Carrier module for a card-shaped data carrier, card-shaped data carrier and method for manufacturing a card-shaped data carrier

Abstract

The invention relates to a carrier module (10) for a card-shaped data carrier (1). The carrier module (10) comprises a carrier layer (11) and a contact interface (20) attached to a first surface (12) of the carrier layer (11) and extending over a first sub-area (13) of the first surface (12). The carrier module (10) also comprises an electrical component (30) attached to the carrier layer (11), wherein at least a part of the electrical component (30) extends over a second sub-area (14) of the first surface (12). Furthermore, the carrier module (10) comprises a filler layer (40) applied to a third sub-area (15) of the first surface (12) of the carrier layer (11), and a design layer (50) that at least partially covers the filler layer (40) and the electrical component (30).

Description

[0001] The present invention relates to a foil-like carrier module for dual-interface (DI) chip cards. In particular, the invention relates to a carrier module for a card-shaped data carrier, a card-shaped data carrier, and a method for manufacturing a card-shaped data carrier.

[0002] Card-shaped data carriers are used in a wide variety of applications today. For example, such data carriers can be used for cashless payment of goods or services, for personal identification, or for accessing internet-based applications. Accordingly, card-shaped data carriers include, for example, chip cards in general, payment cards such as credit or debit cards, as well as smart cards and identity cards. These card-shaped data carriers typically contain security features, personalization information, and other components.

[0003] The production of card-shaped data carriers, especially so-called dual-interface (DI) chip cards, can often be complex, as a large number of different components, such as the chip module, contact interface, and antenna, must be integrated into the card body. Similarly, recycling card-shaped data carriers can be problematic, since they contain a multitude of different components made of various materials, some of which are difficult to separate.

[0004] It is an object of the present invention to facilitate the manufacture of card-shaped data carriers.

[0005] This problem is solved by the subject matter of the independent claims. Further features of the invention will become apparent from the dependent claims, the following description, and the figures.

[0006] According to one aspect, a carrier module for a card-shaped data carrier is provided. The carrier module comprises a carrier layer and a contact interface, which is attached to a first surface of the carrier layer and extends over a first sub-area of ​​the first surface of the carrier layer. The carrier module also comprises an electrical component attached to the carrier layer, wherein at least a part of the electrical component extends over a second sub-area of ​​the first surface of the carrier layer. Furthermore, the carrier module comprises a filler layer applied to at least a third sub-area of ​​the first surface of the carrier layer, as well as a design layer that at least partially covers the filler layer and the electrical component.

[0007] The carrier module according to the invention provides a simple-to-manufacture, prefabricated unit that has all the components required for a dual-interface (DI) chip card and then only needs to be connected to a card body to provide the card-shaped data carrier, in particular the dual-interface (DI) chip card.

[0008] In other words, the carrier module can form a modular unit that includes the contact interface, the chip, security elements and electrical components such as antenna elements or conductor tracks, so that this carrier module as a whole can be connected to the card body, for example by means of an adhesive.

[0009] Advantageously, by introducing a filler layer into the gaps on the first surface of the substrate layer, a flat surface can be created for the carrier module, onto which personalization data, patterns (so-called artwork), etc., can then be applied. This personalization data or patterns can be contained in the aforementioned design layer or applied in the form of the aforementioned design layer to the flat surface of the carrier module created by the filler layer. Gaps on the first surface of the substrate layer of the carrier module can arise, for example, from various electrical components, such as conductor tracks or antenna elements, extending across the first surface of the substrate layer. These components can, so to speak, form protrusions on the first surface of the substrate layer, which in turn create the gaps or depressions in the area of ​​the first surface.The filler layer can be used to fill or seal these gaps, creating a flat overall surface on the support module.

[0010] Another advantage resulting from the modular design of the carrier module is that, during a recycling process, the entire carrier module, including the contact interface, the electrical component and any security elements, can be separated from the card body of the card-shaped data carrier, so that the carrier module and the card body, which is often made of plastic, can be recycled separately.

[0011] The carrier layer is preferably designed as a carrier film. In particular, the carrier layer can be a thin and flexible plastic film. The contact interface and the electrical component can be attached to the carrier film, with these components extending onto the first surface of the carrier film and thus forming unevenness on the first surface, which can be filled and leveled with the filler layer to create a flat surface for the application of the design layer.

