OPTICAL HOUSING COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP

Abstract

Optical package (OP) comprising: - a support substrate (SUB) having a mounting face (FM) equipped with first electrically conductive contact areas (BF), - an electronic chip (CHP) comprising a front face (FH) having second contact areas (PAD) electrically connected to the first contact areas (BF) by conductive wires (WB), - a film-on-wire (FLM) encapsulation covering at least a first portion (P1) of the conductive wires (WB) and the second contact areas (PAD), - an optical element (OPT) fixed to the encapsulation (FLM), the encapsulation (FLM) defining an internal housing (CAV1) between the optical element (OPT) and the front face (FH) of the electronic chip (CHP). Figure for abbreviation: Fig 1

Description

Title of the invention: OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP

[0001] Embodiments and implementations relate to the field of packaging of integrated circuits, in particular the field of optoelectronics, and more particularly the manufacture of optical devices.

[0002] Optical devices such as optical packages conventionally comprise a support substrate on which is mounted at least one electronic chip which is electrically connected to the support substrate by conductive wires.

[0003] In particular, the chip of such a package has an optical component, such as a pixel matrix for example, on a functional face and electrical contacts connected to electronic circuits, for example circuits which control the emission or reception of an optical signal by the optical component.

[0004] In addition, the substrate also has electrical contacts which are typically connected to the electrical contacts of the chip via conductive wires. The connection between the respective electrical contacts of the chip and the substrate makes it possible in particular to transmit electrical signals between the substrate and the electronic circuits of the chip.

[0005] When manufacturing optical packages, several chips can be fixed and connected to respective locations on the same wafer which is then cut to form individualized optical packages, i.e. each comprising an electronic chip and a support substrate. When cutting the wafer, dendrite particles typically spread onto the functional face of the chip and can consequently impair the operation of the chip, for example by hindering the emission or transmission of the optical signal by the optical component of the chip.

[0006] In this regard, optical packages sometimes include walls, formed on the functional face of the chip, making it possible to protect the functional face of the chip, and more particularly the optical matrix from a dendrite deposit.

[0007] Furthermore, the arrangement of the walls and the optical element on the support substrate makes it possible to protect both the electrical contacts of the support substrate and those of the chip from the risk of dendrite deposition.

[0008] However, none of the known arrangements of the walls and the optical element allow sufficient protection of the electrical contacts and the optical matrix without inducing on the one hand relatively high manufacturing costs, and on the other hand a complex housing design, for example using an adhesive to fix the optical element and a resin to cover the electrical contacts.

[0009] There is therefore a need to find a solution to prevent the deposition of dendrite on the electrical contacts and / or the optical matrix while making the manufacture of optical packages less expensive and less complex.

[0010] According to one aspect, there is provided an optical housing comprising: - a support substrate having a mounting face equipped with first electrically conductive contact pads, - an electronic chip comprising a rear face fixed on the mounting face of the support substrate and a front face comprising second contact pads electrically connected to the first contact pads by conductive wires.

[0011] The optical package also comprises a film-on-wire type coating coating at least a first portion of the conductive wires and the second contact pads, and an optical element, such as a lens, fixed on the coating and being in optical cooperation with the electronic chip, the coating delimiting an internal housing between the optical element and the front face of the electronic chip.

[0012] The film-type coating on wires typically protects the second contact pads from dendrite deposition and from the effects of humidity and temperature that can affect the electrical performance of the package.

[0013] Furthermore, the coating has the advantage of fixing the optical element on the chip while preventing the optical element from tilting relative to the front face of the chip, unlike a conventional adhesive which would be used to fix the optical element and the thickness of which is more difficult to control during deposition than that of the film-on-wire type coating. Thus, the coating ensures a better, in particular flatter, seat for the optical element.

[0014] The optical housing according to this aspect therefore makes it possible to minimize or even avoid the presence of dendrite in the internal housing thanks to an arrangement of the coating and the optical element which is advantageous in terms of ease of production and cost.

[0015] According to one embodiment, the support substrate comprises a cavity housing the electronic chip, the rear face of the chip being fixed to the mounting face by an adhesive at a depth of the substrate such that the conductive wires connecting the second contact pads to the first contact pads extend from the mounting face to a maximum height less than the thickness of the coating.

[0016] Thus, positioning the chip in the cavity makes it possible to reduce the distance between the front face of the chip and the mounting face of the substrate, consequently reducing the size and loop height of the conductive wires as well as the distance separating the optical element from the support substrate.

