Power supply module cooling structure

Abstract

The power module includes a substrate, an electronic component disposed on an upper surface of the substrate, a lower board electrically connected to the electronic component via the substrate, and an upper board electrically connected to another end of the at least one support pillar opposite an end of the at least one support pillar electrically connected to the at least one lower board, the at least one upper board being electrically connected to the substrate. The support pillar extends between the lower board and the upper board. The support pillar includes a first end electrically connected to the lower board and a second end electrically connected to the upper board. The magnetic material is disposed around a periphery of the support pillar.

Description

[Technical field]

[0001] The present invention relates to a power supply module, and more particularly to improving the performance of a power supply module by cooling heat-generating power elements in the power supply module. [Background technology]

[0002] Known power supply modules include heat generating components, such as power elements of the power supply module, that are connected to a heat sink such that a portion of the heat generated by the heat generating components is transferred to the heat sink, which aids in dissipating the heat. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-047648 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the typical layout of known power modules requires a large space, which is not favorable when miniaturization of the power module is required. Moreover, if the heat-generating power components must be placed close to the inductive components, the cooling efficiency will be reduced because the inductive components have a low thermal conductivity. When the cooling efficiency is reduced, the heat-generating power components cannot generate a large current.

[0005] Patent Document 1 shows an inductor in a DC-DC converter. However, the core of the structure of the inductor 4i is toroidal and lacks sufficient heat dissipation capability for high current power components. [Means for solving the problem]

[0006] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS In order to solve the above problems, a preferred embodiment of the present invention provides a power supply module that can be miniaturized while also providing sufficient cooling to generate large currents. A preferred embodiment of the present invention provides a power module including a substrate, an electronic component disposed on a top surface of the substrate, a lower board electrically connected to the electronic component through the substrate, and an upper board electrically connected to another end of the at least one support pillar opposite an end of the at least one support pillar electrically connected to the at least one lower board, the at least one upper board being electrically connected to the substrate. The support pillar extends between the lower board and the upper board. The support pillar includes a first end connected to the lower board and a second end connected to the upper board. A magnetic material is disposed around a periphery of the support pillar.

[0007] The electronic component may be thermally coupled to the lower board. The electronic component may be thermally coupled to the lower board via a thermally conductive material. The lower board, the support posts, and the upper board may define an inductor.

[0008] The lower board may be connected to an upper surface of the substrate. The lower board may include a lower board upright portion extending upward from the substrate, a lower board curved portion located at an end of the lower board upright portion, and a lower board flat portion extending from the lower board curved portion along a plane parallel or substantially parallel to the upper surface of the substrate. The upper surface of the lower board flat portion may be connected to a first end of one of the supports.

[0009] The top surface of the electronic component may be thermally connected to the bottom surface of the lower board planar portion, and a thermally conductive material may be provided between the top surface of the electronic component and the bottom surface of the lower board planar portion. The surface area of ​​the lower board flat portion may be greater than the surface area of ​​the lower board upright portion. The maximum height of the electronic components is equal to or less than the distance between the lower surface of the lower board flat portion and the upper surface of the substrate.

[0010] The electronic components may be at least partially molded within the resin material, the maximum height of which may be equal to or less than the distance between a bottom surface of the lower board flat portion and a top surface of the substrate. The upper board may include an upper board flat portion extending along a plane parallel or substantially parallel to the upper surface of the substrate, an upper board curved portion provided at an end of the upper board flat portion, and an upper board upright portion that may extend from the upper board curved portion and may be electrically connected to the substrate. The sum of the maximum height of the electronic component, the maximum thickness of the lower board flat portion, and the maximum thickness of the support post may be equal to the total distance between the lower surface of the upper board flat portion and the upper surface of the substrate. The total surface area of ​​the upper board flat portion may be greater than the total surface area of ​​the upper board upright portions.

[0011] The support pillar may be cylindrical. The electronic component may include a field effect transistor. The module may further include an additional support pillar, and the support pillar and the additional support pillar may be arranged on a straight line extending in a direction intersecting with the extension direction of the lower board.

