Flexible display panel and flexible display device

Abstract

Flexible display panel (100) with a display area (2), a non-display area (4) and a bending area (6) arranged between the display area (2) and the non-display area (4), wherein the flexible display panel (100) has: a flexible substrate (10); a thin-film transistor layer (12) arranged on the flexible substrate (10), wherein the thin-film transistor layer (12) comprises a semiconductor layer (122), a gate electrode insulation layer (123), a gate electrode layer (124), an insulating intermediate layer (125) and a source-drain electrode metal layer (126), which are stacked in one direction away from the flexible substrate (10); a contact layer (14) arranged on one side of the thin-film transistor layer (12) away from the flexible substrate (10), wherein the contact layer (14) comprises a first contact metal layer and a second contact metal layer; and Signal transmission lines (20) comprising two parallel wiring layers (202) in the bending region (6), wherein one of the two parallel wiring layers (202) and the source-drain electrode metal layer (126) are manufactured in the same layer, wherein the other of two parallel wiring layers (202) is manufactured in the same layer with the first contact metal layer or the second contact metal layer, wherein two ends of each of the at least two parallel wiring layers (202) which are arranged outside the bending area (6) are connected by a through hole (204), wherein orthogonal projections of the two parallel wiring layers (202) onto a plane of the flexible substrate (10) form a plurality of hollow regions (202a) arranged along a direction perpendicular to a bending axis of the bending region (6).

Description

TECHNICAL AREA

[0001] The present disclosure relates to the technical field of display technologies and relates in particular to a flexible display panel. BACKGROUND

[0002] With the development of science and technology, portable devices have emerged as a new trend in modern society, gradually changing human life and bringing about significant changes in science and technology. In particular, flexible display panels are becoming increasingly popular with users due to their advantages of flexibility, portability, and wide applicability. Flexible display panels also offer a completely new visual experience.

[0003] In the technologies in question, it is common for the metal wires to break in the bending area of ​​the flexible display panels, leading to display defects. DE 10 2017 128 459 A1 discloses a display panel and a display device. DE 10 2017 108 600 A1 discloses a touchscreen control panel and a display device. DE 10 2016 125 930 A1 discloses a cover plate and a display device with the same. US 2017 / 0 277 288 A1 discloses a display device. US 2018 / 0 122 863 A1 discloses a display device. OVERVIEW

[0004] The present disclosure provides a flexible display panel that can reduce the risk of metal wiring breaking.

[0005] In a first aspect, the present disclosure provides a flexible display panel. The flexible display panel has a display area, a non-display area, and a bending area located between the display area and the non-display area. The flexible display panel comprises a flexible substrate and a thin-film transistor layer arranged on the flexible substrate. The thin-film transistor layer comprises a semiconductor layer, a gate electrode insulating layer, a gate electrode layer, an insulating intermediate layer, and a source-drain electrode metal layer, which are stacked sequentially in one direction away from the flexible substrate. The flexible display panel further comprises a contact layer arranged on one side of the thin-film transistor layer, away from the flexible substrate. The contact layer comprises a first contact metal layer and a second contact metal layer.The flexible display panel further includes signal transmission lines with two parallel wiring layers in the bending area. One of the two parallel wiring layers and the source-drain electrode metal layer are manufactured in the same layer. The other of the two parallel wiring layers is manufactured in the same layer as either the first or the second contact metal layer.

[0006] In a second aspect, the present disclosure provides a flexible display device. The flexible display device comprises the aforementioned flexible display panel. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 shows a schematic diagram of a flexible display panel according to an embodiment of the present disclosure; Fig. Figure 2 shows a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure; Fig. Figure 3 illustrates a schematic diagram of a type of connection between two conductive layers according to an embodiment of the present disclosure; Fig. Figure 4 illustrates a schematic diagram of another type of connection of the two conductive layers according to an embodiment of the present disclosure; Fig. Figure 5 illustrates a schematic diagram of a wiring layer according to an embodiment of the present disclosure; Fig. Figure 6 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 7 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 8 illustrates a schematic diagram of hollow areas in a wiring layer according to an embodiment of the present disclosure; Fig. Figure 9 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 10 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 11 shows a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 12 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 13 illustrates a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure; Fig. Figure 14 illustrates a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure; Fig. Figure 15 illustrates a schematic diagram of a flexible display device according to an embodiment of the present disclosure.

