Substrate arrangement for connection to an electronic component

Description

[0001] The present invention relates to a substrate arrangement for connection with an electronic component. Furthermore, the present invention relates to a method for manufacturing a substrate arrangement and a method for connecting at least one electronic component to a substrate arrangement.

[0002] In power electronics, it is common practice to provide substrates with a pre-applied contacting layer, such as a pre-dried sintering paste. In a higher manufacturing stage, the substrates are attached to electronic components, such as power transistors, and then sintered. It has been found that attaching the substrates with the pre-applied sintered layer, with or without simultaneous heat application, results in insufficient transport strength, as the adhesion between the substrate and the electronic component is inadequate to ensure reliable transport from the assembly point to the sintering point.

[0003] To prevent the substrate from slipping on the electronic component during transport from the assembly site to the sintering site, it is known in the art to fix the substrate to the electronic component using a pre-fixing agent. This agent is applied to a side of the contact layer facing away from the substrate and / or to the substrate on the same side as the contact layer. For example, WO 2017 / 060140 A2 describes the application of such a pre-fixing agent to prevent slippage during transport. The described pre-fixing agent comprises at least one organic compound, such as a solvent and / or a polymer, to achieve good fixation to the electronic component.

[0004] US 2015 / 0270207 A1 relates to a semiconductor module package and a method for manufacturing it. The semiconductor module package includes a lead frame mounted on the semiconductor device and having openings through which solder paste can be injected for contacting.

[0005] US 2006 / 0197200 A1 (see Fig. 23) describes a method for connecting an electronic component to a substrate provided with through-holes using various connecting materials.

[0006] Even though such a pre-fixing agent can essentially prevent the substrate from slipping relative to the electronic component, a disadvantage of the known prior art is that portions or residues of the pre-fixing agent can negatively affect the sintered bond after sintering by reducing its durability and / or lifespan. Furthermore, portions or residues of the pre-fixing agent that leak laterally between the substrate and the electronic component can contaminate the opposite side of the substrate, which is often used for contact, for example, via at least one bond wire, thus reducing the available contact area and / or impairing the quality of the bond. The leaking residues can also contaminate adjacent areas on the electronic component and, in the worst case, destroy the component.

[0007] The object of the present invention is therefore to provide an improved substrate arrangement for connection with an electronic component, a method for manufacturing a substrate arrangement and a method for connecting an electronic component with a substrate arrangement.

[0008] This problem is solved according to the invention with regard to the improved substrate arrangement by a substrate arrangement according to the subject matter of claim 1. The substrate arrangement according to the invention for connection with an electronic component comprises: at least a substrate with a first side and a second side opposite the first side; at least a contacting agent layer arranged at least sectionally on the first side of the substrate; and at least a pre-fixing agent arranged at least sectionally on a side of the contacting agent layer facing away from the substrate and / or at least sectionally on the first side of the substrate, wherein the substrate has at least one through-hole with a first opening and a second opening from the first side to the opposite second side, and wherein the pre-fixing agent is a pre-fixing agent composition comprising the following components: 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents, 3 to 100 wt.%.-% of at least one material M melting in the range of 30 to 180°C selected from the group consisting of (i) organic compounds melting in the range of 30 to 180°C, (ii) mixtures of organic substances melting in the range of 30 to 180°C, and (iii) organic polymers, 0 to 20 wt.% of at least one organic free additive other than the at least one material M melting in the range of 30 to 180°C, and 0 to 30 wt.% of one or more inorganic solid fillers, wherein the wt.% add up to 100 wt.%.

[0009] In this context, the term "electronic component" can be used to refer to an electronic or electrical component. The term "electronic component" can therefore include components used in power electronics, such as a power transistor. In one example, the substrate arrangement according to the invention can be used with the electronic component. In another example of the invention, the substrate arrangement according to the invention can include the electronic component.