[0012] A preferred embodiment of the present invention includes a first substrate and a second substrate, a first electronic component provided on an upper surface of the first substrate, a first lower board electrically connected to the first electronic component via the first substrate, a first upper board electrically connected to the first substrate, a first support pillar extending between the first lower board and the first upper board and including a first end electrically connected to the first lower board and a second end electrically connected to the first upper board, and a first support pillar provided around the first support pillar. A power supply module is provided, the power supply module including: a magnetic material, a second electronic component provided on an upper surface of a second substrate, a second lower board electrically connected to the second electronic component via the second substrate, a second upper board electrically connected to the second substrate, a second support pole extending between the second lower board and the second upper board and including a first end electrically connected to the second lower board and a second end electrically connected to the second upper board, and a second magnetic material provided around the second support pole. The first lower board, the first support pole, the first upper board, the second lower board, the second support pole, and the second upper board are magnetically connected to each other.

[0013] The first magnetic material and the second magnetic material may be fixed to one another.The first magnetic material and the second magnetic material may be provided together as a single monolithic member. The above and other features, elements, characteristics, steps, and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the accompanying drawings. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 shows a side view of a power module according to a first preferred embodiment of the present invention. [Figure 2A] 1 shows a perspective view of a portion of a power module according to a first preferred embodiment of the present invention; [Figure 2B] 1 shows a perspective view of a portion of a power module according to a first preferred embodiment of the present invention; [Figure 2C]1 shows a perspective view of a portion of a power module according to a first preferred embodiment of the present invention; [Figure 2D] 1 shows a perspective view of a portion of a power module according to a first preferred embodiment of the present invention; [Figure 2E] FIG. 1 shows a perspective view of a power module according to a first preferred embodiment of the present invention. [Figure 2F] 1 shows a circuit diagram of a power supply module according to a first preferred embodiment of the present invention; [Diagram 3] FIG. 2 shows a perspective view of a power module according to a modification of the first preferred embodiment of the present invention. [Figure 4A] FIG. 2 shows a perspective view of a power module according to a second preferred embodiment of the present invention; [Figure 4B] FIG. 2 shows a perspective view of a power module according to a second preferred embodiment of the present invention; [Diagram 5] FIG. 13 shows a perspective view of a power module according to a third preferred embodiment of the present invention. [Figure 6A] FIG. 13 shows a perspective view of a power module according to a fourth preferred embodiment of the present invention. [Figure 6B] FIG. 13 shows a perspective view of a power module according to a fourth preferred embodiment of the present invention. [Figure 6C] FIG. 13 shows a perspective view of a portion of a power module according to a fourth preferred embodiment of the present invention. [Figure 6D] FIG. 13 shows a perspective view of a portion of a power module according to a fourth preferred embodiment of the present invention. [Figure 7A] FIG. 13 illustrates a perspective view of a power module according to a fifth preferred embodiment of the present invention. [Figure 7B] FIG. 13 illustrates a perspective view of a power module according to a fifth preferred embodiment of the present invention. [Figure 7C] FIG. 13 illustrates a perspective view of a power supply module according to a modification of the fifth preferred embodiment of the present invention. [Figure 8A] FIG. 13 shows a perspective view of a power module according to a sixth preferred embodiment of the present invention. [Figure 8B]FIG. 13 shows a perspective view of a portion of a power module according to a sixth preferred embodiment of the present invention. [Figure 8C] FIG. 13 shows a perspective view of a portion of a power module according to a sixth preferred embodiment of the present invention. [Figure 9] FIG. 13 shows a perspective view of a portion of a power module according to a seventh preferred embodiment of the present invention. [Figure 10] FIG. 19 shows a perspective view of a power module according to an eighth preferred embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] First Preferred Embodiment A power supply module 1 according to a first preferred embodiment of the present invention will be described with reference to Figures 1 to 2F. Figure 1 is a side view of the power supply module 1 according to the first preferred embodiment of the present invention. Figures 2A to 2D are perspective views of a portion of the power supply module 1 according to the first preferred embodiment of the present invention. Figure 2E is a perspective view of the power supply module 1 according to the first preferred embodiment of the present invention. Figure 2F is a circuit diagram of the power supply module 1 according to the first preferred embodiment of the present invention.