[0007] The accompanying drawings are incorporated into the description as part of this disclosure. The accompanying drawings illustrate the embodiments according to this disclosure and are used to explain the principle of this disclosure together with the description. DESCRIPTION OF EXECUTION FORMS

[0008] The embodiments of the present disclosure are further described in detail with reference to the drawings.

[0009] It should be noted that terms such as "above", "below", "left", "right", and the like, mentioned in embodiments of the present disclosure, are described with reference to the placement status in the accompanying drawings and should not be interpreted as limiting embodiments of the present disclosure. Furthermore, it should be understood that in this context, when referring to an element formed "over" or "under" another element, it is possible that the element is formed directly "over" or "under" the other element, or it is also possible that the element is formed "over" or "under" the other element via an intermediate element.

[0010] Fig. Figure 1 is a schematic diagram of a flexible display panel according to an embodiment of the present disclosure.

[0011] The present disclosure provides a flexible display panel 100, wherein the flexible display panel 100 comprises a display area 2, a non-display area 4, and a bending area 6 arranged between the display area 2 and the non-display area 4. The flexible display panel 100 can be bent in the bending area 6.

[0012] In one embodiment, the bending area 6 can be a non-display area not used for displaying images. For example, the bending area 6 can be located in an IC (integrated circuit) area or an FPC (flexible printed circuit, flexible circuit board) area, and the like. In other embodiments, the bending area 6 can, of course, also be a display area, used, for example, to display the time, date, and the like.

[0013] Fig. Figure 2 shows a cross-sectional view of a flexible display panel according to an embodiment of the present disclosure.

[0014] The flexible display panel 100 comprises a flexible substrate 10, a thin-film transistor layer 12, and a contact layer 14, which are arranged on the flexible substrate 10. The contact layer 14 is located on one side of the thin-film transistor layer 12, away from the flexible substrate 10.

[0015] In the embodiments of the present disclosure, the flexible substrate can comprise 10 different suitable flexible or bendable organic materials. For example, the flexible substrate can comprise 10 polymer resins such as polyethersulfone (PES), polypropylene resin (PP), polyetherimide (PEI), poly(ethylene naphthalate) (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl compounds, polyimide (PI), polycarbonate (PC) and / or cellulose acetate propionate (CAP).

[0016] The thin-film transistor layer 12 comprises a semiconductor layer 122, a gate electrode insulating layer 123, a gate electrode layer 124, an insulating intermediate layer 125, and a source-drain electrode metal layer 126, which are stacked sequentially in one direction away from the flexible substrate 10. The gate electrode layer 124 comprises a gate electrode 124a. The source-drain electrode metal layer 126 comprises a source electrode 126a and a drain electrode 126b, both of which are connected to the semiconductor layer 122 (also referred to as the active layer). In the flexible display panel 100, the source electrode 126a, the drain electrode 126b, the gate electrode, and the semiconductor layer 122 form a thin-film transistor. The thin-film transistor is used to form a pixel control circuit to control a light-emitting element to emit light.

[0017] The touch layer 14 can be used to implement a touch function of the flexible display panel 100. The touch layer 14 can comprise a first touch metal layer and a second touch metal layer. A touch electrode and a sensing electrode are arranged in the first touch metal layer and the second touch metal layer, respectively, to form a counter-capacitance mode or a self-capacitance mode.

[0018] Referring to Fig. The flexible display panel 100 further comprises signal transmission lines 20. Since the signal transmission lines 20 are repeatedly bent, there is a high risk of line breakage in the bending area 6 of the flexible display panel 100. To address this, the present disclosure proposes that the signal transmission lines 20 comprise at least two parallel wiring layers in the bending area 6. That is, two, three, or more wiring layers can be provided, with the wiring layers arranged in parallel and used as signal transmission lines. This configuration ensures that even if a crack or break occurs in one wiring layer, the crack will not propagate to the other wiring layer, so that some wiring layers in the bending area 6 remain available for signal transmission, thus ensuring normal signal input and output.

[0019] In the flexible display panel 100, each of the parallel wiring layers used as signal transmission lines 20 can be manufactured in the same layer as at least two of the source-drain electrode metal layers 126, namely the first contact metal layer and the second contact metal layer. The manufacturing processes can include, but are not limited to, physical deposition, vacuum evaporation, and the like.

[0020] In an optional embodiment, the signal transmission lines 20 comprise two parallel wiring layers. That is, the two wiring layers are arranged in parallel and are used as signal transmission lines 20. One of the wiring layers can be manufactured in the same layer as the source-drain electrode metal layer 126, while the other wiring layer can be manufactured in the same layer or in the second contact metal layer.