[0017] An optical housing which has such a cavity is therefore more compact.

[0018] According to one embodiment, the thickness of the adhesive is chosen so that the sum of the thickness of the adhesive and the thickness of the chip is equal to within a tolerance at said depth.

[0019] The wire height of the conductive wires can be limited without however being restrictive for the positioning of the chip which can be slightly raised relative to the mounting face of the substrate according to a certain tolerance.

[0020] According to one embodiment, the coating also coats a second part of the conductive wires and the first contact pads.

[0021] The film-type coating on wires therefore makes it possible to simultaneously protect the contact areas of the chip and the substrate.

[0022] It is therefore no longer necessary to protect the contact pads of the substrate, which makes it possible to simplify the manufacture of the optical housing and make it more economical.

[0023] According to one embodiment, the optical housing comprises a ball of a coating material coating a second part of the conductive wires and the first contact pads.

[0024] The ball of coating material makes it possible to protect the second part of the conductive wires and the contact pads of the substrate in the same way that the film-type coating on wires protects the contact pads of the chip.

[0025] According to one embodiment, the optical housing comprises a molding resin coating a second part of the conductive wires and the first contact pads.

[0026] Alternatively, the second part of the conductive wires and the contact pads of the substrate are protected by a molding resin typically used for packaging packages.

[0027] According to one embodiment, the film-on-wire type coating has a thickness of between 30 μm and 100 μm.

[0028] The coating having this thickness range makes it possible to fix the optical element while making the optical housing more compact. Indeed, the thickness of the coating can be easily controlled during the manufacture of the housing and makes it possible to avoid the use of an adhesive which may require a greater thickness to allow the fixing of the optical element and which may therefore be restrictive with regard to the dimensions of the housing.

[0029] According to another aspect, there is provided a method of manufacturing an optical housing comprising: - a supply of a support substrate having a mounting face equipped with first electrically conductive contact pads, - fixing a rear face of an electronic chip on the mounting face of the support substrate, - an electrical connection of second contact pads from a front face of the chip to the first contact pads by conductive wires, - formation of a film-type coating on wires coating at least a first part of the conductive wires and the second contact pads, - fixing an optical element on the coating, the optical element being in optical cooperation with the electronic chip,

[0030] the coating delimiting an internal housing between the optical element and the front face of the electronic chip;

[0031] According to one embodiment, the method comprises forming a cavity in the support substrate housing the electronic chip, in which the rear face of the chip is fixed to the mounting face by an adhesive at a depth of the support substrate such that the conductive wires connecting the second contact pads to the first contact pads extend from the mounting face to a maximum height less than the thickness of the coating.

[0032] According to one embodiment, the thickness of the adhesive is chosen so that the sum of the thickness of the adhesive and the thickness of the chip is equal to within a tolerance of the depth.

[0033] According to one embodiment, the coating also coats a second part of the conductive wires and the first contact pads.

[0034] According to one embodiment, the method comprises forming a ball of a coating material coating a second portion of the conductive wires and the first contact pads.

[0035] According to one embodiment, the method comprises molding the housing with a molding resin coating a second part of the conductive wires and the first contact pads.

[0036] According to one embodiment, the film-on-wire type coating has a thickness of between 30 μm and 100 μm.

[0037] Other advantages and characteristics of the invention will appear on examining the detailed description of the embodiment and implementation, which is in no way limiting, and the appended drawings in which:

[0038] [Fig.l] ;

[0039] [Fig.2] ;

[0040] [Fig.3] ;

[0041] [Fig.4] ;

[0042] [Fig.5] ;

[0043] [Fig.6] ;

[0044] [Fig.7] ;

[0045] [Fig.8] ;

[0046] [Fig.9] ;

[0047] [Fig. 10] ;

[0048] [Fig. 11];

[0049] [Fig.l2];and

[0050] [Fig. 13] schematically illustrate methods of implementing and producing the invention.

[0051] [Fig.l] schematically illustrates a sectional view of a BT optical housing according to a first embodiment of the invention.

[0052] The BT housing comprises a support substrate SUB comprising a mounting face FM equipped with first electrically conductive contact pads BF. The first contact pads BF are for example contacts of the “connection fingers” type usually designated by the English term “bonding fingers”).