[0010] The term "contacting medium layer" can be used to describe a layer that includes at least one contacting material, such as a sintered material, which may include a sintering paste, solder, conductive adhesive, or other adhesive to permanently and reliably bond the substrate to the electronic component. Depending on the contacting material used, a temperature and / or pressure treatment, such as a sintering process, may be necessary to create the final connection. The contacting medium layer can be applied to the entire surface or in sections to the first side of the substrate and can have a thickness of 5–500 µm.

[0011] The pre-fixing agent serves to pre-fix or temporarily adhere the substrate to the electronic component, or vice versa. This pre-fixing or adhesion ensures sufficient transportability of the component from the assembly point to the processing location, as well as during the processing itself, such as sintering. In this context, "pre-fixing agent" refers to a temporary or removable fixing agent that enables at least temporary fixation of a substrate assembly or a substrate to an electronic component. The pre-fixing agent can, for example, comprise an organic compound such as a solvent or a polymer to facilitate adhesion.

[0012] The pre-fixing agent is applied from a pre-fixing agent composition. This pre-fixing agent composition contains the following components: 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents, 3 to 100 wt.% of at least one material M melting in the range of 30 to 180°C selected from the group consisting of (i) organic compounds melting in the range of 30 to 180°C, (ii) mixtures of organic substances melting in the range of 30 to 180°C and (iii) organic polymers, 0 to 20 wt.% of at least one organic free additive other than the at least one material M melting in the range of 30 to 180°C, and 0 to 30 wt.% of one or more inorganic solid fillers, wherein the wt.% may add up to 100 wt.%.

[0013] The terms "organic compound", "organic substance", "organic polymer" and "organic additive" used herein may also include substances with organic and inorganic components; only purely inorganic substances are not included by these terms.

[0014] Depending on its content of 0 to 97 wt% of at least one solvent selected from the group consisting of water and organic solvents, the prefixing agent composition from which the prefixing agent is applied may be solvent-free, aqueous organic solvent-free, aqueous organic solvent-containing, or non-aqueous organic solvent-containing.

[0015] Examples of solvent-free pre-fixing compositions include solid to sticky pre-fixing compositions, for example, in the form of film, strand, powder, drops, hot melt material, oily or resinous material. Depending on the consistency of the solvent-free pre-fixing composition in question, a person skilled in the art will select a suitable application method.

[0016] Examples of aqueous fixative compositions include aqueous prefixative compositions free of organic solvents or containing aqueous organic solvents. These can be solutions, suspensions, or dispersions whose rheological behavior can range from liquid to pasty. Accordingly, aqueous prefixative compositions can be applied in various ways, for example, by jetting, dispensing, spraying, brushing, dabbing, dipping, or printing, followed by drying to largely, or preferably completely, remove the water and any organic solvent that may be present.

[0017] Non-aqueous pre-fixing compositions containing organic solvents can be solutions, suspensions, or dispersions, with a rheological behavior ranging from liquid to pasty. Accordingly, these compositions can be applied in various ways, such as by jetting, dispensing, spraying, brushing, dabbing, dipping, or printing, followed by drying to achieve extensive or, preferably, complete removal of the organic solvent.

[0018] Preferably, the material M melting in the range of 30 to 180°C is an organic polymer, in particular a semi-synthetic or fully synthetic organic polymer.

[0019] Preferred examples of organic compounds that melt in the range of 30 to 180°C are lactams such as laurinlactam; and fatty alcohols such as 1-dodecanol (lauryl alcohol), 1-tetradecanol (myristyl alcohol), 1-hexadecanol (cetyl alcohol), 1-heptadecanol (margaryl alcohol), 1-octadecanol (stearyl alcohol), 1-eicosanol (arachidyl alcohol), 1-docosanol (behenyl alcohol), 1-tetracosanol (lignoceryl alcohol), 1-hexacosanol (ceryl alcohol), 1-octacosanol (montanyl alcohol), 1-triacontanol (melissyl alcohol).

[0020] Preferred examples of mixtures of organic substances that melt in the range of 30 to 180°C are corresponding oils, fats, waxes, for example natural waxes such as beeswax, paraffin waxes and petroleum jelly.