[0016] 1, the power supply module 1 may include a substrate 10, one or more electronic components 40 on a surface of the substrate 10, a lower board 21 extending from an upper surface of the substrate 10 to cover the electronic components 40, one or more support pillars 30 extending from an upper surface of the lower board 21, a magnetic material 31 surrounding the one or more support pillars 30, and an upper board 22 extending from the substrate 10 to cover the upper ends of the one or more support pillars 30. The electronic components 40 may include, for example, a power element (e.g., a field effect transistor, etc.), a capacitor, a resistor, etc.

[0017] The lower board 21 may include a pair of lower board portions 21A and 21B spaced apart from each other with a gap 214 therebetween, as shown in FIG. 2B. The lower board 21 may include a lower board upright portion 211, a lower board curved portion 212, and a lower board flat portion 213. The lower board upright portion 211 extends perpendicular or substantially perpendicular to the upper surface of the substrate 10 within a manufacturing error range and / or a measurement error range. The lower board flat portion 213 extends parallel or substantially parallel to the upper surface of the substrate 10 within a manufacturing error range and / or a measurement error range. The surface area of ​​the lower board flat portion 213 may be greater than the surface area of ​​the lower board upright portion 211. However, the surface area of ​​the lower board flat portion 213 may be equal to or smaller than that of the lower board upright portion 211. The bottom of the lower board upright portion 211 may be fixed within an opening 1021 defined on the substrate 10. Lower board 21 may be electrically connected to one or more electronic components 40 via solder and / or wires defined on or within substrate 10 .

[0018] As shown in FIG. 2D , the upper board 22 may include a pair of upper board portions 22A and 22B spaced apart from each other with a gap 224 therebetween. The upper board 22 may include an upper board upright portion 221, an upper board curved portion 222, and an upper board flat portion 223. The upper board upright portion 221 extends perpendicular or substantially perpendicular to the upper surface of the substrate 10 within a manufacturing error range and / or a measurement error range. The upper board flat portion 223 extends parallel or substantially parallel to the upper surface of the substrate 10 within a manufacturing error range and / or a measurement error range. The bottom of the upper board upright portion 221 may be fixed within an opening 1022 defined in the substrate 10. The total surface area of ​​the upper board flat portion 223 may be greater than the total surface area of ​​the upper board upright portion 221. However, the total surface area of ​​the upper board flat portion 223 may be equal to or less than the upper board upright portion 221. Top board 22 may be electrically connected to one or more electronic components 40 via solder and / or wires defined on or within substrate 10 .

[0019] At least one support pillar 30 extends from the lower board flat portion 213 to the upper board flat portion 223. The lower board 21 and the upper board 22 are electrically connected to each other through the at least one support pillar 30. For example, the at least one support pillar 30 may include a pair of support pillars, as shown in FIG. 2C. However, a different number of support pillars may be used. The at least one support pillar 30 may be cylindrical, but any other shape may be used. The at least one support pillar 30 is surrounded by a magnetic material 31. The lower board 21, the upper board 22, the at least one support pillar 30, and the magnetic material 31 may together define one or more inductors. Furthermore, the structure of the lower board 21, the upper board 22, the at least one support pillar 30, and the magnetic material 31 may define a heat sink that can dissipate heat generated inside the power supply module 1.

[0020] The maximum height of at least one of the electronic components 40 is the same as or substantially the same as the distance between the lower board planar portion 213 and the top surface of the substrate 10. Additionally, the maximum height of at least one of the electronic components 40 may be less than the distance between the lower board planar portion 213 and the top surface of the substrate 10.

[0021] 2E and 2F show an example of a circuit arrangement provided in the power supply module 1. The circuit arrangement may include a pair of transistors Q1, Q2 and a transformer TX1 provided between a pair of transistors Q3, Q4. The primary winding P1 includes a node B, and the secondary winding S1 includes a node A. The node B is connected between the transistors Q3 and Q4 and corresponds to the connection of the upper board 22 to the substrate 10. The node A is connected between the transistors Q1 and Q2 and corresponds to the connection of the lower board 21 to the substrate 10. The ends of the primary winding P1 and the secondary winding S1 that are not connected to the nodes A and B are connected to a capacitor C1 and an AC power source I1 that are connected in parallel between the primary winding P1 and the secondary winding S1 and ground. The pair of transistors Q1, Q2 and the pair of transistors Q3, Q4 are also connected in parallel between a voltage source V1 and ground.