[0053] The optical package BT also comprises an electronic chip CHP. The electronic chip CHP comprises a rear face FL fixed to the mounting face FM of the support substrate SUB, for example by means of an adhesive GL. The electronic chip CHP further comprises a front face FH which comprises for example an optical component PX such as a pixel matrix making it possible to generate an electrical signal from an optical signal coming from outside the package BT, then also comprises electronic components such as transistors.

[0054] Furthermore, the front face FH of the CHP chip comprises second electrically conductive contact pads PAD, for example of the “connection fingers” type or connection surfaces known to those skilled in the art. The second PAD pads of the front face FH of the CHP chip are electrically connected to the first contact pads BF by conductive wires WB.

[0055] The first BF pads and second PAD contact pads as well as the WB conductive wires make it possible to transmit electrical signals between the electrical components of the CHP chip and circuits outside the BT package, for example the electrical signal generated by the PX pixel matrix.

[0056] The BT optical package further comprises a film-on-wire (FLM) coating and an optical element OPT such as a filter or a lens, for example. The FLM coating may be, for example, a reference coating ESP7666-FOW marketed by AI Technology INC.

[0057] The FLM coating of the film-on-wire type coats a first PI portion of the WB conductive wires and the second PAD contact pads. The first PI portion coated by the FLM coating corresponds, for example, to the portion of the WB conductive wires extending from the second PAD pads to a distance defined during the formation of the FLM coating.

[0058] The optical element OPT is fixed on the FLM coating and is in optical cooperation with the electronic chip CHP. The optical element OPT is for example superimposed on the optical component PX of the chip CHP and makes it possible to perform optical functions (filtering, polarization for example) on the optical radiation received or emitted by the optical component PX.

[0059] The FLM coating delimits an internal housing CAV1 between the optical element OPT and the front face FH of the electronic chip CHP, in which the optical component PX is located as well as the electronic components of the chip CHP.

[0060] The film-type coating on FLM wires therefore makes it possible to prevent the deposition of dendrite during the manufacture of the BT housing on the second PAD contact pads as well as on the elements located in the internal housing and in particular makes it possible to protect the PAD contact pads from the effects of humidity and temperature which may affect the electrical performance of the BT housing.

[0061] Furthermore, the FLM coating has the advantage of fixing the optical element OPT on the CHP chip while preventing the inclination of the optical element OPT relative to the front face FH, unlike a conventional adhesive which would be used to fix the optical element and the thickness of which is more difficult to control during deposition than that of the film-on-wire type coating. Thus, the FLM coating ensures a better, in particular flatter, seat for the optical element OPT.

[0062] Such an arrangement of the coating and the optical element allows the BT optical housing to be simpler to manufacture while making it less expensive.

[0063] Furthermore, the FLM coating has a thickness Eflm of between 30 μm and 100 μm

[0064] The FLM coating having this thickness range makes it possible to fix the optical element while making the optical housing more compact. Indeed, the thickness Eflm of the FLM coating can be easily controlled and makes it possible to avoid the use of an adhesive which may require a greater thickness to allow the fixing of the optical element and which may therefore be restrictive with regard to the dimensions of the BT housing.

[0065] The optical housing BT also comprises a ball of coating material GL_TP, known by the English term “glob top”, which coats a second part P2 of the conductive wires WB and the first contact pads BF. The second part P2 corresponds to the portion of the conductive wires WB extending from the first pads BF up to a distance defined during the formation of the ball GL_TP.

[0066] The ball of coating material GL_TP makes it possible to protect the second part P2 of the conductive wires and the contact pads BF of the substrate SUB from the effects of humidity and temperature.

[0067] [Fig.2] schematically illustrates a sectional view of a BT optical box according to a second embodiment. The elements common with the BT box of [Fig.l] support the same references and will not all be detailed again.

[0068] The BT housing comprises a molding resin RES, such as the resin typically used for packaging housings. The molding resin RES coats the second part P2 of the conductive wires WB and the first contact pads BF.

[0069] Thus, the RES resin makes it possible to protect the second part P2 of the WB conductive wires and the first BF contact pads as well as the other elements of the BT housing such as the OPT optical element.

[0070] [Fig.3] schematically illustrates a sectional view of a BT optical housing according to a third embodiment. The elements common to the BT housing of [Fig.l] bear the same references and will not all be detailed again.

[0071] The BT housing comprises both the ball of coating material GB_TP of the first embodiment coating one or more contact pads BF of the substrate and the second part P2 of the conductive wires WB connected to these contact pads BF, then the molding resin RES of the second embodiment coating the contact pads BF and the second part P2 of the conductive wires WB not coated by the ball GB_TP.