[0021] Examples of organic polymers, besides the preferred thermoplastics, include thermosetting polymers. There are no material restrictions for the organic polymer(s). They can be, for example, vinyl copolymers, (meth)acrylic copolymers, polyesters, polyurethanes, polymer precursors of such polymers, and / or cellulose derivatives such as cellulose ethers and esters. (Meth)acrylic copolymers and cellulose derivatives such as methylcellulose or ethylcellulose are particularly preferred.

[0022] The term "organic polymers" used herein also includes organic oligomers. The organic polymers have a weight-average molar mass (Mw), for example, in the range of 1000 to 300,000, determinable by GPC (gel permeation chromatography, polystyrene standards, polystyrene gel as stationary phase, tetrahydrofuran as mobile phase).

[0023] The pre-fixing agent composition may contain 0 to 20 wt% of at least one organic free additive from at least one material M melting in the range of 30 to 180°C, for example hardeners, wetting additives, rheology additives, catalysts, photoinitiators.

[0024] The pre-fixing agent composition can contain 0 to 30 wt% of one or more inorganic solid fillers. Examples of inorganic solid fillers are silicon dioxide and aluminum oxide.

[0025] Prefix applied from a prefix composition may differ qualitatively and / or quantitatively in its composition from that of the prefix composition itself. This can be a consequence, for example, of its application and / or of solvent removal, drying, and / or thermal and / or photochemical treatment carried out during its application. In the case of a prefix applied from a solvent-containing prefix composition, its solvent content is reduced by >50 to 100 wt.%, preferably by >80 to 100 wt.%, relative to that of the prefix composition. In other words, compared to the solvent-containing prefix composition, more than half, preferably more than 80 wt.%, of the solvent originally contained in the solvent-containing prefix composition has been removed from the applied prefix.

[0026] According to the invention, the substrate has at least one through-opening with a first opening and a second opening extending from the first side to the opposite second side. The term "through-opening" can be understood as a recess in the substrate material that extends from the first opening on one side of the substrate to the second opening on the other side of the substrate. The openings can have different sizes and geometries. Preferably, the substrate has several through-openings. For example, a number of through-openings can correspond to a number of pre-fixation centers.

[0027] The passage opening(s) and their openings can be designed, for example, cylindrical, round, rectangular, oval, elliptical or rectangular with rounded corners.

[0028] The invention is thus based on the surprising finding that components or residues of the pre-fixing agent liquefy during a temperature and / or pressure treatment, such as a sintering process, and can be selectively drawn into the through-hole by capillary action, thereby preventing uncontrolled leakage of these components or residues. These components or residues of the pre-fixing agent can, for example, consist of material M and / or other organic additives different from material M.

[0029] The invention provides, for the first time, a solution that prevents the uncontrolled release of organic pre-fixing agents, or portions or residues thereof, during temperature and / or pressure treatment for the permanent bonding of the substrate to the electronic component, particularly when using organic pre-fixing agents. The portions or residues of the pre-fixing agent, which typically transition into a liquid phase during temperature and / or pressure treatment, can be absorbed into the through-hole and thus spatially contained. This prevents or minimizes interference with functional areas, such as on the electronic component or within the contact layer's bonding area.

[0030] In one example, the substrate has a multitude of openings from the first side to the opposite second side; preferably, the substrate has openings at an edge area of ​​the substrate.

[0031] As previously described, the through-holes can have different sizes and geometries. Depending on the specific application and the amount of pre-fixing agent used, the length of the through-hole(s) can be selected so that a defined quantity of the liquefiable components or residues of the pre-fixing agent are absorbed into the through-holes during temperature and / or pressure treatment. The width can be chosen to be small enough to generate the necessary capillary force to draw the components or residues of the pre-fixing agent upwards against the force of gravity.

