Solder ball mounting device, control method, and program

Abstract

To provide a solder ball mounting device or the like capable of stably mounting a solder ball on an electrode of a substrate that is a solder ball mounting target.SOLUTION: A solder ball mounting device includes: a suction block in which a plurality of holes are formed at a plurality of locations including locations aligned with an electrode of a substrate that is a solder ball mounting target and that can decompress an inside by exhaust with a vacuum source; a thin plate that is arranged on a lower surface of the suction block and in which a plurality of suction holes are formed at a position corresponding to a position of the electrode of the substrate; a push-out unit that vertically detaches / attaches the thin plate from / to the lower surface of the suction block; and a vertical drive source that vertically moves the push-out unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a solder ball mounting device, a control method, and a program. [Background technology]

[0002] Solder balls are mounted on electrodes of packages (substrates) such as BGA (Ball Grid Array). When mounting the solder balls, they are vacuum-attached to an adsorption block and then transported above an electrode to which flux has been applied. When the vacuum is turned off with the solder ball positioned above the electrode, the solder ball is mounted on the electrode. The adhesive power of the flux causes the solder ball to adhere to the terminal.

[0003] Packages may have a certain degree of warping. In such packages, there may be some places where the solder balls do not come into sufficient contact with the flux when the solder balls are mounted. In such places, the solder balls may remain attached to the suction block even when the vacuum suction is turned off due to static electricity or snagging on the contact surface between the solder balls and the suction block. Packages where this occurs will have bumps not formed on some of the electrodes, resulting in a defective product.

[0004] Patent Document 1 discloses a conductive ball mounting device that mounts conductive balls on a package. The device in Patent Document 1 has an alignment mask that adsorbs and holds the solder balls. A sheet that covers the upper ends of multiple ejection pins that are supported so as to be slidable is arranged inside the alignment mask. The device in Patent Document 1 has a pin holder that holds the sheet down with compressed air adjusted to the required pressure.

[0005] Patent Document 2 discloses a ball mounting jig for mounting solder balls on a substrate. The jig in Patent Document 2 has an elastic material on the surface that attracts the solder balls.

[0006] Patent Document 3 discloses a semiconductor manufacturing device having a ball mount tool. A flexible deformation plate is placed on the underside of the main body of the ball mount tool. In the method of Patent Document 3, in the stage of mounting the solder balls, the deformation plate in contact with the solder balls is deformed by pushing with air. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2003-110234 A [Patent Document 2] JP 2000-340935 A [Patent Document 3] JP 2001-351938 A Summary of the Invention [Problem to be solved by the invention]

[0008] In the device of Patent Document 1, one ejector pin is arranged for each solder ball that is sucked and held. Generally, the number of solder balls mounted on a package at one time ranges from several hundred to several thousand. To accommodate such packages, the device of Patent Document 1 is arranged with several hundred to several thousand ejector pins. Incorporating these pins into the device requires enormous costs.

[0009] The jig in Patent Document 2 absorbs the warpage of the board by deforming the elastic material. The elastic material deforms when the solder balls are attached. The elastic material also deforms in response to the warpage of the package when the solder balls are mounted. Therefore, in the jig in Patent Document 2, the hole diameter of the elastic material may widen, causing the solder balls to get stuck in the attachment holes.

[0010] In the method of Patent Document 3, when the solder balls are mounted, the deformation plate in contact with the solder balls is pushed with air to deform it and conform to the package warpage. According to the method of Patent Document 3, when the suction block is released from suction, more than half of the solder balls leave the suction block and drop to the package side to be mounted. If positive pressure air comes out of the suction port at this stage, the position of the solder balls mounted on the package will be shifted.

[0011] An object of the present disclosure is to provide a solder ball mounting device, a control method, and a program that can stably mount solder balls on electrodes of a substrate on which the solder balls are to be mounted. [Means for solving the problem]

[0012] A solder ball mounting device of one embodiment of the present disclosure comprises an suction block having a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of a substrate on which the solder balls are to be mounted, and in which the interior can be depressurized by exhausting with a vacuum source, a thin plate arranged on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate, a push-out unit that vertically detaches the thin plate from the underside of the suction block, and a vertical drive source that moves the push-out unit up and down.

[0013] In one embodiment of the present disclosure, a method for controlling a solder ball mounting device includes an suction block having a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of a substrate on which a solder ball is to be mounted, and the interior of which can be depressurized by exhausting with a vacuum source; a thin plate arranged on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for vertically detaching the thin plate from the underside of the suction block; and an up-down drive source for moving the push-out unit up and down, wherein when a solder ball is set below the suction block, the vacuum source is operated, and when the substrate is aligned downward, the up-down drive source is driven to move the push-out unit downward, and depending on the adhesion of the solder ball to the electrode of the substrate, the vacuum source is stopped and the up-down drive source is driven to move the push-out unit upward.

[0014] A program of one embodiment of the present disclosure is a program for controlling a solder ball mounting device comprising an suction block having a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of a substrate on which the solder balls are to be mounted, and in which the interior can be depressurized by exhausting with a vacuum source, a thin plate arranged on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate, a push-out unit for vertically detaching the thin plate from the underside of the suction block, and an up-down drive source for moving the push-out unit up and down, and causes a computer to execute the following processes: operating the vacuum source when a solder ball is set below the suction block; driving the up-down drive source to move the push-out unit downward when the substrate is aligned downward; stopping the vacuum source in response to adhesion of the solder ball to the electrode of the substrate; and driving the up-down drive source to move the push-out unit upward. Effect of the Invention

[0015] According to the present disclosure, it is possible to provide a solder ball mounting device, a control method, and a program that can stably mount solder balls on electrodes of a substrate on which the solder balls are to be mounted. [Brief description of the drawings]

[0016] [Figure 1] 1 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a first embodiment. [Diagram 2] 1 is a plan view of a solder ball mounting device according to a first embodiment, seen from above; [Diagram 3] 2 is a bottom view of the suction block of the solder ball mounting device according to the first embodiment, seen from a lower perspective. FIG. [Figure 4] 2 is a bottom view of the thin plate of the solder ball mounting device according to the first embodiment, seen from a lower perspective. FIG. [Diagram 5] 3 is an enlarged conceptual diagram of a connecting portion between an ejection pin and a thin plate of the solder ball mounting device according to the first embodiment. FIG. [Figure 6]3 is an enlarged conceptual diagram of a connecting portion between an ejection pin and a thin plate of the solder ball mounting device according to the first embodiment. FIG. [Figure 7] 4 is a conceptual diagram showing an example of a state in which a solder ball is attracted to the lower surface of the solder ball mounting device according to the first embodiment. FIG. [Figure 8] 1 is a conceptual diagram showing an example of a state in which a substrate is placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 9] 4 is a conceptual diagram showing an example of a state in which solder balls are attached to electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 10] 2 is a conceptual diagram showing an example of a state in which solder balls are mounted on electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 11] 5 is a conceptual diagram showing another example of a state in which solder balls are attached to electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 12] 5 is a conceptual diagram showing another example of a state in which solder balls are mounted on electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 13] 10 is a conceptual diagram showing yet another example of a state in which solder balls are attached to electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 14] 2 is a conceptual diagram showing an example of a state in which solder balls are mounted on electrodes of a substrate arranged below the solder ball mounting device according to the first embodiment. FIG. [Figure 15] 5 is a flowchart for explaining an example of an operation of the solder ball mounting device according to the first embodiment. [Figure 16] FIG. 11 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a second embodiment. [Figure 17] FIG. 11 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a second embodiment. [Figure 18] 13 is a plan view of a solder ball mounting device according to a second embodiment, seen from above. FIG. [Figure 19] 13 is a bottom view of the suction block of the solder ball mounting device according to the second embodiment, as viewed from below. FIG. [Figure 20] 13 is a bottom view of a thin plate of the solder ball mounting device according to the second embodiment, seen from a lower perspective. FIG. [Figure 21] FIG. 13 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a third embodiment. [Figure 22] FIG. 13 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a third embodiment. [Figure 23] FIG. 2 is a block diagram showing an example of a hardware configuration for executing control and processing according to each embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below are limited in a manner that is technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following. In addition, in all the drawings used to explain the following embodiments, the same reference numerals are used for similar parts unless otherwise specified. In addition, in the following embodiments, repeated explanations of similar configurations and operations may be omitted.

