3 connected. The bond hills can be made of gold or copper, for example. The IC naked chip 3 is on the surface of the multilayer printed circuit board 2 , i.e. arranged in the first insulating layer 20.

[0079] In the multilayer printed circuit board 2 of the present embodiment, the wiring pattern 10 has a ground- Coplanar strip conductor structure. The widths of the signal conductors and the distances between the signal conductors and the ground conductors are determined. determined in such a way that The characteristic impedance of the multilayer printed circuit board 2 assumes a predetermined value. The predetermined value is, for example, 50. &OHgr;.

[0080] An exemplary process for manufacturing the printed circuit board 1 with the integrated circuit attached to it is described below. The embodiment is described with reference to Figures 5A to 5E. During a process shown in Figure 5A, the Base substrate 8 is formed similarly to the process shown in Fig. 3A.

[0081] During a process shown in Figs. 5B and 5C, a cavity is, for example, created by means of a laser device on a A predetermined area of ​​the second insulating layer 20 and the third insulating layer in the base substrate 8 is formed. The cavity extends from a surface of the base substrate 8 on a side opposite electrodes 10a and 10b through the base substrate 8 to a surface the second insulating layer 20 adjacent to the first insulating layer 20. Subsequently, the base substrate 8 and the metal base 30 are arranged such that They are connected so that the copper section 6 fits into the cavity. In the present embodiment, the copper section 6 is located opposite all electrodes 10a and 10b. That is, a lower area opposite all electrodes 10a and 10b is located in the insulating layers 20 educated.

[0082] During a process shown in Fig. 5D, the chip section 4, such as the capacitor and the resistor, is applied to A predetermined section of the signal lines is soldered to the surface of the multilayer printed circuit board 2. The multilayer printed circuit board 2 It is placed on the heating stage, which is heated to a temperature of 150 to 200°C. The IC bare chip 3 is placed with its front side facing downwards. arranged, and the bond hillocks formed on contact points 3a and 3b are directly connected to electrodes 10a and 10b on the surface of the multilayer printed circuit board 2 , i.e., fused to the first insulating layer 20.

[0083] In the manufacturing process described above, the IC bare chip 3 can be electrically connected to the without the connecting wires 5. multilayer printed circuit board 2 are connected. Consequently, a mounting area of ​​the IC bare chip 3 and a length of the The connection sections between the IC bare chip 3 and the multilayer printed circuit board 2 are reduced. Consequently, an electrical The properties of the printed circuit board 1 with the integrated circuit attached to it can be improved. (Other embodiments)

[0084] Although the present invention is fully described in connection with its preferred embodiments with reference to the attached Once the drawing has been revealed, it will be apparent to experts that it can be modified in various ways.

[0085] For example, as shown in Figs. 6A to 6C and Figs. 7A to 7C, the thickness of the first insulating layer 20 can be less than a thickness of the insulating layer 20 different from the first insulating layer 20.

[0086] If the thickness of the first insulating layer 20 is reduced, scattering of the ultrasonic wave and the load during the Fusion bonding may be limited when the printed circuit board 1 is manufactured with the integrated circuit attached to it. Consequently The IC bare chip 3 can definitely be electrically connected to the multilayer circuit board 2.

[0087] In each printed circuit board 1 with an integrated circuit attached to it of the embodiments described above, the Wiring pattern 10 shows the microstrip wire structure or the ground-coplanar strip wire structure as examples. Wiring pattern 10 However, it can also have a coplanar strip line structure.

[0088] In a case where the wiring pattern 10 has a microstrip conductor structure, as shown in Figs. 8A to 8C and Fig. 9A to Fig. 9C, can be placed on a surface of the first insulating layer 20, on which the electrodes 10a and 10b and the ground contact points 10c are located. up to 10f are formed, corresponding to a first surface, a striped pattern layer is formed, on a surface of the first Insulating layer 20 adjacent to the second insulating layer 20, which corresponds to a second surface, a mass pattern layer only at one section corresponding to the lower area required for the copper sections 6 and the vias 7, and on a Surface of the second insulating layer opposite the first insulating layer 20, which corresponds to a third surface, a mass pattern layer to be formed in an area that differs from the lower areas and the advanced sections 2a. The one on the second The surface-arranged ground pattern layer and the ground pattern layer arranged on the third surface can be connected via vias. 7, which penetrate the second insulating layer 20, are connected.