[0021] The entire source-drain electrode metal layer 126, the first contact metal layer and the second contact metal layer have a three-layer structure of T i A1T iSince an intermediate metal layer A1 is a relatively soft material that exhibits higher flexibility, the source-drain electrode metal layer 126, the first contact metal layer, or the second contact metal layer have a better flexural stiffness property, thereby reducing the risk of breakage of the wiring layers.

[0022] Fig. Figure 3 is a schematic diagram of a connection type of the wiring layers. Fig. Figure 3 shows signal transmission lines 20 which contain two parallel wiring layers 202, but are not limited to two layers.

[0023] The two wiring layers 202 are connected by a through-hole in the bending region 6, where the through-hole can have a diameter of 2 µm to 8 µm. The insulation layer 120 between the two wiring layers 202 is discontinuous in the bending region 6 due to the through-hole. An electrical connection between the two wiring layers is disadvantageous if the through-hole is too small. If the through-hole is too large, it is necessary to widen the wires at the through-hole, which is undesirable for sophisticated wiring designs and would also reduce the distance between adjacent wiring layers, causing short circuits, which is detrimental to signal transmission.

[0024] In the embodiment as described in Fig. As shown in Figure 3, the wiring layers 202 can be connected at the through-hole in bending area 6 due to the through-hole located there. The number of through-holes can be selected according to the size of bending area 6. For example, the number of through-holes can be one or more. In this way, even if one of the wiring layers 202 breaks at a specific point (for example, section A) in bending area 6, which is frequently bent and has the highest risk of wire breakage, other parts of the wiring layers 202 (for example, section B) can still form a parallel structure with the other wiring layer 202, thus reducing the impact of partially broken parts on the entire wiring layers 202.

[0025] The two wiring layers 202 are separated by the middle layer 120. The middle layer 120 is an insulating layer. In the manufacturing process of the flexible display panel 100, a portion of the middle layer 120 can be photo-etched by exposure or similar processes to form the through-hole in the middle layer 120 for connecting the two wiring layers 202.

[0026] In one embodiment, the middle layer 120 can be an inorganic or an organic layer. If an organic film layer is used as the middle layer 120, the photo-etched middle layer 120 can form a smaller angle, for example, less than 50°, at the through-hole. A smaller angle allows for a more suitable arrangement of the upper wiring layer 202, so that a reliable bridging connection between the upper wiring layer 202 and the lower wiring layer 202 at the through-hole can be achieved. In one embodiment, the through-hole in the middle layer can be configured to have an inclined side wall.The inclined side wall has a projection (not shown) facing away from the flexible substrate 10, allowing the wiring layer 202, located on one side of the middle layer away from the flexible substrate 10, to be readily electrically connected to the other wiring layer 202. This prevents electrical connection failure at the through-hole due to a broken circuit resulting from the relatively steep slope. Furthermore, if an organic film is used as the middle layer, the organic middle layer can be made thicker than the inorganic middle layer due to its superior flexural properties. This prevents signal interference when adjacent wiring overlaps, thus improving signal transmission reliability.

[0027] Fig. Figure 4 shows a schematic diagram of another type of connection for parallel wiring layers. In the diagram shown in Fig. In the example shown in Figure 4, the signal transmission lines 20 contain two parallel wiring layers 202, but this is not limited to two wiring layers.

[0028] Both ends of each wiring layer 202 are located outside the bending region 6, with the section between the two ends being located within the bending region 6. The two wiring layers 202 are connected in parallel by through holes at their ends, i.e., outside the bending region 6. In this technical solution, the through holes are located in the non-bendable area, while the middle layer 120 forms a continuous connection between the two wiring layers 202 within the bending region 6.

[0029] The middle layer 120 can be an organic or an inorganic middle layer and can be used as an insulating layer between the two wiring layers 202. If the middle layer 120 is organic, it can buffer stress in the wiring layers 202. Therefore, the middle layer 120, continuously distributed in the bending region 6, can exert a significant protective effect on the wiring layers 202.

[0030] In another aspect, the embodiment, as it is described in Fig. Figure 4 shows that no through-hole is required in the middle layer 120 in the bending area 6, allowing the middle layer 120 to be continuous. This simplifies the manufacturing process and reduces manufacturing costs. Furthermore, the two wiring layers 202 are not bent in the non-bend area, so the risk of breakage is extremely low. Therefore, it is unnecessary to check whether the two wiring layers 202 can form a parallel connection after breakage. Based on the analysis above, the number of through-holes in the bending area can be reduced accordingly, further simplifying the manufacturing process and reducing costs.In other embodiments, the through holes in the middle layer 120 in the bending area 6 can be arranged such that the two wiring layers in the bending area are electrically connected, whereby a person skilled in the art can design as required.