[0022] FIG. 3 shows a power module 1A according to a modification of the first preferred embodiment of the present invention. The power module 1A according to the modification of the first preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that the electronic components 40 on the substrate 10 are encapsulated in a thermally conductive resin material 401. In addition, the thermally conductive resin material 401 supports the lower board 21, thereby facilitating the stabilization of the structure of the power module 1A. The maximum height of at least one of the electronic components 40 may be substantially the same as or smaller than the maximum height of the resin material 401. Encapsulating the electronic components 40 with the resin material 401 can provide better heat transfer between the substrate 10, the electronic components 40, and the lower board 21 while simultaneously improving stability.

[0023] Second Preferred Embodiment A power module 2 according to a second preferred embodiment of the present invention will be described with reference to Figures 4A and 4B. Figure 4A is a perspective view of an example of a power module 2 according to the second preferred embodiment of the present invention. Figure 4B is another perspective view of an example of a power module 2 according to the second preferred embodiment of the present invention, which is semi-transparent to show the internal geometry of the components of the power module 2.

[0024] 4A and 4B, the power module 2 according to the second preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that the shape of the support pillar 2030 and the magnetic material 2031 may be rectangular or cubic. Furthermore, the support pillar 2030 may be polygonal (such as pentagonal, hexagonal, etc.). Other configurations of the power module 2 according to the second preferred embodiment may be the same as those of the power module 1 according to the first preferred embodiment, and the description of the same parts will be omitted for simplicity.

[0025] Third Preferred Embodiment A power module 3 according to a third preferred embodiment of the present invention will now be described with reference to Figure 5. Figure 5 is a perspective view of an example of a power module 3 according to the third preferred embodiment of the present invention, which is semi-transparent to show the internal geometry of the components of the power module 3.

[0026] 5, the power module 3 according to the third preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that the support pole 30 is surrounded by a magnetic material 2031, which may be columnar or cylindrical. Other configurations of the power module 3 according to the third preferred embodiment may be the same as those of the power module 1 according to the first preferred embodiment, and the description of the same parts will be omitted for simplicity.

[0027] Fourth Preferred Embodiment A power supply module 4 according to a fourth preferred embodiment of the present invention will be described with reference to Figures 6A to 6D. Figures 6A and 6B are perspective views of the power supply module 4 according to the fourth preferred embodiment of the present invention. Figures 6C and 6D show perspective views of a portion of the power supply module 4 according to the fourth preferred embodiment of the present invention.

[0028] As shown in FIG. 6A-FIG. 6D, the power module 4 according to the fourth preferred embodiment may be different from the power module 1 according to the first preferred embodiment in that the support 4030 is surrounded by a magnetic material 4031, which may be rectangular or cubic in shape. Furthermore, the magnetic material 4031 may include a separately provided structure having a Greek letter pi (π) shape. The lower board 4021 and the upper board 4022 may be defined as a pair of separate structures that directly contact only the upper and lower surfaces of the corresponding support 4030. Other configurations of the power module 4 according to the fourth preferred embodiment may be the same as those of the power module 1 according to the first preferred embodiment, and the description of the same parts is omitted for simplicity.

[0029] Fifth Preferred Embodiment A power supply module 5 according to a fifth preferred embodiment of the present invention will be described with reference to Figures 7A and 7B, which are perspective views of the power supply module 5 according to the fifth preferred embodiment of the present invention.

[0030] As shown in FIG. 7A and FIG. 7B, the power module 5 according to the fifth preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that a plurality of support posts 5030, which may be rectangular or cubic in shape, are surrounded by a magnetic material 5031. The magnetic material 5031 may include a separately provided structure having a shape of a single long side with a plurality of vertical protrusions extending between a pair of support posts 5030. Furthermore, the lower board 5021 and the upper board 5022 may be defined as a pair of separate structures that directly contact only the upper and lower surfaces of the corresponding support posts 5030. For example, four vertical protrusions of the magnetic material 5031 may be provided adjacent to the four support posts 5030. Other configurations of the power module 5 according to the fifth preferred embodiment may be the same as those of the power module 1 according to the first preferred embodiment, and the description of the same parts is omitted for simplicity. By increasing the number of inductors (corresponding to the pillars 5030 and the magnetic material 5031) in the power supply module 5 according to the fifth preferred embodiment compared to that in the power supply module 1 according to the first preferred embodiment, the performance of the power supply module 5 according to the fifth preferred embodiment can be improved compared to the power supply module 1 according to the first preferred embodiment.