[0032] Advantageously, arranging the through-holes at the edge of the substrate offers efficient protection against leakage of the pre-fixing agent. For example, several elongated through-holes can run essentially parallel to the edge of the substrate and be arranged one behind the other to further increase protection against leakage of the pre-fixing agent during temperature and / or pressure treatment.

[0033] In another example, the first opening of the through-hole or through-holes on the first side of the substrate is at least partially located on the pre-fixing agent, and / or is in contact with the pre-fixing agent, and / or is at least partially located on an area of ​​the first side of the substrate which is at least partially neither covered by the pre-fixing agent nor by the contacting agent layer.

[0034] The term "arranged in certain areas on the pre-fixing agent" can be understood as the arrangement of the pre-fixing agent on and / or at the first opening of the through-hole. For example, the pre-fixing agent can be arranged on / in the first opening, such as printed on it. Advantageously, this allows a predefined quantity of pre-fixing agent to be arranged to enable sufficient pre-fixation or adhesion during transport of the substrate assembly to the electronic component. Furthermore, during temperature and / or pressure treatment, the pre-fixing agent can be immediately absorbed into the through-hole without contaminating other areas of the substrate and / or the electronic component and / or impairing the contacting agent layer connection.

[0035] The term "is in contact with the pre-fixing agent" can be understood as "being related to" the first opening, which may be directly or indirectly related to the pre-fixing agent. For example, there may be an air gap between the first opening and the pre-fixing agent, and / or portions of the contacting agent layer may be present between the first opening and the pre-fixing agent.

[0036] In one example, the geometry of the through-opening is essentially constant over the course from the first opening to the second opening, or the geometry of the through-opening is designed to decrease in size over the course from the first opening to the second opening, in particular to decrease gradually, or to decrease stepwise.

[0037] Advantageously, a decreasing or tapered opening from the first opening to the second opening provides sufficient volume to accommodate a defined quantity of the liquefied components or residues of the pre-fixing agent during temperature and / or pressure treatment, while the second side of the substrate is almost completely closed. In this example, the second opening is only large enough to allow a capillary effect, and the majority or residue of the liquid pre-fixing agent is collected in the resulting cavity-like recess in the substrate material.

[0038] In another example, the through-hole is essentially rectangular and has a width of 10-100 µm, preferably 20-70 µm, and / or the volume of the through-hole is at least 5% of the volume of the pre-fixing agent.

[0039] In this context, the term "rectangular" can also be understood as "slit-shaped". Particularly good results can be achieved with a narrow but correspondingly long slit as a through-opening, which expands within the substrate material and into which the liquid pre-fixing agent can be quickly absorbed.

[0040] Surprisingly, it has been found that the volume of the through-hole(s) should essentially only be 5% to 80% of the volume of the pre-fixing agent in order to be able to absorb the liquefiing portions or residues of the pre-fixing agent essentially completely, since a considerable portion of the pre-fixing agent evaporates and / or otherwise volatilizes.

[0041] In another example, the contacting agent layer comprises metal particles, in particular silver particles, and the pre-fixing agent comprises at least one organic component, in particular at least one solvent and / or at least one polymer.

[0042] Furthermore, the contacting material of the contacting layer can comprise binders and / or fatty acids. The binders can be, in particular, polymers such as cellulose derivatives, for example, methylcellulose, ethylcellulose, ethylmethylcellulose, carboxycellulose, and hydroxypropylcellulose. The fatty acids can be, in particular, caprylic acid (octanoic acid), capric acid (decanoic acid), lauric acid (dodecanoic acid), myristic acid (tetradecanoic acid), palmitic acid (hexadecanoic acid), margaric acid (heptadecanoic acid), stearic acid (octadecanoic acid), arachidic acid (eicosanoic acid / icosanoic acid), behenic acid (docosanoic acid), and lignoceric acid (tetracosanoic acid).

[0043] In another example, the contacting agent layer is arranged on a surface of the first side of the substrate and forms a contacting agent-free area, in particular an edge, on the first side of the substrate which is free of the contacting agent layer, and the pre-fixing agent is arranged at least section by section on the contacting agent-free area, in particular arranged in a point-like manner.