[0031] The shape of the wiring layers 202 can be designed according to the force exerted when they are bent. According to a Fig. 5 In the referenced embodiment, the wiring layers 202 contain several hollow regions 202a. In one embodiment, the hollow regions 202a can have the shape of a quadrilateral.

[0032] The hollow regions 202a form a grid-like structure of the wiring layers 202. Each grid is surrounded by a curved line or by several curved lines, with the adjacent grids being connected by the curved lines or the curved line. It can be in Fig. As can be seen in Figure 5, each wiring layer 202 with hollow regions 202a has two branches 202b connected in parallel. In this case, even if one of the branches 202b has cracks or is broken, the signal can still be transmitted through the other branch 202b. Furthermore, the wiring layer 202 with a grid-like structure can accommodate other wiring in the same layer as this wiring layer 202, thus improving the flexibility of the wiring of the wiring layers 202 and the space utilization. Additionally, the wiring layers 202 containing the hollow regions 202a can also reduce bending stress in the bending region 6, thus improving the bending stiffness performance of the wiring layers 202.

[0033] In the embodiment as described in Fig. As shown in section 5, the hollow areas 202a are arranged in the bending area 6. They are arranged in a direction parallel to a bending axis (direction X in the bending area). Fig. 5) The wiring layer 202 has only one hollow region 202a. That is, the hollow regions 202a are sequentially arranged only in one direction perpendicular to the bending axis (direction Y in). Fig. 5) arranged. This configuration can reduce the space occupied by each wiring layer 202, thereby achieving a more efficient arrangement of the wiring layers 202.

[0034] Fig. Figure 6 is a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.

[0035] The two wiring layers 202, which are in Fig. Figure 6 shows that they have the same shape, i.e., both include hollow regions 202a. It is understood that the shape of each wiring layer 202 may be different, which is not limited in the present disclosure.

[0036] In the Fig. In the embodiment shown in Figure 6, orthographic projections of the hollow areas 202a of one wiring layer 202 on the flexible substrate 10 overlap orthographic projections of the hollow areas 202a of the other wiring layer 202 on the flexible substrate 10. That is, the projections of the two wiring layers 202 are not completely overlapped, but are offset in the direction Y, with the two wiring layers 202 being indicated by solid lines and dashed lines, respectively.

[0037] When the flexible display panel 100 is bent, the two offset wiring layers 202 have different bending positions. If the hollow areas of the wiring layers 202 have a quadrilateral shape, the positions of the angles α of one wiring layer 202 are offset relative to the positions of the angles α of the other wiring layer 202. Since the positions of the acute angles are points of stress concentration, the two wiring layers 202 are subjected to different bending stresses. Thus, a stress concentration can be distributed between the upper and lower wiring layers 202, reducing the risk of the wiring layers 202 breaking. Furthermore, in the present embodiment, the two wiring layers are connected in parallel, effectively reducing the electrical resistance of the wiring layers and thus reducing energy consumption.

[0038] Fig. Figure 7 illustrates a schematic diagram of an arrangement of two wiring layers according to an embodiment of the present disclosure.

[0039] Orthographic projections of the hollow region 202a of one wiring layer 202 on the flexible substrate 10 do not overlap orthographic projections of the hollow region 202a of the other wiring layer 202 on the flexible substrate 10. That is, the projections of the two wiring layers 202 are arranged sequentially in the X direction and offset in the Y direction. The two wiring layers 202 are shown in solid lines and dashed lines, respectively.

[0040] When the flexible display panel 100 is bent, the two offset wiring layers 202 have different bending positions. If the wiring layers 202 have a quadrilateral shape, the positions of the sharp angles of one wiring layer 202 are offset relative to the positions of the sharp angles of the other wiring layer 202. Since the positions of the sharp angles are points of stress concentration, the two wiring layers 202 are subjected to different bending stresses. Thus, the stress accumulation in the upper and lower wiring layers 202 can be distributed, thereby reducing the risk of the wiring layers 202 breaking.Furthermore, the projections of the two wiring layers 202 are arranged sequentially in the X-direction, so that only one wiring layer is bent in the thickness direction, and the stress when bent can be further distributed, thus further improving bendability. Additionally, since the two wiring layers are arranged in an upper and a lower configuration, preventing the adjacent signal transmission lines from being short-circuited when bent, the reliability of the signal transmission is improved.