[0072] [Fig.4] schematically illustrates a sectional view of a BT optical housing according to a fourth embodiment. The elements common to the BT housing of [Fig.1] bear the same references and will not all be detailed again.

[0073] The support substrate SUB comprises a cavity CAV2 which houses the electronic chip CHP. The rear face FL of the chip CHP is fixed on the mounting face FM at a depth Ecav2 of the substrate SUB so that the conductive wires WB extend from the mounting face FM to a maximum height Hwb less than the thickness Eflm of the coating FLM.

[0074] In particular, the depth Ecav2 is between 30 and 70% of the thickness Esub of the support substrate SUB.

[0075] Indeed, the WB conductive wires which connect the first BF contact pads and the second PAD contact pads have a maximum height which corresponds to the height of the loop formed by the WB conductive wires. As an indication, this maximum height can be between 40 and 70% of the thickness of the film-type coating on FLM wires.

[0076] Thus, the positioning of the CHP chip in the CAV2 cavity makes it possible to reduce the distance between the front face FH of the CHP chip and the mounting face FM of the SUB substrate, consequently reducing the size and the loop height of the WB conductive wires as well as the distance separating the optical element OPT from the support substrate SUB.

[0077] A BT optical housing which has such a cavity is therefore more compact.

[0078] The adhesive GL has a thickness Egl which can be adapted according to the depth Ecav2 of the CAV2 cavity and thus allow the positioning of the CHP chip in the CAV2 cavity to be adjusted.

[0079] Advantageously, the thickness of the adhesive GL is chosen so that the sum of the thickness Egl of the adhesive and the thickness Echp of the chip is equal to within a tolerance of the depth Ecav2.

[0080] The loop height of the WB conductive wires can be limited without however being restrictive for the positioning of the CHP chip which can be slightly raised relative to the FM mounting face of the SUB substrate according to a certain tolerance.

[0081] For example, the tolerance may correspond to a maximum deviation of approximately 10 μm between the front face FH of the CHP chip and the mounting face FM of the substrate SUB below which the formation of the FLM coating is not hindered by the CHP chip during the manufacture of the BT package.

[0082] The FLM coating also coats the second part P2 of the WB conductive wires and the first BF contact pads.

[0083] The film-type coating on FLM wires therefore makes it possible to simultaneously protect the contact pads of the CHP chip and the SUB substrate.

[0084] It is therefore no longer necessary to protect the BF contact pads of the SUB substrate by the ball of coating material as described previously in relation to [Fig.2] or by the molding resin as described previously in relation to [Fig.3], which makes it possible to simplify the manufacture of the optical housing and make it more economical.

[0085] Figures 5 to 9 schematically illustrate a method for manufacturing optical devices according to a first embodiment. Such a manufacturing method is for example used to manufacture a BT optical package, as shown in [Fig.l].

[0086] [Fig.5] illustrates a step 100 of providing a support substrate SUB. In particular, the substrate SUB comprises a mounting face FM of the substrate SUB equipped with first electrically conductive contact pads BF.

[0087] Step 100 also comprises fixing a rear face FL of an electronic chip CHP on the mounting face FM of the support substrate SUB. The fixing of the rear face FL can be carried out by means of an adhesive GL for example.

[0088] In addition, the electronic chip CHP comprises a front face FH opposite the rear face FL. The front face FH of the chip CHP comprises second electrically conductive contact pads PAD. The front face FH of the chip CHP also comprises an optical component such as a pixel matrix PX as well as electronic components such as transistors.

[0089] [Fig.6] illustrates a step 101 of connecting the front face FH of the CHP chip to the mounting face FM of the support substrate SUB.

[0090] More particularly, the connection of step 101 is an electrical connection of the second contact pads PAD of the front face FH of the chip CHP to the first contact pads BF by conductive wires WB using a wire bonding type assembly.

[0091] The WB conductive wires typically extend from the FM mounting face to a maximum height Hwb corresponding to the height of the loop formed by the WB conductive wires.

[0092] [Fig.7] illustrates a step 102 of forming a film-type coating on FLM wires.

[0093] The FLM coating is formed on a Fopt face of an optical element OPT such as a filter or a lens. The FLM coating may be, for example, a reference coating ESP7666-FOW marketed by AI Technology INC and has a thickness Efhn of between 30 μm and 100 μm.