[0012] The contact interface can have electrical contacts or contact surfaces, or so-called ISO contacts, through which an electrical connection to an external device, in particular an external reading device such as a card reader, can be established. The contact interface can thus be designed for contact-based or wired communication with the external reading device. The contact interface can protrude at least partially from the first surface of the substrate. For example, the contact interface can be bonded to the substrate. Similarly, the contact interface can be provided as a metallization on the first surface of the substrate. The contact interface can thus cover the first partial area of ​​the first surface of the substrate.

[0013] The contact interface can be connected via conductors, so-called vias, to a safety element or a chip, which is also attached to the substrate. For example, the safety element or the chip is attached to a second surface of the substrate, which is opposite the first surface of the substrate.

[0014] The electrical component can comprise an electrical conductor or a conductive trace. For example, the electrical conductor or conductive trace can be part of an antenna element or an antenna. The electrical component can protrude at least partially from the first surface of the substrate. For example, the electrical component can be bonded to the substrate. Likewise, the electrical component can be provided as a metallization on the first surface of the substrate. The electrical component extends at least partially onto the first surface of the substrate. In this way, at least a portion of the electrical component can cover the second part of the first surface of the substrate.

[0015] It may be provided that the contact interface and / or the electrical component are at least partially embedded in the substrate. It may also be provided that at least a further part of the electrical component extends into the substrate or onto a second surface of the substrate that faces the first surface of the substrate. In particular, it may be provided that an antenna of the electrical component extends onto the second surface of the substrate.

[0016] The protruding parts or sections of the contact interface and the electrical component create the aforementioned gaps or depressions in the area of ​​the first surface, which complicate the application of the design layer. For this reason, the filler layer can be introduced into these gaps or depressions, thus providing a substantially flat outer surface for the application of the design layer. The filler layer can be a continuous film or a filler material in the form of a lacquer. It is preferred that the filler layer does not cover the contact interface but merely extends around it, leaving the contacts exposed. However, it is also possible for the filler layer to completely or partially cover the electrical component and not just be located in the gaps or depressions around it.In this case, at least part of the electrical component is located between the carrier layer and part of the filler layer.

[0017] According to one embodiment, the carrier layer is designed as an opaque or transparent carrier film.

[0018] In the case of a transparent or semi-transparent substrate, components or elements located beneath the substrate or on the card body of the card-shaped data carrier may remain visible. For example, conductors, antenna elements, or security features such as holograms, etc., positioned between the substrate module and the card body of the card-shaped data carrier, may be visible through the substrate module or substrate. In particular, personalization information printed on the surface of the card body may be visible through the substrate module.

[0019] In the case of an opaque design of the carrier layer, components or elements provided under the carrier layer or between the carrier module and the card body of the card-shaped data carrier can be hidden.

[0020] According to one embodiment, the electrical component is part of a contactless interface or forms a contactless interface.

[0021] For example, the contactless interface is designed for wireless communication with an external reading device. The contactless interface can include elements such as conductors or conductor tracks, which are partially arranged on the first surface and / or the second surface of the substrate layer.

[0022] These elements can also extend at least partially through the support structure or be embedded within it.

[0023] Since the carrier layer can thus have both the contact interface and the contactless interface, the foil-like carrier module can also be referred to as a so-called dual-interface carrier module or dual-interface foil.

[0024] In one example, the electrical component includes an antenna element which is arranged on the first surface of the support layer and / or embedded in the support layer.

[0025] The antenna element can have an electrical connection to a chip, which, as described above, can also be located on the substrate. In other words, all electrical or electronic components can be attached to the substrate, creating a modular structure that can be connected as a whole to any card body to provide a card-shaped data carrier. This facilitates both the manufacturing and recycling of the card-shaped data carrier.

[0026] According to one embodiment, at least part of the electrical component is embedded or pressed into the support layer, wherein the filler layer is further applied to at least part of the electrical component embedded in the support layer.

[0027] The filler layer can then span a continuous area that includes the first sub-area and the second sub-area of ​​the first surface.

[0028] For example, during the manufacturing of the carrier module, at least part of the electrical component can first be pressed or pressed into the first surface of the carrier layer, for instance, using a punch. The punch can be heated to soften the carrier layer material as the electrical component is pressed into it. The pressing of the electrical component in the second part of the first surface of the carrier layer can be such that the component is either completely pressed into the carrier layer or partially protrudes from the first surface. In either case, the electrical component can remain exposed at the first surface in the second part of the first surface. The filler layer can then be applied to this exposed portion of the electrical component.This means the filler layer can also be applied to the second sub-area of ​​the first surface, where at least part of the electrical component is located, so that the filler layer covers both the third sub-area of ​​the first surface of the substrate layer and exposed outer surfaces of at least part of the electrical component. The design layer can then be applied on top of the filler layer.