[0041] In the Fig. In the embodiment shown in Figure 7, each of the two wiring layers 202 is configured as a strand. In some other embodiments, each of the two wiring layers 202 can be configured as multiple strands, with the multiple strands of each wiring layer being connected in a one-to-one relationship.

[0042] Additionally, in the above embodiments, the number of through-holes for creating bridge connections between different wiring layers 202 is not limited. The number of through-holes can be selected according to the actual structure and size of each wiring layer 202.

[0043] In the in the Fig. In embodiments 5 to 7, the shape of each hollow region 202a is a quadrilateral. However, it should be clear that the hollow regions 202a can also have the shape of an ellipse, a circle, or any polygon. Fig. Figure 8 shows a schematic representation of hollow areas with an elliptical shape.

[0044] To distribute the voltage accumulation, the hollow areas 202a, which have an elliptical shape, can be used in Fig. 6 or in Fig. 7 are shown, with reference to Fig. 9 and are not described in detail herein, are arranged in a staggered manner. Fig. Figure 10 is a schematic diagram of another arrangement of two wiring layers according to an embodiment of the present disclosure.

[0045] In one embodiment, the signal transmission line 20 contains two parallel wiring layers in the bending region. The two parallel wiring layers are electrically connected by a plurality of through holes in the direction of extension of the wiring layers.

[0046] Fig. Figure 10 is a schematic diagram of an arrangement of double-wiring layers according to another embodiment of the present disclosure. Fig. 10, place S1 ... S nThe signal transmission lines 20 are represented, with one end of each signal transmission line 20 connected to an AA area and the other end of each signal transmission line 20 electrically connected to a driver chip (IC) connector. Projections of two adjacent signal transmission lines 20 do not overlap in a direction perpendicular to the flexible substrate 10.

[0047] Each signal transmission line 20 contains a first wiring section 20a and a second wiring section 20b. The first wiring section 20a is located in the bending region 6, and the second wiring section 20b is located in the non-bent region. The first wiring section 20a contains two parallel wiring layers 202 and 202'. Both of the two wiring layers 202 and 202' have a bending structure. The two distinct layers in which the first wiring section 20a is distributed have symmetrical projections on the flexible substrate with respect to a straight line where the second wiring section 20b is located. The projection of one wiring layer 202 on the flexible substrate is on the left side of the straight line, while the projections of the other wiring layer 202' on the flexible substrate are on the right side of the straight line.In the embodiment of the present disclosure, the first wiring section 20a comprises two parallel wiring layers 202 and 202'. The two parallel wiring layers are electrically connected by a plurality of through-holes along the direction of extension of the wiring layers, thus effectively reducing the electrical resistance of the wiring layers and consequently reducing energy consumption. Furthermore, if a short circuit occurs in a particular section of the wiring layer, the signal can still be transmitted through other sections, thereby improving the reliability of signal transmission. On the other hand, the two different layers in which the first wiring section 20a is distributed have symmetrical projections on the flexible substrate with respect to a straight line where the second wiring section 20b is located.This means that when bent in the thickness direction, only one wiring layer is bent, effectively reducing the bending stress and thus improving the bending behavior of the wiring layers.

[0048] Fig. Figure 11 is a schematic diagram of an arrangement of two wiring layers according to another embodiment of the present disclosure. Each signal transmission line 20 contains a first wiring section 20a and a second wiring section 20b. The first wiring section 20a is arranged in the bending region 6, with the second wiring section 20b being arranged in the non-bending region. The first wiring section 20a contains two parallel wiring layers 202 and 202'. Each wiring layer 202 or 202' has a bending structure, wherein the two distinct layers in which the first wiring section 20a is distributed have symmetrical projections on the flexible substrate with respect to a straight line where the second wiring section 20b is arranged. The projections of the wiring layers 202 and 202' on the flexible substrate are located on both sides of the straight line.In the arrangement of the present embodiment, the requirements for graphic accuracy for arranging the wiring layers 202 and 202' can be reduced, thereby decreasing the manufacturing difficulties.