[0094] Such an FLM coating is typically intended to cover a first part PI of the conductive wires WB as described below in relation to [Fig.9].

[0095] As a variant (not shown), the FLM coating is formed on the front face FH of the CHP chip so as to coat the first part PI at least of the conductive wires WB and the second contact pads PAD before fixing the optical element OPT on the FLM coating.

[0096] [Fig.8] illustrates a step 103 of forming a ball of coating material GL_TP.

[0097] The ball of coating material GL_TP, known by the English term “glob top”, coats a second part P2 of the conductive wires WB and the first contact pads BF.

[0098] [Fig.9] illustrates a step 104 of fixing the FLM coating on the front face FH of the CHP chip.

[0099] More particularly, the FLM coating coats the first PI part of the WB conductive wires and the second PAD contact pads while allowing the optical element OPT to be in optical cooperation with the CHP electronic chip. Indeed, the optical element OPT can be positioned opposite the optical component PX of the CHP chip so that the optical element OPT is crossed by the optical signal received by the optical component PX of the CHP chip.

[0100] Furthermore, the FLM coating delimits an internal housing CAV1 between the optical element OPT and the front face FH of the electronic chip CHP.

[0101] Figures 10 and 11 schematically illustrate steps 105 and 106 of the method for manufacturing the BT optical housing according to a second embodiment. More particularly, steps 105 and 106 are carried out from steps 100 to 102 previously described in relation to Figures 5 to 7. The method according to this second This implementation mode is for example used to manufacture a BT optical box, as shown in [Fig.2].

[0102] [Fig. 10] illustrates more particularly a step 105 of fixing the FLM coating on the front face FH of the CHP chip.

[0103] During step 105, the FLM coating is fixed on the front face FH in a manner analogous to the FLM coating during step 104 previously described in relation to [Fig.9].

[0104] On the other hand, at this stage, the first contact pads BF as well as the second part P2 of the conductive wires WB are not coated by the ball of coating material.

[0105] [Fig. 11] schematically illustrates a step 106 of molding the BT housing.

[0106] The molding of the BT housing is carried out using a RES molding resin which coats the second part P2 of the WB conductive wires as well as the first BF contact pads.

[0107] Thus, the second part of the conductive wires WB and the first contact pads BF are protected during molding which is typically carried out during the manufacture of packages to ensure the protection of the various elements of the package such as the support substrate SUB and the optical element OPT.

[0108] Alternatively, the molding of step 106 is carried out after a step of forming a ball of coating material GL_TP, such as step 103 described previously in relation to [Fig.8].

[0109] In this way, one or more contact pads BF of the substrate and the second part P2 of the conductive wires WB connected to these contact pads BF can be coated by the ball of coating material GB_TP and the contact pads BF and the second part P2 of the conductive wires WB not coated by the ball GB_TP can be coated by the molding resin RES. Thus, the method according to this variant makes it possible to obtain a BT optical package such as the package illustrated in [Fig.3].

[0110] Figures 12 and 13 schematically illustrate steps 107 and 108 of the method for manufacturing the BT optical housing according to a third embodiment. The method according to this third embodiment is for example used to manufacture a BT optical housing, as shown in [Fig.4].

[0111] [Fig. 12] schematically illustrates a step 107 of fixing the electronic chip CHP and connecting the front face FH of the chip CHP to the mounting face FM of the support substrate SUB.

[0112] In particular, step 107 is preceded by a step (not shown) of forming a cavity CAV2 in the support substrate SUB.

[0113] The cavity CAV2 is typically adapted to house the electronic chip CHP. The rear face FL of the chip CHP is fixed on the mounting face FM at a depth Ecav2 of the substrate SUB.

[0114] As an indication, the depth Ecav2 is between 30 and 70% of the thickness Esub of the support substrate SUB.

[0115] During step 107, the second contact pads PAD of the front face FH of the chip are electrically connected to the first contact pads BF in a manner analogous to the connection of the second contact pads of step 103 described previously in relation to [Fig.8].

[0116] [Fig. 13] schematically illustrates a step 108 of fixing the FLM coating on the front face FH of the CHP chip. Step 108 is carried out from step 102 of forming the FLM coating as described previously in relation to [Fig.7].

[0117] The FLM coating coats not only the first part PI of the conductive wires and the second contact pads PAD, but also the second part P2 of the conductive wires WB and the first contact pads BF.