[0029] According to one embodiment, the first sub-region of the first surface of the support layer borders the third sub-region of the first surface of the support layer. Additionally or alternatively, the second sub-region of the first surface of the support layer borders the third sub-region of the first surface of the support layer.

[0030] The first, second and third sub-areas together can define the entire first surface of the carrier layer, with the contact interface covering the first sub-area, at least part of the electrical component covering the second sub-area, and the filler layer covering the third sub-area.

[0031] In other words, the filler layer can be applied to the first surface of the substrate layer wherever the contact interface and at least part of the electrical component are not located. Since the contact interface and at least part of the electrical component may protrude from or stand away from the substrate layer, the filler layer fills or levels the resulting gaps to create a flat overall outer surface.

[0032] According to one embodiment, the filler layer is applied to the third sub-area of ​​the first surface of the carrier layer such that an outer surface of the filler layer is substantially aligned with an outer surface of the contact interface. Alternatively or additionally, the filler layer is applied to the third sub-area of ​​the first surface of the carrier layer such that an outer surface of the filler layer is substantially aligned with an outer surface of at least one part of the electrical component.

[0033] In this way, a relatively flat or smooth outer surface of the carrier module can be provided, onto or into which personalization or a pattern can subsequently be applied using the design layer. Due to the aligned surface, the overall outer surface is essentially flat, which facilitates the application of the personalization or pattern in the form of the design layer.

[0034] According to one embodiment, the filler layer is applied to the third sub-area of ​​the first surface of the carrier layer in such a way that an outer surface of the filler layer, together with an outer surface of the contact interface and / or together with an outer surface of at least one part of the electrical component, forms a substantially flat overall outer surface. The design layer is applied to this overall outer surface.

[0035] It may be intended that the design layer is applied only to the filler layer and, if applicable, parts of the electrical component, and specifically not to the contact interface. This means that the design layer is not applied to the entire outer surface, but only to parts of the total outer surface formed by the filler layer and, if applicable, the outer surfaces of the electrical component.

[0036] It can also be provided that the filler layer additionally covers at least part of the electrical component, either partially or completely, and is thus also arranged over the second part of the first surface. In other words, the filler layer can then extend over the entire substrate layer, with the exception of the contact interface, so that the design layer is only arranged on top of the filler layer.

[0037] The design layer is preferably implemented as a printing layer or a print-accepting layer. It can be provided that the design layer, or parts thereof, are applied to the entire outer surface using a so-called drop-on-demand printing process. In this process, ink droplets can be applied to the entire outer surface of the substrate module as required by an inkjet.

[0038] The design layer can form a single, continuous layer or consist of separate layers. For example, the design layer can be in the form of separate strings, such as a sequence of letters or numbers. The design layer can be a pattern, a character, or something similar.

[0039] The design layer covers the filler layer, which is located in at least the third sub-region of the first surface, and the at least part of the electrical component, which extends in the second sub-region of the first surface. This can mean that, when viewed perpendicularly to the first surface of the substrate module, the design layer is positioned in front of the filler layer and the at least part of the electrical component. As described above, a portion of the filler layer can also be located between the design layer and the at least part of the electrical component, for example, if the at least part of the electrical component is pressed into the first surface of the substrate layer.

[0040] According to one embodiment, the carrier module comprises a personalization area arranged on the first surface of the carrier layer and having protruding elements, wherein an outer surface of the protruding elements is substantially aligned with an outer surface of the filler layer.

[0041] It is possible for the filler layer to partially or completely cover the protruding elements of the personalization area, and thus also be positioned over the personalization area of ​​the first surface. In other words, the filler layer then extends over the entire substrate layer, with the exception of the contact interface, so that the design layer is only located on top of the filler layer. The filler layer can be transparent or semi-transparent.

[0042] According to one embodiment, the filler layer comprises a lacquer layer.

[0043] This can be a UV-curable varnish. The varnish can be applied to those areas of the first surface of the substrate layer where the contact interface and at least part of the electrical component are not located, so that the gaps on the first surface are filled by the varnish. This creates a homogeneous overall outer surface onto which the design layer, including any personal data, can subsequently be printed.