[0018] (First embodiment) First, the solder ball mounting device according to the first embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment is used in a manufacturing process for mounting solder balls on electrodes of a semiconductor package (hereinafter also referred to as a package or a substrate) such as a BGA (Ball Grid Array). The drawings used in the following description are conceptual diagrams, and may not accurately show the size, shape, positional relationship, etc. of components.

[0019] (composition) Fig. 1 is a conceptual diagram showing an example of the configuration of a solder ball mounting device 10 of this embodiment. Fig. 1 is a cross-sectional view of the inside of the solder ball mounting device 10 as seen from a side perspective. Fig. 1 shows a cross-section of a representative portion, not a cross-section cut along a linear cutting line.

[0020] The solder ball mounting device 10 includes a suction block 11, a thin plate 13, a connecting plate 120, a vertical drive source 15, a first support 130, a second support 152, a control unit 16, and a vacuum source 17. Furthermore, the solder ball mounting device 10 includes a first push shaft 121, a first compression spring 123, a second push shaft 126, a second compression spring 127, a first push pin 131, a connecting plate 150, and a second push pin 151.

[0021] The connecting plate 120, the first push shaft 121, the first compression spring 123, the first support 130, and the first push pin 131 constitute a first push unit. The second push shaft 126, the second compression spring 127, the connecting plate 150, the second push pin 151, and the second support 152 constitute a second push unit. The first push unit and the second push unit move up and down in conjunction with the movement of the connecting plate 120. The thin plate 13 moves up and down in conjunction with the up and down movement of the first push unit and the second push unit. The first compression spring 123 and the second compression spring 127 expand and contract independently in accordance with the warp of the substrate on which the solder balls are to be mounted. Therefore, when the solder balls are mounted on the substrate, the thin plate 13 deforms in accordance with the warp of the substrate.

[0022] The suction block 11 is a housing used for suctioning solder balls. The inside of the suction block 11 is hollow. Some of the components of the solder ball mounting device 10 are housed inside the suction block 11. An exhaust port V used for adjusting the internal pressure of the suction block 11 is opened on the side (wall) of the suction block 11. The exhaust port V may be formed on the upper surface (ceiling) of the suction block 11. The exhaust port V is connected to the vacuum source 17 via an air hose 175. For example, the vacuum source 17 is realized by a vacuum pump. When the vacuum source 17 is operated, the inside of the suction block 11 becomes negative pressure due to exhaust through the exhaust port V. Therefore, a suction force is generated through a hole formed on the lower surface of the suction block 11. For example, the pressure inside the suction block 11 may be adjusted by controlling the exhaust amount of the vacuum source 17. There is no particular limitation on the vacuum source 17 and the air hose 175.

[0023] FIG. 2 is a plan view of the solder ball mounting device 10 as viewed from above. Through holes for inserting the first extrusion shaft 121 and the second extrusion shaft 126 are formed on the upper surface of the suction block 11. The upper ends of the first extrusion shaft 121 and the second extrusion shaft 126 are connected to the lower surface of the connection plate 120. As shown in FIG. 2, the first extrusion shaft 121 is connected to each of the four corners of the connection plate 120. In addition, the second extrusion shaft 126 is connected to the center of the connection plate 120. The first extrusion shaft 121 and the second extrusion shaft 126 are arranged to be movable up and down inside the through holes formed on the upper surface of the suction block 11. The lower parts of the first extrusion shaft 121 and the second extrusion shaft 126 are arranged inside the suction block 11.

[0024] FIG. 3 is a bottom view of the solder ball mounting device 10 (the suction block 11) from which the thin plate 13 has been removed, as viewed from below. The bottom surface of the suction block 11 has a first hole h1, a second hole h2, a third hole h3, and a fourth hole h4. The first hole h1 is a hole used for suction of the solder ball. In the example of FIG. 3, 25 first holes h1 arranged in a lattice pattern are opened on the bottom surface of the suction block 11. The second holes h2 are holes used for suction of the thin plate 13. In the example of FIG. 3, four second holes h2 are opened on the bottom surface of the solder suction block 11. The third hole h3 is a hole through which the second push pin 151 penetrates. The second push pin 151 moves up and down inside the third hole h3. In the example of FIG. 3, four third holes h3 are opened on the bottom surface of the suction block 11. The fourth hole h4 is a hole through which the first support 130 is disposed. In the example of Fig. 3, four fourth holes h4 are opened in the lower surface of the suction block 11. The first hole h1, second hole h2, third hole h3, and fourth hole h4 shown in Fig. 3 are merely examples, and do not limit the positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 11. The positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 11 are set according to the size and type of the substrate (package) on which the solder balls are to be mounted.

[0025] The thin plate 13 is disposed on the lower surface of the suction block 11. The thin plate 13 is detachable from the lower surface of the suction block 11. The thin plate 13 is flexible. For example, the thin plate 13 is realized by a flexible metal plate. The thin plate 13 may be realized by a flexible resin plate. The thin plate 13 has suction holes H formed at positions corresponding to the first holes h1 formed on the lower surface of the suction block 11. There is no limitation on the method of forming the suction holes H in the thin plate 13. When the thin plate 13 is made of metal, the suction holes H are formed by a method such as etching or an additive method.

[0026] Fig. 4 is a bottom view of the solder ball mounting device 10 (thin plate 13) to which the thin plate 13 is attached, as viewed from below. In the example of Fig. 4, 25 suction holes H arranged in a grid pattern are formed in the thin plate 13. Fig. 4 also shows positions corresponding to the first hole h1, the second hole h2, the third hole h3, and the fourth hole h4 formed in the lower surface of the suction block 11. The multiple suction holes H are formed at positions corresponding to the multiple first holes h1.

[0027] The vertical drive source 15 moves the connecting plate 120 up and down in response to the control of the control unit 16. There is no limitation on the mechanism by which the vertical drive source 15 moves the connecting plate 120 up and down. For example, the vertical drive source 15 is realized by an air cylinder that expands and contracts by air pressure. In response to the up and down movement of the connecting plate 120, the first push shaft 121 and the second push shaft 126 connected to the lower part of the connecting plate 120 move up and down. In response to the up and down movement of the first push shaft 121 and the second push shaft 126, the thin plate 13 moves up and down. That is, the thin plate 13 moves up and down in conjunction with the up and down movement of the connecting plate 120.