[0049] Fig. Figure 12 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure. By moving the signal transmission lines upwards in even-numbered rows from S1 ... S1, the signal transmission lines are connected in even-numbered rows from S1 to S1. n , which in Fig. 10 or Fig. As shown in 11, one obtains a in Fig. 12. In the version shown in Fig. In the embodiment shown in Figure 12, the positions of the through-holes 204 and the positions of the angles of the wiring layers 202 and 202' can be arranged in an offset manner. Additionally, the projection of one wiring layer 202 onto the flexible substrate 10 partially overlaps the projection of the other wiring layer 202' onto the flexible substrate 10. At the overlap position, waviness occurs on the layers 202 and 202' in the direction perpendicular to the flexible substrate 10, and this wavier structure can reduce the unequal bending stress in the wiring layers 202 and 202' during bending. Accordingly, the risk of the wiring layers 202 and 202' breaking is reduced. Since the two wiring layers are arranged in different layers at the overlap positions, interference between adjacent signals is also reduced.Furthermore, the distance between adjacent wiring sections can be effectively reduced, allowing more signal transmission lines to be arranged in the same area, which is advantageous for high-solution wiring designs. Because the two wiring layers are located in different layers at the overlapping positions, the adjacent signal transmission lines are not short-circuited when bent, thus improving signal transmission reliability.

[0050] Fig. Figure 13 is a schematic diagram of an arrangement of the two wiring layers according to another embodiment of the present disclosure.

[0051] By moving the signal transmission lines upwards in an even-numbered series from S1 ... S n in Fig. 12 will be in Fig. The differing embodiment shown in 13 is obtained. In the Fig. In the embodiment shown in Figure 13, the positions of the through holes 204 and the positions of the angles of the wiring layers 202 and 202' can be arranged in an offset manner. The positions of the angles of the wiring layer 202 and the positions of the angles of the wiring layer 202' are also arranged in an offset manner. Based on the embodiment above, the offset arrangement of the angles of the wiring layers 202 and 202' can further reduce the stress concentration when bent, thereby further reducing the risk of the wiring layers 202 and 202' breaking.

[0052] In the in the Fig. In the embodiments shown in Figures 10 to 13, the two wiring layers of the first wiring section 20a are connected by a plurality of through-holes 204. The plurality of through-holes is arranged sequentially along an axis of symmetry of the two wiring layers of the first wiring section 20a. The plurality of through-holes results in the two wiring layers of the first wiring section 20a forming a plurality of connection positions o in an interval. With such an arrangement, even if the first wiring section 20a is interrupted in one section (for example, section A), other sections (for example, section B or section C, etc.) can still be connected.) of the first wiring section 20a can be used as a signal transmission line 20 to transmit signals due to the presence of the through holes 204, thereby improving the bending stiffness performance of the signal transmission lines 20 and the reliability of the signal transmission.

[0053] In another aspect, in the embodiments described above, if the first wiring sections 20a are configured to have the same length, the first wiring sections 20a with a bending structure can occupy a smaller space, which allows for optimization of the arrangement of the wiring layers 202.

[0054] In the in the Fig. In the embodiments shown in Figures 10 to 13, projections of the two wiring layers 202 and 202' in the direction perpendicular to the flexible substrate 10 form a square, a circle or an ellipse.

[0055] It should be noted that in the Fig. 10 to 13 The number of through holes 204 is not limited to the cases shown above. For example, the number of through holes 204 can be reduced, and the person skilled in the art can adjust this according to the requirements.

[0056] It should also be noted that in the embodiments described in the Fig. As described in sections 10 to 13, the through-holes can be arranged not only in the bending area 6, but also simultaneously in the non-bending area. In the non-bending area, one of the two wiring layers 202 and 202' is connected to other parts of the signal transmission line 20 through the through-hole 204.

[0057] In an optional embodiment, the quadrilateral projection of two wiring layers can be designed to be symmetrical with respect to a first straight line, wherein one extension direction of the first straight line is a direction perpendicular to the bending axis (direction Y shown in Fig. 10) is.

[0058] In another optional embodiment, the four-sided projection of two wiring layers can also be in a first direction (direction Y in Fig. 10) be arranged in a staggered manner, the first direction being a direction perpendicular to the bending axis. The staggered arrangement of the quadrilaterals is more advantageous for reducing bending stress. This is because the acute angles of the quadrilaterals tend to form stress concentration points during bending, whereas the acute angles of the quadrilaterals are staggered relative to each other, with the stress concentration points being offset in the first direction by the staggered arrangement of the quadrilaterals relative to each other.

[0059] The majority of signal transmission lines S1 ... S nIt may also include at least one data signal transmission line, one touch signal transmission line, and one power signal line. That is, the entire data signal transmission line, the touch signal transmission line, and the power signal line may contain a structure of multiple parallel wiring layers to reduce the risk of any signal transmission line being interrupted.