[0031] 7C shows a power module 5A according to a modification of the fifth preferred embodiment of the present invention. The power module 5A according to the modification of the fifth preferred embodiment differs from the power module 5 according to the fifth preferred embodiment in that the magnetic material 5031 is defined by a plurality of structures having the shape of the Greek letter pi (π). Furthermore, instead of a single substrate, a pair of substrates 10A and 10B is provided. As with the power module 5, the performance of the power module 5A can be improved by increasing the number of inductors in the power module 5A.

[0032] Sixth Preferred Embodiment A power module 6 according to a sixth preferred embodiment of the present invention will be described with reference to Figures 8A to 8C. Figure 8A is a perspective view of the power module 6 according to the sixth preferred embodiment of the present invention. Figures 8B and 8C show perspective views of a portion of the power module 6 according to the fourth preferred embodiment of the present invention.

[0033] As shown in FIG. 8A, the power module 6 according to the sixth preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that a plurality of support posts 6030, which may be rectangular or cubic in shape, are surrounded by a magnetic material 6031. The magnetic material 6031 may include a separate structure having a single long-sided shape with a plurality of vertical protrusions extending between pairs of support posts 6030. Furthermore, the upper board 6022 may be defined by a plurality of separate structures that directly contact only the upper surface of the corresponding support posts 6030. In contrast, the lower board 6021 may include a single structure having an opening 6033 through which the lower part of the upper board 6022 can pass and reach the substrate 6010.

[0034] 8B and 8C show views of the lower board 6021. The opening 6033 may include a curved protrusion 6034 provided at the periphery of the opening 6033. The curved protrusion 6034 extends downwards towards the upper surface of the substrate 6010. The opening may overlap a portion of the lower surface of the support post 6030. The remaining portion of the lower board 6021 may have a structure similar to that of the power supply module 1 according to the first preferred embodiment. Inserting a portion of the support post 6030 into the opening 6033 may increase the stability of the power supply module 6.

[0035] Seventh Preferred Embodiment A power supply module 7 according to a seventh preferred embodiment of the present invention will be described with reference to Figure 9. Figure 9 is a perspective view of a power supply module 7 according to the seventh preferred embodiment of the present invention.

[0036] As shown in FIG. 9, the power module 7 according to the seventh preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that a plurality of support posts 7030, which may be rectangular or cubic in shape, are surrounded by a magnetic material 7031. The magnetic material 7031 may include a separate structure having a single long-sided shape with a plurality of vertical protrusions extending between pairs of support posts 7030. Furthermore, the upper board 7022 may include a single structure having an opening 7033, while the lower board 7021 may be defined by a plurality of separate structures that directly contact only the lower surface of the corresponding support posts 7030. The opening 7033 may include a curved protrusion 7034 that extends downward between adjacent ones of the separate structures of the lower board 7021 to reach the substrate 7010. When a portion of the support post 7030 is inserted into the opening 7033, the stability of the power module 7 may be increased.

[0037] Eighth Preferred Embodiment A power supply module 8 according to an eighth preferred embodiment of the present invention will be described with reference to Fig. 10. Fig. 10 is a perspective view of a power supply module 8 according to the eighth preferred embodiment of the present invention.

[0038] 10, the power module 8 according to the eighth preferred embodiment may differ from the power module 1 according to the first preferred embodiment in that a plurality of support pillars 8030, which may be rectangular or cubic in shape, are surrounded by a magnetic material 8031. The magnetic material 8031 ​​may include a plurality of structures having a shape of the Greek letter pi (π). A wide gap 8066 may be defined between adjacent ones of the plurality of structures of the magnetic material 8031.