[0028] The upper end of the first push shaft 121 is connected to the lower surface of the connection plate 120. A storage space is formed in the lower part of the first push shaft 121. The first compression spring 123 and the upper end of the first push pin 131 are stored in the storage space. The first compression spring 123 is disposed between the upper surface of the storage space of the first push shaft 121 and the upper surface of the first push pin 131. The first compression spring 123 presses the first push pin 131 downward. The first push pin 131 is disposed between the first push shaft 121 and the thin plate 13. The upper and lower ends of the first push pin 131 have a larger cross-sectional area than the main shaft. The upper end of the first push pin 131 is stored in the storage space of the first push shaft 121. The lower end of the first push pin 131 is supported by the first support 130. The first support 130 is disposed on the upper surface of the thin plate 13. The first support 130 is disposed inside a fourth hole h4 formed in the lower surface of the suction block 11. The solder ball mounting device 10 includes four first supporters 130. The four first supporters 130 are disposed corresponding to the four corners of the upper surface of the thin plate 13. The first support 130 supports the lower end of the first push-out pin 131 in a wrapping manner.

[0029] The upper end of the second push shaft 126 is connected to the lower end of the vertical drive source 15. The lower end of the second push shaft 126 is supported by the second support 152. A narrowed portion having a smaller cross-sectional area than the upper and lower ends is formed at the lower part of the second push shaft 126. A second compression spring 127 is disposed at the narrowed part of the second push shaft 126. The second compression spring 127 is disposed between the upper end of the narrowed part of the second push shaft 126 and the upper surface of the second support 152. The second compression spring 127 presses the second support 152 downward. The second support 152 is disposed on the upper surface of the connecting plate 150. The second support 152 is disposed above the third hole h3 formed on the lower surface of the suction block 11. The solder ball mounting device 10 has four third holes h3. A second push pin 151 is disposed in each of the four third holes h3. An upper end of the second push-out pin 151 is connected to the lower surface of the connecting plate 150. A lower end of the second push-out pin 151 is connected to the upper surface of the thin plate 13 through the third hole h3.

[0030] For example, assume that the thickness of the thin plate 13 is 0.2 millimeters (mm), the outer dimensions of the thin plate 13 according to the outer shape of the substrate 180 are 60 mm×60 mm, and the warpage of the substrate 180 is 0.2 mm. In order to bend the thin plate 13 by 0.2 mm in accordance with the warpage of the substrate 180, a force of about 1 Newton (N) is applied to each of the first push pins 131 and the second push pins 151. In this case, the first compression spring 123 and the second compression spring 127 are springs that can generate a force of about 1 Newton (N) for each of the first push pins 131 and the second push pins 151.

[0031] 5 and 6 are conceptual diagrams enlarging the connection portion between the first push pin 131 and the thin plate 13. FIG. 5 shows a state in which the thin plate 13 is in close contact with the lower surface of the suction block 11. FIG. 6 shows a state in which the thin plate 13 is detached from the lower surface of the suction block 11. The first support 130 is disposed in the fourth hole h4 in which the lower end L of the first push pin 131 is accommodated. The first support 130 is fixed to the thin plate 13. The upper end T of the first push pin 131 is accommodated in the accommodation space at the bottom of the first extrusion shaft 121. The lower end L of the first push pin 131 is accommodated in the internal space of the first support 130. When the lower end L of the first push pin 131 is accommodated, there is a gap in the internal space of the first support 130. Due to the gap in the internal space of the first support 130, horizontal deformation caused by vertical deformation of the thin plate 13 is permitted. A tapered portion T1 tapered from the bottom to the top is formed on the inner lower portion of the fourth hole h4 of the suction block 11. Also, a tapered portion T2 tapered from the bottom to the top is formed on the outer lower portion of the first support 130. As shown in Fig. 5, when the thin plate 13 is in close contact with the lower surface of the suction block 11, the tapered portion T1 and the tapered portion T2 come into contact with each other, whereby the horizontal deformation of the thin plate 13 caused by the vertical deformation of the thin plate 13 returns to the original state.

[0032] The first push-out shaft 121 and the second push-out shaft 126 move up and down in response to the drive of the vertical drive source 15, thereby changing the positional relationship between the bottom surface of the suction block 11 and the thin plate 13. The first compression spring 123 and the second compression spring 127 expand and contract independently of each other. Therefore, the peripheral portion and the central portion of the thin plate 13 can have different distances from the bottom surface of the suction block 11. Therefore, the thin plate 13 can deform in accordance with the warping of the substrate on which the solder balls are to be mounted.

[0033] 7 is a conceptual diagram showing an example of a state in which a solder ball 100 is adsorbed to the lower surface of the solder ball mounting device 10. When the inside of the suction block 11 is depressurized by exhaust from the exhaust port V, the inside of the suction block 11 becomes negative pressure. As a result, a suction force toward the inside of the suction block 11 is generated in each of the multiple suction holes H formed in the thin plate 13. Therefore, the solder ball 100 arranged below is adsorbed to each of the multiple suction holes H formed in the thin plate 13.

[0034] 8 is a conceptual diagram showing an example of a state in which a substrate 180 is disposed below the solder ball mounting device 10. A plurality of electrodes 181 are formed on the upper surface of the substrate 180. Each of the plurality of electrodes 181 is aligned below one of the plurality of solder balls 100. Flux 185 is applied to each of the plurality of electrodes 181. Note that solder paste may be applied to each of the plurality of electrodes 181 instead of the flux 185. The solder balls 100 attracted to the lower surface of the suction block 11 are associated above the plurality of electrodes 181 to which the flux 185 is applied.

[0035] FIG. 9 is a conceptual diagram showing an example of a state in which the solder balls 100 are attached to the electrodes 181 of the substrate 180. In the example of FIG. 9, the substrate 180 is not bent. In the example of FIG. 9, the solder balls 100 are attached to each of the electrodes 181 to which the flux 185 is applied in response to the downward drive of the connecting plate 120 by the vertical drive source 15. When the connecting plate 120 is further moved downward in a state in which all the solder balls 100 are in contact with the electrodes 181, the first compression springs 123 and the second compression springs 127 are compressed. Therefore, within the deformable range of the first compression springs 123 and the second compression springs 127, even if the connecting plate 120 is moved downward from a state in which all the solder balls 100 are in contact with the electrodes 181, the thin plate 13 does not descend.

[0036] Fig. 10 is a conceptual diagram showing an example of a state in which solder balls 100 are mounted on electrodes 181 of substrate 180 in the example of Fig. 9. When vacuum source 17 is stopped and moved above connecting plate 120 by vertical drive source 15, solder balls 100 are mounted on each of the multiple electrodes 181 to which flux 185 has been applied. With solder balls 100 mounted on electrodes 181, substrate 180 is reflowed, whereby solder balls 100 are mounted on electrodes 181.

[0037] FIG. 11 is a conceptual diagram showing another example of a state in which the solder balls 100 are attached to the electrodes 181 of the substrate 180. In the example of FIG. 11, the central portion of the substrate 180 is warped upward relative to the peripheral portion. In the example of FIG. 11, the solder balls 100 are attached to each of the electrodes 181 to which the flux 185 is applied in response to the downward drive of the connecting plate 120 by the vertical drive source 15. The central portion of the thin plate 13 is warped upward relative to the peripheral portion in response to the warping of the substrate 180. The second compression spring 127 is deformed more than the first compression spring 123, so that the thin plate 13 is deformed along the warping of the substrate 180. As a result, the solder balls 100 are attached to all the electrodes 181 of the substrate 180.