[0060] Furthermore, the parallel wiring layers contained in the data signal transmission line may also have hollow areas, which may be in the shape of a square, a circle, or an ellipse.

[0061] The touch signal transmission line and the power signal line can be arranged according to the data signal transmission line, which is not described here.

[0062] It should be noted that the power signal line may contain a plurality of (more than two) parallel wiring layers, which may further reduce the electrical resistance of the power signal line.

[0063] In one embodiment, projections of the parallel wiring layers, which are used as an energy signal line on the flexible substrate 10, can be arranged in a non-overlapping manner, as shown in Fig. Figure 7 shows that the technical effects are essentially the same as those of the technical solution, which is not described here.

[0064] Fig. Figure 14 shows a cross-sectional view of a flexible display panel.

[0065] The flexible display panel 100 provided in the present disclosure can be an inorganic light-emitting display panel. Furthermore, an organic light-emitting element layer 16 can be included between the thin-film transistor layer 12 and the contact layer 14, wherein the organic light-emitting element layer 16 is used as a light source capable of emitting light of different colors.

[0066] Furthermore, a thin-film encapsulation layer 18 can be located on one side of the organic light-emitting element layer 16, away from the flexible substrate 10. The thin-film encapsulation layer 18 covers the display area of ​​the flexible display panel 100. The thin-film encapsulation layer 18 can encapsulate the thin-film transistor layer 12, the organic light-emitting element layer 16, and the like, to protect them from water and oxygen.

[0067] The thin-film encapsulation layer 18 can comprise an organic encapsulation layer and an inorganic encapsulation layer. The number of organic or inorganic encapsulation layers is not limited.

[0068] In an optional embodiment, the thin-film encapsulation layer 18 comprises an inorganic encapsulation layer 180, an organic encapsulation layer 182, and an inorganic encapsulation layer 184, which are arranged in a stacked manner. The organic encapsulation layer 182 is positioned between the organic encapsulation layer 184 and the organic encapsulation layer 184.

[0069] With regard to the contact layer 14, in one embodiment the contact layer 14 can be arranged on one side of the thin-film encapsulation layer 18 away from the flexible substrate 10.

[0070] In another embodiment, at least one of the first contact metal layer and the second contact metal layer is arranged in the thin-film encapsulation layer 18. In this embodiment, the first contact metal layer or the second contact metal layer can be integrated into the thin-film encapsulation layer 18 without a separate contact field, which is advantageous for forming a thinner and lighter flexible display panel 100.

[0071] The present disclosure further provides a flexible display device 200. Fig.Figure 15 shows a schematic diagram of a flexible display device 200 according to an embodiment of the present disclosure, wherein the flexible display device 200 comprises the flexible display field 100 described in one of the embodiments above. It should be noted that the flexible display device 200 can be a mobile phone, a tablet computer, a portable device, and the like.

[0072] The above descriptions are merely preferred embodiments of the present disclosure and are not intended to limit the present disclosure. A person skilled in the art may make any modification or variation. Within the principles of the present disclosure, any modification, equivalent substitution, or improvement shall fall within the scope of protection of the present disclosure.