[0044] According to one embodiment, the filler layer comprises a cover layer with a recess through which the contact interface extends at least partially.

[0045] The cover layer can be designed as a cover film. In particular, the cover layer can be a thin and flexible plastic film. The cover layer can be made of a flexible material so that it is pressed or conforms to the spaces formed by at least part of the electrical component on the first surface of the substrate layer. In this case, the cover layer can be designed to completely cover at least part of the electrical component and thus completely cover the second and third sections of the first surface of the substrate layer. The cover layer can be transparent or semi-transparent.

[0046] The recess can be provided in the form of a through-hole in the top layer. This allows the top layer to surround the contact interface, leaving any contact surfaces of the interface exposed.

[0047] According to one embodiment, the cover layer has an adhesive layer which is adapted to a contour of at least part of the electrical component.

[0048] The adhesive layer can comprise a pressure- and / or heat-activated adhesive. Before applying the cover layer or cover film, it can be coated on one side with the adhesive layer. When the cover layer or cover film is applied to the first surface of the substrate, the adhesive layer conforms to the contours formed by at least part of the electrical component on that surface. A flexible adhesive can be used for this purpose, allowing the adhesive to compensate for any irregularities on the electrical component and create a flat outer surface. The design layer, including any personal data, can then be applied to this flat outer surface.

[0049] The design layer can be applied to the flat outer surface using a printing process, and can be applied to the entire surface or only to specific areas of the outer surface created by the filler layer. The design layer can, in particular, contain a pattern or personal information.

[0050] According to one aspect, a card-shaped data carrier is provided. The card-shaped data carrier comprises a card body and the carrier module according to the invention as described herein. The carrier module is connected or bonded to the card body by means of an adhesive.

[0051] Advantageously, the card body and the carrier module according to the invention can be manufactured separately and only joined together after their separate production. The card body can have several layers or strata, which are joined together, for example, in a lamination process.

[0052] The card body and the associated carrier module or carrier layer can have a total thickness of up to 840 µm. In other words, the card-shaped data carrier can have a total thickness of up to 840 µm.

[0053] According to one embodiment, the adhesion promoter comprises a UV-activated adhesive system, a heat-activated adhesive system and / or a pressure-activated adhesive system.

[0054] According to one example, the card-shaped data carrier described herein according to the invention can be used as an identification document, identity document, chip card, or payment card. The card-shaped data carrier can, for example, be a dual-interface (DI) chip card, a smart card, a personal identification card, or a payment card such as a credit card or a debit card.

[0055] The card body may have a personalization area with a pattern or the like, onto which the carrier module is applied, wherein the information contained in the personalization area is recognizable through the carrier layer, for example by a suitable transparency of the carrier layer.

[0056] According to one aspect, a method for manufacturing a card-shaped data carrier, such as the previously described card-shaped data carrier, is provided. In one step of the method, a card body is provided. In a further step, a substrate layer is provided. In a further step, a contact interface is applied to a first surface of the substrate layer, such that the contact interface extends over a first sub-area of ​​the first surface.

[0057] In a further step, an electrical component is attached to the substrate layer, such that at least part of the electrical component extends over a second sub-area of ​​the first surface. In a further step, a filler layer is applied to at least a third sub-area of ​​the first surface. In a further step, a design layer is applied to the filler layer and at least part of the electrical component, such that the design layer at least partially covers the filler layer and the electrical component. In a further step, the substrate layer is bonded to the card body.

[0058] The methods according to the invention reduce the complexity and thus also the costs of manufacturing a card-shaped data carrier. In particular, the carrier module can be provided as a prefabricated unit, i.e., as a dual-interface module, which already has the contact interface and the contactless interface, in order to be easily connected to any card body.

[0059] According to one embodiment, the method further comprises a step of providing the card body by unwinding the card body from a first roll, a step of providing the backing layer by unwinding the backing layer from a second roll, and a step of connecting the backing layer to the card body by gluing the backing layer to the card body.

[0060] According to an example, a method for recycling a card-shaped data carrier is provided, for example the card-shaped data carrier according to the invention described above, wherein the method comprises a step of providing the card-shaped data carrier according to the invention and a step of detaching the carrier layer from the card body, while the contact interface and the electrical component remain connected to the carrier layer.

[0061] Exemplary embodiments of the invention are explained in more detail below with reference to schematic drawings.