[0038] 12 is a conceptual diagram showing another example of the state in which the solder balls 100 are mounted on the electrodes 181 of the substrate 180 in the example of FIG. 11. As the vertical drive source 15 drives the connecting plate 120 upward, the solder balls 100 are mounted on each of the electrodes 181 to which the flux 185 is applied. Since the thin plate 13 deforms in response to the warping of the substrate 180, the solder balls 100 do not remain on the solder ball mounting device 10 side. The solder balls 100 are soldered to the electrodes 181 by reflowing while the solder balls 100 are mounted on the electrodes 181.

[0039] FIG. 13 is a conceptual diagram showing yet another example of a state in which the solder balls 100 are attached to the electrodes of the substrate 180. In the example of FIG. 13, the peripheral portion of the substrate 180 is warped upward relative to the central portion. In the example of FIG. 13, the solder balls 100 are attached to each of the electrodes 181 to which the flux 185 is applied in response to the downward drive of the connecting plate 120 by the vertical drive source 15. The peripheral portion of the thin plate 13 is warped upward relative to the central portion in response to the warping of the substrate 180. The first compression spring 123 is deformed more than the second compression spring 127, so that the thin plate 13 is deformed along the warping of the substrate 180. As a result, the solder balls 100 are attached to all the electrodes 181 of the substrate 180.

[0040] 14 is a conceptual diagram showing an example of a state in which solder balls 100 are mounted on electrodes 181 of substrate 180 in the example of FIG. 13. As connecting plate 120 is driven upward by vertical drive source 15, solder balls 100 are mounted on each of a plurality of electrodes 181 to which flux 185 is applied. Since thin plate 13 deforms in response to warping of substrate 180, solder balls 100 do not remain on the solder ball mounting device 10 side. With solder balls 100 mounted on electrodes 181, reflow is performed, whereby solder balls 100 are soldered to electrodes 181.

[0041] The control unit 16 (controller) controls the vacuum source 17 and the vertical drive source 15. For example, the control unit 16 is realized by a microcomputer including a processor and a memory. The control unit 16 controls the vacuum source 17 to adjust the internal pressure of the suction block 11. The control unit 16 drives the vacuum source 17 to evacuate the interior of the suction block 11, thereby reducing the pressure inside the suction block 11. The control unit 16 adjusts the pressure inside the suction block 11 by controlling the degree of exhaust by the vacuum source 17. The control unit 16 stops exhaust by the vacuum source 17, and returns the pressure inside the suction block 11 to normal pressure.

[0042] The control unit 16 drives the vertical drive source 15 to control the position (height) of the connecting plate 120 in the vertical direction. The control unit 16 moves the vertical drive source 15 downward to move the connecting plate 120 downward. As a result, the thin plate 13, which moves in conjunction with the connecting plate 120, moves downward. The control unit 16 moves the vertical drive source 15 upward to move the connecting plate 120 upward. As a result, the thin plate 13, which moves in conjunction with the connecting plate 120, moves upward.

[0043] When the solder balls 100 are set below the solder ball mounting device 10, the control unit 16 operates the vacuum source 17. For example, the solder balls 100 are set below the solder ball mounting device 10 by a conveying device (not shown). The solder balls 100 may be set below the solder ball mounting device 10 by an operator. In response to the operation of the vacuum source 17, the inside of the suction block 11 becomes negative pressure, and a suction force toward the inside of the suction block 11 is generated from the suction hole H of the thin plate 13. As a result, the solder balls 100 arranged below the thin plate 13 are sucked to the suction hole H of the thin plate 13. In addition, the thin plate 13 is tightly attached to the lower surface of the suction block 11 by the suction force via the second hole h2. In this way, the suction block 11 is tightly attached to the thin plate 13 in accordance with the suction of the solder balls 100, and the undulation of the thin plate 13 is eliminated.

[0044] When the substrate 180 is set below the solder ball mounting device 10, the control unit 16 weakens the exhaust by the vacuum source 17. The exhaust by the vacuum source 17 is weakened to an extent that the thin plate 13 can be moved downward. When the inside of the suction block 11 is maintained in a depressurized state, the control unit 16 may stop the vacuum source 17. For example, the substrate 180 is set below the solder ball mounting device 10 by a conveying device (not shown). For example, the conveying device may be controlled by the control unit 16. For example, the substrate 180 may be set below the solder ball mounting device 10 by an operator. When the control unit 16 weakens the exhaust by the vacuum source 17, it drives the vertical drive source 15 to push the connection plate 120 downward. In conjunction with the movement of the connection plate 120, the thin plate 13 is released from the lower surface of the suction block 11 with the solder balls 100 still adsorbed to the suction holes H of the thin plate 13. For example, if the thin plate 13 can be moved downward without weakening the exhaust by the vacuum source 17, the control unit 16 may drive the vertical drive source 15 to push the connecting plate 120 downward without weakening the exhaust by the vacuum source 17.

[0045] When the connecting plate 120 is lowered to a position where the solder balls 100 are attached to the electrodes 181 of the substrate 180, the control unit 16 stops the vacuum source 17. Thereafter, the control unit 16 drives the vertical drive source 15 to move the connecting plate 120 upward. In conjunction with the upward movement of the connecting plate 120, the thin plate 13 moves upward. The control unit 16 moves the connecting plate 120 upward to a position where the thin plate 13 is in close contact with the lower surface of the suction block 11. In this manner, the solder balls are mounted on the electrodes 181 of the substrate 180.

[0046] (operation) Next, an example of the operation of the solder ball mounting device 10 according to this embodiment will be described with reference to the drawings. In the following, an example of control by the control unit 16 included in the solder ball mounting device 10 will be described. Fig. 15 is a flowchart for explaining an example of the operation of the solder ball mounting device 10. In explaining the process according to the flowchart of Fig. 15, the control unit 16 will be described as the main operator.

[0047] 15, first, the control unit 16 operates the vacuum source 17 with the solder balls 100 set downward (step S11). As a result, the inside of the suction block 11 is depressurized, and the solder balls 100 are suctioned to the suction holes H. Also, the thin plate 13 is tightly attached to the lower surface of the suction block 11 by the suction force through the second holes h2. In this state, the positions of the electrodes 181 of the substrate 180 on which the solder balls 100 are to be mounted are aligned with the positions of the solder balls 100. For example, the positions of the electrodes 181 of the substrate 180 and the solder balls 100 are aligned with each other by a conveying device (not shown). For example, the positions of the electrodes 181 of the substrate 180 and the solder balls 100 may be aligned with each other by the control of the control unit 16.

[0048] Next, with the substrate 180 aligned below the suction block 11, the control unit 16 weakens the exhaust by the vacuum source 17 (step S12). The control unit 16 weakens the exhaust by the vacuum source 17 to an extent that the thin plate 13 can be released from below the suction block 11. If the thin plate 13 can be released from below the suction block 11 without weakening the exhaust by the vacuum source 17, step S12 may be omitted.

[0049] Next, the control unit 16 drives the vertical drive source 15 to move the connecting plate 120 downward (step S13). The control unit 16 moves the connecting plate 120 downward to a position where the first compression spring 123 and the second compression spring 127 are compressed. As a result, all the solder balls 100 adsorbed to the suction holes H of the thin plate 13 are attached to the electrodes 181 (flux 185) of the substrate 180.