[0089] If the microstrip conductor structure has a strip line width W, the insulating layers 20 have a dielectric constant εr Given that the multilayer printed circuit board 2 has a characteristic impedance Z, a thickness “h” of two isotopes can be used. The coating layers 20 can be determined on the basis of the following equation (1): Z = (120μ / μeff1 / 2) / {W / h + 1.393 + In(W / h + 1.444)}(1) where εeff = (εr + 1) / 2 + (εr – 1) / 2(1 + 12h / W)1 / 2

[0090] If Z = 50 Ω, θ = 3.5 and W = 300 Ω, then h ≈ 135 μm. Consequently, the thickness of each of the insulating layers can be 20 approximately 67.5 mm.

[0091] The printed circuit board 1 having the structure described above, with the integrated circuit attached to it, is essentially similar to a case in which the thickness of the first insulating layer 20 is reduced only in an area corresponding to the lower area. Consequently, The IC bare chip 3 is definitely electrically connected to the multilayer circuit board 2 and its influence on the characteristic impedance is reduced. become.

[0092] In each printed circuit board 1 with an integrated circuit attached to it of the embodiments described above, the metal base 30 is designed to be used as a heat sink. The metal base 30 can also be designed to be used as a slotted antenna. The metal base 30 can be made of a metal containing copper or of a metal other than copper.

[0093] In each printed circuit board 1 with an integrated circuit attached to it of the embodiments described above, an IC bare chip is 3 attached. Each printed circuit board 1 with an integrated circuit attached to it can be a multi-chip module in which several IC bare chips 3 are attached. Each printed circuit board 1 with an integrated circuit attached to it can be a single-layer printed circuit board instead of the multi-layer printed circuit board 2. exhibit.

[0094] In the circuit board 1 with integrated circuit attached to it in the first embodiment, the IC bare chip 3 is attached to the The recessed sections 2a of the multilayer printed circuit board 2 are attached and the several copper sections 6 are in the insulating layers 20 connected. As shown in Figs. 10A to 10C, the IC bare chip 3 can also be placed on a surface of the multilayer printed circuit board 2. arranged and a copper section 6 is fitted into the insulating layers 20 so that it is connected to the IC bare chip 3, the electrodes 10a and 10b and opposite the ground contact points 10c to 10f.

[0095] Foreword, a printed circuit board with an integrated circuit attached to it, a printed circuit board and a method for manufacturing a Printed circuit board with integrated circuit attached to it revealed.

[0096] A printed circuit board 1 with an integrated circuit attached to it comprises a printed circuit board 2 and an IC attached to the printed circuit board 2 Naked chip 3. The circuit board 2 has a metal base 30, an insulating element made of an insulating material and mounted on the a metal base 30, and a wiring pattern 10 arranged on the insulating element. The wiring pattern 10 has a Electrode section 10a–10f, to which the IC raw chip 3 is electrically connected. The insulating element has a lower area. opposite the electrode section 10a–10f. The metal base 30 has a metal substrate 30a and a metal substrate 30a. The excellent metal section 6 is embedded in the lower part of the insulating element. QUOTES INCLUDED IN THE DESCRIPTION

[0097] This list of documents cited by the applicant was generated automatically and is solely for the better information of the Readers' contributions were included. The list is not part of the German patent or utility model application. The DPMA assumes no liability whatsoever. for any errors or omissions. Cited patent literature

[0098] - JP 7-323501 A

[0005]