[0062] This shows: Fig. 1 A side view of a carrier module for a card-shaped data carrier. Fig. 2 a top view of the support module of Fig. 1. Fig. 3 a side view of a card-shaped data carrier with the carrier module of Fig. 1. Fig. 4 A side view of a card-shaped data carrier with a carrier module comprising a cover layer. Fig. 5 A side view of a card-shaped data carrier with a carrier module comprising a lacquer layer. Fig. 6 another top view of the support module of Fig. 1. Fig. 7. A flowchart for a process for manufacturing a card-shaped data carrier. Fig. 8 a roller device for producing a card-shaped data carrier.

[0063] In the figures, identical or functionally equivalent elements are given the same reference symbols.

[0064] Fig. Figure 1 shows a side view of a carrier module 10 for a card-shaped data carrier 1, as used, for example, in the Fig. 3, Fig. 4 to Fig. Figure 5 is shown. The support module 10 has a support layer 11, which is preferably designed as an opaque or transparent film.

[0065] The carrier module 10 further comprises a contact interface 20, which is attached to a first surface 12 of the carrier layer 11 and extends over a first sub-area 13 of the first surface 12. The contact interface 20 can, in particular, have metallic contact surfaces, which are also referred to as ISO contacts and extend over the entire area within the first sub-area 13 of the first surface 12 and thus cover the first sub-area 13.

[0066] The carrier module 10 further comprises an electrical component 30 attached to the carrier layer 11, wherein at least a part of the electrical component 30, for example conductor tracks or antenna elements, extends over a second sub-area 14 of the first surface 12 of the carrier layer 11. The electrical component 30 may include metallic elements that also extend planarly within the second sub-area 14 of the first surface 12 and thus cover the second sub-area 14. In a third in Fig. 1. A filler layer may be provided in the unmarked sub-area of ​​the first surface 12 of the support layer 11, as will be explained in more detail below.

[0067] In Fig. Figure 2 is a top view of the support module 10 of Fig. 1. shown, where the individual areas 13, 14 and 15 of the first surface 12 can be seen.

[0068] In particular, the boundaries of the three areas 13, 14 and 15 are shown by dashed lines. The area in which the contact interface 20 is located forms the first sub-area 13 of the first surface 12 of the support layer 11 (see figure). Fig. 1) The area in which at least part of the electrical component 30 is located forms the second sub-area 14 of the first surface 12 of the support layer 11 (see also Fig. 1) The remaining portion of the first surface 12 of the support layer 11 can define the third portion 15, which is located adjacent to the first portion 13 and the second portion 14. The portions 13, 14, and 15 are adjacent to each other and together can form the entire first surface 12 of the support layer 11.

[0069] With reference to Fig. Figure 1 further shows an electronic component in the form of a chip 21, which is located on, or attached to, a second surface 16 of the support layer 11. The second surface 16 is arranged opposite the first surface 12 of the support layer 11. The chip 21 is communicatively coupled to the contact interface 20 via electrical conductors 22, so-called vias 22.

[0070] The electrical component 30 can be part of a contactless interface. For example, the electrical component 30 can comprise an antenna element arranged on the first surface 12 of the support layer 11, as shown in Fig. Figure 1 shows that the antenna element can also be arranged on the second surface 16 of the support layer 11, with only other parts of the electrical component 30 extending onto the first surface 12. In the figure shown Fig. In the case shown in Figure 1, the antenna element and / or corresponding conductor tracks of the antenna element are provided on the first surface 12 of the support layer 11, with these parts of the electrical component 30 covering the second sub-area 14 of the first surface 12.

[0071] In Fig. Figure 1 shows that the contact interface 20 and at least part of the electrical component 30 protrude from the first surface 12 of the support layer 11, as they are, for example, attached to the first surface 12 of the support layer 11. The upper side of the support module 10 thus still exhibits irregularities in the form of gaps or depressions located between the first sub-area 13 and the second sub-area 14. As will be explained in more detail below, these irregularities can be smoothed out by a filler layer to create a flat top surface of the support module 10.

[0072] Fig. Figure 3 shows a side view of a card-shaped data carrier 1 with the carrier module 10 of Fig. 1. In particular, the carrier module 10 is connected to an outer surface of a card body 60, for example by adhesive bonding. The carrier module 10 can be connected to the card body 60 by means of an adhesion promoter 70, wherein the adhesion promoter 70 can be a UV-activated adhesive system, a heat-activated adhesive system, and / or a pressure-activated adhesive system. In the Fig. In the case shown in 3, the chip 21 extends partially into the card body 60, which may have a specially provided recess for this purpose.