[0044] Advantageously, by arranging the pre-fixing agent at least sectionally around the contacting agent on the first side of the substrate, sufficient adhesion of the substrate to the electronic component for transport and a substantially impurity-free contacting agent layer, for example a sintered layer, can be achieved after temperature and / or pressure treatment.

[0045] In yet another example, the substrate comprises a metal sheet or metal strip section, in particular a copper sheet or a copper sheet section, or a leadframe or a DCB or PCB substrate, and / or the substrate is coated on the first and / or second side with a material comprising gold (Au), nickel-gold (NiAu), silver (Ag), nickel-silver (NiAg) and / or nickel-palladium-gold (NiPdAu), in particular electroplated or chemically deposited.

[0046] Advantageously, improved contacting of the contact, for example by means of a bond wire, can be achieved through appropriate coating and / or material selection of the substrate and arrangement of the substrate on the electronic component or on a contact of the electronic component.

[0047] The invention also proposes a method for manufacturing a substrate arrangement for connection with an electronic component, comprising the steps of: Providing at least one substrate with a first side and a second side opposite the first side, wherein the substrate has at least one through-hole with a first opening and a second opening from the first side to the opposite second side; applying at least one contacting agent layer at least sectionally to the first side of the substrate; and applying at least one pre-fixing agent composition at least sectionally to a side of the contacting agent layer facing away from the substrate and / or applying the pre-fixing agent composition at least sectionally to the first side of the substrate, wherein the pre-fixing agent is a pre-fixing agent composition and comprises the following components: 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents, 3 to 100 wt.% of the solvent.-% of at least one material M melting in the range of 30 to 180°C selected from the group consisting of (i) organic compounds melting in the range of 30 to 180°C, (ii) mixtures of organic substances melting in the range of 30 to 180°C, and (iii) organic polymers, 0 to 20 wt.% of at least one organic free additive other than the at least one material M melting in the range of 30 to 180°C, and 0 to 30 wt.% of one or more inorganic solid fillers, wherein the wt.% add up to 100 wt.%.

[0048] In one example, the provision of the substrate comprises: introducing at least one, preferably a plurality of, through-holes, in particular by etching, punching and / or a laser / water jet, from the first side of the substrate to the opposite second side of the substrate, preferably introducing the through-holes at an edge region of the substrate.

[0049] In another example, the first opening of the through-hole or through-holes on the first side of the substrate is at least partially located on the pre-fixing agent, and / or is in contact with the pre-fixing agent, and / or is at least partially located on an area of ​​the first side of the substrate which is at least partially neither covered by the pre-fixing agent nor by the contacting agent layer.

[0050] In another example, the geometry of the through-opening is essentially constant over the course from the first opening to the second opening, or the geometry of the through-opening is designed to decrease in size over the course from the first opening to the second opening, in particular to decrease gradually, or to decrease stepwise.

[0051] In yet another example, the through-hole is essentially rectangular and has a width of 10-100µm, preferably 20-70µm, and / or the volume of the through-hole is at least 5% of the volume of the pre-fixing agent.

[0052] Furthermore, the invention also proposes a method for connecting at least one electronic component with a substrate arrangement according to the invention and / or with a substrate arrangement produced according to the method according to the invention, comprising the steps of: Positioning the substrate arrangement on the electronic component with the first side facing the electronic component; pre-fixing the substrate arrangement on the electronic component by the pre-fixing agent on the first side of the substrate; and connecting the substrate arrangement to the at least one electronic component.

[0053] In one example, the joining process involves: sintering, pressing, soldering, and / or bonding the substrate assembly to the electronic component, whereby during the joining process, portions or residues of the pre-fixing agent are absorbed into the through-hole of the substrate and / or pass through the through-hole on the second side of the substrate.

[0054] Further features and advantages of the invention will become apparent from the following description, in which preferred embodiments of the invention are explained with reference to schematic drawings.