[0050] Next, the control unit 16 stops the vacuum source 17 (step S14). When the vacuum source 17 is stopped and the reduced pressure in the suction block 11 is released, the suction force in the suction holes H of the thin plate 13 disappears.

[0051] Next, the control unit 16 drives the vertical drive source 15 to move the connecting plate 120 upward (step S15). As a result, the thin plate 13 moves upward with the solder balls 100 mounted on the electrodes 181 of the substrate 180. As shown in FIGS. 5 and 6, the tapered portion T2 of the first support 130 moves upward along the tapered portion T1 of the fourth hole h4 of the suction block 11. Therefore, the horizontal positions of the first support 130 and the thin plate 13 return to their original positions in the state in which the thin plate 13 was in close contact with the lower surface of the suction block 11.

[0052] As described above, the solder ball mounting device of this embodiment includes a suction block, a push-out unit, a thin plate, a vertical drive source, a control unit, and a vacuum source. The suction block has a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the inside can be depressurized by exhausting the vacuum source. The lower surface of the suction block has a first hole, a second hole, a third hole, and a fourth hole. The first hole is formed to match the positions of the electrodes of the substrate. The second hole is formed for sucking the thin plate. A push-out pin is inserted into the third hole. The fourth hole is formed in correspondence with the four corners of the suction block. The push-out unit vertically detaches the thin plate from the lower surface of the suction block. The thin plate is placed on the lower surface of the suction block, and a plurality of suction holes are formed at positions aligned with the positions of the electrodes of the substrate. The control unit controls the vertical drive source and the vacuum source. The vertical drive source moves the push-out unit up and down according to the control of the control unit. The vacuum source operates according to the control of the control unit.

[0053] The push-out unit has a push-out pin, a push-out shaft, a connecting plate, a first support, a second support, and a connecting plate. The push-out pin is inserted into one of a plurality of holes formed on the lower surface of the suction block, and a lower end is connected to the upper surface of the thin plate. The push-out pin has a first push-out pin and a second push-out pin. The first push-out pin has a lower end supported by the first support. The second push-out pin has an upper end connected to the lower surface of the connecting plate, is inserted into a third hole, and has a lower end fixed to the upper surface of the thin plate. The push-out shaft is inserted into a plurality of holes formed on the upper surface of the suction block, and supports the push-out pin so that it can move up and down. The push-out shaft has a first push-out shaft and a second push-out shaft. The first push-out shaft has a lower end supported by the first support. The second push-out shaft has an upper end connected to the center part of the lower surface of the connecting plate, is inserted into a hole formed in the center of the upper surface of the suction block, and has a lower end supported by the second support. The connecting plate is placed on the upper surface of the suction block and has the upper end of the push shaft fixed thereto. The first support is placed inside the fourth hole and is fixed to the upper surface of the thin plate. The second support supports one of the lower ends of the push shaft. The second support is fixed to the upper surface of the connecting plate.

[0054] A deformable thin plate is placed on the lower surface of a suction block provided in the solder ball mounting device of this embodiment. A mechanism for moving the thin plate up and down with an appropriate load is placed inside the suction block. When mounting the solder balls, the thin plate pushed downward deforms to follow the warp of the substrate (package), so that the flux applied to the electrodes of the substrate comes into contact with the solder balls. According to this embodiment, even if the substrate on which the solder balls are to be mounted is warped, the solder balls will make sufficient contact with the electrodes to which the flux is applied. Therefore, according to this embodiment, the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0055] The board on which the solder balls are mounted may have a certain degree of warping. If the board warps significantly, a situation may occur in which the flux applied to the electrodes does not make sufficient contact with the solder balls when the solder balls are mounted. If this situation occurs, the solder balls will remain attached to the suction block even when the vacuum suction is turned off due to snagging on the contact surface between the solder balls and the suction block, static electricity, etc. If the solder balls remain attached to the suction block, a defect will occur in which the solder balls are not mounted on some of the electrodes on the board.

[0056] In one aspect of this embodiment, the first pusher shaft has a storage space in which the upper end portion of the first pusher pin is stored. The second pusher shaft has a narrowed portion at its lower portion. Compression springs are disposed between the ceiling surface of the storage space and the upper surface of the pusher pin, and between the upper surface of the narrowed portion of the second pusher shaft and the upper surface of the second support. According to this aspect, the first pusher pin and the second pusher pin expand and contract independently, so that the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0057] In one aspect of this embodiment, the control unit operates the vacuum source with the solder balls set below the suction block. With the substrate aligned downward, the control unit drives the vertical drive source to move the push-out unit downward. The control unit stops the vacuum source in response to the adhesion of the solder balls to the electrodes of the substrate. The control unit drives the vertical drive source to move the push-out unit upward. According to this aspect, the control of the control unit allows the solder balls to be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0058] Second embodiment Next, a solder ball mounting device according to a second embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment differs from the solder ball mounting device of the first embodiment in the structure of the push-out unit. In this embodiment, a diagram showing the mounting of the solder balls by the solder ball mounting device is omitted. The mounting of the solder balls is the same as in the first embodiment.

[0059] (composition) Figures 16 to 17 are conceptual diagrams showing an example of the configuration of the solder ball mounting device 20 of this embodiment. Figures 16 to 17 are cross-sectional views of the inside of the solder ball mounting device 20 as seen from a side perspective. Figures 16 to 17 do not show cross sections cut along the same cutting line, but show cross sections of representative parts.

[0060] The solder ball mounting device 20 includes a suction block 21, a thin plate 23, a connecting plate 220, a vertical drive source 25, a support 230, a control unit 26, and a vacuum source 27. The solder ball mounting device 20 further includes a push-out shaft 221, a compression spring 223, a first push-out pin 231, and a second push-out pin 251.

[0061] The connecting plate 220, the push-out shaft 221, the compression spring 223, the support 230, the first push-out pin 231, and the second push-out pin 251 constitute a push-out unit. The push-out unit attaches and detaches the thin plate 23 in the vertical direction from the lower surface of the suction block 21. FIG. 17 shows a state in which the push-out unit is pushed downward. The push-out unit moves up and down in conjunction with the movement of the connecting plate 220. The thin plate 23 moves up and down in conjunction with the vertical movement of the push-out unit. The multiple compression springs 223 independently expand and contract in accordance with the warping of the substrate on which the solder balls are to be mounted. Therefore, when the solder balls are mounted on the substrate, the thin plate 23 deforms in accordance with the warping of the substrate.

[0062] The suction block 21 has the same configuration as the suction block 11 of the first embodiment. The suction block 21 is a housing used for suctioning solder balls. The inside of the suction block 21 is hollow. Some of the components of the solder ball mounting device 20 are housed inside the suction block 21. An exhaust port V used for adjusting the internal pressure of the suction block 21 is opened on the side (wall) of the suction block 21. The exhaust port V may be formed on the upper surface (ceiling) of the suction block 21. The exhaust port V is connected to the vacuum source 27 via an air hose 275. For example, the vacuum source 27 is realized by a vacuum pump. When the vacuum source 27 is operated, the inside of the suction block 21 becomes negative pressure due to exhaust through the exhaust port V. Therefore, a suction force is generated through a hole formed on the lower surface of the suction block 21. For example, the pressure inside the suction block 21 may be adjusted by controlling the exhaust amount of the vacuum source 27. There is no particular limitation on the vacuum source 27 and the air hose 275.