[0073] Fig. Figure 4 shows a side view of a card-shaped data carrier 1 with a carrier module comprising a cover layer 42. The carrier module is, for example, the one related to the Fig. 1, Fig. 2 to Fig. 3 described carrier module 10, so that in this respect reference is made to the Fig. 1, Fig. 2 to Fig. 3 was referred to.

[0074] The top layer 42 can represent a filler layer 40, which is applied to the third sub-area 15 (see also Fig. 2) can be applied to the first surface 12 of the carrier layer 11. It thus fills the gaps on the first surface 12 of the carrier layer 11 that are located between the contact interface 20 and at least part of the electrical component 30. It is understood that the Fig. Figure 4 represents a state in which the cover layer 42 has not yet been applied to the third sub-area 15 of the first surface 12, but is still separate from the carrier layer 11. If the cover layer 42 is now applied downwards (arrow 45) to the carrier layer 11, the gaps located in the third sub-area 15 are closed. The cover layer 42 has a recess 43 through which the contact interface 20 extends at least partially after the cover layer 42 has been applied to the third sub-area 15 of the first surface 12 of the carrier layer 11.

[0075] The cover layer 42 can have a flexible adhesive layer that is adaptable to the contour of at least part of the electrical component 30. This means that when the cover layer 42 is applied to the substrate 11, the flexible adhesive layer of the cover layer 42 can deform in such a way that the underside of the cover layer 42 conforms to the protrusions or projections of the electrical component 30, while the top surface of the cover layer 42 remains essentially flat or smooth. The cover layer 42 can then extend over the second sub-area 14, that is, over at least part of the electrical component 30, as well as over the third sub-area 15.

[0076] The cover layer 42 can be applied to the third sub-area 15 of the first surface 12 of the carrier layer 11 in such a way that the flat outer surface 44 of the cover layer 42 is substantially aligned with an outer surface 23 of the contact interface 20, so that the outer surface 44 of the cover layer 42 and the outer surface 23 of the contact interface 20 form a substantially flat outer surface of the carrier module 10. The electrical component 30 can be covered by the cover layer 42.

[0077] In another example, the cover layer 42 can be applied to the third sub-area 15 of the first surface 12 of the support layer 11 such that the flat outer surface 44 of the cover layer 42 is substantially aligned with an outer surface 34 of at least part of the electrical component 30, so that the outer surface 44 of the cover layer 42 and the outer surface 34 of at least part of the electrical component 30 form a substantially flat outer surface of the support module 10. The at least part of the electrical component 30 is not completely or at all covered by the cover layer 42, with the most protruding parts of the electrical component 30 forming the outer surface 34 of the electrical component 30 and being exposed to the outside.

[0078] In any case, the above-described structure of the carrier module provides a flat overall outer surface onto which a further layer, for example a design layer 50 in the form of a printed layer, can be applied. The design layer 50 thus covers the top layer 42 and, if applicable, any exposed outer surface 34 of the electrical component 30, whereby the contact interface 30 is specifically not covered by the design layer 50.

[0079] Fig. Figure 5 shows a side view of a card-shaped data carrier 1 with a carrier module comprising a lacquer layer and thus a Fig. 4. Alternative embodiment. The support module is, for example, the one relating to the Fig. 1, Fig. 2 to Fig. 3 described carrier module 10, so that in this respect reference is made to the Fig. 1, Fig. 2 to Fig. 3 was referred to.

[0080] The lacquer layer 41 can be a filler layer 40, which is applied to the third sub-area 15 (see also Fig. 2) can be applied to the first surface 12 of the carrier layer 11. It thus fills the gaps on the first surface 12 of the carrier layer 11 that are located between the contact interface 20 and at least part of the electrical component 30. It is understood that the Fig. 5 represents a state in which the lacquer layer 41 has already been applied to the third sub-area 15 of the first surface 12.

[0081] The lacquer layer 41 can only be applied in the third sub-area 15 of the first surface 12 and not in the first sub-area 13, in which the contact interface 20 is located and / or not in the second sub-area 14, in which at least part of the electrical component 30 is located.

[0082] The lacquer layer 41 can be applied to the third sub-area 15 of the first surface 12 of the carrier layer 11 such that the outer surface 44 of the lacquer layer 41 is substantially aligned with an outer surface 23 of the contact interface 20, so that the outer surface 44 of the lacquer layer 41 and the outer surface 23 of the contact interface 20 form a substantially flat outer surface of the carrier module 10. The electrical component 30 can extend partially through the lacquer layer 41 or be completely covered by the lacquer layer 41.