[0055] This shows: Figure 1 is a top view of a substrate arrangement known from the prior art connected with an electronic component; Figure 2 is a schematic sectional view of a substrate arrangement according to an embodiment of the invention connected with an electronic component, before sintering; and Figure 3a, 3b is a schematic sectional view and a detail view of a substrate arrangement according to an embodiment of the invention connected with an electronic component, after sintering.

[0056] In Figure 1 A top view of a substrate arrangement 1 known from the prior art, combined with an electronic component 5, is shown. Figure 1 The electronic component 5 is shown as a power semiconductor and the substrate arrangement 3 is arranged on a contact of the electronic component 5 to enable contacting of the contact by means of a bond wire.

[0057] On the first side of the substrate 3 (not shown), a contacting agent layer and a pre-fixing agent were applied before being connected to the electronic component 5 and sintered after being placed with the electronic component 5. The portions or residues of the pre-fixing agent 7 that liquefied due to the temperature and / or pressure treatment are distributed on the second side of the substrate 3 and on adjacent areas of the electronic component 5, as shown in the Figure 1This is indicated by discoloration. These components or residues of the pre-fixing agent 7 can negatively affect the sintered bond by reducing its durability and / or service life. Furthermore, the laterally oozing components or residues of the pre-fixing agent 7 contaminate the second side of the substrate 3, which is often used for contacting, for example, by means of at least one bond wire, thus reducing the available contact area and potentially impairing the quality of the bond. The components or residues of the pre-fixing agent 7 that ooze onto the adjacent areas of the electronic component 5 can also damage the electronic component 5.

[0058] Figure 2 Figure 1 shows a schematic sectional view of a substrate arrangement 10 according to an embodiment of the invention, which is connected to an electronic component 50, before sintering.

[0059] On the first side of the substrate 30, a contacting agent layer 90 and a pre-fixing agent 70 are arranged. In the embodiment shown, the pre-fixing agent 70 is arranged in a droplet shape at the edge region of the substrate 30, while the pre-fixing agent 70 is arranged towards the center of the substrate 30. In embodiments not shown, the pre-fixing agent 70 can also be surrounded by the contacting agent layer 90 or arranged on top of the contacting agent layer 90.

[0060] In the illustrated embodiment, there is a gap between the pre-fixing agent 70 and the contacting agent layer 90, so that the pre-fixing agent 70 and the contacting agent layer 90 are not in direct contact. Furthermore, a through-opening 110 with a first opening and a second opening is shown, extending from the first side to the opposite second side of the substrate 30. In the illustrated embodiment, the through-opening 110 is located in a region of the substrate 30 on which neither the pre-fixing agent 70 nor the contacting agent layer 90 is arranged. In an embodiment not shown, the pre-fixing agent 70 can also be arranged directly at the through-opening 110.

[0061] The schematically drawn arrows in Figure 2show that components or residues of the pre-fixing agent 70 liquefy during a temperature and / or pressure treatment, such as a sintering process, and can be selectively absorbed into the through-opening 110 by a capillary action of the through-opening 110 in order to prevent an uncontrolled escape of the components or residues of the pre-fixing agent 70.

[0062] The Figures 3a, 3b Figure 1 shows a schematic sectional view and a detailed view of a substrate arrangement 10' according to an embodiment of the invention combined with an electronic component 50', after sintering.

[0063] The substrate arrangement 10' shown can essentially be the one described in Figure 2 The substrate arrangement shown in section 10 corresponds to the substrate arrangement after sintering. As shown in the Figures 3a, 3b As shown, the portions or residues of the pre-fixing agent 70' that remain after sintering are located in the through-hole 110'.

[0064] This prevents the uncontrolled release of the pre-fixing agent 70' during a temperature and / or pressure treatment for permanently bonding the substrate 30' to the electronic component 50'. As described in the Figures 3a and 3b As shown, the pre-fixing agent 70', which usually transitions into a liquid phase during temperature and / or pressure treatment, can be received in the through-opening 110' and thus spatially retained, so that the pre-fixing agent 70' causes no or fewer disturbances within functional areas, such as on the electronic component 50' or within the connection area of ​​the contacting agent layer 90'.