[0063] 18 is a plan view of the solder ball mounting device 20 as seen from above. A through hole for inserting a push-out shaft 221 is formed in the upper surface of the suction block 21. The upper end of the push-out shaft 221 is connected to the lower surface of the connection plate 220. The push-out shaft 221 is arranged inside the through hole formed in the upper surface of the suction block 21 so as to be movable up and down. The lower portion of the push-out shaft 221 is arranged inside the suction block 21.

[0064] FIG. 19 is a bottom view of the solder ball mounting device 20 (the suction block 21) from which the thin plate 23 has been removed, as viewed from below. The bottom surface of the suction block 21 has a first hole h1, a second hole h2, a third hole h3, and a fourth hole h4. The first hole h1 is a hole used for suction of the solder ball. In the example of FIG. 19, 100 first holes h1 arranged in a lattice pattern are opened on the bottom surface of the suction block 21. The second holes h2 are holes used for suction of the thin plate 23. In the example of FIG. 19, 20 second holes h2 are opened on the bottom surface of the solder suction block 21. The third hole h3 is a hole through which the second push pin 251 penetrates. The second push pin 251 moves up and down inside the third hole h3. In the example of FIG. 19, five third holes h3 are opened on the bottom surface of the suction block 21. The fourth holes h4 are holes in which the supports 230 are disposed. In the example of Fig. 19, four fourth holes h4 are opened in the lower surface of the suction block 21. The first hole h1, second hole h2, third hole h3, and fourth hole h4 shown in Fig. 19 are merely examples, and do not limit the positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 21. The positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 21 are set according to the size and type of the substrate (package) on which the solder balls are to be mounted.

[0065] The thin plate 23 is disposed on the lower surface of the suction block 21. The thin plate 23 is detachable from the lower surface of the suction block 21. The thin plate 23 is flexible. For example, like the thin plate 13 of the first embodiment, the thin plate 23 is realized by a flexible metal plate or the like. The thin plate 23 may be realized by a flexible resin plate. The thin plate 23 has a suction hole H formed at a position corresponding to the first hole h1 formed on the lower surface of the suction block 21. There is no particular limitation on the method of forming the suction hole H in the thin plate 23.

[0066] Fig. 20 is a bottom view of the solder ball mounting device 20 (thin plate 23) as viewed from below. In the example of Fig. 20, 100 suction holes H arranged in a grid pattern are formed in the thin plate 23. Fig. 20 also shows positions corresponding to the first hole h1, second hole h2, third hole h3, and fourth hole h4 formed in the lower surface of the suction block 21. The multiple suction holes H are formed at positions corresponding to the multiple first holes h1.

[0067] The vertical drive source 25 has the same configuration as the vertical drive source 15 of the first embodiment. The vertical drive source 25 moves the connecting plate 220 up and down in response to the control of the control unit 26. For example, the vertical drive source 25 is realized by an air cylinder that expands and contracts by air pressure. There are no limitations on the mechanism of the vertical drive source 25 as long as it can move the connecting plate 220 up and down. In response to the up and down movement of the connecting plate 220, the push-out shaft 221 connected to the lower part of the connecting plate 220 moves up and down. In response to the up and down movement of the push-out shaft 221, the thin plate 23 moves up and down. That is, the thin plate 23 moves up and down in conjunction with the up and down movement of the connecting plate 220.

[0068] The push shaft 221 has the same configuration as the first push shaft 121 of the first embodiment. The upper end of the push shaft 221 is connected to the lower surface of the connection plate 220. A storage space is formed in the lower part of the push shaft 221. The compression spring 223 and the upper end of the first push pin 231 are stored in the storage space of the push shaft 221 connected to the lower surface of the four corners of the connection plate 220. The compression spring 223 and the upper end of the second push pin 251 are stored inside the storage space of the push shaft 221 connected to the lower surface of the connection plate 220 other than the four corners. The compression spring 223 is disposed in the storage space of the push shaft 221. The compression spring 223 presses the first push pin 231 or the second push pin 251 downward with respect to the push shaft 221.

[0069] The first push pin 231 is disposed between the push shaft 221 and the thin plate 23. The upper and lower ends of the first push pin 231 have a larger cross-sectional area than the main shaft. The upper end of the first push pin 231 is stored in the storage space of the push shaft 221. A downward stress is applied to the upper surface of the first push pin 231 by the compression spring 223. The lower end of the first push pin 231 is supported by the support 230. The support 230 is disposed on the upper surface of the thin plate 23. The support 230 is disposed inside the fourth hole h4 formed on the lower surface of the suction block 21. The solder ball mounting device 20 includes four supports 230. Each of the four supports 230 is disposed in correspondence with the four corners of the upper surface of the thin plate 23. The support 230 supports the lower end of the first push pin 231 in a wrapping manner.

[0070] The second push pin 251 is disposed between the push shaft 221 and the thin plate 23. The upper end of the second push pin 251 has a larger cross-sectional area than the main shaft. The upper end of the second push pin 251 is stored in the storage space of the push shaft 221. A downward stress is applied to the upper surface of the second push pin 251 by the compression spring 223. The lower portion of the second push pin 251 is inserted into the inside of a third hole h3 formed in the lower surface of the suction block 21. The lower end of the second push pin 251 is connected to the upper surface of the thin plate 23.

[0071] The positional relationship between the bottom surface of the suction block 21 and the thin plate 23 changes as the push-out shaft 221 moves up and down in response to the drive of the vertical drive source 25. The multiple compression springs 223 expand and contract independently of each other. Therefore, the peripheral portion and the central portion of the thin plate 23 can have different distances from the bottom surface of the suction block 21. Therefore, the thin plate 23 can deform in accordance with the warp of the substrate on which the solder balls are to be mounted.

[0072] The control unit 26 (controller) has the same configuration as the control unit 16 of the first embodiment. The control unit 26 controls the vacuum source 27 and the vertical drive source 25. For example, the control unit 26 is realized by a microcomputer including a processor and a memory. The control unit 26 controls the vacuum source 27 to adjust the internal pressure of the suction block 21. The control unit 26 drives the vacuum source 27 to exhaust air from the inside of the suction block 21, thereby reducing the pressure inside the suction block 21. The control unit 26 adjusts the pressure inside the suction block 21 by controlling the degree of exhaust by the vacuum source 27. The control unit 26 stops exhaust by the vacuum source 27, and returns the pressure inside the suction block 21 to normal pressure.

[0073] The control unit 26 drives the vertical drive source 25 to control the position (height) of the connecting plate 220 in the vertical direction. The control unit 26 moves the vertical drive source 25 downward to move the connecting plate 220 downward. As a result, the thin plate 23, which moves in conjunction with the connecting plate 220, moves downward. The control unit 26 moves the vertical drive source 25 upward to move the connecting plate 220 upward. As a result, the thin plate 23, which moves in conjunction with the connecting plate 220, moves upward.

[0074] When the solder balls are set below the solder ball mounting device 20, the control unit 26 drives the vacuum source 27 to evacuate the inside of the suction block 21. In response to the driving of the vacuum source 27, the inside of the suction block 21 becomes negative pressure, and an airflow is generated from the suction hole H of the thin plate 23 toward the inside of the suction block 21. As a result, the solder balls arranged below the thin plate 23 are sucked to the suction hole H of the thin plate 23. In addition, the thin plate 23 is tightly attached to the lower surface of the suction block 21 by the suction force via the second hole h2. In this way, the suction block 21 is tightly attached to the thin plate 23 in accordance with the suction of the solder balls, and the undulation of the thin plate 23 is eliminated.