[0083] In the event that the lacquer layer 41 does not completely cover at least part of the electrical component 30, the parts of the electrical component 30 that protrude furthest from the first surface 12 form the outer surface 34 of the electrical component 30 and are exposed to the outside. The outer surface 44 of the lacquer layer 41 and the outer surface 34 of the electrical component 30 together form a flat outer surface.

[0084] In any case, the above-described structure of the carrier module 10 provides a flat overall outer surface onto which a further layer, for example a design layer 50 in the form of a printed layer, can be applied. The design layer 50 thus covers the lacquer layer 41 and, if applicable, the still exposed outer surface 34 of at least part of the electrical component 30, whereby the contact interface 30 is specifically not covered by the design layer 50.

[0085] Fig. Figure 6 shows another top view of the support module 10 of Fig. 1. In this embodiment, the carrier module 10 has a personalization area 80, which is arranged on the first surface 12 of the carrier layer 11 and has projecting elements 81 (represented here by the word "SAMPLE"). An outer surface of the projecting elements 81 can extend so far from the first surface 12 of the carrier layer 11 that it abuts an outer surface 44 of the cover layer 42 (see Figure 1). Fig. 4) or an outer surface 44 of the paint layer 41 (see Fig. 5) is substantially aligned. It may be provided that the foregoing elements 81 extend through the design layer 50 or are recognizable through design layer 50 (in Fig. (6 not shown). The design layer 50, for example, can be at least partially transparent.

[0086] Fig. Figure 7 shows a flowchart for a process for manufacturing a card-shaped data carrier, for example, for manufacturing the one related to the Fig. 3, Fig. 4 to Fig. 5. Card-shaped data carrier as depicted. 1. In step S10, a card body 60 is provided. In a further step S20, a carrier layer 11 is provided. In a further step S30, a contact interface 20 is applied to a first surface 12 of the carrier layer 11, such that the contact interface 20 extends over a first sub-area 13 of the first surface 12. In a further step S40, an electrical component 30 is applied to the carrier layer 11, such that at least a part of the electrical component 30 extends over a second sub-area 14 of the first surface 12. In a further step S50, a filler layer 40 is applied to at least a third sub-area 15 of the first surface 12.In a further step S60, a design layer 50 is applied to the filler layer 40 and at least part of the electrical component 30, such that the design layer 50 at least partially covers the filler layer 40 and the electrical component 30. In a further step S70, the carrier layer 11 is bonded to the card body 60.

[0087] The provision of the card body 60 can be carried out in sub-step S11 by unwinding the card body from a first roll 110. The provision of the backing layer 11 can be carried out in sub-step S21 by unwinding the backing layer 11 from a second roll 120. The joining of the backing layer 11 to the card body 60 can be carried out in sub-step S71 by gluing the backing layer 11 to the card body 60.

[0088] Fig. Figure 8 shows a roller device 100 for producing a card-shaped data carrier, for example for producing the data relating to the Fig. 3, Fig. 4 to Fig. Figure 5 shows a card-shaped data carrier. 1. The roller device 10 has a first roller 110 on which a tape with several card bodies 60 arranged one behind the other is wound. The roller device 10 also has a second roller 120 on which the carrier layer 11 is wound. The contact interface 20 and / or the electrical component 30 can already be present on the carrier layer 11 when it is wound on, or they can be applied to the carrier layer 11 only after the carrier layer 11 has been unwound from the second roller 120 and before the carrier layer 11 is joined with the card body 60.

[0089] After the carrier layer 11 and the card body 60 are unwound, they are brought together and bonded. Each card body 60 of the unwound strip can be brought together with a corresponding section of the unwound carrier layer 11, on which the contact interface 20 and the electrical component 30 are provided, so that the card body can be bonded to the carrier layer 11. The bonding of the individual layers can be achieved using heat-activated or UV-activated adhesive systems. The adhesives can be applied to the carrier layer 11 and / or the card body 60 before unwinding. Alternatively, an adhesive dispensing system is located between the carrier layer 11 and the card body 60, where the adhesive can be applied.

[0090] To apply the carrier layer 11 or the finished carrier module 10 to the card body 60, the carrier layer 11 can alternatively be applied to a sheet in which a card body 60 is already predefined or precut. This can be a plastic sheet containing several predefined card bodies 60, each connected to a corresponding carrier module 10. The entire card-shaped data carrier 1 can then be cut out of the sheet.