[0065] The features described above, in the claims and in the figures can be essential to the invention in its various embodiments, both individually and in any combination. Reference symbol list

[0066] 1. Substrate arrangement - state of the art 3. Substrate - state of the art 5. Electronic component 7. Pre-fixing agent - state of the art 10, 10'Substrate arrangement 30, 30'Substrate 50, 50'Electronic component 70, 70'Prefixing agent 90, 90'Contacting agent layer 110, 110'Through opening Excerpt

Claims

1. A substrate arrangement for connection to an electronic component (50, 50'), comprising: at least one substrate (30, 30') having a first side and a second side opposite the first side; at least one contacting agent layer (90, 90'), arranged at least in portions on the first side of the substrate (30, 30'); at least one pre-fixing agent (70, 70'), arranged at least in portions on a side of the contacting agent layer (90, 90') that faces away from the substrate (30, 30') and / or at least in portions on the first side of the substrate (30, 30'); the substrate (30, 30') comprising at least one through-opening (110, 110') having a first opening and a second opening from the first side to the opposite second side and the pre-fixing agent being a pre-fixing agent composition, characterized in that the pre-fixing agent composition comprises the following constituents: - 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents, - 3 to 100 wt.% of at least one material M which melts in the range of 30 to 180°C, selected from the group consisting of (i) organic compounds which melt in the range of 30 to 180°C, (ii) mixtures of organic substances which melt in the range of 30 to 180°C and (iii) organic polymers, - 0 to 20 wt.% of at least one organic free additive which is different from at least one material M which melts in the range of 30 to 180°C, and - 0 to 30 wt.% of one or more inorganic solid fillers, the wt.% values adding up to 100 wt.%.

2. The substrate arrangement according to claim 1, characterized in that the substrate (30, 30') comprises a plurality of through-openings (110, 110') from the first side to the opposite second side, preferably the substrate (30, 30') comprises through-openings (110, 110') at an edge region of the substrate (30, 30').

3. The substrate arrangement according to claim 1 or claim 2, characterized in that the first opening of the through-opening (110, 110') or through-openings (110, 110') on the first side of the substrate (30, 30') is arranged at least partially on the pre-fixing agent (70, 70'), and / or is in contact with the pre-fixing agent (70, 70'), and / or is arranged at least partially at a region of the first side of the substrate (30, 30') that is at least partially neither covered by the pre-fixing agent (70, 70') nor by the contacting agent layer (90, 90').

4. The substrate arrangement according to any of the preceding claims, characterized in that the geometry of the through-opening (110, 110') is substantially constant over the path from the first opening to the second opening, or the geometry of the through-opening (110, 110') is designed to decrease in size over the path from the first opening to the second opening, in particular to decrease gradually or to decrease stepwise.

5. The substrate arrangement according to any of claims 1 to 4, characterized in that the through-opening (110, 110') is substantially rectangular and has a width of 10-100 µm, preferably 20-70 µm, and / or wherein a volume of the through-opening (110, 110') is at least 5% of the volume of the pre-fixing agent (70, 70').

6. The substrate arrangement according to any of the preceding claims, characterized in that the contacting agent layer (90, 90') comprises metal particles, in particular silver particles.

7. The substrate arrangement according to any of the preceding claims, characterized in that the contacting agent layer (90, 90') is arranged on a surface of the first side of the substrate (30, 30') and forms a contacting agent-free region, in particular an edge, on the first side of the substrate (30, 30'), which region is free from the contacting agent layer, and the pre-fixing agent (70, 70') is arranged at least in portions on the contacting agent-free region, in particular arranged in a point-like manner.