[0118] In particular, the conductive wires WB which connect the second contact pads PAD to the first contact pads BF extend from the mounting face FM to a maximum height Hwb less than the thickness Eflm of the coating FLM.

[0119] As an indication, the maximum height Ewb is between 40 and 70% of the thickness of the film-type coating on FLM wires.

[0120] Advantageously, the thickness of the adhesive GL is chosen so that the sum of the thickness Egl of the adhesive and the thickness Echp of the chip is equal to within a tolerance of the depth Ecav2.

Claims

Claims

1. Optical package (BT) comprising: - a support substrate (SUB) having a mounting face (FM) equipped with first electrically conductive contact pads (BF), - an electronic chip (CHP) comprising a rear face (FL) fixed on the mounting face (FM) of the support substrate (SUB) and a front face (FH) comprising second contact pads (PAD) electrically connected to the first contact pads (BF) by conductive wires (WB), - a film-on-wire type coating (FLM) coating at least a first part (PI) of the conductive wires (WB) and the second contact pads (PAD) - an optical element (OPT) fixed on the coating (FLM) and being in optical cooperation with the electronic chip (CHP), the coating (FLM) delimiting an internal housing (CAV1) between the optical element (OPT) and the front face (FH) of the electronic chip (CHP).

2. Optical package according to claim 1, in which the support substrate (SUB) comprises a cavity (CAV2) housing the electronic chip (CHP), the rear face (FL) of the chip (CHP) being fixed on the mounting face (FM) by an adhesive (GL) at a depth (Ecav2) of the substrate (SUB) so that the conductive wires (WB) connecting the second contact pads (PAD) to the first contact pads (BF) extend from the mounting face (FM) to a maximum height (Hwb) less than the thickness (Efhn) of the coating (FLM).

3. Optical package according to claim 2, wherein the thickness of the adhesive (GL) is chosen so that the sum of the thickness (Egl) of the adhesive and the thickness (Echp) of the chip is equal to within a tolerance of the depth (Ecav2).

4. Optical package according to any one of the preceding claims, in which the coating (FLM) also coats a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

5. Optical housing according to claims 1 to 3, comprising a ball of a coating material (GL_TP) coating a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

6. Optical housing according to one of claims 1 to 3, comprising a molding resin (RES) coating a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

7. An optical package according to any preceding claim, wherein the film-on-wire (FLM) type coating has a thickness (Eflm) of between 30 pm and 100 pm.

8. Method for manufacturing an optical package (BT) comprising: - providing a support substrate (SUB) having a mounting face (FM) equipped with first electrically conductive contact pads (BF), - fixing a rear face (FL) of an electronic chip (CHP) on the mounting face (FM) of the support substrate (SUB), - electrically connecting second contact pads (PAD) of a front face (FH) of the chip (CHP) to the first contact pads (BF) by conductive wires (WB), - forming a film-on-wire type coating (FLM) coating at least a first part (PI) of the conductive wires (WB) and the second contact pads (PAD), - fixing an optical element (OPT) on the coating (FLM), the optical element (OPT) being in optical cooperation with the electronic chip (CHP), the coating (FLM) delimiting an internal housing (CAV1) between the optical element (OPT) and the front face (FH) of the electronic chip (CHP).

9. Method according to claim 8, comprising the formation of a cavity (CAV2) in the support substrate (SUB) housing the electronic chip (CHP), in which the rear face (FL) of the chip (CHP) is fixed on the mounting face (FM) by an adhesive (GL) at a depth (Ecav2) of the support substrate (SUB) so that the conductive wires (WB) connecting the second contact pads (PAD) to the first contact pads (BF) extend from the mounting face (FM) to a maximum height (Hbw) less than the thickness (Eflm) of the coating (FLM).

10. Method according to claim 9, in which the thickness of the adhesive (GL) is chosen so that the sum of the thickness (Egl) of the adhesive and the thickness (Echp) of the chip is equal to within a tolerance of the depth (Ecav2).

11. Method according to one of claims 9 or 10, in which the coating (FLM) also coats a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

12. A method according to one of claims 9 or 10, comprising a formation of a ball of a coating material (GL_TP) coating a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

13. Method according to one of claims 9 or 10, comprising molding the housing (BT) by a molding resin (RES) coating a second part (P2) of the conductive wires (WB) and the first contact pads (BF).

14. Method according to one of claims 8 to 13, in which the film-on-wire (FLM) type coating has a thickness (Eflm) of between 30 pm and 100 pm.

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