[0039] The configurations of the preferred embodiments and modifications described above can be appropriately combined with each other, and effects corresponding to each combination can be obtained. It should be understood that the foregoing description is only illustrative of the present invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the present invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the appended claims.

Claims

1. 1. A power supply module, comprising: A substrate; An electronic component provided on an upper surface of the substrate; a lower board electrically connected to the electronic components via the substrate; an upper board electrically connected to another end of the at least one support pillar opposite an end of the at least one support pillar electrically connected to the at least one lower board, the at least one upper board being electrically connected to the substrate; a post extending between the lower board and the upper board, a first end electrically connected to the lower board; a second end electrically connected to the top board; and a magnetic material disposed around a periphery of the post.

2. The module of claim 1 , wherein the electronic components are thermally connected to the lower board.

3. The module of claim 1 or 2, wherein the electronic components are thermally connected to the lower board via a thermally conductive material.

4. The module of any preceding claim, wherein the lower board, the support posts and the upper board define an inductor.

5. the lower board is connected to the top surface of the substrate; the lower board includes a lower board upright portion extending upward from the base, a lower board curved portion located at an end of the lower board upright portion, and a lower board flat portion extending from the lower board curved portion along a plane parallel or substantially parallel to the top surface of the base, The module of any one of claims 1 to 4, wherein an upper surface of the lower board flat portion is connected to the first end of the one support post.

6. The module of claim 5 , wherein a top surface of the electronic components is thermally connected to a bottom surface of the lower board planar portion.

7. The module of claim 6 , wherein a thermally conductive material is provided between the top surface of the electronic components and the bottom surface of the lower board planar portion.

8. The module according to any one of claims 5 to 7, wherein the surface area of ​​the lower board flat portion is greater than the surface area of ​​the lower board upright portion.

9. The module according to any one of claims 5 to 8, wherein the maximum height of the electronic components is less than or equal to the distance between a lower surface of the lower board flat portion and the upper surface of the substrate.

10. The module of claim 9 , wherein the electronic components are at least partially molded in a resin material.

11. The module of claim 10 , wherein a maximum height of the resin material is equal to or less than a distance between the lower surface of the lower board planar portion and the upper surface of the substrate.

12. The upper board is an upper board planar portion extending along a plane parallel or substantially parallel to the top surface of the substrate; an upper board curved portion provided at an end of the upper board flat portion; A module according to any one of claims 9 to 11, comprising an upper board upright portion extending from said upper board curved portion and electrically connected to said substrate.

13. 13. The module of claim 12, wherein the sum of the maximum height of the electronic components, the maximum thickness of the lower board planar portion, and the maximum thickness of the posts is the same as the total distance between the lower surface of the upper board planar portion and the upper surface of the substrate.

14. 14. The module of claim 12 or 13, wherein a total surface area of ​​the upper board flat portions is greater than a total surface area of ​​the upper board upright portions.

15. The module according to any one of claims 1 to 14, wherein the support pillars are cylindrical in shape.

16. The module of any preceding claim, wherein the electronic components include field effect transistors.

17. Further equipped with additional supports, The module according to any one of claims 1 to 16, wherein the support pillars and the additional support pillars are arranged on a straight line extending in a direction intersecting an extension direction of the lower board.

18. 1. A power supply module, comprising: a first substrate and a second substrate; a first electronic component provided on an upper surface of the first substrate; a first lower board electrically connected to the first electronic component through the first substrate; a first upper board electrically connected to the first substrate; a first post extending between the first lower board and the first upper board, a first end electrically connected to the first lower board; a first post having a second end electrically connected to the first upper board; a first magnetic material disposed around the first post; a second electronic component provided on an upper surface of the second substrate; a second lower board electrically connected to the second electronic component through the second substrate; a second upper board electrically connected to the second substrate; a second post extending between the second lower board and the second upper board, a first end electrically connected to the second lower board; a second post having a second end electrically connected to the second upper board; a second magnetic material disposed around the second post; a power module, wherein the first lower board, the first support, the first upper board, the second lower board, the second support, and the second upper board are magnetically connected to one another.

19. The module of claim 18 , wherein the first magnetic material and the second magnetic material are fixed to one another.

20. 20. The module of claim 19, wherein the first magnetic material and the second magnetic material are provided together as a single monolithic member.

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