Claims

[1] Carrier module (10) for a card-shaped data carrier (1), comprising: a support position (11); a contact interface (20) which is attached to a first surface (12) of the support layer (11) and extends over a first sub-area (13) of the first surface (12); an electrical component (30) attached to the support layer (11), wherein at least a part of the electrical component (30) extends over a second sub-area (14) of the first surface (12); a filler layer (40) which is applied to at least a third sub-area (15) of the first surface (12); a design layer (50) which at least partially covers the filler layer (40) and the electrical component (30). [2] Carrier module (10) according to claim 1, wherein the carrier layer (11) is designed as an opaque or transparent carrier film. [3] Carrier module (10) according to one of the preceding claims, wherein the electrical component (30) is part of a contactless interface or forms a contactless interface. [4] Carrier module (10) according to any of the preceding claims, wherein at least part of the electrical component (30) is embedded or pressed into the support position (11); wherein the filler layer (40) is further applied to at least part of the electrical component (30) embedded in the support layer (11). [5] Carrier module (10) according to any of the preceding claims, wherein the first sub-area (13) of the first surface (12) adjoins the third sub-area (15) of the first surface (12); and / or wherein the second sub-area (14) of the first surface (12) borders the third sub-area (15) of the first surface (12). [6] Carrier module (10) according to any of the preceding claims, wherein the filler layer (40) is applied to the third sub-area (15) of the first surface (12) of the carrier layer (11) such that an outer surface (44) of the filler layer (40) is substantially aligned with an outer surface (23) of the contact interface (20); and / or wherein the filler layer (40) is applied to the third sub-area (15) of the first surface (12) of the support layer (11) such that an outer surface (44) of the filler layer (40) is substantially aligned with an outer surface (34) of at least a part of the electrical component (30). [7] Carrier module (10) according to any of the preceding claims, wherein the filler layer (40) is applied to the third sub-area (15) of the first surface (12) of the support layer (11) such that an outer surface (44) of the filler layer (40) together with an outer surface (23) of the contact interface (20) and / or together with an outer surface (34) of at least one part of the electrical component (30) forms a substantially planar overall outer surface; wherein the design layer (50) is applied to the entire outer surface. [8] Carrier module (10) according to any of the preceding claims, comprising: a personalization area (80) which is arranged on the first surface (12) of the support layer (11) and has protruding elements (81); wherein an outer surface of the foregoing elements (81) is substantially aligned with an outer surface (44) of the fill layer (40). [9] Carrier module (10) according to any one of the preceding claims: wherein the filler layer (40) comprises a lacquer layer (41). [10] Carrier module (10) according to one of the preceding claims, wherein the filler layer (40) comprises a cover layer (42) with a recess (43) through which the contact interface (20) extends at least partially. [11] Carrier module (10) according to claim 10, wherein the cover layer (42) has an adhesive layer which is adapted to a contour of at least a part of the electrical component (30). [12] Card-shaped data carrier (1), comprising: a card body (60); a carrier module (10) according to one of the preceding claims; wherein the carrier module (10) is connected to the card body (60) by means of an adhesive intermediary (70). [13] Card-shaped data carrier according to claim 12, wherein the adhesive agent (70) comprises a UV-activated adhesive system, a heat-activated adhesive system and / or a pressure-activated adhesive system. [14] Method for producing a card-shaped data carrier (1), comprising: Providing a map body (60, p. 10); Providing a support layer (11, S20); Attaching a contact interface (20) to a first surface (12) of the carrier layer (11) such that the contact interface (20) extends over a first sub-area (13) of the first surface (12) (S30); Attaching an electrical component (30) to the support layer (11) such that at least part of the electrical component (30) extends over a second sub-area (14) of the first surface (12) (S40); Applying a filler layer (40) to at least a third sub-area (15) of the first surface (12, S50); Applying a design layer (50) to the filler layer (40) and at least part of the electrical component (30), such that the design layer (50) at least partially covers the filler layer (40) and the electrical component (30) (S60); Connecting the carrier layer (11) to the map body (60, S70). [15] Method according to claim 14, Providing the card body (60) by unwinding the card body from a first roll (110, S11); Providing the carrier position (11) by unwinding the carrier position (11) from a second roll (120, S21); Connecting the carrier layer (11) to the card body (60) by gluing the carrier layer (11) to the card body (60, S71).

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