[0075] When the substrate is set below the solder ball mounting device 20, the control unit 26 weakens the exhaust by the vacuum source 27. When the control unit 26 weakens the exhaust by the vacuum source 27, it drives the vertical drive source 25 to push the connecting plate 220 downward. In conjunction with the movement of the connecting plate 220, the thin plate 23 is released from the lower surface of the suction block 21 with the solder balls still adsorbed in the suction holes H of the thin plate 23. The control unit 26 may also drive the vertical drive source 25 to push the connecting plate 220 downward without weakening the exhaust by the vacuum source 27.

[0076] When connecting plate 220 is lowered to a position where the solder balls are attached to the electrodes of the substrate, control unit 26 stops vacuum source 27. Thereafter, control unit 26 drives vertical drive source 25 to move connecting plate 220 upward. Thin plate 23 moves upward in conjunction with the upward movement of connecting plate 220. Control unit 26 moves connecting plate 220 upward to a position where thin plate 23 is in close contact with the lower surface of suction block 21. In this manner, the solder balls are mounted on the electrodes of the substrate.

[0077] As described above, the solder ball mounting device of this embodiment includes a suction block, a push-out unit, a thin plate, a support, a vertical drive source, a control unit, and a vacuum source. The suction block has a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the inside can be depressurized by exhausting the vacuum source. The lower surface of the suction block has a first hole, a second hole, a third hole, and a fourth hole. The first hole is formed to match the positions of the electrodes of the substrate. The second hole is formed for sucking the thin plate. A push-out pin is inserted into the third hole. The fourth hole is formed corresponding to the four corners of the suction block. The push-out unit vertically detaches the thin plate from the lower surface of the suction block. The thin plate is placed on the lower surface of the suction block, and a plurality of suction holes are formed at positions aligned with the positions of the electrodes of the substrate. The control unit controls the vertical drive source and the vacuum source. The vertical drive source moves the push-out unit up and down according to the control of the control unit. The vacuum source operates according to the control of the control unit.

[0078] The push-out unit has a push-out pin, a push-out shaft, a connecting plate, a support, and a connecting plate. The push-out pin is inserted into one of a plurality of holes formed on the lower surface of the suction block, and a lower end is connected to the upper surface of the thin plate. The push-out pin has a first push-out pin and a second push-out pin. The lower end of the first push-out pin is supported by the support. The second push-out pin is inserted into the third hole, and a lower end is fixed to the upper surface of the thin plate. The push-out shaft is inserted into a plurality of holes formed on the upper surface of the suction block, and supports the push-out pin so that it can move up and down. The connecting plate is disposed on the upper surface of the suction block, and an upper end of the push-out shaft is fixed to the connecting plate. The first support is disposed inside the fourth hole, and fixed to the upper surface of the thin plate.

[0079] A deformable thin plate is placed on the lower surface of a suction block provided in the solder ball mounting device of this embodiment. A mechanism for moving the thin plate up and down with an appropriate load is placed inside the suction block. When mounting the solder balls, the thin plate pushed downward deforms to follow the warp of the substrate (package), so that the flux applied to the electrodes of the substrate comes into contact with the solder balls. According to this embodiment, even if the substrate on which the solder balls are to be mounted is warped, the solder balls will make sufficient contact with the electrodes to which the flux is applied. Therefore, according to this embodiment, the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0080] In one aspect of this embodiment, the pusher shaft has a storage space in which the upper end portion of the pusher pin is stored. A compression spring is disposed between a ceiling surface of the storage space and the upper surface of the pusher pin. According to this aspect, the multiple pusher pins expand and contract independently, so that the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0081] In one aspect of this embodiment, the control unit operates the vacuum source with the solder balls set below the suction block. With the substrate aligned downward, the control unit drives the vertical drive source to move the push-out unit downward. The control unit stops the vacuum source in response to the adhesion of the solder balls to the electrodes of the substrate. The control unit drives the vertical drive source to move the push-out unit upward. According to this aspect, the control of the control unit allows the solder balls to be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0082] Third embodiment Next, a solder ball mounting device according to a third embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment has a simplified configuration of the solder ball mounting devices of the first and second embodiments.

[0083] 21 and 22 are conceptual diagrams showing an example of the configuration of a solder ball mounting device 30 of this embodiment. The solder ball mounting device 30 includes a suction block 31, a push-out unit 32, a thin plate 33, and a vertical drive source 35. Fig. 22 shows a state in which the push-out unit 32 is pushed downward.

[0084] The suction block 31 has a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the interior can be depressurized by exhausting with a vacuum source. The push-out unit 32 vertically detaches the thin plate 33 from the lower surface of the suction block 31. The thin plate 33 is placed on the lower surface of the suction block 31, and a plurality of suction holes H are formed at positions aligned with the positions of the electrodes of the substrate. The vertical drive source 35 moves the push-out unit 32 up and down.

[0085] The solder ball mounting device of this embodiment includes a thin plate that can be attached and detached from the bottom surface of the suction block. When the solder balls are mounted on the substrate, the thin plate deforms along the warp of the substrate. Therefore, the multiple solder balls are pressed against the electrodes with a uniform force in accordance with the warp of the substrate. According to this embodiment, the solder balls adhere stably to the electrodes, so that the solder balls are not carried away by the suction block, and the solder balls can be stably mounted on the electrodes of the substrate on which they are to be mounted.

[0086] (Hardware) Next, a hardware configuration for executing control and processing according to each embodiment of the present disclosure will be described with reference to the drawings. Here, an information processing device 90 (computer) in FIG. 23 is given as an example of such a hardware configuration. The information processing device 90 in FIG. 23 is an example of a configuration for executing control and processing according to each embodiment, and does not limit the scope of the present disclosure.

[0087] As shown in Fig. 23, an information processing device 90 includes a processor 91, a main storage device 92, an auxiliary storage device 93, an input / output interface 95, and a communication interface 96. In Fig. 23, the interface is abbreviated as I / F (Interface). The processor 91, the main storage device 92, the auxiliary storage device 93, the input / output interface 95, and the communication interface 96 are connected to each other via a bus 98 so as to be able to communicate data with each other. In addition, the processor 91, the main storage device 92, the auxiliary storage device 93, and the input / output interface 95 are connected to a network such as the Internet or an intranet via the communication interface 96.

[0088] The processor 91 loads a program (instructions) stored in the auxiliary storage device 93 or the like into the main storage device 92. For example, the program is a software program for executing the control and processing of each embodiment. The processor 91 executes the program loaded into the main storage device 92. The processor 91 executes the program to execute the control and processing of each embodiment.

[0089] The main memory device 92 has an area in which a program is loaded. The processor 91 loads a program stored in the auxiliary memory device 93 or the like in the main memory device 92. The main memory device 92 is realized by a volatile memory such as a dynamic random access memory (DRAM). Furthermore, a non-volatile memory such as a magneto resistive random access memory (MRAM) may be configured / added to the main memory device 92.

[0090] The auxiliary storage device 93 stores various data such as programs. The auxiliary storage device 93 is realized by a local disk such as a hard disk or a flash memory. Note that it is also possible to configure the main storage device 92 to store various data and omit the auxiliary storage device 93.