Claims

[1] Flexible display panel (100) with a display area (2), a non-display area (4) and a bending area (6) arranged between the display area (2) and the non-display area (4), wherein the flexible display panel (100) has: a flexible substrate (10); a thin-film transistor layer (12) arranged on the flexible substrate (10), wherein the thin-film transistor layer (12) comprises a semiconductor layer (122), a gate electrode insulation layer (123), a gate electrode layer (124), an insulating intermediate layer (125) and a source-drain electrode metal layer (126), which are stacked in one direction away from the flexible substrate (10); a contact layer (14) arranged on one side of the thin-film transistor layer (12) away from the flexible substrate (10), wherein the contact layer (14) comprises a first contact metal layer and a second contact metal layer; and Signal transmission lines (20) comprising two parallel wiring layers (202) in the bending region (6), wherein one of the two parallel wiring layers (202) and the source-drain electrode metal layer (126) are manufactured in the same layer, wherein the other of two parallel wiring layers (202) is manufactured in the same layer with the first contact metal layer or the second contact metal layer, wherein two ends of each of the at least two parallel wiring layers (202) which are arranged outside the bending area (6) are connected by a through hole (204), wherein orthogonal projections of the two parallel wiring layers (202) onto a plane of the flexible substrate (10) form a plurality of hollow regions (202a) arranged along a direction perpendicular to a bending axis of the bending region (6). [2] Flexible display panel (100) according to claim 1, wherein each of the two wiring layers (202) has a plurality of hollow areas (202a), wherein one shape of a hollow area (202a) of the plurality of hollow areas (202a) is a square, a circle, an ellipse or a polygon. [3] Flexible display panel (100) according to claim 2, wherein projections of the plurality of hollow areas (202a) of one of the two parallel wiring layers (202) on the flexible substrate (10) partially overlap with projections of the plurality of hollow areas (202a) of the other of the two parallel wiring layers (202) on the flexible substrate (10). [4] Flexible display panel (100) according to claim 2, wherein projections of the plurality of hollow areas (202a) of the two parallel wiring layers (202) on the flexible substrate (10) do not overlap projections of the plurality of hollow areas (202a) of the other of the two parallel wiring layers (202) on the flexible substrate (10). [5] Flexible display panel (100) with a display area (2), a non-display area (4) and a bending area (6) arranged between the display area (2) and the non-display area (4), wherein the flexible display panel (100) comprises: a flexible substrate (10); a thin-film transistor layer (12) arranged on the flexible substrate (10), wherein the thin-film transistor layer (12) comprises a semiconductor layer (122), a gate electrode insulation layer (123), a gate electrode layer (124), an insulating intermediate layer (125) and a source-drain electrode metal layer (126) stacked in one direction away from the flexible substrate (10); a contact layer (14) arranged on one side of the thin-film transistor layer (12) away from the flexible substrate (10), wherein the contact layer (14) comprises a first contact metal layer and a second contact metal layer; and signal transmission lines (20) with two parallel wiring layers (202) in the bending region (6), wherein one of the two parallel wiring layers (202) and the source-drain electrode metal layer (126) are produced in the same layer, wherein the other of two parallel wiring layers (202) is produced in the same layer with the first contact metal layer or the second contact metal layer, wherein in one direction of extension of the two parallel wiring layers (202) the two parallel wiring layers (202) are electrically connected by a plurality of through holes, wherein projections of the two parallel wiring layers (202) in a direction perpendicular to the flexible substrate (10) form shapes of a square, a circle or an ellipse, where projections of adjacent signal transmission lines (20) in the direction perpendicular to the flexible substrate (10) do not overlap, wherein the projections having quadrilateral shapes are symmetrical with respect to a first straight line, wherein a direction of extension of the first straight line is a direction perpendicular to a bending axis of the bending area (6), wherein orthogonal projections of the two parallel wiring layers (202) onto a plane of the flexible substrate (10) form a plurality of hollow regions (202a) arranged along a direction perpendicular to a bending axis of the bending region (6). [6] Flexible display panel (100) according to claim 5, wherein the projections are arranged with square shapes offset in a first direction and the first direction is a direction perpendicular to a bending axis of the bending area (6). [7] Flexible display panel (100) according to any one of claims 1 to 5, wherein the signal transmission lines (20) comprise at least one data signal transmission line, one touch signal transmission line and / or one power signal line. [8] Flexible display panel (100) according to claim 7, wherein the energy signal line comprises at least three parallel wiring layers (202). [9] Flexible display panel (100) according to claim 8, wherein projections of the at least three parallel wiring layers (202) on the flexible substrate (10) do not overlap each other. [10] Flexible display panel (100) according to claim 9, wherein each of the at least two parallel wiring layers (202) has several hollow areas (202a), wherein one shape of one of the several hollow areas (202a) is a square, circle or ellipse. [11] Flexible display panel (100) according to claim 10, wherein the signal transmission lines (20) comprise the power signal line. [12] Flexible display panel (100) according to any one of claims 1 to 11, wherein an organic light-emitting element layer (16) is arranged between the thin-film transistor layer (12) and the contact layer (14), wherein a thin-film encapsulation layer (18) is provided on a side of the organic light-emitting element layer (16) that is away from the flexible substrate (10), and wherein the thin-film encapsulation layer (18) comprises an organic encapsulation layer (181) and at least one inorganic encapsulation layer (180, 184). [13] Flexible display panel (100) according to claim 12, wherein the contact layer (14) is arranged on a side of the thin-film encapsulation layer (18) facing away from the flexible substrate (10). [14] Flexible display panel (100) according to claim 12, wherein the first contact metal layer and / or the second contact metal layer are arranged in the thin-film encapsulation layer (18). [15] Flexible display device (200) comprising the flexible display panel (100) according to any one of claims 1 to 14.

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