Claims

[1] Printed circuit board (1 ) with integrated circuit attached to it, comprising a printed circuit board (2 ) and an IC attached to the printed circuit board (2 ). Naked chip (3 ), wherein – the printed circuit board (2 ) a metal base (30 ), an insulating element made of an insulating material and mounted on the metal base (30 ) is arranged, and has a wiring pattern (10) arranged on the insulating element; – the wiring pattern (10 ) has an electrode section (10a –10f ) with which the IC bare chip (3 ) is electrically connected is connected; – the insulating element has a lower area opposite the electrode section (10a –10f); – the metal base (30) comprises a metal substrate (30a) and a metal section (6) projecting from the metal substrate (30a); and – the metal section (6 ) is embedded in the lower part of the insulating element. [2] Printed circuit board (1 ) with integrated circuit attached thereto according to claim 1, characterized in that the insulating material has a thermoplastic material. [3] Printed circuit board (1 ) with integrated circuit attached thereto according to claim 1 or 2, characterized in that – the electrode section (10a –10f) has several electrodes; – the lower area has several sections; and – each of the several areas is opposite one of the several electrodes. [4] Printed circuit board (1 ) with integrated circuit attached thereto according to one of claims 1 to 3, characterized in that – the insulating element has several insulating layers (20 ); – the wiring pattern (10) has several wiring layers; and – each of the several wiring layers is arranged on one of the several insulating layers (20 ). [5] Printed circuit board (1 ) with integrated circuit attached thereto according to claim 4, characterized in that – the several insulating layers (20 ) a first insulating layer (20 ) on which the electrode section (10a –10f ) is arranged, and has a second insulating layer (20 ) which is located on a side opposite the first insulating layer (20 ) from the electrode section (10a ). –10f ) is arranged; and – the metal section (6 ) the multiple insulating layers (20 ) from a surface of the multiple insulating layers (20 ) adjacent to the metal base (30 ) penetrates to a surface of the second insulating layer (20 ) adjacent to the first insulating layer (20 ). [6] Printed circuit board (1 ) with integrated circuit attached thereto according to claim 5, characterized in that a thickness of the first insulating layer (20 ) less than the thickness of an insulating layer (20 ) in the multiple insulating layers other than the first insulating layer (20 ). [7] Printed circuit board (1 ) with integrated circuit attached thereto according to claim 5 or 6, characterized in that – the circuit board (2 ) further comprises a via (7 ) which penetrates the second insulating layer (20 ); – the wiring pattern (10 ) has a microstrip conductor structure and the multiple wiring layers have a have a stripline pattern layer and two ground pattern layers; – the first insulating layer (20 ) a first surface on which the electrode section (10a –10f ) is arranged, and a second surface adjacent to the second insulating layer (20 ); – the second insulating layer (20 ) has a third surface on a side opposite the first insulating layer (20 ); – the striped pattern layer is arranged on the first surface; – one of the mass pattern layers is arranged only on a section of the second surface corresponding to the lower area; – the other of the mass pattern layers is arranged on the third surface; and – the ground pattern layer arranged on the second surface is electrically connected to the layer on the third surface via a through-hole (7) The surface is connected to the mass pattern layer. [8] Printed circuit board (1 ) with integrated circuit attached thereto according to one of claims 1 to 7, characterized in that – the insulating material has an additive material such that the insulating element has a linear coefficient of expansion equal to a linear exhibits expansion coefficients of the wiring pattern (10); and – the metal substrate (30a ) and the metal section (6 ) made of a material with a linear coefficient of expansion equal to the linear expansion coefficients of the wiring pattern (10 ) are constructed. [9] Printed circuit board (2 ) with: – a metal base (30 ) with a metal substrate (30a ) and a metal section (6) projecting from the metal substrate (30a ); – an insulating element made of an insulating material and arranged on the metal base (30); and – a wiring pattern (10) that is on the insulator lier element is arranged and has an electrode section (10a –10f ) designed to be electrically connected to an IC naked chip (3 ) to be connected, whereby – the insulating element has a lower area opposite the electrode section (10a –10f ), and – the metal section (6) is embedded in the lower area. [10] Method for manufacturing a printed circuit board with an integrated circuit attached to it, comprising a printed circuit board (2 ) and a circuit mounted on the printed circuit board (2 ) has an attached IC naked chip (3 ), wherein: – the circuit board (2 ) has a metal base (30 ), several insulating layers (20 ) and a wiring pattern (10 ); – the metal base (30 ) comprises a metal substrate (30a ) and a metal section (6 ) projecting from the metal substrate (30a ); – the multiple insulating layers (20 ) are made of an insulating material and arranged on the metal base (30 ); – the wiring pattern (10 ) is arranged on the multiple insulating layers (20 ) and includes an electrode section (10a –10f ) exhibits, with which the IC naked chip (3 ) is electrically connected; – the several insulating layers (20 ) a first insulating layer (20 ) on which the electrode section (10a –10f ) is arranged, and a second insulating layer (20 ) which is on a side opposite the first insulating layer (20 ) from the electrode section (10a –10f ) is arranged, exhibit; and – the multiple insulating layers (20) furthermore have a lower area opposite the electrode section (10a –10f), the procedure comprises the following steps: – Form a cavity in the lower area such that the cavity separates the several insulating layers (20) from one surface of the several Insulating layers on a side opposite the electrode section (10a –10f ) to a surface of the second insulating layer (20 ) adjacent to the first insulating layer (20) penetrates; and – Arranging the multiple insulating layers (20 ) on the metal base (30) such that the metal section (6 ) fits into the cavity.

Images