8. The substrate arrangement according to any of the preceding claims, characterized in that the substrate (30, 30') comprises a metal sheet or metal strip portion, in particular a copper sheet or a copper sheet portion, or a leadframe or a DCB substrate or PCB substrate, and / or the substrate (30, 30') is coated on the first and / or second side with a material comprising gold (Au), nickel-gold (NiAu), silver (Ag), nickel-silver (NiAg) and / or nickel-palladium-gold (NiPdAu), in particular galvanized or chemically deposited.

9. A method for manufacturing a substrate arrangement for connection to an electronic component (50, 50'), comprising the steps of: providing at least one substrate (30, 30') having a first side and a second side opposite the first side, the substrate (30, 30') comprising at least one through-opening (110, 110') having a first opening and a second opening from the first side to the opposite second side; applying at least one contacting agent layer (90, 90') at least in portions to the first side of the substrate (30, 30'); and applying at least one pre-fixing agent (70, 70') at least in portions to a side of the contacting agent layer (90, 90') that faces away from the substrate (30, 30') and / or applying the pre-fixing agent (70, 70') at least in portions to the first side of the substrate (30, 30') and the pre-fixing agent being a pre-fixing agent composition, characterized in that the pre-fixing agent composition comprises the following constituents: - 0 to 97 wt.% of at least one solvent selected from the group consisting of water and organic solvents, - 3 to 100 wt.% of at least one material M which melts in the range of 30 to 180°C, selected from the group consisting of (i) organic compounds which melt in the range of 30 to 180°C, (ii) mixtures of organic substances which melt in the range of 30 to 180°C and (iii) organic polymers, - 0 to 20 wt.% of at least one organic free additive which is different from at least one material M which melts in the range of 30 to 180°C, and - 0 to 30 wt.% of one or more inorganic solid fillers, the wt.% values adding up to 100 wt.%.

10. The method according to claim 9, characterized in that providing the substrate (30, 30') comprises: introducing at least one, preferably a plurality of through-openings (110, 110'), in particular by etching, punching out and / or a laser / water jet, from the first side of the substrate (30, 30') to the opposite second side of the substrate (30, 30'), preferably introducing the through-openings (110, 110') at an edge region of the substrate (30, 30').

11. The method according to claim 9 or claim 10, characterized in that the first opening of the through-opening or through-openings (110, 110') on the first side of the substrate (30, 30') is arranged at least partially on the pre-fixing agent (70, 70'), and / or is in contact with the pre-fixing agent (70, 70'), and / or is arranged at least partially at a region of the first side of the substrate (30, 30') that is at least partially neither covered by the pre-fixing agent (70, 70') nor by the contacting agent layer (90, 90').

12. The method according to any of claims 9 to 11, characterized in that the geometry of the through-opening (110, 110') is substantially constant over the path from the first opening to the second opening, or the geometry of the through-opening (110, 110') is designed to decrease in size over the path from the first opening to the second opening, in particular to decrease gradually or to decrease stepwise.

13. The method according to any of claims 9 to 12, characterized in that the through-opening (110, 110') is substantially rectangular and has a width of 10-100 µm, preferably 20-70 µm, and / or wherein a volume of the through-opening (110, 110') is at least 5% of the volume of the pre-fixing agent (70, 70').

14. A method for connecting at least one electronic component (50, 50') to a substrate arrangement according to any of claims 6 to 8 or to a substrate arrangement manufactured according to any of claims 9 to 13, comprising the steps of: positioning the substrate arrangement on the electronic component (50, 50') so that the first side faces the electronic component (50, 50'); pre-fixing the substrate arrangement onto the electronic component (50, 50') on the first side of the substrate (30, 30') by means of the pre-fixing agent (70, 70'); and connecting the substrate arrangement to the at least one electronic component (50, 50').

15. The method according to claim 14, characterized in that connecting comprises: sintering, pressing, soldering, and / or bonding the substrate arrangement to the electronic component (50, 50'), and, during connection, portions or residues of the pre-fixing agent (70, 70') being absorbed into the through-opening (110, 110') of the substrate (30, 30'), and / or passing through the through-opening (110, 110') on the second side of the substrate (30, 30').