[0091] The input / output interface 95 is an interface for connecting the information processing device 90 to peripheral devices based on standards and specifications. The communication interface 96 is an interface for connecting to an external system or device through a network such as the Internet or an intranet based on standards and specifications. The input / output interface 95 and the communication interface 96 may be a common interface for connecting to an external device.

[0092] Input devices such as a keyboard, a mouse, and a touch panel may be connected to the information processing device 90 as necessary. These input devices are used to input information and settings. When a touch panel is used as the input device, a screen having the function of the touch panel becomes the interface. The processor 91 and the input devices are connected via an input / output interface 95.

[0093] The information processing device 90 may be equipped with a display device for displaying information. When the display device is equipped, the information processing device 90 is equipped with a display control device (not shown) for controlling the display of the display device. The information processing device 90 and the display device are connected via an input / output interface 95.

[0094] The information processing device 90 may be provided with a drive device. The drive device mediates between the processor 91 and a recording medium (program recording medium) in reading data and programs stored in the recording medium and writing the processing results of the information processing device 90 to the recording medium. The information processing device 90 and the drive device are connected via an input / output interface 95.

[0095] The above is an example of a hardware configuration for enabling the control and processing according to each embodiment of the present disclosure. The hardware configuration in FIG. 23 is an example of a hardware configuration for executing the control and processing according to each embodiment, and does not limit the scope of the present disclosure. A program for causing a computer to execute the control and processing according to each embodiment is also included in the scope of the present disclosure.

[0096] A program recording medium on which the program according to each embodiment is recorded is also included in the scope of the present disclosure. The recording medium can be realized by an optical recording medium such as a CD (Compact Disc) or a DVD (Digital Versatile Disc). The recording medium may be realized by a semiconductor recording medium such as a USB (Universal Serial Bus) memory or an SD (Secure Digital) card. The recording medium may also be realized by a magnetic recording medium such as a flexible disk or other recording medium. When the program executed by the processor is recorded on a recording medium, the recording medium corresponds to a program recording medium.

[0097] The components of each embodiment may be combined in any manner. The components of each embodiment may be realized by software. The components of each embodiment may be realized by a circuit.

[0098] Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above-mentioned embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention. [Explanation of symbols]

[0099] 10, 20, 30 Solder ball mounting device 11, 21 Suction block 13, 23 thin plate 15, 25, 35 Vertical drive source 16, 26 Control unit 17, 27 Vacuum source 32 Push-out unit 120, 220 connecting plate 121 First extrusion shaft 123 First compression spring 126 Second Extrusion Shaft 127 Second compression spring 130 1st support 131, 231 First ejection pin 150 Connecting plate 151, 251 Second ejection pin 152 Second support 175, 275 Air Hose 221 Extrusion shaft 223 Compression Spring 230 Supports

Claims

1. a suction block having a plurality of holes formed at a plurality of locations including positions aligned with electrodes of a substrate on which the solder balls are to be mounted, the interior of which can be depressurized by exhausting with a vacuum source; a thin plate disposed on a lower surface of the suction block, the thin plate having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for vertically pushing and detaching the thin plate from the lower surface of the suction block; and a vertical drive source for moving the push-out unit up and down.

2. The extrusion unit comprises: At least one ejection pin is inserted into one of a plurality of holes formed on the lower surface of the suction block and has a lower end connected to the upper surface of the thin plate; At least one push shaft that is inserted into a plurality of holes formed in an upper surface of the suction block and supports the push pin so as to be movable up and down; 2. The solder ball mounting device according to claim 1, further comprising: a connection plate disposed on an upper surface of the suction block, the connection plate having an upper end of the push-out shaft fixed thereto.

3. The lower surface of the suction block is At least one first hole formed in alignment with the position of an electrode of the substrate; At least one second hole formed for sucking the thin plate; At least one third hole into which the ejection pin is inserted; 3. The solder ball mounting device according to claim 2, wherein said suction block has four corners, and fourth holes are formed corresponding to the four corners of said suction block.

4. The extrusion unit comprises: at least one support disposed within the fourth hole and secured to an upper surface of the thin plate; At least one of the ejector pins is At least one first ejection pin having a lower end supported by the support; 4. The solder ball mounting device according to claim 3, further comprising: at least one second ejection pin inserted into said third hole and having a lower end fixed to the upper surface of said thin plate.

5. The extruded shaft comprises: a storage space for storing an upper end portion of the ejection pin; 5. The solder ball mounting device according to claim 4, further comprising a compression spring disposed between a ceiling surface of said storage space and an upper surface of said ejector pin.

6. At least one first support disposed within the fourth hole and secured to an upper surface of the thin plate; A second support that supports a lower end of at least one of the extrusion shafts; a connecting plate having an upper surface to which the second support is fixed, At least one of the ejector pins is At least one first ejection pin whose lower end is supported by the first support; at least one second ejection pin having an upper end connected to the lower surface of the connecting plate, inserted into the third hole, and a lower end fixed to the upper surface of the thin plate; The extruded shaft comprises: At least one first extrusion shaft, the lower end of which is supported by the first support; 4. The solder ball mounting device as described in claim 3, further comprising: a second push-out shaft whose upper end is connected to the central portion of the lower surface of the connecting plate, inserted into a hole formed in the center of the upper surface of the suction block, and whose lower end is supported by the second support.

7. The first extruded shaft is a storage space for storing an upper end portion of the first ejection pin; The second extruded shaft is A narrowed portion is provided at the lower portion.

7. The solder ball mounting device according to claim 6, wherein a compression spring is disposed between the ceiling surface of the storage space and the upper surface of the ejector pin, and between the upper surface of the narrowed portion of the second ejector shaft and the upper surface of the second support.

8. a control unit for controlling the vertical drive source and the vacuum source, The control unit is With the solder balls set under the suction block, the vacuum source is operated; With the substrate aligned downward, the vertical drive source is driven to move the push-out unit downward; terminating the vacuum source in response to attachment of the solder balls to the electrodes of the substrate; 8. The solder ball mounting device according to claim 1, wherein the vertical drive source is driven to move the push-out unit upward.

9. A method for controlling a solder ball mounting device comprising: a suction block having a plurality of holes formed at a plurality of locations including positions aligned with electrodes of a substrate on which solder balls are to be mounted, and capable of reducing the pressure inside by exhausting with a vacuum source; a thin plate disposed on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for vertically detaching the thin plate from the underside of the suction block; and a vertical drive source for vertically moving the push-out unit, The computer With the solder balls set under the suction block, the vacuum source is operated; With the substrate aligned downward, the vertical drive source is driven to move the push-out unit downward; terminating the vacuum source in response to attachment of the solder ball to the electrode of the substrate; A control method for driving the vertical drive source to move the push-out unit upward.

10. A program for controlling a solder ball mounting device comprising: a suction block having a plurality of holes formed at a plurality of locations including positions aligned with electrodes of a substrate on which solder balls are to be mounted, and capable of reducing the pressure inside by exhausting with a vacuum source; a thin plate disposed on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for vertically detaching the thin plate from the underside of the suction block; and a vertical drive source for vertically moving the push-out unit, a step of operating the vacuum source while the solder balls are set under the suction block; a process of driving the vertical drive source to move the push-out unit downward in a state in which the substrate is aligned downward; deactivating the vacuum source in response to attachment of the solder balls to the electrodes of the substrate; and a process of driving the vertical drive source to move the push-out unit upward.

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